CN104282676A - Integrated LED lamp panel packaging structure and technology - Google Patents
Integrated LED lamp panel packaging structure and technology Download PDFInfo
- Publication number
- CN104282676A CN104282676A CN201410485247.7A CN201410485247A CN104282676A CN 104282676 A CN104282676 A CN 104282676A CN 201410485247 A CN201410485247 A CN 201410485247A CN 104282676 A CN104282676 A CN 104282676A
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- led lamp
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
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Abstract
The invention provides an integrated LED lamp panel packaging structure. The integrated LED lamp panel packaging structure comprises a PCB, an LED substrate and LED chips. Holes are formed in the PCB at equal intervals. Bases are arranged on the LED substrate at equal intervals. The holes correspond to the bases. The height of each base is equal to the thickness of the PCB. The shape and the size of each base are matched with those of the corresponding hole. A drive circuit is arranged on the PCB. Constant-current IC chips in the drive circuit are unpackaged chips and are connected into the drive circuit through key alloy wires B. The LED chips are unpackaged chips. A chip groove is formed in each base. The LED chips are arranged in the chip grooves and are connected to the drive circuit through key alloy wires A. The LED chips and the constant-current IC chips are covered with fluorescent glue layers. The fluorescent glue layers also cover the key alloy wires A and the key alloy wires B. The integrated LED lamp panel packaging technology comprises the steps of bonding, wafer fixing, wire leading, glue dispensing, drying and welding. By the adoption of the integrated LED lamp panel packaging structure and technology, the heat resistance of an LED lamp panel can be reduced, the cooling performance of the LED lamp panel can be improved, the service life of an LED lamp can be prolonged, and cost and the technology complexity degree can be lowered.
Description
Technical field
The invention belongs to LED illumination and encapsulation technology, particularly relate to integral LED lamp plate encapsulating structure and packaging technology.
Background technology
Along with the universal of LED illumination lamp and high strength integrated circuit development, traditional LED lamp packaged type, no matter the growth requirement being cost and product stability have been difficult to meet LED illumination lamp.
Present stage, LED lamp panel packaged type was: by LED chip glue Surface Mount in cup-shape electrode metal or other substrate surfaces; then with superfine plain conductor by LED chip Electrode connection to electrode of substrate; high index of refraction colloid is utilized to fill whole substrate; play a protective role; just obtain on this basis one can be luminous LED element; then the LED element of single utilized series-parallel mode to be fixed on pcb board by Reflow Soldering or other welding manners, recycling Switching Power Supply or resistance-capacitance depressurization mode provide the condition of work of normal table.Due to present stage encapsulation, to there is equipment investment many with application technology, and manufacturing procedure is loaded down with trivial details just causes the high major reason of cost.The technique Surface Mount simultaneously packaged LED element being passed through again to weld is on PCB substrate, this operation turn increases the thermal resistance between LED-baseplate and pcb board, greatly reduce LED normal service life, again because contain multiple electric capacity and other electronic components in Switching Power Supply, reduce the stability of Total Product, and resistance-capacitance depressurization mode reactive loss is large.Therefore, need to be improved.
The invention provides a kind of integral LED lamp plate encapsulating structure and packaging technology, reduce LED lamp panel thermal resistance, improve the heat dispersion of LED lamp panel, the whole LED lamp life-span can be extended, and reduce costs and complex process degree.
Summary of the invention
The invention provides integral LED lamp plate encapsulating structure and packaging technology, to solve above-mentioned the deficiencies in the prior art, reduce LED lamp panel thermal resistance, improve the heat dispersion of LED lamp panel, the whole LED lamp life-span can be extended, and reduce costs and complex process degree.
In order to realize object of the present invention, intend adopting following technology:
Integral LED lamp plate encapsulating structure, comprise pcb board (1), LED-baseplate (2) and LED chip (3), it is characterized in that: described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101); Described pcb board (1) is provided with drive circuit, and the constant current IC chip (7) in described drive circuit is the bare chip do not encapsulated, and described constant current IC chip (7) accesses drive circuit by bonding gold thread B (62); Described LED chip (3) is the bare chip do not encapsulated, described pedestal (201) there is chip groove (202), described LED chip (3) is arranged in chip groove (202), and described LED chip (3) is connected to drive circuit by bonding gold thread A (61);
Described LED chip (3) and constant current IC chip (7) are coated with fluorescent adhesive layer (5);
Described fluorescent adhesive layer (5) also covers bonding gold thread A (61) and bonding gold thread B (62).
Further, described hole (101) are circular hole or square hole, and the pedestal matched (201) is for circular or square.
Further, described LED chip (3) is fixed in chip groove (202) by die bond glue-line (4), achieve direct welding (fixing), eliminate traditional support, not only save raw material, also reduce the thermal resistance between LED chip (3) and LED-baseplate (2), the heat dispersion of whole LED lamp panel (chip) can be improved, described chip groove (202) is the truncated cone stood upside down, its sidewall inclination angle is 0 ° ~ 90 °, more by the side luminescence back of LED chip (3) out, the light extraction efficiency of whole LED lamp panel can be improved.
Further, described chip groove (202) is the truncated cone stood upside down, and its sidewall inclination angle is 0 ° ~ 90 °.
Further, described pcb board (1) is close to LED-baseplate (2) top, and pcb board (1) profile and size are mated with LED-baseplate (2).
The packaging technology of integral LED lamp plate encapsulating structure, is characterized in that, comprise the following steps:
A, bonding: pcb board (1) is fitted in LED-baseplate (2) upper surface;
B, die bond: high thermal conductive silicon glue or elargol are coated in the die bond position of the die bond position on the chip groove (202) of pedestal (201) and the upper fixing constant current IC chip (7) of PCB (1), i.e. die bond glue-line (4), utilize bonder that LED chip (3) is fixed on the die bond position of chip groove (202), constant current IC chip (7) is fixed on the die bond position on PCB (1), baking, completes die bond;
C, lead-in wire: by gold wire ball bonder, utilize bonding gold thread A (61) to be connected on the circuit of pcb board (1) drive circuit by the both positive and negative polarity of LED chip (3), utilize bonding gold thread B (62) by the drive circuit of constant current IC chip (7) electrode access pcb board (1);
D, some glue: fluorescent material is mixed with high index of refraction colloid, form fluorescent glue, to LED chip (3) and constant current IC chip (7) upper some fluorescent glue, form fluorescent adhesive layer (5), cover LED chip (3) and constant current IC chip (7) respectively, and bonding gold thread A (61) and bonding gold thread B (62);
E, baking: by dry for fluorescent adhesive layer (5) baking;
F, welding: the relevant position other electronic devices and components needed for drive circuit being welded to pcb board (1), complete integral type encapsulation.
In step a, described pcb board (1) is bonded by heat-conducting glue and LED-baseplate (2).
Fluorescent material described in steps d is yellow fluorescent powder, or the hybrid combining of yellow fluorescent powder and red fluorescence powder, or the combination of yellow fluorescent powder and green emitting phosphor, or yellow fluorescent powder, red fluorescence powder, green emitting phosphor combination.
The blue light that LED chip (3) sends, after fluorescent adhesive layer (5), sends white light, and meanwhile, fluorescent adhesive layer (5) can also play sealing and protective effect.
The invention has the beneficial effects as follows:
1, LED chip is set directly in LED-baseplate, instead of the packaged type of traditional " chip+support+heat-radiating substrate ", decreases the thermal resistance from LED chip to LED-baseplate, improve the heat dispersion of LED lamp panel;
2, base height and pcb board consistency of thickness, after assembling, makes pcb board surfacing consistent, is convenient to full-filling fluorescent glue;
3, chip groove is the truncated cone stood upside down, and more by LED chip side luminescence back out, can improve the light extraction efficiency of whole LED lamp panel;
4, adopt the constant current IC chip do not encapsulated, be set directly on pcb board, utilize fluorescent glue to encapsulate, eliminate the loaded down with trivial details of individual packages constant current IC;
5, traditional packaging technology, be first by LED chip die bond on support, the both positive and negative polarity of LED chip is connected with the respective lead of support by bonding gold thread, at a fluorescent glue, again support is fixed on pcb board by heat-conducting glue, and support and pcb board are electrically connected, then at pcb board back adhesive heat-radiating substrate, finally also to be equipped with driving power separately.This mode, not only increase making (support and drive power supply) cost, and LED chip is higher to the thermal resistance of LED-baseplate, be unfavorable for heat radiation, and when being applied to LED lamp, independently driving power also can take certain volumetric spaces, be unfavorable for structural design and the optimization of light fixture.And packaged type of the present invention is: first pcb board and LED-baseplate are bonded, then the bare chip will do not encapsulated---LED chip and constant current IC chip be the IC chip die bond position of direct die bond in the chip groove of the pedestal of LED-baseplate and on pcb board respectively, again by by bonding gold thread by the circuit of drive circuit on the Electrode connection pcb board of the both positive and negative polarity of LED chip and constant current IC chip, then fluorescent glue is put, form fluorescent adhesive layer, not only cover LED chip and constant current IC chip, also cover their bonding gold thread, finally other electronic devices and components needed for drive circuit are welded to the relevant position of pcb board, complete integral type encapsulation, not only greatly reduce the thermal resistance of LED chip to LED-baseplate, eliminate the trouble of individual packages LED and constant current IC, save activity time and cost of material, and without the driving power that proportioning is independent,
6, integral LED lamp plate encapsulating structure of the present invention and technique can be applied to LED lamp tube, LED luminous lamp strip, LED down, LEDbulb lamp and other LED illumination products.
Accompanying drawing explanation
Fig. 1 shows decomposition texture schematic diagram of the present invention.
Fig. 2 shows the cross section view of pedestal of the present invention.
Fig. 3 shows the combining structure schematic diagram of LED-baseplate of the present invention and pcb board.
Fig. 4 shows the combining structure schematic diagram that the present invention applies LED-baseplate and pcb board after fluorescent glue.
Fig. 5 shows the structural representation of the embodiment of the present invention.
Embodiment
As shown in Fig. 1 ~ Fig. 5, integral LED lamp plate encapsulating structure, comprises pcb board (1), LED-baseplate (2) and LED chip (3).Described pcb board (1) is close to LED-baseplate (2) top, and pcb board (1) profile and size are mated with LED-baseplate (2).Described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, described hole (101) is circular hole or square hole, the pedestal (201) matched is for circular or square, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101); Described pcb board (1) is provided with drive circuit, and the constant current IC chip (7) in described drive circuit is the bare chip do not encapsulated, and described constant current IC chip (7) accesses drive circuit by bonding gold thread B (62); Described LED chip (3) is the bare chip do not encapsulated, described pedestal (201) there is chip groove (202), described LED chip (3) is arranged in chip groove (202), and described LED chip (3) is connected to drive circuit by bonding gold thread A (61); Described LED chip (3) and constant current IC chip (7) are coated with fluorescent adhesive layer (5); Described fluorescent adhesive layer (5) also covers bonding gold thread A (61) and bonding gold thread B (62).
Described LED chip (3) is fixed in chip groove (202) by die bond glue-line (4), achieve direct welding (fixing), eliminate traditional support, not only save raw material, also reduce the thermal resistance between LED chip (3) and LED-baseplate (2), the heat dispersion of whole LED lamp panel (chip) can be improved, described chip groove (202) is the truncated cone stood upside down, its sidewall inclination angle is 0 ° ~ 90 °, more by the side luminescence back of LED chip (3) out, the light extraction efficiency of whole LED lamp panel can be improved.
The packaging technology of integral LED lamp plate encapsulating structure, comprises the following steps:
A, bonding: pcb board (1) is fitted in LED-baseplate (2) upper surface;
B, die bond: high thermal conductive silicon glue or elargol are coated in the die bond position of the die bond position on the chip groove (202) of pedestal (201) and the upper fixing constant current IC chip (7) of PCB (1), i.e. die bond glue-line (4), utilize bonder that LED chip (3) is fixed on the die bond position of chip groove (202), constant current IC chip (7) is fixed on the die bond position on PCB (1), baking, completes die bond;
C, lead-in wire: by gold wire ball bonder, utilize bonding gold thread A (61) to be connected on the circuit of pcb board (1) drive circuit by the both positive and negative polarity of LED chip (3), utilize bonding gold thread B (62) by the drive circuit of constant current IC chip (7) electrode access pcb board (1);
D, some glue: fluorescent material is mixed with high index of refraction colloid, form fluorescent glue, to LED chip (3) and constant current IC chip (7) upper some fluorescent glue, form fluorescent adhesive layer (5), cover LED chip (3) and constant current IC chip (7) respectively, and bonding gold thread A (61) and bonding gold thread B (62);
E, baking: by dry for fluorescent adhesive layer (5) baking;
F, welding: the relevant position other electronic devices and components needed for drive circuit being welded to pcb board (1), complete integral type encapsulation.
In step a, described pcb board (1) is bonded by heat-conducting glue and LED-baseplate (2).
Fluorescent material described in steps d is yellow fluorescent powder, or the hybrid combining of yellow fluorescent powder and red fluorescence powder, or the combination of yellow fluorescent powder and green emitting phosphor, or yellow fluorescent powder, red fluorescence powder, green emitting phosphor combination.
Fig. 5 is the example that the present invention is applied to strip-shaped LED lamp plate.Embodiment is:
1, pcb board (1) and LED-baseplate (2) is first prepared.Described pcb board (1) profile and size are mated with LED-baseplate (2).Described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, described hole (101) is circular hole or square hole, the pedestal (201) matched is for circular or square, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101), described pedestal (201) there is chip groove (202), described pcb board (1) is provided with the electronic circuit that drive circuit needs to use.Described chip groove (202) is the truncated cone stood upside down.
2, get out the bare chip of non-individual packages---LED chip (3) and and constant current IC chip (7), and the material such as high thermal conductive silicon glue or elargol, heat-conducting glue, bonding gold thread (6), fluorescent material, high viscosity colloid, also have the electric components needed for drive circuit.
3, pcb board (1) is fitted in LED-baseplate (2) upper surface by heat-conducting glue or other technique, completes bonding.
High thermal conductive silicon glue or elargol are coated in the die bond position of the die bond position 4, on the chip groove (202) of pedestal (201) and the upper fixing constant current IC chip (7) of PCB (1), i.e. die bond glue-line (4), utilize bonder that LED chip (3) is fixed on the die bond position of chip groove (202), constant current IC chip (7) is fixed on the die bond position on PCB (1), baking, completes die bond;
5, by gold wire ball bonder, utilize bonding gold thread A (61) to be connected on the circuit of pcb board (1) drive circuit by the both positive and negative polarity of LED chip (3), utilize bonding gold thread B (62) by the drive circuit of constant current IC chip (7) electrode access pcb board (1).
6, fluorescent material is mixed with high index of refraction colloid, form fluorescent glue, to LED chip (3) and constant current IC chip (7) upper some fluorescent glue, form fluorescent adhesive layer (5), cover LED chip (3) and constant current IC chip (7) respectively, and bonding gold thread A (61) and bonding gold thread B (62).
7, by dry for fluorescent adhesive layer (5) baking.
8, other electronic devices and components needed for drive circuit are welded to the relevant position of pcb board (1), other electronic devices and components of concrete welding have: protective tube, bridge rectifier, current-limiting resistance, bleeder resistance, shunt capacitance, voltage stabilizing didoe, Zener diode, complete integral type encapsulation, realize directly welding drive circuit on pcb board (1), eliminate the trouble of design drive power supply.
The blue light that LED chip (3) sends, after fluorescent adhesive layer (5), sends white light, and meanwhile, fluorescent adhesive layer (5) can also play sealing and protective effect.
Claims (8)
1. integral LED lamp plate encapsulating structure, comprises pcb board (1), LED-baseplate (2) and LED chip (3), it is characterized in that:
Described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101);
Described pcb board (1) is provided with drive circuit, and the constant current IC chip (7) in described drive circuit is the bare chip do not encapsulated, and described constant current IC chip (7) accesses drive circuit by bonding gold thread B (62);
Described LED chip (3) is the bare chip do not encapsulated, described pedestal (201) there is chip groove (202), described LED chip (3) is arranged in chip groove (202), and described LED chip (3) is connected to drive circuit by bonding gold thread A (61);
Described LED chip (3) and constant current IC chip (7) are coated with fluorescent adhesive layer (5);
Described fluorescent adhesive layer (5) also covers bonding gold thread A (61) and bonding gold thread B (62).
2. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described hole (101) are circular hole or square hole, and the pedestal matched (201) is for circular or square.
3. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described LED chip (3) is fixed in chip groove (202) by die bond glue-line (4).
4. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described chip groove (202) is the truncated cone stood upside down, and its sidewall inclination angle is 0 ° ~ 90 °.
5. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described pcb board (1) is close to LED-baseplate (2) top, and pcb board (1) profile and size are mated with LED-baseplate (2).
6. the packaging technology of integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, comprise the following steps:
A, bonding: pcb board (1) is fitted in LED-baseplate (2) upper surface;
B, die bond: high thermal conductive silicon glue or elargol are coated in the die bond position of the die bond position on the chip groove (202) of pedestal (201) and the upper fixing constant current IC chip (7) of PCB (1), i.e. die bond glue-line (4), utilize bonder that LED chip (3) is fixed on the die bond position of chip groove (202), constant current IC chip (7) is fixed on the die bond position on PCB (1), baking, completes die bond;
C, lead-in wire: by gold wire ball bonder, utilize bonding gold thread A (61) to be connected on the circuit of pcb board (1) drive circuit by the both positive and negative polarity of LED chip (3), utilize bonding gold thread B (62) by the drive circuit of constant current IC chip (7) electrode access pcb board (1);
D, some glue: fluorescent material is mixed with high index of refraction colloid, form fluorescent glue, to LED chip (3) and constant current IC chip (7) upper some fluorescent glue, form fluorescent adhesive layer (5), cover LED chip (3) and constant current IC chip (7) respectively, and bonding gold thread A (61) and bonding gold thread B (62);
E, baking: by dry for fluorescent adhesive layer (5) baking;
F, welding: the relevant position other electronic devices and components needed for drive circuit being welded to pcb board (1), complete integral type encapsulation.
7. the packaging technology of integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, in step a, described pcb board (1) is bonded by heat-conducting glue and LED-baseplate (2).
8. the packaging technology of integral LED lamp plate encapsulating structure according to claim 1, it is characterized in that, fluorescent material described in steps d is yellow fluorescent powder, or the hybrid combining of yellow fluorescent powder and red fluorescence powder, or the combination of yellow fluorescent powder and green emitting phosphor, or yellow fluorescent powder, red fluorescence powder, green emitting phosphor combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410485247.7A CN104282676A (en) | 2014-09-22 | 2014-09-22 | Integrated LED lamp panel packaging structure and technology |
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| CN201410485247.7A CN104282676A (en) | 2014-09-22 | 2014-09-22 | Integrated LED lamp panel packaging structure and technology |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107101095A (en) * | 2017-05-31 | 2017-08-29 | 陆春生 | A kind of LED disjunctors Frame lamp and its production technology |
| CN108461604A (en) * | 2018-05-31 | 2018-08-28 | 福建鸿博光电科技有限公司 | A kind of LED light integrated encapsulation method and encapsulating structure |
| CN110094700A (en) * | 2019-04-29 | 2019-08-06 | 深圳市天宇力程光电科技有限公司东莞分公司 | A kind of LED lamp integrated punching molding structure and process |
| CN110248446A (en) * | 2019-07-02 | 2019-09-17 | 绿亚科技(平潭)有限公司 | A kind of constant current LED lamp |
| US10480720B2 (en) | 2017-08-17 | 2019-11-19 | Microsoft Technology Licensing, Llc | Active illumination source and PCB components having mountings for reduced Z-height and improved thermal conductivity |
| CN111968531A (en) * | 2020-08-14 | 2020-11-20 | 深圳市锐拓显示技术有限公司 | LED display module, manufacturing method and LED display screen |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107101095A (en) * | 2017-05-31 | 2017-08-29 | 陆春生 | A kind of LED disjunctors Frame lamp and its production technology |
| US10480720B2 (en) | 2017-08-17 | 2019-11-19 | Microsoft Technology Licensing, Llc | Active illumination source and PCB components having mountings for reduced Z-height and improved thermal conductivity |
| CN108461604A (en) * | 2018-05-31 | 2018-08-28 | 福建鸿博光电科技有限公司 | A kind of LED light integrated encapsulation method and encapsulating structure |
| CN108461604B (en) * | 2018-05-31 | 2024-06-07 | 福建鸿博光电科技有限公司 | LED lamp integrated packaging method and packaging structure |
| CN110094700A (en) * | 2019-04-29 | 2019-08-06 | 深圳市天宇力程光电科技有限公司东莞分公司 | A kind of LED lamp integrated punching molding structure and process |
| CN110248446A (en) * | 2019-07-02 | 2019-09-17 | 绿亚科技(平潭)有限公司 | A kind of constant current LED lamp |
| CN111968531A (en) * | 2020-08-14 | 2020-11-20 | 深圳市锐拓显示技术有限公司 | LED display module, manufacturing method and LED display screen |
| CN114464608A (en) * | 2022-02-16 | 2022-05-10 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
| CN114464608B (en) * | 2022-02-16 | 2022-11-15 | 深圳市旋彩电子有限公司 | COB (chip on board) double-color light source of photographic lamp and packaging method thereof |
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Application publication date: 20150114 |