CN201359224Y - Module for high-power COB-packed LED road lamps - Google Patents
Module for high-power COB-packed LED road lamps Download PDFInfo
- Publication number
- CN201359224Y CN201359224Y CNU2009201120895U CN200920112089U CN201359224Y CN 201359224 Y CN201359224 Y CN 201359224Y CN U2009201120895 U CNU2009201120895 U CN U2009201120895U CN 200920112089 U CN200920112089 U CN 200920112089U CN 201359224 Y CN201359224 Y CN 201359224Y
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- Prior art keywords
- module
- heat sink
- chip
- heat
- street lamp
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Abstract
The utility model discloses an illuminating LED lamp, in particular to a module for high-power COB-packed LED road lamps; the module comprises a lens, silica gel, a gold thread, a chip, a heat-radiating panel and the like; the chip is directly and fixedly connected on the heat-radiating panel, five to fifty convex plates are arranged on the heat-radiating panel, the chip is arranged on the convex plate, screw holes are arranged at the periphery of the heat-radiating panel for connection. The module has the advantages that the heat radiating effect is good, the glaring efficiency is improved, and the middle is more in accordance with the road lamp requirements. The module can be widely applied to occasions with various illuminating LED lamps.
Description
Technical field
The utility model relates to a kind of illumination LED lamp, specifically is meant a kind of high-power LED street lamp module of COB encapsulation.
Technical background
The great power LED that the COB mode encapsulates is extensive use of by many encapsulation factory now.Though it has the good advantage of heat radiation, the great power LED light efficiency that encapsulates of COB mode is lower now, still needs the secondary optics luminous intensity distribution during use, cannot connect between module and the module, and is non-watertight also dustproof.
The utility model content
The utility model proposes a kind of novel structure at deficiency of the prior art, realizes improving light efficiency, reduces between thermal resistance, module and the module and can make up, not need secondary optics luminous intensity distribution, water proof and dust proof.
The utility model is achieved by following technical proposals:
A kind of high-power LED street lamp module of COB encapsulation, it comprises: lens, silica gel, gold thread, chip, heat sink etc. is characterized in that chip directly is fixed on the heat sink.Lens material is generally organic materials such as glass, PC.
As preferably, above-mentioned high-power LED street lamp is fixed on the boss of heat sink with the chip in the module.As better selection, boss and the heat sink on the described heat sink is integrated, boss quantity is 5-50, boss be shaped as circle or polygon.
As preferably, above-mentioned high-power LED street lamp is pasted with the PCB that thickness is 0.1-1mm with heat sink surface in the module, and PCB is passed through in the connection between a plurality of chips.PCB has aperture, and the boss above the heat sink can expose from the inside, PCB hole.Chip electrode and PCB link tester are crossed gold thread and are welded, and space filling gel or silica gel between chip and the lens add fluorescent material.
As preferably, above-mentioned a kind of high-power LED street lamp module is characterized in that using screw hole around the heat sink.Around the heat sink screw hole is arranged, can connect combination by screw between the heat sink.
Beneficial effect: adopt special COB (chip is directly solid on heat sink) frame mode in the utility model, the module that is used for street lamp that the COB mode encapsulates, heat sink is integrated, do not need in addition radiation fin again, the heat radiation of score body structure will be got well, the solid brilliant place of heat sink is for boss structure and through silver-plated processing, can effectively improve light extraction efficiency, being fixed as between lens and the heat sink totally-enclosedly combines waterproof dustproofly, and the good optical design allows module luminous intensity distribution light pictograph close the street lamp requirement, as rectangular light spots, do not need to add again the secondary optics luminous intensity distribution, around the heat sink screw hole is arranged, can make up between module and the module, very easy to use.
Description of drawings
Fig. 1 COB modular structure figure
The details drawing of Fig. 2 A portion structure
The 1-lens, 2-silica gel, 3-gold thread, 4-chip, 5-boss, 6-PCB, 7-heat sink
The specific embodiment
Below in conjunction with accompanying drawing, enforcement of the present utility model is specified:
Embodiment one
According to structure shown in Figure 1, heat sink 7 surperficial bonding PCB6, more in conjunction with the accompanying drawings 2, chip 4 on consolidating on heat sink 7 boss 5 welds chip 4 surface point fluorescent material with gold thread 3 between chip 4 and the PCB6, pre-point is gone up silica gel 2 in the lens 1, and formation heat sink 7 combines with lens 1.Carry out testing package then, can get product.
Claims (5)
1, a kind of high-power LED street lamp module of COB encapsulation, it comprises: lens (1), silica gel (2), gold thread (3), chip (4), heat sink (7) is characterized in that chip (4) directly is fixed on the heat sink (7).
2, the high-power LED street lamp module of a kind of COB encapsulation according to claim 1 is characterized in that described chip (4) is fixed on the boss (5) of heat sink (7).
3, the high-power LED street lamp module of a kind of COB encapsulation according to claim 2, it is characterized in that the boss (5) on the heat sink (7) is integrated with heat sink (7), boss (5) quantity is that 5-50 is individual, boss (5) be shaped as circle or polygon.
4, the high-power LED street lamp module of a kind of COB encapsulation according to claim 1 is characterized in that heat sink (7) surface is pasted with the PCB that thickness is 0.1-1mm (6), and the connection between a plurality of chips is by PCB (6).
5, the high-power LED street lamp module of a kind of COB encapsulation according to claim 1 is characterized in that heat sink (7) uses screw hole all around.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009201120895U CN201359224Y (en) | 2009-01-04 | 2009-01-04 | Module for high-power COB-packed LED road lamps |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009201120895U CN201359224Y (en) | 2009-01-04 | 2009-01-04 | Module for high-power COB-packed LED road lamps |
Publications (1)
Publication Number | Publication Date |
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CN201359224Y true CN201359224Y (en) | 2009-12-09 |
Family
ID=41424988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNU2009201120895U Expired - Fee Related CN201359224Y (en) | 2009-01-04 | 2009-01-04 | Module for high-power COB-packed LED road lamps |
Country Status (1)
Country | Link |
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CN (1) | CN201359224Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102364709A (en) * | 2011-10-29 | 2012-02-29 | 华南师范大学 | High-power LED packaging structure |
CN102646776A (en) * | 2012-01-12 | 2012-08-22 | 深圳市瑞丰光电子股份有限公司 | Light-emitting diode module and manufacturing method thereof |
CN103236489A (en) * | 2013-04-18 | 2013-08-07 | 浙江深度照明有限公司 | LED (light emitting diode) packaging structure |
-
2009
- 2009-01-04 CN CNU2009201120895U patent/CN201359224Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102364709A (en) * | 2011-10-29 | 2012-02-29 | 华南师范大学 | High-power LED packaging structure |
CN102646776A (en) * | 2012-01-12 | 2012-08-22 | 深圳市瑞丰光电子股份有限公司 | Light-emitting diode module and manufacturing method thereof |
CN103236489A (en) * | 2013-04-18 | 2013-08-07 | 浙江深度照明有限公司 | LED (light emitting diode) packaging structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20110104 |