CN202797061U - COB package high-power LED lamp - Google Patents
COB package high-power LED lamp Download PDFInfo
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- CN202797061U CN202797061U CN 201220335373 CN201220335373U CN202797061U CN 202797061 U CN202797061 U CN 202797061U CN 201220335373 CN201220335373 CN 201220335373 CN 201220335373 U CN201220335373 U CN 201220335373U CN 202797061 U CN202797061 U CN 202797061U
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- pad
- colloidal silicas
- little groove
- box dam
- led lamp
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Abstract
The utility model discloses a COB package high-power LED lamp. The LED lamp comprises an aluminum substrate or a copper substrate, a number of dam colloids or a number of pad small grooves, a number of LED chips, a number of colloidal silicas and fluorescent powder. A number of dam colloids or a number of pad small grooves are fixedly distributed on the aluminum substrate or the copper substrate. The fluorescent powder is covered on a number of colloidal silicas. The LED chips are respectively arranged on the dam colloids or a number of pad small grooves. A number of dam colloids or a number of pad small grooves are respectively connected with a number of colloidal silicas and respectively package a number of LED chips in a number of colloidal silicas. The out-light surfaces of the LED chips face the fluorescent powder. According to the utility model, a number of dam colloids or a number of pad small grooves, which are fixedly distributed on the aluminum substrate or the copper substrate, are used to fix a number of LED chips, thus the support cost is eliminated, and the production cost is low; and at the same time, because of low thermal resistance and heat dispersion, the COB package high-power LED lamp has the advantages of good heat dissipation effect, low light loss of a light source and high light utilization rate.
Description
Technical field
The utility model relates to lighting technical field, relates in particular to a kind of COB packaged high-power LED lamp.
Background technology
At present, in the led light source field, the method for doing high power light source roughly is divided into two kinds: be combined to form high-powered LED lamp by many high-power lamp pearls 1.; 2. utilize COB integration packaging plurality of LEDs chip to obtain high-powered LED lamp.
See also Fig. 1 and Fig. 2, the manufacturing process of the method for the first high-power lamp pearl is: at first with 12 dozens of led chips on small rack 11, then upper fluorescent material and silica gel 13 are dried, it is fixing to cover lens 14 again.When making larger power, must be connected on many lamp bead welds on the aluminium base of coupling, this way production process is loaded down with trivial details, and work consuming is time-consuming, lamp assembled trouble, and efficient is low, and cost is high, and the thermal resistance height is unfavorable for heat radiation, but the light efficiency utilance is high.
Given this, propose the COB integrated encapsulation method on the market and made high-powered LED lamp.So-called COB encapsulation is chip On board, exactly bare chip is sticked on the interconnect substrates with conduction or non-conductive adhesive, then carries out Bonding and realizes its electrical connection.If bare chip is directly exposed in the air, vulnerable to pollution or artificial damage, impact or destruction chip functions are so just be encapsulated chip and bonding wire with glue.People claim that also this packing forms is the Soft Roll envelope.
See also Fig. 3 and Fig. 4, the manufacturing process of the second COB integrated encapsulation method is: 22 dozens of plurality of LEDs chips are on support 21, and then upper fluorescent material and silica gel 23 are dried.This way production process is simple, and lamp assembled is convenient, and efficient is high, become instinct to reduce about 30%, and thermal resistance is low, but the light loss of area source is high, and the utilance of light is not high.
The utility model content
For the weak point that exists in the above-mentioned technology, the utility model provides a kind of light loss simple in structure, light source low, the COB packaged high-power LED lamp that the utilance of light is high.
For achieving the above object, the utility model provides a kind of COB packaged high-power LED lamp, comprise aluminium base or copper base, a plurality of box dam colloids or the little groove of a plurality of pad, a plurality of led chips, a plurality of colloidal silicas and fluorescent material, the little groove stationary distribution of described a plurality of box dam colloid or a plurality of pad is on aluminium base or copper base, described fluorescent material covers on a plurality of colloidal silicas, described each led chip places respectively on described box dam colloid or the little groove of a plurality of pad, described a plurality of box dam colloid or the little groove of a plurality of pad are connected with a plurality of colloidal silicas respectively, and a plurality of led chips are encapsulated in respectively in a plurality of colloidal silicas, the exiting surface of described led chip is towards described fluorescent material.
Wherein, described a plurality of box dam colloid or the even stationary distribution of the little groove of a plurality of pad are on aluminium base or copper base.
Wherein, described aluminium base or copper base are square, circular or irregularly shaped.
For achieving the above object, the utility model also provides a kind of COB packaged high-power LED lamp, comprise aluminium base or copper base, a plurality of box dam colloids or the little groove of a plurality of pad, a plurality of led chips, a plurality of colloidal silicas and fluorescent material, the little groove stationary distribution of described a plurality of box dam colloid or a plurality of pad is on aluminium base or copper base, described fluorescent material is evenly distributed in a plurality of colloidal silicas, described each led chip places respectively on described box dam colloid or the little groove of a plurality of pad, described a plurality of box dam colloid or the little groove of a plurality of pad are connected with a plurality of colloidal silicas respectively, and a plurality of led chips are encapsulated in respectively in a plurality of colloidal silicas, the exiting surface of described led chip is towards described fluorescent material.
Wherein, described a plurality of box dam colloid or the even stationary distribution of the little groove of a plurality of pad are on aluminium base or copper base.
Wherein, described aluminium base or copper base are square, circular or irregularly shaped.
For achieving the above object, the utility model also provides a kind of COB packaged high-power LED lamp manufacture method, comprises
The beneficial effects of the utility model are: compared with prior art, the COB packaged high-power LED lamp that the utility model provides, by a plurality of box dam colloids or a plurality of pad little groove fixing a plurality of led chips of stationary distribution on aluminium base or copper base, then utilize a plurality of colloidal silicas to encapsulate these led chips, saved timbering cost usefulness, production cost is low.Simultaneously, since the low and spread heat of thermal resistance, good heat dissipation effect, and the light loss of light source is low, and light utilization efficiency is high.
Description of drawings
Fig. 1 is the explosive view of the high-powered LED lamp that forms of the high-power lamp pearl of prior art;
Fig. 2 is the structure chart of the high-powered LED lamp that forms of the high-power lamp pearl of prior art;
Fig. 3 is the explosive view of high-powered LED lamp of the COB encapsulation of prior art;
Fig. 4 is the structure chart of high-powered LED lamp of the COB encapsulation of prior art;
Fig. 5 is the explosive view of COB packaged high-power LED lamp of the present utility model;
Fig. 6 is the structure chart of COB packaged high-power LED lamp of the present utility model.
The main element symbol description is as follows:
11, small rack 12, led chip
13, silica gel 14, lens
21, support 22, led chip
23, silica gel 31, aluminium base or copper base
32, the little groove 33 of box dam colloid or pad, led chip
34, colloidal silica
Embodiment
In order more clearly to explain the utility model, below in conjunction with accompanying drawing the utility model is done to describe further.
See also Fig. 5 and Fig. 6, among COB packaged high-power LED lamp the first embodiment that the utility model provides, this LED lamp comprises aluminium base or copper base 31, the little groove 32 of a plurality of box dam colloids or a plurality of pad, a plurality of led chips 33, a plurality of colloidal silicas 34 and fluorescent material (not shown), little groove 32 stationary distribution of a plurality of box dam colloids or a plurality of pad are on aluminium base or copper base 31, the fluorescent material (not shown) covers on a plurality of colloidal silicas 34, each led chip 33 places respectively on a plurality of box dam colloids or the little groove 32 of a plurality of pad, the little groove 32 of a plurality of box dam colloids or a plurality of pad is connected with a plurality of colloidal silicas 34 respectively, and a plurality of led chips 33 are encapsulated in respectively in a plurality of colloidal silicas 34, the exiting surface of a plurality of led chips 33 is towards the fluorescent material (not shown).
Situation compared to prior art, the COB packaged high-power LED lamp that the utility model provides, by a plurality of box dam colloids or a plurality of pad little groove fixing a plurality of led chips of stationary distribution on aluminium base or copper base, then utilize a plurality of colloidal silicas to encapsulate these led chips, saved timbering cost usefulness, production cost is low.Simultaneously, since the low and spread heat of thermal resistance, good heat dissipation effect, and the light loss of light source is low, and light utilization efficiency is high.
In the present embodiment, the little groove 32 even stationary distribution of above-mentioned a plurality of box dam colloid or a plurality of pad are on aluminium base or copper base 31.Be understandable that; the little groove 32 of box dam colloid or a plurality of pad can be evenly distributed on aluminium base or the copper base 31; also can arrange according to certain rule; also can arrange according to irregular spacing; so long as box dam colloid or the little groove 32 of a plurality of pad are fixed on execution mode on aluminium base or the copper base 31; be not limited to arrangement mode, all belong to simple deformation of the present utility model or conversion, fall into protection range of the present utility model.
In the present embodiment, above-mentioned aluminium base or copper base 31 are square, circular or irregularly shaped.Be understandable that; present embodiment is not limited to the concrete shape of aluminium base or copper base 31; so long as arrange the execution mode of box dam colloid or the little groove 32 of a plurality of pad by aluminium base or copper base 31; be not limited to the quantity of led chip 33; also be not limited to the quantity of box dam colloid or the little groove 32 of a plurality of pad; all belong to simple deformation of the present utility model or conversion, fall into protection range of the present utility model.
See also Fig. 5 and Fig. 6, the second embodiment of the COB packaged high-power LED lamp that the utility model also provides, technology contents is basic identical, and difference is, packaging LED chips is evenly distributed in a plurality of colloidal silicas with fluorescent material, and the exiting surface of led chip 33 is towards fluorescent material.
In the present embodiment, the little groove 32 even stationary distribution of above-mentioned a plurality of box dam colloid or a plurality of pad are on aluminium base or copper base 31.Similarly; the little groove 32 of box dam colloid or a plurality of pad can be evenly distributed on aluminium base or the copper base 31; also can arrange according to certain rule; also can arrange according to irregular spacing; so long as box dam colloid or the little groove 32 of a plurality of pad are fixed on execution mode on aluminium base or the copper base 31; be not limited to arrangement mode, all belong to simple deformation of the present utility model or conversion, fall into protection range of the present utility model.
In the present embodiment, above-mentioned aluminium base or copper base 31 are square, circular or irregularly shaped.Similarly; present embodiment is not limited to the concrete shape of aluminium base or copper base 31; so long as arrange the execution mode of box dam colloid or the little groove 32 of a plurality of pad by aluminium base or copper base 31; be not limited to the quantity of led chip 33; also be not limited to the quantity of box dam colloid or the little groove 32 of a plurality of pad; all belong to simple deformation of the present utility model or conversion, fall into protection range of the present utility model.
The manufacture method of the utility model COB packaged high-power LED lamp is: on square, circular or erose specific aluminum substrate or a copper base, at a certain distance led chip is independently beaten on aluminium base or copper base and with gold thread and linked up, then box dam glue is dried (the little groove of pad perhaps is set) on chip periphery point, and upper silica gel and fluorescent powder packaging get up to dry again.The method production process is simple, and lamp assembled is convenient, and efficient is high, becomes instinct to reduce 20-30%, low, the spread heat of thermal resistance, and the light loss of this kind light source is low, and utilance is high.
The effect of the utility model and existing two kinds of high-powered LED lamps is compared as follows shown in the table:
More than disclosed only be several specific embodiment of the present utility model, but the utility model is not limited thereto, the changes that any person skilled in the art can think of all should fall into protection range of the present utility model.
Claims (6)
1. COB packaged high-power LED lamp, it is characterized in that, comprise aluminium base or copper base, a plurality of box dam colloids or the little groove of a plurality of pad, a plurality of led chips, a plurality of colloidal silicas and fluorescent material, the little groove stationary distribution of described a plurality of box dam colloid or a plurality of pad is on aluminium base or copper base, described fluorescent material covers on a plurality of colloidal silicas, described each led chip places respectively on described box dam colloid or the little groove of a plurality of pad, described a plurality of box dam colloid or the little groove of a plurality of pad are connected with a plurality of colloidal silicas respectively, and a plurality of led chips are encapsulated in respectively in a plurality of colloidal silicas, the exiting surface of described led chip is towards described fluorescent material.
2. COB packaged high-power LED lamp according to claim 1 is characterized in that, described a plurality of box dam colloids or the even stationary distribution of the little groove of a plurality of pad are on aluminium base.
3. COB packaged high-power LED lamp according to claim 1 and 2 is characterized in that, described aluminium base or copper base are square, circular or irregularly shaped.
4. COB packaged high-power LED lamp, it is characterized in that, comprise aluminium base or copper base, a plurality of box dam colloids or the little groove of a plurality of pad, a plurality of led chips, a plurality of colloidal silicas and fluorescent material, the little groove stationary distribution of described a plurality of box dam colloid or a plurality of pad is on aluminium base or copper base, described fluorescent material is evenly distributed in a plurality of colloidal silicas, described each led chip places respectively on described box dam colloid or the little groove of a plurality of pad, described a plurality of box dam colloid or the little groove of a plurality of pad are connected with a plurality of colloidal silicas respectively, and a plurality of led chips are encapsulated in respectively in a plurality of colloidal silicas, the exiting surface of described led chip is towards described fluorescent material.
5. COB packaged high-power LED lamp according to claim 4 is characterized in that, described a plurality of box dam colloids or the even stationary distribution of the little groove of a plurality of pad are on aluminium base.
6. according to claim 4 or 5 described COB packaged high-power LED lamps, it is characterized in that described aluminium base or copper base are square, circular or irregularly shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220335373 CN202797061U (en) | 2012-07-11 | 2012-07-11 | COB package high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220335373 CN202797061U (en) | 2012-07-11 | 2012-07-11 | COB package high-power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202797061U true CN202797061U (en) | 2013-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220335373 Expired - Fee Related CN202797061U (en) | 2012-07-11 | 2012-07-11 | COB package high-power LED lamp |
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| CN (1) | CN202797061U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938402A (en) * | 2012-07-11 | 2013-02-20 | 周海兵 | Chip-on-board (COB) packaging high-power light-emitting diode (LED) lamp and manufacture method thereof |
| CN108598240A (en) * | 2017-12-13 | 2018-09-28 | 江西众光照明科技有限公司 | A kind of COB light source and packaging method of the encapsulation of high reflecting mirror surface glass plate |
-
2012
- 2012-07-11 CN CN 201220335373 patent/CN202797061U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102938402A (en) * | 2012-07-11 | 2013-02-20 | 周海兵 | Chip-on-board (COB) packaging high-power light-emitting diode (LED) lamp and manufacture method thereof |
| CN108598240A (en) * | 2017-12-13 | 2018-09-28 | 江西众光照明科技有限公司 | A kind of COB light source and packaging method of the encapsulation of high reflecting mirror surface glass plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20150711 |
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| EXPY | Termination of patent right or utility model |