CN201556644U - Rectangular light spot power type LED encapsulating structure - Google Patents
Rectangular light spot power type LED encapsulating structure Download PDFInfo
- Publication number
- CN201556644U CN201556644U CN2009202929159U CN200920292915U CN201556644U CN 201556644 U CN201556644 U CN 201556644U CN 2009202929159 U CN2009202929159 U CN 2009202929159U CN 200920292915 U CN200920292915 U CN 200920292915U CN 201556644 U CN201556644 U CN 201556644U
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- led
- chip
- encapsulating structure
- led chip
- light spot
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
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Abstract
A rectangular light spot power type LED encapsulating structure relates to the field of high-power LED luminaries for road lighting. The LED encapsulating structure comprises a high-thermal conductive insulation base, an LED chip and a molding lens, wherein the high-thermal conductive insulation base is provided with a chip bearing plane surface bulge, and recesses are arranged on two sides of the bulge; through holes are respectively formed on the bulge and the recesses; the LED chip is arranged on the chip bearing plane surface bulge and used for packaging the molding lens, and the molding lens and the recess are filled. The LED chip is covered with fluorescent glue. An electrode is arranged in the through hole of each recess and connected with the LED chip and the circuit board through a conducting wire. The chip is welded on the base through a eutectic crystal, a circuit layer is directly connected with high-thermal conductive matters with through holes, so as to improve the heat conduction of the chip, and the molding lens is directly injected and packed on the LED in batch, thereby avoiding the secondary lens arrangement in the LED use. The utility model has strong heat conductivity and optical properties, low cost and high luminous efficiency.
Description
Technical field
The utility model relates to a kind of high-power LED lamp field that is used for the road traffic illumination, is specifically related to the LED encapsulating structure of light fixture.
Background technology
The prior art relevant with the application, its LED fitting structure generally includes: led chip, substrate and lens are that a plurality of led chips are encapsulated on the substrate by heat sink, colloid, the lens suit of the led chip after the encapsulation.Two electrodes of led chip are realized interconnecting by a plurality of pellet electrodes that are provided with on the welding substrate, and substrate is connected and fixed with the lamp body shell with heat sinking function, and high-power LED chip is directly welded in aluminium base usually, and its radiating effect is undesirable.Simultaneously, the effect of lens is to make light shine ground according to desirable hot spot effect.The design feature that these are a series of makes that heat radiation and lighting effect are unsatisfactory.At first led chip is welded on the planar substrates, and lens are installed above, and complex structure, light go out light effect and heat dispersion all can not be reached effect preferably.
The utility model content
In order effectively to address the above problem, the utility model provides a kind of rectangular light spot power-type LED encapsulating structure, and is rational in infrastructure, can effectively improve product manufacture, reduces production costs, and perfect heat-dissipating can produce desirable lighting effect.
The utility model provides such technical scheme, rectangular light spot power-type LED encapsulating structure, it comprises high heat conductive insulating pedestal, led chip and sealing lens, described high heat conductive insulating pedestal is provided with the chip bearing planar projections, the projection both sides are provided with recess, and projection and recess are provided with through hole respectively, and led chip is arranged on the chip bearing planar projections, led chip encapsulation sealing lens, sealing lens and recess are filled.
Above-mentioned led chip covers fluorescent glue.
Above-mentioned recess through hole is provided with electrode, connects led chip by lead.
Above-mentioned high heat conductive insulating base bottom is provided with circuit board, the circuit board connection electrode.
The rectangular light spot power-type LED encapsulating structure that the utility model provides, chip is welded on the high heat conductive insulating pedestal by eutectic, directly link to each other with the electrode substance of high heat conduction in the heat sink hole, improve chip heat conduction, the last directly encapsulation of LED has the sealing lens of rectangular light spot, adds secondary lens when avoiding LED to use again.When improving the LED heat-conductive characteristic, directly possessed the function of output rectangular light again, both simplified production technology, improved the LED optical property again, saved man-hour and cost.The injection moulding of sealing lens forms the mass productivity height.The chip bearing planar projections is provided with and can overcomes the drawback that a part of bright dipping is blocked in the concordant meeting with base bottom surface in chip bearing plane.Carrying platform is promoted certain altitude help doing high light-emitting efficiency.The high heat conductive insulating pedestal is provided with through hole, fills in high conduction material silver and can better improve radiating effect in through hole.
Below in conjunction with accompanying drawing technical solutions of the utility model are described in further detail.
Description of drawings
Fig. 1 is the utility model rectangular light spot power-type LED encapsulating structure schematic diagram.
Embodiment
In order to understand the utility model, make those skilled in the art can realize the utility model, see also accompanying drawing 1, understand the most preferred embodiment of the utility model.Rectangular light spot power-type LED encapsulating structure 1, it comprises high heat conductive insulating pedestal 2, led chip 3 and sealing lens 4, described high heat conductive insulating pedestal is provided with chip bearing planar projections 5, the projection both sides are provided with recess 6, projection 5 and recess 6 are provided with through hole 7,8 respectively, led chip 3 is arranged on the chip bearing planar projections 5, led chip 3 encapsulation sealing lens 9, and sealing lens 9 are filled with recess 9.Led chip 3 covers fluorescent glue 10.Recess 6 through holes are provided with electrode 11, connect led chip 3 by lead 12.High heat conductive insulating pedestal 2 bottoms are provided with circuit board 13, circuit board 13 connection electrode 11.
The geometric figure that the sealing lens shape preferably embodies in the accompanying drawing, its geometric optics has good rectangular light spot output effect.
Led chip and the welding of heat conducting base eutectic technology, the pedestal with good heat conductive insulation property is provided with through hole heat conduction, and packing colloid directly substitutes secondary lens, and the setting of bulge-structure is a novel substance that needs protection.
The base construction of embodiment of the present utility model is not limited to the described structure of present embodiment, conspicuous to those skilled in the art conversion or alternative all at protection range of the present utility model.
Claims (4)
1. rectangular light spot power-type LED encapsulating structure, it is characterized in that: it comprises high heat conductive insulating pedestal, led chip and sealing lens, described high heat conductive insulating pedestal is provided with the chip bearing planar projections, the projection both sides are provided with recess, projection and recess are provided with through hole respectively, led chip is arranged on the chip bearing planar projections, led chip encapsulation sealing lens, and sealing lens and recess are filled.
2. rectangular light spot power-type LED encapsulating structure as claimed in claim 1 is characterized in that: described led chip covers fluorescent glue.
3. rectangular light spot power-type LED encapsulating structure as claimed in claim 1 or 2 is characterized in that: described recess through hole is provided with electrode, connects led chip by lead.
4. rectangular light spot power-type LED encapsulating structure as claimed in claim 3 is characterized in that: described high heat conductive insulating base bottom is provided with circuit board, the circuit board connection electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202929159U CN201556644U (en) | 2009-12-14 | 2009-12-14 | Rectangular light spot power type LED encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202929159U CN201556644U (en) | 2009-12-14 | 2009-12-14 | Rectangular light spot power type LED encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201556644U true CN201556644U (en) | 2010-08-18 |
Family
ID=42616333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202929159U Expired - Fee Related CN201556644U (en) | 2009-12-14 | 2009-12-14 | Rectangular light spot power type LED encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201556644U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022319A (en) * | 2012-12-17 | 2013-04-03 | 四川鼎吉光电科技有限公司 | Light emitting diode (LED) encapsulating structure |
| CN103307481A (en) * | 2012-03-12 | 2013-09-18 | 松下电器产业株式会社 | Light emitting device, and illumination apparatus and luminaire using same |
| CN105870309A (en) * | 2015-02-06 | 2016-08-17 | Lg伊诺特有限公司 | Light-emitting device package and lighting apparatus including the package |
-
2009
- 2009-12-14 CN CN2009202929159U patent/CN201556644U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103307481A (en) * | 2012-03-12 | 2013-09-18 | 松下电器产业株式会社 | Light emitting device, and illumination apparatus and luminaire using same |
| CN103022319A (en) * | 2012-12-17 | 2013-04-03 | 四川鼎吉光电科技有限公司 | Light emitting diode (LED) encapsulating structure |
| CN105870309A (en) * | 2015-02-06 | 2016-08-17 | Lg伊诺特有限公司 | Light-emitting device package and lighting apparatus including the package |
| CN105870309B (en) * | 2015-02-06 | 2019-07-12 | Lg伊诺特有限公司 | Light emitting device package and lighting device comprising the encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100818 Termination date: 20151214 |
|
| EXPY | Termination of patent right or utility model |