CN202373627U - Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique - Google Patents
Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique Download PDFInfo
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- CN202373627U CN202373627U CN2011205698933U CN201120569893U CN202373627U CN 202373627 U CN202373627 U CN 202373627U CN 2011205698933 U CN2011205698933 U CN 2011205698933U CN 201120569893 U CN201120569893 U CN 201120569893U CN 202373627 U CN202373627 U CN 202373627U
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Abstract
The utility model relates to an LED packaging structure and an LED lightening device based on COB technique. The existing packaging has the problems of being large in size, numerous in particles, difficult in cooling, standard exceeding in glare, high in cost and the like when applied in indoor lightening devices. The LED packaging structure comprises a substrate and a plurality of groups of LED chip packaging structures which are arranged on the substrate and enclosed by silica gel; mixture of fluorescent powder and glue is filled in an enclosing area, and the mixture is plane-shaped at the top of the enclosing area. The LED lightening device comprises the LED packaging structure; and each of the plurality of groups of the LED chip packaging structures is connected in parallel between upper bus and lower bus. The LED packaging structure and the LED lightening device based on the COB technique have the advantages of being simple and practical in structure, and good in cooling performance and reflection effect.
Description
Technical field
The utility model belongs to LED encapsulation technology field, relates in particular to a kind of LED encapsulating structure and LED lighting device based on the COB encapsulation technology.
Background technology
Existing room lighting LED matrix mainly uses led chip is packaged into individual devices, like the SMD packagings of SMD such as 3020,3528,5050.There are problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height in the SMD package application in interior illuminator.
Also there are some uses that the COB encapsulating structure of circular groove is arranged.There is the COB encapsulation of circular groove to solve some problems that many connection in series-parallel application of SMD bring; But groove needs machinery to carry out secondary process; And when carrying out the COB encapsulation, need put fluorescent glue one by one, cause the production cycle long, some glue is uneven; Because the method point fluorescent glue is outer gibbosity, causes LED to go out the relatively poor problem of light consistency.
Summary of the invention
The purpose of the utility model is the deficiency to prior art, and first technical problem of solution is: the COB encapsulating structure that shortcomings such as a kind of SMD of overcoming formula LED volume is big, heat radiation is difficult, cost is high, dazzle exceeds standard are provided.
Second technical problem that the utility model solves is: a kind of LED lighting device based on the COB encapsulation technology is provided, and this device encapsulation is simple, and fluorescent glue is evenly distributed, thereby eliminates hot spot, makes the bright dipping of LED lighting device even.
The utility model solves the technical scheme that first technical problem adopted:
LED encapsulating structure based on the COB encapsulation technology comprises substrate, organizes the led chip encapsulating structure more.Many group led chip encapsulating structures are arranged on the substrate, and are surrounded by silica gel; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top.
Described led chip encapsulating structure comprises the led chip encapsulation unit of a plurality of serial connections, and each led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, connects through gold thread between the adjacent LED chip packaging unit, and described gold thread one end and led chip upper surface electrode are fixed, and the pad between the other end and the led chip encapsulation unit is fixed.
Said led chip is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Said substrate is rectangular-shaped high-thermal conductive metal base plate.
Said silica gel is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, and described encapsulating material is the amalgam of fluorescent material and glue.
The utility model solves second technical scheme that technical problem adopted:
The LED lighting device comprises aforesaid LED encapsulating structure; Every group of led chip encapsulating structure in the LED encapsulating structure is connected in parallel between bus and the following bus.
The beneficial effect of the utility model: compare prior art; The utility model proposes a kind of encapsulating structure based on the COB encapsulation technology; But on substrate, surround the silica gel of heat conduction, the encapsulating material that when packaging LED chips, uses fluorescent material and glue to be mixed and made into, said encapsulating material are filled in and surround the zone and be plane; Avoided because fluorescent glue is outer gibbosity; Cause LED to go out the relatively poor problem of light consistency, also can simplify packaging process, and the lighting device of a kind of simple and practical, thermal diffusivity good, reflecting effect good, colourity is even, temperature resistant capability is strong, packaging cost is low LED is provided.
Description of drawings
Fig. 1 is prior art constructions figure;
Fig. 2 is the cross sectional representation of single-chip package structure among the utility model embodiment;
Fig. 3 is the structural representation of LED lighting device among the utility model embodiment.
Embodiment
Below in conjunction with accompanying drawing the utility model is further specified.
The utility model has avoided the SMD encapsulation to have problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height.As shown in Figure 1, in Fig. 1, SMD paster LED light source 2 is welded in pcb board 1, and every spacing is bigger, and the point-like effect is obvious, and frame of broken lines is represented the dark space 3 that produces, and the hot spot that when using lighting device, produces causes dazzle to exceed standard.
As shown in Figure 2, the cross sectional representation for single-chip package structure among the embodiment of the utility model comprises: substrate 5 and a led chip encapsulation unit 7; Led chip encapsulation unit 7 is arranged on the substrate 5, and is surrounded by silica gel 15; The amalgam of filling fluorescent material and glue in this surrounds the zone, described amalgam are plane surrounding regional top;
Described led chip encapsulation unit 7 comprises led chip 8, elargol 18 and the coating 19 that sets gradually from top to bottom; Coating 19 is arranged on the solid brilliant position of substrate 5, and led chip 8 is fixed on the coating 19 of said substrate 5 through elargol 18; Led chip 8 upper surface electrodes are connected with substrate 5 upper surface routing positions through gold thread 16.
Said led chip 8 is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side.
Said silica gel 15 is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, and described encapsulating material is the amalgam of fluorescent material and glue.
Said coating 19, optional gold, silver of material or aluminium, thermal conductivity is high, reflecting effect is good;
Said encapsulating material 14 light transmittances are high, refractive index is high, good fluidity, be prone to solidify, and block with cofferdam silica gel 15 and prevent its outflow.Led chip 8 is a blue chip, and technology is ripe relatively, and conversion efficiency is high; Said fluorescent material is blue-light excited ruddiness and gold-tinted fluorescent material; Said glue is epoxide-resin glue, and ratio is prone to allotment, and cost is low.
As shown in Figure 3, be the structural representation of LED lighting device among the utility model embodiment.A kind of LED encapsulating structure 4 based on the COB encapsulation technology comprises substrate 5, organizes led chip encapsulating structure 6 more, and said led chip encapsulating structure 6 is arranged on the substrate 5, and is surrounded by silica gel 15; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulating structure 6 comprises the led chip encapsulation unit 7 of a plurality of serial connections, and the structure of each led chip encapsulation unit 7 as above instance is said.
Connect through gold thread 16 between the adjacent LED chip packaging unit 7, described gold thread 16 1 ends and led chip upper surface electrode are fixed, and the pad 11 between the other end and the led chip encapsulation unit 7 is fixing.
Said led chip 8 is the chip of bipolar electrode, and routing position pad is positioned at solid brilliant position dual-side, shortens the routing distance, has improved operability and reliability, and has practiced thrift the cost of gold thread 16.
Surround with silica gel 15 on the said substrate 5, rectangular being arranged on around the led chip 8 highly is no more than 1mm.After the cold curing, cover with point gum machine and to be coated with encapsulating material 14, need not to put one by one glue; Only need the average mark glue of layouting; Because encapsulating material 14 self good mobility makes it be plane, silica gel 15 surrounds it, and the upper surface of encapsulating material 14 is no more than silica gel 15; With this illuminating source that forms is area source, no point-like effect, free from glare.
Every group of led chip encapsulating structure 6 is connected in parallel between bus 12 and the following bus 13.Two its substrate 5 head and the tail that are provided with LED encapsulating structure 4 are together seamless spliced, are communicated with through lead-in wire between plate 17.
In sum, the utility model embodiment adopts the LED encapsulating structure 4 based on the COB encapsulation technology, has avoided SMD paster class LED lighting device problem, the problem includes: problems such as volume is big, particle is many, heat radiation is difficult, dazzle exceeds standard, cost height.Also eliminated in the COB encapsulation that groove is set, owing to need the heat sink groove of processing, put fluorescent glue one by one, caused the production cycle long, some glue is uneven, and because the method point fluorescent glue is outer gibbosity, causes LED to go out the relatively poor problem of light consistency.Through selecting the silica gel 15 that cohesiveness is strong, heat conduction and heat radiation property is good to surround; Prevent that encapsulating material 14 from overflowing, make things convenient for control point glue amount, and protected encapsulating material 14 well; Make it to have good adhesion strength and heat dispersion, further improved the useful life of LED lighting device.The utility model once can be organized the LED lighting device by encapsulated moulding more, and is simple and practical, thermal diffusivity good, go out that light consistency is good, reflecting effect good, colourity is even, temperature resistant capability is strong, packaging cost is low.
Giving an example of the above near-sighted the utility model embodiment can not assert that the practical implementation of the utility model is confined to these explanations, do not address part in detail and is those skilled in the art's common practise.Under the prerequisite that does not break away from the utility model design, any simple deduction, equivalent transformation of making is also within the protection range of the utility model.
Claims (5)
1. based on the LED encapsulating structure of COB encapsulation technology, comprise substrate, organize the led chip encapsulating structure more, it is characterized in that: organize the led chip encapsulating structure more and be arranged on the substrate, and surround by silica gel; In this surrounds the zone, be filled with the amalgam of fluorescent material and glue, described amalgam is plane surrounding regional top;
Described led chip encapsulating structure comprises the led chip encapsulation unit of a plurality of serial connections, and each led chip encapsulation unit comprises led chip, elargol and the coating that sets gradually from top to bottom; Coating is arranged on the solid brilliant position of substrate, connects through gold thread between the adjacent LED chip packaging unit, and described gold thread one end and led chip upper surface electrode are fixed, and the pad between the other end and the led chip encapsulation unit is fixed.
2. a kind of LED encapsulating structure as claimed in claim 1 based on the COB encapsulation technology, it is characterized in that: said led chip is the chip of bipolar electrode, routing position pad is positioned at solid brilliant position dual-side.
3. a kind of LED encapsulating structure based on the COB encapsulation technology as claimed in claim 1, it is characterized in that: said substrate is rectangular-shaped high-thermal conductive metal base plate.
4. a kind of LED encapsulating structure as claimed in claim 1 based on the COB encapsulation technology, it is characterized in that: said silica gel is heat conductive silica gel, and has the function that prevents that said encapsulating material from overflowing, described encapsulating material is the amalgam of fluorescent material and glue.
5.LED lighting device comprises a plurality of LED encapsulating structures as claimed in claim 1, it is characterized in that: every group of led chip encapsulating structure in the LED encapsulating structure is connected in parallel between bus and the following bus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205698933U CN202373627U (en) | 2011-12-31 | 2011-12-31 | Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205698933U CN202373627U (en) | 2011-12-31 | 2011-12-31 | Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique |
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| Publication Number | Publication Date |
|---|---|
| CN202373627U true CN202373627U (en) | 2012-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205698933U Expired - Lifetime CN202373627U (en) | 2011-12-31 | 2011-12-31 | Light-emitting diode (LED) packaging structure and LED lightening device based on chip on board (COB) packaging technique |
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| Country | Link |
|---|---|
| CN (1) | CN202373627U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102447049A (en) * | 2011-12-31 | 2012-05-09 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
-
2011
- 2011-12-31 CN CN2011205698933U patent/CN202373627U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102447049A (en) * | 2011-12-31 | 2012-05-09 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
| CN102447049B (en) * | 2011-12-31 | 2013-08-14 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120808 Effective date of abandoning: 20130814 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20120808 Effective date of abandoning: 20130814 |
|
| RGAV | Abandon patent right to avoid regrant |