CN113517266A - Semiconductor light source with uniform light color - Google Patents
Semiconductor light source with uniform light color Download PDFInfo
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- CN113517266A CN113517266A CN202110492508.8A CN202110492508A CN113517266A CN 113517266 A CN113517266 A CN 113517266A CN 202110492508 A CN202110492508 A CN 202110492508A CN 113517266 A CN113517266 A CN 113517266A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
Abstract
The invention discloses a semiconductor light source with uniform light color, which is characterized in that: the semiconductor light source comprises an LED light-emitting unit, an LED substrate and a chip resistor, wherein the LED light-emitting unit comprises a red LED chip, a green LED chip and a blue LED chip, the chips with the same color are not adjacent, and any three adjacent chips can form a regular triangle; the LED substrate is provided with an LED chip bonding pad, chip positive and negative bonding pads and circuit wiring, the LED chip bonding pads, the chip positive and negative bonding pads and the circuit wiring are respectively used for bearing the LED chip and connecting the positive and negative electrodes of the chip, the chips of the same type are mutually connected and are connected in series with a group of chip resistors, and then the chip circuits of the three chips are connected in parallel. The light source controls and adjusts optical parameters of various chips through different chip resistors to realize any required light color; simultaneously through being triangle-shaped evenly interactive distribution with the three-colour chip, can make more even symmetry than conventional rectangle array after the light mixes to satisfy the light source color, the higher application demand of quality requirement.
Description
Technical Field
The invention relates to a semiconductor light source with uniform light color, and belongs to the field of semiconductor lighting application.
Background
The LED light source has the characteristics of high lighting effect, long service life, energy conservation, environmental protection, green production and the like, meets the national requirements of energy conservation type national construction, and is widely applied to the field of illumination in recent years. With the demand for basic lighting being met, the demand for lighting is increasing, and more light and high-quality light sources are required in the future to meet the increasing demand for lighting. And the diverse requirements of different application scenarios on light source selection.
In addition to white light illumination, light sources of any color are one of the directions that need improvement. In the realization of any color light source, research is carried out on the mixing of any color by exciting the fluorescent powder by ultraviolet light to generate tricolor light. However, the existing ultraviolet chip and phosphor powder are excited by mixing, the light extraction efficiency is low, and the epoxy resin used for encapsulation is easy to decompose and age under the irradiation of ultraviolet light, so that the light transmittance is reduced. Or the display technology is used for reference, the tricolor chip directly emits light, but the circuit is complex, the control cost is high, and the method is not suitable for the illumination industry.
In addition, most of the existing surface light sources adopt rectangular arrays no matter single-color chips or three-color chips, the distance between the light emitting units is large, and dark areas always exist in the areas among the light emitting units, so that the light emitting surface is uneven, and the problems of glare and the like exist, and the high-end lighting industry cannot be met.
Disclosure of Invention
In order to solve the above problems, the present invention provides a semiconductor light source with uniform light color, which controls and adjusts the optical parameters of various chips through different chip resistors to realize any desired light color; simultaneously through being regular triangle-shaped evenly interactive distribution with the three-colour chip, can make more even symmetry than conventional rectangular array after the light mixes to satisfy the light source color, the higher application demand of quality requirement.
In order to achieve the purpose, the technical scheme of the invention is as follows: the semiconductor light source comprises an LED light-emitting unit, an LED substrate and a chip resistor, wherein the LED light-emitting unit comprises a red light (R) LED chip, a green light (G) LED chip and a blue light (B) LED chip which are arranged alternately and are distributed on the LED substrate in a staggered manner; the LED substrate is provided with an LED chip bonding pad, chip positive and negative bonding pads and circuit wiring, the LED chip bonding pads, the chip positive and negative bonding pads and the circuit wiring are respectively used for bearing the LED chip and connecting the positive and negative electrodes of the chip, the chips of the same type are mutually connected and are connected in series with a group of chip resistors, and then the chip circuits of the three chips are connected in parallel.
Further, the LED chip is of a forward mounting or inverted mounting structure, wherein the forward mounting chip is in lead bonding, and the inverted mounting chip is connected to the positive and negative electrode bonding pads of the substrate through a conductive material.
Further, the LED chip is integrally encapsulated with silicone resin or epoxy resin.
Furthermore, R, G, B chips are arranged in an alternating and cyclic manner between rows, a group of R-G-B chips is used as a cyclic unit, adjacent rows are arranged in a staggered manner, chips of the same color are not adjacent, and any adjacent three-color chips can form a regular triangle.
Furthermore, R, G, B chips of the same type can be connected in series or in parallel, and then are uniformly connected in series with a group of chip resistors; different kinds of chips are connected in parallel.
Furthermore, three groups of chip resistor bonding pads are arranged on the LED substrate and are respectively connected to various LED chip circuits.
Furthermore, the number of the chip resistors is three, and the chip resistors are respectively arranged on the bonding pads of the three chip resistors to conduct a circuit.
Further, the specification of each group of chip resistors can be selected according to the target light color and the circuit characteristics of the light source, wherein the light color parameters comprise color coordinates, light flux or brightness, power and the like.
Furthermore, a group of positive and negative power supply pads are arranged on the LED substrate and are respectively connected with the positive and negative electrodes of the parallel circuit.
Has the advantages that: the semiconductor light source obtained by the technical scheme can achieve the following effects:
(1) the light color of the light source can be adjusted at will, the design can be carried out according to the actual application requirements, and the LED light source can be suitable for or meet any lighting application scene.
(2) The R, G, B chips are adopted as the light sources and are distributed in a regular triangle shape in an interactive mode, light mixing and light emitting can be more uniform and symmetrical, and technical support is provided for the lighting application requirements with higher quality.
(3) The light source does not need to use a lens or a diffusion plate for secondary light distribution, so that the cost is saved, and the structure is simplified.
(4) The light source does not need to use fluorescent powder, so that the problem of light attenuation caused by the fluorescent powder is avoided, and the service life is prolonged.
(5) The light source has simple structure and convenient realization, and is suitable for industrial batch production.
Drawings
FIG. 1 is a schematic view of an LED substrate structure of a semiconductor light source according to the present invention
FIG. 2 is a top view of the semiconductor light source structure of the present invention
FIG. 3 is a cross-sectional view of a semiconductor light source according to the present invention
FIG. 4 is a schematic circuit diagram of a semiconductor light source of the present invention
Reference numerals:
1-LED substrate functional area; 11-a chip pad; 12-positive and negative pads of the chip; 2-a chip resistor pad; 3-positive and negative power supply pads; 41-R chip; 42-G chip; 43-B chip; 5-patch resistance; 6-packaging glue; 7-LED substrate circuit routing.
Detailed Description
The present invention is further illustrated by the following figures and detailed description of specific embodiments thereof, it is to be understood that these embodiments are given by way of illustration only and not by way of limitation, and that various equivalent modifications of the invention will become apparent to those skilled in the art upon reading the present disclosure and are intended to fall within the scope of the appended claims.
Example 1
According to the practical application requirement of the semiconductor light source, various specification indexes of the light source are designed. The light source light emitting units listed in this embodiment are 9 × 5 arrays, in which 9 × 4 arrays are inserted in a staggered manner, as shown in fig. 1, the light emitting units include R, G, B chips, as shown in fig. 2, the arrangement modes of the three chips are alternate and cyclic arrangement between lines, staggered arrangement between adjacent lines, and interlaced alignment, as the first line: R-G-B-R-G-B-R-G-B, second row: B-R-G-B-R-G-B-R-G, (and so that any adjacent three-color chips may form a regular triangle) third row: R-G-B-R-G-B-R-G-B. The sequence is circulated, the distance between the light-emitting units is set to be 2mm, each type of chips are connected with each other, the shape embodiment adopts the mode that the rows or the columns are connected in parallel and then in series, as shown in figure 4, the chip resistors are uniformly connected in series, and the different types of chips are connected in parallel to the whole circuit loop.
Meanwhile, target light color parameters of the light source are set, color coordinates of the target color are set to be (x, Y), total luminous flux is set to be Y, power of the light source is set to be P, and patch resistance parameters required in each branch of R, G, B are calculated according to a theoretical light mixing formula and a correction equation and by combining a circuit design mechanism.
For the specific implementation operation flow of the light source, reference is made to the following:
as shown in fig. 1-4, the LED substrate is manufactured according to the above requirements, the R chip 41, the G chip 42, and the B chip 43 are respectively fixed on the chip bonding pad 11 of the LED substrate functional area 1 according to the above sequence, wherein the R chip is of a vertical structure, the G and B chips are of horizontal structures, the positive and negative electrodes of each chip are connected with the positive and negative chip bonding pads 12 on the LED substrate by using a wire bonding method, then the LED chip is packaged by using a plastic package method, the packaging adhesive 6 is made of a silicone resin material, the corresponding chip resistors 5 in the branches R, G, B are attached to the corresponding chip resistor bonding pads 2 on the LED substrate after the packaging is completed, and finally the light source is driven according to the designed power.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (9)
1. A semiconductor light source with uniform light color is characterized in that: the semiconductor light source comprises an LED light-emitting unit, an LED substrate and a chip resistor, wherein the LED light-emitting unit comprises a red LED chip, a green LED chip and a blue LED chip, the chips with the same color are not adjacent, and any three adjacent chips can form a regular triangle; the LED substrate is provided with an LED chip bonding pad, chip positive and negative bonding pads and circuit wiring, the LED chip bonding pads, the chip positive and negative bonding pads and the circuit wiring are respectively used for bearing the LED chip and connecting the positive and negative electrodes of the chip, the chips of the same type are mutually connected and are connected in series with a group of chip resistors, and then the chip circuits of the three chips are connected in parallel. The light source controls and adjusts optical parameters of various chips through different chip resistors to realize any required light color; simultaneously through being triangle-shaped evenly interactive distribution with the three-colour chip, can make more even symmetry than conventional rectangle array after the light mixes to satisfy the light source color, the higher application demand of quality requirement.
2. A semiconductor light source of uniform light color as recited in claim 1, wherein: the LED chip is of a forward mounting or inverted mounting structure, wherein the forward mounting chip is in lead bonding, and the inverted mounting chip is connected to the positive and negative electrode bonding pads of the substrate through conductive materials.
3. A semiconductor light source of uniform light color as recited in claim 1, wherein: the LED chip is integrally packaged by adopting silicone resin or epoxy resin.
4. A semiconductor light source of uniform light color as recited in claim 1, wherein: r, G, B the arrangement of chips is in interactive circulation arrangement between rows, and R-G-B group is used as a circulation unit; the adjacent rows are arranged in a staggered mode, chips of the same color are not adjacent, and any adjacent three-color chip can form a regular triangle.
5. The semiconductor light source of claim 4, wherein: r, G, B the chips of the same kind can be connected in series or in parallel, and then connected in series with a group of chip resistors; different kinds of chips are connected in parallel.
6. A semiconductor light source of uniform light color as recited in claim 1, wherein: three groups of chip resistor bonding pads are arranged on the LED substrate and are respectively connected to various LED chip circuits.
7. A semiconductor light source with uniform light color as claimed in claim 1 or 6, wherein: the chip resistors are arranged on the bonding pads of the three groups of chip resistors respectively, and the circuit is conducted.
8. A semiconductor light source of uniform light color as claimed in any preceding claim, wherein: the specification of each group of chip resistors can be selected according to the target light color and the circuit characteristics of the light source, wherein the light color parameters comprise color coordinates, light flux or brightness, power and the like.
9. A semiconductor light source of uniform light color as claimed in any preceding claim, wherein: a group of positive and negative power supply pads are arranged on the LED substrate and are respectively connected with the positive and negative electrodes of the parallel circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110492508.8A CN113517266A (en) | 2021-05-06 | 2021-05-06 | Semiconductor light source with uniform light color |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110492508.8A CN113517266A (en) | 2021-05-06 | 2021-05-06 | Semiconductor light source with uniform light color |
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| CN113517266A true CN113517266A (en) | 2021-10-19 |
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| CN202110492508.8A Pending CN113517266A (en) | 2021-05-06 | 2021-05-06 | Semiconductor light source with uniform light color |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202996832U (en) * | 2012-12-24 | 2013-06-12 | 广州市鸿利光电股份有限公司 | COB surface light source |
| CN112599514A (en) * | 2020-12-31 | 2021-04-02 | 南京工业大学 | High-quality full-color semiconductor light source |
| CN112599511A (en) * | 2020-12-29 | 2021-04-02 | 南京工业大学 | Novel integrated semiconductor light source |
| CN112599512A (en) * | 2020-12-29 | 2021-04-02 | 南京工业大学 | Mini LED backlight module and backlight source |
-
2021
- 2021-05-06 CN CN202110492508.8A patent/CN113517266A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202996832U (en) * | 2012-12-24 | 2013-06-12 | 广州市鸿利光电股份有限公司 | COB surface light source |
| CN112599511A (en) * | 2020-12-29 | 2021-04-02 | 南京工业大学 | Novel integrated semiconductor light source |
| CN112599512A (en) * | 2020-12-29 | 2021-04-02 | 南京工业大学 | Mini LED backlight module and backlight source |
| CN112599514A (en) * | 2020-12-31 | 2021-04-02 | 南京工业大学 | High-quality full-color semiconductor light source |
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Application publication date: 20211019 |