CN207716110U - A kind of tri- color COB light sources of RGB that can realize uniform mixed light - Google Patents
A kind of tri- color COB light sources of RGB that can realize uniform mixed light Download PDFInfo
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- CN207716110U CN207716110U CN201820035246.6U CN201820035246U CN207716110U CN 207716110 U CN207716110 U CN 207716110U CN 201820035246 U CN201820035246 U CN 201820035246U CN 207716110 U CN207716110 U CN 207716110U
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Abstract
The utility model discloses a kind of tri- color COB light sources of RGB that can realize uniform mixed light, including several R chips, several B chips, several G chips, conductive circuit, conductive welding disk, conductive bonding line, heat-conduction circuit board, the box dam glue being positioned on heat-conduction circuit board, the filling colloid for being filled in inside box dam glue and being covered on chip and conductive bonding line, the R chips, B chips and G chips are ordered in by certain way on heat-conduction circuit board, several described R chips, B chips and G chips are cascaded by conductive bonding line and conductive circuit respectively, and it is connected by the positive and negative anodes access of conductive circuit and conductive welding disk.The utility model is simple in structure, only by adding heat-conduction circuit board, the effect that chip sequence can reach even light mixing is reset, solves heat dissipation problem, so that chip luminous efficiency maximumlly extends the service life of chip simultaneously, and be conducive to constant-current driving power supply matching and compatibility.
Description
Technical field
The utility model is related to a kind of light sources, are to be related to a kind of tri- colors of RGB that can realize uniform mixed light more specifically
COB light source.
Background technology
With the continuous promotion of LED light source technology, application field is also increasingly wider, just replaces conventional high-tension sodium comprehensively
Lamp, mercury lamp light source.It is that light source is made to obtain the output of more high light flux on smaller light-emitting surface utmostly to match combined lamps in recent years
Originally, COB multi-wafer integration packagings come into being, and it is more to be applied to commercial lighting, landscape brightening etc. for product structure optimization and drop
Field.But current tri- color integrated optical sources of COB-RGB are thirdly color arrangement will appear relatively sternly in a manner of being ranked sequentially in mixed light
Weight cavity.If by optical lightscreening, light projector, mixed light unevenness are unable to reach colour mixture degree of saturation, influence COB-RGB light sources and exist again
The popularization and application of projection lamp, projecting apparatus, projector, stage lighting field.
In addition application No. is 201521052453.5 Chinese utility model patent application disclose one kind can mixed light LED light
Plate, including White LED etc., red LED lamp, green LED lamp and blue LED lamp, the white led lamps are evenly distributed on PCB
The outermost of plate, the red LED lamp are distributed in the innermost circle of pcb board, and green LED lamp and blue LED lamp intersection are placed in
The centre one of red LED lamp and white led lamps is enclosed.Position is put using red, green, the special of three kinds of color LED light of blue
It sets and realizes RGB three primary colours mixed lights；Using position distribution of a variety of colors LED light on lamp plate, realize entire lamp plate in thermal diffusivity
Homogeneouslly-radiating is realized in raising on energy, and luminous efficiency is high, rapid heat dissipation, RGB even light mixings.
However, although the above utility model realizes the uniform mixed light and Homogeneouslly-radiating of RGB, but and not up to best shape
State, in mixed light, assorted light-emitting angle drop is big in rgb light source, and uniform mixed light effect is unable to reach when used in projection-type product.Together
When also do not consider take into account circuit output convenience, drive scheme reasonability, cause to be not easy matched fiber crops in practical applications
It is tired.
Utility model content
To overcome drawbacks described above in the prior art, the utility model to provide a kind of RGB tri- that can realize uniform mixed light
Color COB light source can realize that the uniform mixed light of RGB, Homogeneouslly-radiating improve the service life of LED light, while take into account circuit output facility
Property, drive scheme reasonability, convenient for actual use.
To achieve the above object, the utility model provides a kind of tri- color COB light sources of RGB that can realize uniform mixed light, packet
Several R chips are included, several B chips, several G chips, conductive circuit, conductive welding disk, conductive bonding line, heat conduction circuit
Plate, the box dam glue being positioned on heat-conduction circuit board, is filled in inside box dam glue and colloid, the R are filled in covering on the wafer
Chip, B chips and G chips are ordered in by certain way on heat-conduction circuit board, several described R chips pass through conductive bonding
Line and conductive circuit are cascaded, and are connected by the positive and negative anodes access of conductive circuit and conductive welding disk, described several
A B chips are cascaded by conductive bonding line and conductive circuit, and pass through the positive and negative of conductive circuit and conductive welding disk
Pole access connection, several described G chips are cascaded by conductive bonding line and conductive circuit, and pass through circuit conductive
The positive and negative anodes access of line and conductive welding disk connects.
Preferably, the heat-conduction circuit board includes heat-conducting substrate layer, the insulating layer being covered on heat-conducting substrate layer, absolutely
It is laid with circuit layer in edge layer, surface insulation ink layer is covered on circuit layer.
Preferably, the R chips, B chips and G chips are ordered in by certain way on heat-conducting substrate layer.
Preferably, the R chips, B chips and the hexagonal distribution of G chips, by R chip-B chip-G chip sequences
Or by R chip-G chip-B chip sequence cycle arrangements on hexagon diagonal line, centered on diagonal line, equidistant parallel row
Several rows are arranged by R chip-B chip-G chips sequence or by R chip-G chip-B chip sequence cycle arrangement chips, per single
Chip is in row or lower row's chip any two center wafer position.
Preferably, the R chips are located at first jiao of close side of hexagon corresponding with diagonal line.
Preferably, seven chips are ranked sequentially by R chip-B chip-G chips on the hexagon diagonal line, with right
Centered on linea angulata, totally seven row's chips is sequentially arranged five, four, is amounted to close to six chips of cornerwise row for equidistant parallel arrangement
37 chips.
Compared with prior art, the beneficial effects of the utility model are：
The utility model includes several R chips, several B chips, several G chips, conductive circuit, conduction weldering
Disk, conductive bonding line, heat-conduction circuit board, the box dam glue being positioned on heat-conduction circuit board are filled in inside box dam glue and are covered in
Filling colloid on chip, the R chips, B chips and G chips are ordered in the heat conduction base of heat-conduction circuit board by certain way
Plate layer, several described R chips are cascaded by conductive bonding line and conductive circuit, and by conductive circuit with lead
The positive and negative anodes access of electrical bonding pads connects, several described B chips are cascaded by conductive bonding line and conductive circuit, and
It is connected by the positive and negative anodes access of conductive circuit and conductive welding disk, several described G chips pass through conductive bonding line and circuit
Conductor wire is cascaded, and is connected by the positive and negative anodes access of conductive circuit and conductive welding disk, passes through the orderly row of chip
Row reach ideal light mixing effect, are radiated by heat-conduction circuit board so that chip luminous efficiency maximizes while extending crystalline substance
The service life of piece, while the quantity by suitably increasing low-voltage chip, same wafer is cascaded so that voltage step
It is small, be conducive to constant-current driving power supply matching and compatibility.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is this
Some embodiments of utility model, for those of ordinary skill in the art, without creative efforts, also
It can be obtain other attached drawings according to these attached drawings.
Fig. 1 is that a kind of structure for tri- color COB light sources of RGB that can realize uniform mixed light that the utility model embodiment provides is shown
It is intended to；
Fig. 2 is a kind of R chips for tri- color COB light sources of RGB that can realize uniform mixed light that the utility model embodiment provides,
One of G chips and B chip combinations；
Fig. 3 is a kind of R chips for tri- color COB light sources of RGB that can realize uniform mixed light that the utility model embodiment provides,
The two of G chips and B chip combinations.
Specific implementation mode
It is new below in conjunction with this practicality to keep the purpose, technical scheme and advantage of the utility model embodiment clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained without creative efforts belong to
The range of the utility model protection.
The embodiments of the present invention provide a kind of tri- color COB light sources of RGB that can realize uniform mixed light.
Embodiment one
It please refers to Fig.1 and Fig. 2, the utility model provides a kind of tri- color COB light sources of RGB that can realize uniform mixed light, wrap
Several R chips 4 are included, several B chips 5, several G chips 6, conductive circuit 31, conductive welding disk 33, conductive bonding line
32, heat-conduction circuit board 1, the heat-conduction circuit board 1 includes heat-conducting substrate layer, the insulating layer being covered on heat-conducting substrate layer, insulation
It is laid with circuit layer on layer, surface insulation ink layer is covered on circuit layer, the box dam glue 2 being positioned on heat-conduction circuit board 1, filling
In 2 inside of box dam glue and filling colloid 23 on the wafer is covered, to protect chip and the conductive bonding line in box dam glue 2
32, the R chips 4, B chips 5 and G chips 6 are ordered in by certain way on the heat-conducting substrate layer of heat-conduction circuit board 1,
Several described R chips 4 are cascaded by conductive bonding line 32 and conductive circuit 31, and by conductive circuit 31 with
33 access of positive and negative anodes of conductive welding disk connects, several described B chips are connected by conductive bonding line 32 and conductive circuit 31
Together, and by conductive circuit 31 with 33 access of positive and negative anodes of conductive welding disk it connect, several described G chips 6 are by leading
Electric bonding line 32 and conductive circuit 31 are cascaded, and pass through 33 access of positive and negative anodes of conductive circuit 31 and conductive welding disk
Even.
The sort method of the R chips 4, B chips 5 and G chips 6 is as follows：
The central area of the circuit board 1 is equipped with the reserved place of box dam glue 2, same in 2 reserved location inside-paint of box dam glue one
The hexagon of the heart is to auxiliary positioning, wherein the first parallel edges 21 of hexagon, the second parallel edges 22, and the of heat-conduction circuit board 1
Three parallel edges 11, the 4th parallel edges parallel 12 draw a diagonal line 73 between first jiao 71 and second jiao 72 of hexagon, close
R crystal grain 4 is placed in first jiao 71 of position, sorts by R crystal grain 4-B crystal grain 5-G crystal grain 6 so that seven crystalline substances are booked on diagonal line 73
Piece, centered on diagonal line 73, totally seven row's chips sequentially arranges five close to six chips of row of diagonal line 73 for equidistant parallel arrangement
It is a, four, amount to 37 chips.
Further, close to the chip of first jiao of 71 position it is in principle relatively low one of voltage in several chips, with
When multi-wafer being made to connect, each road driving voltage is closer, and the voltage of R chips 4 is 2V or so, the B chips 5 and G of opposite 3V or so
It is relatively low for chip 6, Gu R chips 4, COB-RGB light source generally use constant currents driving electricity is placed close to first jiao of 71 position
Source powers, and R chips 4, and after B chips 5 and G chips 6 are connected, voltage step is small, is conducive to the matching of constant-current driving power supply and simultaneous
Hold, realizes independently-powered or public anode or public cathode power supply circuit.
Further, row or lower row's chip any two center wafer position are in per single wafer.
By R chips 4, such ordered arrangement that B chips 5 and G chips 6 lead to realizes COB-RGB integrated optical source mixed lights
It is uniform.
The heat-conduction circuit board 1 is including heat conduction basal plate, the insulating layer being covered on heat conduction basal plate, and insulating layer can prevent
Short circuit occurs with basal plate, circuit layer is laid on insulating layer, surface insulation ink layer is covered on circuit layer, shielded segment connects
Appearance and mark demand are realized while connecing section circuit layer.
The heat-conduction circuit board 1 is used to radiate to chip, extends the service life of chip.
According to the present embodiment, the driving voltage term of reference after R chips 4 are connected is 25V-32V, and electric current is within 350MA, B
Driving voltage term of reference after chip 5 and G chips 6 are connected is 32V-45V, and electric current is within 350MA.
According to the capacity of heat transmission and substrate size size of substrate, identical voltage range can be selected, and power is different
Chip, current value can be with smaller or biggers.
Embodiment two
It please refers to Fig.1 and Fig. 3, the present embodiment and the difference of embodiment one are R chips 4, the quantity of B chips 5 and G chips 6
Different, total 19 of three color chips, ordering rule is as in the first embodiment, R chips 4 are opposite with B chips 5 and G chips more than 6 one
Piece, when reaching series connection, the small effect of No. three series circuit voltage steps, to be conducive to the matching of constant-current driving power supply and simultaneous
Hold, realizes independently-powered or public anode or public cathode power supply circuit.
37 wafer arrangement schemes used in the utility model embodiment one are opposite preferred plan, and R is brilliant
Piece 4, B chips 5 and G chips 6 are arranged evenly harmonious best.The embodiment of the other quantity of scheme is also set up according to this, because of its number
Amount and arrangement matching effect have different.
In conclusion the utility model is simple in structure, only by adding heat-conduction circuit board, resets chip sequence and can reach
The effect of even light mixing, solves heat dissipation problem so that chip luminous efficiency maximizes while extending the service life of chip, and advantageous
In constant-current driving power supply matching and compatibility.
Above-described embodiment is the preferable embodiment of the utility model, but the embodiment of the utility model is not by above-mentioned
The limitation of embodiment, under other any Spirit Essences and principle without departing from the utility model made by change, modify, replace
In generation, simplifies combination, should be equivalent substitute mode, is included within the scope of protection of the utility model.
Claims (4)
1. a kind of tri- color COB light sources of RGB that can realize uniform mixed light, including several R chips (4), several B chips (5), if
Dry G chip (6), conductive circuit (31), conductive welding disk (33), conductive bonding line (32), it is characterised in that：Further include heat conduction
Circuit board (1), the box dam glue (2) being positioned on heat-conduction circuit board (1) are filled in box dam glue (2) inside and are covered on chip
Filling colloid (23), the R chips (4), on B chips (5) and G chips (6) arrangement heat-conduction circuit board (1), several described R
Chip (4) is cascaded by conductive bonding line (32) and conductive circuit (31), and by conductive circuit (31) with lead
The positive and negative anodes access of electrical bonding pads (33) connects, several described B chips (5) pass through conductive bonding line (32) and conductive circuit
(31) it is cascaded, and is connect with the positive and negative anodes access of conductive welding disk (33) by conductive circuit (31), several described G
Chip (6) is cascaded by conductive bonding line (32) and conductive circuit (31), and by conductive circuit (31) with lead
The positive and negative anodes access of electrical bonding pads (33) connects.
2. a kind of tri- color COB light sources of RGB that can realize uniform mixed light according to claim 1, which is characterized in that described to lead
Heater circuit plate (1) includes heat conduction basal plate, the insulating layer being covered on heat conduction basal plate, and circuit layer, circuit are laid on insulating layer
It is covered with surface insulation ink layer on layer.
3. a kind of tri- color COB light sources of RGB that can realize uniform mixed light according to claim 1, which is characterized in that the R
Chip (4), B chips (5) and G chips (6) hexagonal distribution by R chips (4)-B chips (5)-G chips (6) sequence or are pressed
R chips (4)-G chips (6)-B chips (5) sequence cycle arrangement is on hexagon diagonal line (73), in being with diagonal line (73)
The heart, equidistant parallel arrange several rows by R chips (4)-B chips (5)-G chips (6) sequence or press R chips (4)-G chips (6)-
B chips (5) sequence cycle arrangement chip is in row or lower row's chip any two center wafer position per single wafer.
4. a kind of tri- color COB light sources of RGB that can realize uniform mixed light according to claim 3, which is characterized in that the R
Chip (4) is located at the close side of hexagon corresponding with diagonal line (73) first jiao (71).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820035246.6U CN207716110U (en) | 2018-01-10 | 2018-01-10 | A kind of tri- color COB light sources of RGB that can realize uniform mixed light |
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| CN201820035246.6U CN207716110U (en) | 2018-01-10 | 2018-01-10 | A kind of tri- color COB light sources of RGB that can realize uniform mixed light |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111856820A (en) * | 2020-08-27 | 2020-10-30 | 苏州车萝卜汽车电子科技有限公司 | Backlight module, display and display device |
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2018
- 2018-01-10 CN CN201820035246.6U patent/CN207716110U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111856820A (en) * | 2020-08-27 | 2020-10-30 | 苏州车萝卜汽车电子科技有限公司 | Backlight module, display and display device |
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