CN112599514A - High-quality full-color semiconductor light source - Google Patents
High-quality full-color semiconductor light source Download PDFInfo
- Publication number
- CN112599514A CN112599514A CN202011642963.3A CN202011642963A CN112599514A CN 112599514 A CN112599514 A CN 112599514A CN 202011642963 A CN202011642963 A CN 202011642963A CN 112599514 A CN112599514 A CN 112599514A
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- Prior art keywords
- led
- glue
- light source
- chip
- fluorescent powder
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 63
- 239000000843 powder Substances 0.000 claims abstract description 41
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 108010043121 Green Fluorescent Proteins Proteins 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000012858 packaging process Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000009877 rendering Methods 0.000 abstract description 3
- 230000005284 excitation Effects 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000009517 secondary packaging Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Abstract
The invention discloses a high-quality full-color semiconductor light source, which is characterized in that: the semiconductor light source comprises an LED light-emitting unit, an LED bracket, packaging glue and the like, wherein the LED light-emitting unit comprises a red LED chip, a green LED chip and a blue LED chip; the LED support comprises a metal bonding pad, pins and an outer lead frame; the packaging glue comprises transparent glue and phosphor-added glue. The LED chip is electrically connected with the support pins, then the LED chip is packaged by adopting a two-layer packaging structure with transparent glue under and fluorescent powder glue on, and the upper surface of the transparent glue is higher than that of the LED chip. The invention can obtain the full-color light source by packaging the red, green and blue chips together, and can improve the color rendering property of the light source by adding the fluorescent powder for packaging.
Description
Technical Field
The invention relates to a high-quality full-color semiconductor light source, and belongs to the field of semiconductor photoelectricity.
Background
The LED semiconductor light source is used as a fourth-generation light source, has the characteristics of excellent energy conservation, environmental protection, low cost, long service life, small volume and the like, and is widely researched and applied in the fields of illumination, display and the like. In recent years, with the increasing demand for light quality and the diversified demands for light source selection from different application scenes, more light color and high quality light sources are required in the future to meet the increasing demands of lighting applications.
The existing mainstream LED lighting source is mainly prepared by exciting yellow fluorescent powder by an LED blue light (B) chip, and the yellow light (Y) generated by excitation is mixed with the rest blue light to obtain white light with a certain color temperature. However, the color temperature of the existing LED lighting source is fixed, and mainly focuses on the white light color temperature range or single color lighting, and the lighting source of any other color is relatively deficient, so that the existing mainstream light source cannot meet the requirement of the scene needing specific color lighting.
In order to obtain any color light source, the LED display screen principle can be used for reference, and the light mixing is realized by red (R), green (G) and blue (B) chips, but because the spectral distribution of the light obtained by the LED chips is narrow, the obtained mixed light source has low color rendering and poor light quality; or the red, green, yellow and other fluorescent powders can be excited by the short-wavelength chip, but the obtained light source has low light efficiency and large color difference, and the fluorescent powders are easy to precipitate to the bottom of the glue water if not being timely hardened in the packaging glue water, as shown in fig. 1, the manufacturability is poor, and the problem that the performance of the product is reduced because the fluorescent powders cannot be effectively excited due to the fact that the LED chip is in a surface light emitting mode cannot be effectively solved in batch production is solved.
Disclosure of Invention
In order to solve the problems, the invention provides a high-quality full-color semiconductor light source, which can obtain a full-color light source by packaging red, green and blue chips together, and simultaneously adds fluorescent powder for packaging, wherein the blue chip is arranged at the center of the LED light source in order to improve the excitation uniformity of the blue chip to the fluorescent powder, and the LED chip is provided with a two-layer packaging structure with transparent glue under and fluorescent powder glue on, and the upper surface of the transparent glue is higher than that of the LED chip, so that the light source obtained finally can effectively solve the excitation failure problem caused by fluorescent powder precipitation while improving the reliability of the light source, and the high-quality full-color light source is obtained.
In order to achieve the purpose, the technical scheme of the invention is as follows: the semiconductor light source comprises an LED light-emitting unit, an LED bracket, packaging glue and the like, wherein the LED light-emitting unit comprises a red LED chip, a green LED chip and a blue LED chip; the LED support comprises a metal bonding pad, pins and an outer lead frame; the packaging glue comprises transparent glue and phosphor-added glue. The LED chip is electrically connected with the support pins, then the LED chip is packaged by adopting a two-layer packaging structure with transparent glue under and fluorescent powder glue on, and the upper surface of the transparent glue is higher than that of the LED chip.
Further, the LED chip is of a forward mounting or flip chip structure, wherein the forward mounting chip is connected to the support pins by lead bonding, and the flip chip is connected to the support pins by conductive materials.
Further, the LED support is of a four-pin or six-pin surface-mounted structure.
Further, the LED blue light chip is distributed at the central position of the light source, and the LED red light chip and the LED green light chip are distributed around the LED blue light chip.
Furthermore, the main material of the packaging glue is transparent silicon resin or silica gel.
Further, the fluorescent powder comprises any one or more of red fluorescent powder, yellow-green fluorescent powder and green fluorescent powder.
Furthermore, the fluorescent powder glue is obtained by adding fluorescent powder into transparent glue, and the adding content and the type of the fluorescent powder depend on the selection of the color coordinate of the semiconductor light source.
Further, the LED chip adopts a two-layer packaging structure with transparent glue below and fluorescent powder glue above, the two layers of glue are in close contact, the upper surface of the transparent glue is higher than the LED chip and lower than the upper surface of the LED support bowl, and the upper surface of the fluorescent powder glue is not lower than the upper surface of the LED support bowl.
Furthermore, the two-layer packaging structure corresponds to two packaging processes, and after the transparent glue is packaged and hardened, the fluorescent powder glue is added for sealing and hardening.
Has the advantages that: the semiconductor light source obtained by the technical scheme can achieve the following effects:
(1) the light source can realize full-color light color, and is suitable for application requirements of any scene.
(2) The fluorescent powder is added for packaging, and the light source color rendering property can be improved because the fluorescent powder has wider spectral distribution and can be directly excited by the blue chip.
(3) The blue light chip is arranged at the center of the LED light source, so that the fluorescent powder is uniformly excited, and the light quality is good.
(4) The LED chip is of a two-layer packaging structure with transparent glue under and fluorescent powder glue on, the upper surface of the transparent glue is higher than that of the LED chip, the reliability of a light source can be improved, the problem of excitation failure caused by fluorescent powder precipitation can be effectively solved, and therefore the optical performance of the light source is improved.
Drawings
FIG. 1 is a cross-sectional view of a conventional LED light source structure
FIG. 2 is a top view of a semiconductor light source structure according to embodiment 1 of the present invention
FIG. 3 is a cross-sectional view of a semiconductor light source structure according to embodiment 1 of the present invention
FIG. 4 is a top view of a semiconductor light source structure in accordance with embodiment 2 of the present invention
Reference numerals:
1-an outer lead frame of the LED bracket; 2-a support metal pad; 3-bracket pins; 41-LED blue light (B) chip; 42-LED red (R) chip; 43-LED green (G) chip; 5-a conductive lead; 6-transparent packaging glue; 7-fluorescent powder-added packaging glue
Detailed Description
The present invention is further illustrated by the following figures and detailed description of specific embodiments thereof, it is to be understood that these embodiments are given by way of illustration only and not by way of limitation, and that various equivalent modifications of the invention will become apparent to those skilled in the art upon reading the present disclosure and are intended to fall within the scope of the appended claims.
Example 1
The selected semiconductor light source is in a surface-mounted six-pin structure, as shown in fig. 2, the main components of the light source comprise an LED support, an LED chip, packaging glue and the like, the LED chip selects a red light (R) chip 42 which is positively provided with a vertical structure, a green light (G) chip 43 which is positively provided with a horizontal structure and a blue light (B) chip 41, the three chips are sequentially fixed on a metal bonding pad 2 of the LED support according to the sequence of R-B-G or G-B-R, wherein the R chip is bonded by using conductive slurry, the G and B chips are bonded by using insulating slurry, and the positive and negative electrodes of the LED chip are respectively and electrically connected with six pins 3 of the support by using conductive lead wires 5.
Mixing and stirring the two-component silicone A, B glue in proportion and defoaming to obtain transparent packaging glue 6, adding a certain amount of transparent glue into yellow fluorescent powder with an excitation peak value of about 570nm in proportion, mixing and stirring and defoaming to obtain fluorescent powder-added glue 7, wherein the adding proportion and the types of the fluorescent powder depend on the light color parameters of a required light source. As shown in fig. 3, the R, G, B chips are packaged by the transparent packaging glue 6 in a dispensing manner, specifically, the transparent glue 6 is dripped into a bowl cavity on the LED support where the chips are placed, the upper surface of the glue is higher than the light-emitting surfaces of the upper surfaces of the three chips and lower than the upper surface of the support bowl, and then the transparent glue 6 is put into an oven for hardening, after hardening, the phosphor powder-added glue 7 is used for secondary packaging of the LED chips in a dispensing or spraying manner, specifically, the phosphor powder-added glue 7 is continuously added into the unfilled support bowl cavity, the upper surface of the glue is not lower than the upper surface of the support bowl, and after hardening, the semiconductor light source with a two-layer packaging structure is obtained.
Example 2
The light source implementation manner of the present embodiment is evolved on the basis of embodiment 1, and is different from embodiment 1 in that: r, G, B chips all adopt flip-chip structure, and carry out electrical connection to chip positive and negative pole and support pin through conducting material, as shown in fig. 4, the phosphor powder selects the red of excitation peak value 630nm and the green phosphor powder of 530nm simultaneously. The remaining implementation forms or processes are all performed with reference to embodiment 1, and are not described herein again.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A high quality full color semiconductor light source, comprising: the semiconductor light source comprises an LED light-emitting unit, an LED bracket, packaging glue and the like, wherein the LED light-emitting unit comprises a red LED chip, a green LED chip and a blue LED chip; the LED support comprises a metal bonding pad, pins and an outer lead frame; the packaging glue comprises transparent glue and phosphor-added glue. The LED chip is electrically connected with the support pins, then the LED chip is packaged by adopting a two-layer packaging structure with transparent glue under and fluorescent powder glue on, and the upper surface of the transparent glue is higher than that of the LED chip.
2. A high quality full color semiconductor light source as claimed in claim 1, wherein: the LED chip is of a forward mounting or inverted mounting structure, wherein the forward mounting chip is in lead bonding, and the inverted mounting chip is connected to the pins of the bracket by adopting a conductive material.
3. A high quality full color semiconductor light source as claimed in claim 1, wherein: the LED support is of a four-pin or six-pin surface-mounted structure.
4. A high quality full color semiconductor light source as claimed in claim 1, wherein: the LED blue light chip is distributed at the central position of the light source, and the LED red light chip and the LED green light chip are distributed around the LED blue light chip.
5. A high quality full color semiconductor light source as claimed in claim 1, wherein: the main material of the packaging glue is transparent silicon resin or silica gel.
6. A high quality full color semiconductor light source as claimed in claim 1, wherein: the fluorescent powder comprises one or more of red fluorescent powder, yellow-green fluorescent powder and green fluorescent powder.
7. A high quality full color semiconductor light source as claimed in claim 1 or 6, wherein: the fluorescent powder glue is obtained by adding fluorescent powder into transparent glue, and the adding content and the type of the fluorescent powder depend on the selection of the color coordinate of the semiconductor light source.
8. A high quality full color semiconductor light source as claimed in claim 1, wherein: the LED chip adopts a two-layer packaging structure with transparent glue below and fluorescent powder glue above, the two layers of glue are in close contact, the upper surface of the transparent glue is higher than the LED chip and lower than the upper surface of the LED support bowl, and the upper surface of the fluorescent powder glue is not lower than the upper surface of the LED support bowl.
9. A high quality full color semiconductor light source as claimed in claim 1 or 8, wherein: the two-layer packaging structure corresponds to two packaging processes, and after the transparent glue is packaged and hardened, the fluorescent powder glue is added for water sealing and hardening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642963.3A CN112599514A (en) | 2020-12-31 | 2020-12-31 | High-quality full-color semiconductor light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642963.3A CN112599514A (en) | 2020-12-31 | 2020-12-31 | High-quality full-color semiconductor light source |
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| Publication Number | Publication Date |
|---|---|
| CN112599514A true CN112599514A (en) | 2021-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011642963.3A Pending CN112599514A (en) | 2020-12-31 | 2020-12-31 | High-quality full-color semiconductor light source |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314042A (en) * | 2021-04-26 | 2021-08-27 | 厦门大学 | Flexible transparent LED display screen |
| CN113517266A (en) * | 2021-05-06 | 2021-10-19 | 南京工业大学 | Semiconductor light source with uniform light color |
| CN114388678A (en) * | 2021-07-15 | 2022-04-22 | 南京工业大学 | High-quality accurate controllable colour temperature light source |
| CN115799433A (en) * | 2023-01-09 | 2023-03-14 | 四川世纪和光科技发展有限公司 | Red light packaging structure, red light LED light source and packaging method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202633302U (en) * | 2012-04-26 | 2012-12-26 | 广东德豪润达电气股份有限公司 | Led device |
| CN203118988U (en) * | 2013-03-06 | 2013-08-07 | 河南森源集团有限公司 | Packaging structure of multi-chip high-color-rendering COB |
| CN203491257U (en) * | 2013-09-10 | 2014-03-19 | 中山市光圣半导体科技有限责任公司 | Novel COB (Chip On Board) light source with high color rendering index |
| CN210778584U (en) * | 2019-09-05 | 2020-06-16 | 深圳市两岸光电科技有限公司 | Full-color LED packaging device with light emitting from side surface |
-
2020
- 2020-12-31 CN CN202011642963.3A patent/CN112599514A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202633302U (en) * | 2012-04-26 | 2012-12-26 | 广东德豪润达电气股份有限公司 | Led device |
| CN203118988U (en) * | 2013-03-06 | 2013-08-07 | 河南森源集团有限公司 | Packaging structure of multi-chip high-color-rendering COB |
| CN203491257U (en) * | 2013-09-10 | 2014-03-19 | 中山市光圣半导体科技有限责任公司 | Novel COB (Chip On Board) light source with high color rendering index |
| CN210778584U (en) * | 2019-09-05 | 2020-06-16 | 深圳市两岸光电科技有限公司 | Full-color LED packaging device with light emitting from side surface |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314042A (en) * | 2021-04-26 | 2021-08-27 | 厦门大学 | Flexible transparent LED display screen |
| CN113517266A (en) * | 2021-05-06 | 2021-10-19 | 南京工业大学 | Semiconductor light source with uniform light color |
| CN114388678A (en) * | 2021-07-15 | 2022-04-22 | 南京工业大学 | High-quality accurate controllable colour temperature light source |
| CN115799433A (en) * | 2023-01-09 | 2023-03-14 | 四川世纪和光科技发展有限公司 | Red light packaging structure, red light LED light source and packaging method |
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