CN204230295U - A kind of LED matrix of COB encapsulation - Google Patents
A kind of LED matrix of COB encapsulation Download PDFInfo
- Publication number
- CN204230295U CN204230295U CN201420635276.2U CN201420635276U CN204230295U CN 204230295 U CN204230295 U CN 204230295U CN 201420635276 U CN201420635276 U CN 201420635276U CN 204230295 U CN204230295 U CN 204230295U
- Authority
- CN
- China
- Prior art keywords
- arc surface
- chip
- lens unit
- lens
- led matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to the LED matrix that a kind of COB encapsulates, comprise substrate and be arranged at the plural chip on substrate, described chip surface is provided with fluorescent adhesive layer, the top of described two or more chip is provided with lens, described lens comprise two or more lens unit, described two or more lens unit is disposed adjacent, and described lens unit comprises the first arc surface, the second arc surface and is connected the plane of the first arc surface, the second arc surface.The LED matrix of COB encapsulation of the present utility model can realize nearly lambertian distribution and the Uniform Illumination of specific light, and avoids light to occur in the total reflection of fluorescent glue or silica gel and Air Interface, improves the light extraction of device.Meanwhile, by the Optical Field Superposition of numerous lens unit, when observing in far field, there will not be a luminous effect; The heat that fluorescent glue work produces can pass to substrate quickly through chip and dispel the heat, thus avoids the rising of colloid temperature to impact the physical characteristic of fluorescent glue and silica gel.
Description
Technical field
The utility model relates to lighting apparatus, particularly the LED matrix that encapsulates of a kind of COB.
Background technology
LED (light-emitting diode) encapsulation refers to the encapsulation of luminescence chip, and comparing integrated antenna package has relatively big difference.The encapsulation of LED not only requirement can protect wick, but also can printing opacity.So the encapsulation of LED has special requirement to encapsulating material.Mostly development and the differentiation in Discrete device packaging technical foundation of LED technology, but have very large particularity.Generally, the tube core of discrete device is sealed in packaging body, and the effect of encapsulation is mainly protected tube core and completes electric interconnection.LED has been then the output signal of telecommunication, and protection tube core normally works, and export the function of visible ray, existing electrical quantity, has again design and the technical requirement of optical parameter, simply the encapsulation of discrete device cannot be used for LED.The type of LED encapsulation structure comprises pinned encapsulation, surface mount package, power-type encapsulation and the encapsulation of COB type.Multiple chips can be directly encapsulated in metal base printed circuit board MCPCB by COB encapsulation, is directly dispelled the heat, can not only reduce manufacturing process and the cost thereof of support by substrate, also has the heat radiation advantage reducing thermal resistance.The COB packaging system of LED chip of the prior art, adopt complete tube core lay and gold thread bonding substrate on embedding fluorescent glue, to tube core and gold thread etc. formed mechanical protection.Cover fluorescent glue by large area, the Integral luminous structure of forming surface light source simultaneously.Because the refractive index of packing colloid refractive index and air is excessive, the full transmitting that interface occurs will have a strong impact on the light extraction of overall device, meanwhile, when normally working, because colloid has higher temperature, cause serious impact to fluorescent material.Along with the rising of temperature, the thermal stress of glue inside increases, and the refractive index of glue decreases, thus affects the optical profile of device, and reduces light extraction efficiency.In addition, the casting glue that prior art adopts is mixed according to a certain percentage by organic packaging materials (as silica gel etc.) and fluorescent material, and radiating effect is poor.Therefore, COB encapsulating structure of the prior art to get optical efficiency lower.
Utility model content
Technical problem to be solved in the utility model is: the LED matrix of the COB encapsulation providing a kind of light extraction efficiency high.
In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is:
A kind of LED matrix of COB encapsulation, comprise substrate and be arranged at the plural chip on substrate, described chip surface is provided with fluorescent adhesive layer, the top of described two or more chip is provided with lens, described lens comprise two or more lens unit, described two or more lens unit is disposed adjacent, described lens unit comprises the first arc surface, the second arc surface and is connected the plane of the first arc surface, the second arc surface, the central angle of described first arc surface is 40-60 °, and the central angle of described second arc surface is 40-60 °.
Further, the central angle of described first arc surface and the second arc surface is 48 °.
Further, described fluorescent adhesive layer is provided with layer of silica gel, and described layer of silica gel is full of the gap between described two or more chip.
The beneficial effects of the utility model are:
(1) design of the utility model scioptics, consider that the factor of the arc surface of lens and the relative position of chip and lens can realize nearly lambertian distribution and the Uniform Illumination of specific light on the impact of LED light extraction efficiency, and avoid light to occur in the total reflection of fluorescent glue or silica gel and Air Interface, improve the light extraction of device.Meanwhile, because each lens is adjacent very near, and optical profile is consistent, by the Optical Field Superposition of numerous lens unit, when observing in far field, there will not be a luminous effect;
(2) fluorescent glue of the present utility model is only coated in chip surface, and the scope covered is very little, and the heat that fluorescent glue work produces can pass to substrate quickly through chip and dispel the heat.Thus avoid the rising of colloid temperature to impact the physical characteristic of fluorescent glue and silica gel.
Accompanying drawing explanation
Fig. 1 is the structure chart of the LED matrix of the COB encapsulation of the utility model embodiment;
Fig. 2 is the structure chart of the lens unit of the LED matrix of the COB encapsulation of the utility model embodiment.
Label declaration:
1, substrate; 2, chip; 3, fluorescent adhesive layer; 4, lens; 41, lens unit; 411, the first arc surface; 412, the second arc surface; 413, plane.
Embodiment
By describing technology contents of the present utility model in detail, realized object and effect, accompanying drawing is coordinated to be explained below in conjunction with execution mode.
The design of the utility model most critical is: the design of scioptics, can realize nearly lambertian distribution and the Uniform Illumination of light, and avoid light total reflection to occur, thus improves the light extraction efficiency of device.
Please refer to Fig. 1 and Fig. 2, the LED matrix of COB encapsulation of the present utility model, the plural chip 2 comprising substrate 1 and be arranged on substrate, described chip 2 surface is provided with fluorescent adhesive layer 3, the top of described two or more chip 2 is provided with lens 4, described lens 4 comprise two or more lens unit 41, described two or more lens unit 41 is disposed adjacent, described lens unit 41 comprises the first arc surface 411, second arc surface 412 be connected the first arc surface, the plane 413 of the second arc surface, the central angle of described first arc surface 411 is 40-60 °, the central angle of described second arc surface 412 is 40-60 °.
From foregoing description, the beneficial effects of the utility model are:
(1) design of the utility model scioptics, consider that the factor of the arc surface of lens and the relative position of chip and lens can realize nearly lambertian distribution and the Uniform Illumination of specific light on the impact of LED light extraction efficiency, and avoid light to occur in the total reflection of fluorescent glue or silica gel and Air Interface, improve the light extraction of device.Meanwhile, because each lens is adjacent very near, and optical profile is consistent, by the Optical Field Superposition of numerous lens unit, when observing in far field, there will not be a luminous effect;
(2) fluorescent glue of the present utility model is only coated in chip surface, and the scope covered is very little, and the heat that fluorescent glue work produces can pass to substrate quickly through chip and dispel the heat.Thus avoid the rising of colloid temperature to impact the physical characteristic of fluorescent glue and silica gel.
Further, the central angle of described first arc surface 411 and the second arc surface 412 is 48 °.
Seen from the above description, the LED matrix of the COB of the present embodiment encapsulation is preferred example, and when the central angle of the first arc surface and the second arc surface is 48 °, the light extraction efficiency of the LED matrix tool of COB encapsulation is the highest.
Further, described fluorescent adhesive layer 3 is provided with layer of silica gel, and described layer of silica gel is full of the gap between described two or more chip.
In sum, the LED matrix of the COB encapsulation that the utility model provides can realize nearly lambertian distribution and the Uniform Illumination of specific light, and avoids light to occur in the total reflection of fluorescent glue or silica gel and Air Interface, improves the light extraction of device.Meanwhile, by the Optical Field Superposition of numerous lens unit, when observing in far field, there will not be a luminous effect; The heat that fluorescent glue work produces can pass to substrate quickly through chip and dispel the heat, thus avoids the rising of colloid temperature to impact the physical characteristic of fluorescent glue and silica gel.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every equivalents utilizing the utility model specification and accompanying drawing content to do; or be directly or indirectly used in relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (3)
1. the LED matrix of a COB encapsulation, comprise substrate and be arranged at the plural chip on substrate, it is characterized in that, described chip surface is provided with fluorescent adhesive layer, the top of described two or more chip is provided with lens, described lens comprise two or more lens unit, described two or more lens unit is disposed adjacent, described lens unit comprises the first arc surface, the second arc surface and is connected the plane of the first arc surface, the second arc surface, the central angle of described first arc surface is 40-60 °, and the central angle of described second arc surface is 40-60 °.
2. the LED matrix of COB encapsulation according to claim 1, it is characterized in that, the central angle of described first arc surface and the second arc surface is 48 °.
3. the LED matrix of COB encapsulation according to claim 1, it is characterized in that, described fluorescent adhesive layer is provided with layer of silica gel, and described layer of silica gel is full of the gap between described two or more chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420635276.2U CN204230295U (en) | 2014-10-29 | 2014-10-29 | A kind of LED matrix of COB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420635276.2U CN204230295U (en) | 2014-10-29 | 2014-10-29 | A kind of LED matrix of COB encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204230295U true CN204230295U (en) | 2015-03-25 |
Family
ID=52928355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420635276.2U Expired - Fee Related CN204230295U (en) | 2014-10-29 | 2014-10-29 | A kind of LED matrix of COB encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204230295U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107906379A (en) * | 2017-12-08 | 2018-04-13 | 深圳市晶锐铭科技有限公司 | A kind of efficiently UVLED integrated optical sources |
| CN113078246A (en) * | 2017-12-27 | 2021-07-06 | 群创光电股份有限公司 | Display device |
-
2014
- 2014-10-29 CN CN201420635276.2U patent/CN204230295U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107906379A (en) * | 2017-12-08 | 2018-04-13 | 深圳市晶锐铭科技有限公司 | A kind of efficiently UVLED integrated optical sources |
| CN113078246A (en) * | 2017-12-27 | 2021-07-06 | 群创光电股份有限公司 | Display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102447049B (en) | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator | |
| CN205752232U (en) | A kind of COB light module | |
| CN204230295U (en) | A kind of LED matrix of COB encapsulation | |
| CN103700653A (en) | LED (Light-Emitting Diode) light source packaging structure | |
| CN103236489A (en) | LED (light emitting diode) packaging structure | |
| CN207883721U (en) | A kind of LED light bar with excellent heat dispersion performance | |
| CN203423214U (en) | Light emitting diode packaging structure and light emitting diode tube | |
| CN202120908U (en) | Single-lead light-emitting diode (LED) module | |
| CN106058031B (en) | A kind of integrated form high power ultraviolet LED heat sink | |
| CN202888235U (en) | LED packaging structure | |
| CN205900596U (en) | Integrated form high power ultraviolet LED heating panel | |
| CN206076228U (en) | Novel C OB encapsulating structure | |
| CN202797061U (en) | COB package high-power LED lamp | |
| CN202120907U (en) | Leadless LED (Light-emitting Diode) module | |
| CN102255035B (en) | Multi-LED chip packaging structure on substrate | |
| CN204538086U (en) | Multi-chip encapsulated LED structure | |
| CN205429008U (en) | Metal heat conduction post COB LED light source | |
| CN204391110U (en) | A kind of LED integrated light-emitting device | |
| CN207009472U (en) | A kind of LED filament | |
| CN203232910U (en) | LED package structure | |
| CN210692584U (en) | Packaging light source structure capable of adjusting central luminous intensity | |
| CN202373627U (en) | Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique | |
| CN103236486A (en) | LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure | |
| CN204088376U (en) | Electronic controller wire type LED device | |
| CN202511024U (en) | Light-emitting diode (LED) display device and module light source thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20191029 |