CN102270627A - Packaging structure of light-emitting diode - Google Patents

Packaging structure of light-emitting diode Download PDF

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Publication number
CN102270627A
CN102270627A CN2010101972267A CN201010197226A CN102270627A CN 102270627 A CN102270627 A CN 102270627A CN 2010101972267 A CN2010101972267 A CN 2010101972267A CN 201010197226 A CN201010197226 A CN 201010197226A CN 102270627 A CN102270627 A CN 102270627A
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CN
China
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eu
light
sr
ca
emitting diode
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CN2010101972267A
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Chinese (zh)
Inventor
郑子淇
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英特明光能股份有限公司
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Priority to CN2010101972267A priority Critical patent/CN102270627A/en
Publication of CN102270627A publication Critical patent/CN102270627A/en

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Abstract

The invention discloses a packaging structure of a light-emitting diode, comprising a substrate, a first light-emitting diode, a second light-emitting diode and resin material, wherein the surface of the substrate is provided with at least one rail made of a transparent material in a protruding manner, and at least one configuration region is formed on the substrate in a surrounding manner, the two light-emitting diodes are arranged in the configuration region and are adjacent, and the resin material is arranged in the configuration region and covers the two light-emitting diodes. The packaging structure of the light-emitting diode obtains required illuminating rays by mixing light rays respectively emitted by the two light-emitting diodes; and the illuminating ray in the required colour can be obtained when the light rays emitted by the two light-emitting diodes arranged in the configuration region composed of the rails are mutually mixed; besides, the light-emitting diodes are surrounded by virtue of the rails with light transmission property, and the packaging structure is simple, thus manufacturing steps can be greatly simplified and manufacturing cost can be greatly reduced, and the whole luminous efficiency of the packaging structure of the light-emitting diode also can be improved.

Description

Package structure for LED

Technical field

The present invention relates to a kind of encapsulating structure, relate in particular to a kind of encapsulating structure that is arranged at the light-emitting diode in the fence that has.

Background technology

Light-emitting diode (light emitting diode, LED) because the advantage that its power consumption is low, efficient is high and the life-span is long, therefore, can be widely used in various applications, for example the light source of mobile computer, monitor, mobile phone, TV and the used backlight module of LCD.Moreover the research and development along with more and more research staff drop into light-emitting diode (LED) makes the luminous intensity of present light-emitting diode reach the degree of illumination.

Be example with the most normal present white light emitting diode that uses, for example TaiWan, China I291251 number, No. the 200905854th, TaiWan, China, TaiWan, China I237406 number, and patent case such as TaiWan, China I253192 number disclose, its white light emitting diode utilizes light three primary colors light modulation combination, three kinds of light-emitting diode chip for backlight unit red with sending, green and blue light make up and are encapsulated with array way, and the coloured light that light-emitting diode sent of three kinds of different colours mixed, promptly obtain to send the polycrystalline grain encapsulation device of light emitting diode of white light.

Yet, existing white light emitting diode packaging system also can't provide luminous intensity and tone all to belong to uniform light source, cause its luminous mass to be seriously influenced, if therefore will have the time spent of white light emitting diode packaging system now as lighting source, but do not see to have and adjust correlated colour temperature (correlated color temperature, technological means CCT) at white light emitting diode.

Because the basic luminous units of existing white light emitting diode is formed by three chip portfolios, with regard to making, it spends on the cost of chip higher relatively, and three chips operate simultaneously and will produce higher power consumption and caloric value.Moreover, because the design of above-mentioned package structure for LED must be controlled the luminous quantity of three kinds of chips earlier respectively with three groups of circuit, cause the design complexity comparatively of the drive circuit of light-emitting diode.

Summary of the invention

Technical problem to be solved by this invention is to provide a kind of package structure for LED, so as to improveing the colour temperature inequality of existing encapsulation device of light emitting diode, and the drive circuit of light-emitting diode problem such as complexity comparatively in design.

The disclosed package structure for LED of the present invention includes a substrate, one first light-emitting diode, one second light-emitting diode, reaches a resin material.The surface of substrate is provided with a fence, and surrounds formation one configuring area on substrate, and the material of fence is a transparent material.First light-emitting diode and second light-emitting diode are arranged in the configuring area and are contiguous mutually, first light-emitting diode can send first light with first wavelength, second light-emitting diode can send second light with second wavelength, and is mixed into illuminating ray with first light.Resin material is arranged in the configuring area, and resin material covers first light-emitting diode and second light-emitting diode.

Wherein, this substrate more is concaved with a storage tank, and this fence is arranged in this storage tank.

Wherein, more contain a fluorescent material in this resin material.

Wherein, this fluorescent material is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming.

Wherein, the wave-length coverage of this first wavelength is identical with the wave-length coverage of this second wavelength.

Wherein, the wave-length coverage of the wave-length coverage of this first wavelength and this second wavelength is different.

Wherein, the material of this substrate be selected from metal material, ceramic material, diamond material, class bore material with carbon element or printed circuit board (PCB) one of them.

Wherein, the material of this resin material is epoxy resin or silica gel.

Disclosed another package structure for LED of the present invention includes a substrate, at least one first light-emitting diode, at least one second light-emitting diode, reaches a resin material.The surface of substrate is provided with a fence and partition wall, and wherein dividing wall is arranged in the fence, constitutes two configuring areas to surround on substrate, and the material of fence is a transparent material.First light-emitting diode is arranged at wherein in the configuring area, and first light-emitting diode can send first light with first wavelength, second light-emitting diode is arranged in another configuring area, and second light-emitting diode can send second light with second wavelength, and is mixed into illuminating ray with first light.Resin material is arranged in two configuring areas, and resin material covers first light-emitting diode and second light-emitting diode.

Wherein, this substrate more is concaved with a storage tank, and this fence is arranged in this storage tank.

Wherein, more contain a fluorescent material in this resin material.

Wherein, this fluorescent material is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO7:Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10 (PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming.

Wherein, the wave-length coverage of this first wavelength is identical with the wave-length coverage of this second wavelength.

Wherein, the wave-length coverage of the wave-length coverage of this first wavelength and this second wavelength is different.

Wherein, the material of this substrate be selected from metal material, ceramic material, diamond material, class bore material with carbon element or printed circuit board (PCB) one of them.

Wherein, the material of this resin material is epoxy resin or silica gel.

The disclosed another package structure for LED of the present invention includes a substrate, at least one first light-emitting diode, at least one second light-emitting diode, reaches a resin material.The surface of substrate is provided with two adjacent fences, and wherein two fences surround respectively on substrate and constitute two configuring areas, and the material of two fences is a transparent material.First light-emitting diode is arranged at wherein in the configuring area, and first light-emitting diode can send first light with first wavelength, second light-emitting diode is arranged in another configuring area, and second light-emitting diode can send second light with second wavelength, and is mixed into illuminating ray with first light.Resin material is arranged in two configuring areas, and resin material covers first light-emitting diode and second light-emitting diode.

Wherein, this substrate more is concaved with a storage tank, and this fence is arranged in this storage tank.

Wherein, more contain a fluorescent material in this resin material.

Wherein, the Sr that is selected from of this fluorescent material 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming.

Wherein, the wave-length coverage of this first wavelength is identical with the wave-length coverage of this second wavelength.

Wherein, the wave-length coverage of the wave-length coverage of this first wavelength and this second wavelength is different.

Wherein, this substrate send out material be selected from metal material, ceramic material, diamond material, class bore material with carbon element or printed circuit board (PCB) one of them.

Wherein, the material of this resin material is epoxy resin or silica gel.

Effect of the present invention is, is arranged on two light-emitting diodes in the configuring area that is made of fence, the mutual mixed light of two light that it sent and can obtain required photochromic illuminating ray.In addition, the present invention lives light-emitting diode by the fence corral with light transmission features, and its encapsulating structure is quite simple, therefore can significantly simplify making step and reduce manufacturing cost, also can improve the whole lighting efficiency of package structure for LED simultaneously.

Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.

Description of drawings

Figure 1A is the cross sectional side view of first embodiment of the invention;

Figure 1B is the cross sectional side view of the different aspects of first embodiment of the invention;

Fig. 1 C is the cross sectional side view of the different aspects of first embodiment of the invention;

Fig. 1 D is the cross sectional side view of the different aspects of first embodiment of the invention;

Fig. 1 E is the cross sectional side view of the different aspects of first embodiment of the invention;

Fig. 2 A is the cross sectional side view of second embodiment of the invention;

Fig. 2 B is the cross sectional side view of the different aspects of second embodiment of the invention;

Fig. 2 C is the cross sectional side view of the different aspects of second embodiment of the invention;

Fig. 2 D is the cross sectional side view of the different aspects of second embodiment of the invention;

Fig. 2 E is the cross sectional side view of the different aspects of second embodiment of the invention;

Fig. 3 A is the cross sectional side view of third embodiment of the invention;

Fig. 3 B is the cross sectional side view of the different aspects of third embodiment of the invention;

Fig. 3 C is the cross sectional side view of the different aspects of third embodiment of the invention;

Fig. 3 D is the cross sectional side view of the different aspects of third embodiment of the invention; And

Fig. 3 E is the cross sectional side view of the different aspects of third embodiment of the invention.

Wherein, Reference numeral:

100: package structure for LED

110: substrate

111: fence

112: configuring area

113: storage tank

114: dividing wall

120: the first light-emitting diodes

130: the second light-emitting diodes

140: resin material

141: fluorescent material

Embodiment

Figure 1A is the cross sectional side view of first embodiment of the invention.As shown in the figure, the package structure for LED 100 of first embodiment of the invention includes a substrate 110, one first light-emitting diode (light emittingdiode, LED) 120,1 second light-emitting diode 130, an and resin material 140.The material of substrate 110 can be selected from wherein a kind of material of metal material, ceramic material, diamond material, class brill material with carbon element or printed circuit board (PCB), but not as limit.The top surface of substrate 110 is equipped with a fence (enclosure) 111, and surrounds formation one configuring area 112 on the surface of substrate 110.

Material that it should be noted that fence 111 of the present invention is transparent material (transparent material), and described transparent material can be silica gel material or epoxide resin material.And the configuring area that fence 111 constituted 112 of present embodiment be shaped as kenels such as rectangle, circle or ellipse, right those skilled in the art, can configuring area 112 be designed to various geometries according to actual user demand, not exceed with the above-mentioned shape that is disclosed.

In addition, the fence 111 of first embodiment shown in Figure 1A is a rectangular plate shape structure, and is orthogonal relation between fence 111 and the substrate 110.Yet fence 111 of the present invention also can be designed to be arranged at kenel on the substrate 110 with an angle of inclination shown in Fig. 1 D, or the fence shown in Fig. 1 E 111 is similar trapezoidal structure, and its purpose all is in order to reach the optimization of light reflection.Therefore, those skilled in the art, can be according to actual user demand fence 111 of the present invention more being derived is designed to various geometries and different form of putting angle, does not exceed with disclosed each embodiment of the present invention.

Please continue to consult Figure 1A, first light-emitting diode 120 and second light-emitting diode 130 all are arranged in the configuring area 112, and promptly two light-emitting diodes 120,130 are positioned at the inside of fence 111.First light-emitting diode 120 and second light-emitting diode 130 are electrically connected to a voltage respectively, and first light-emitting diode 120 and second light-emitting diode 130 send first light with first wavelength and second light with second wavelength respectively by the driving of this voltage.

It is noted that the wave-length coverage of first wavelength of first light-emitting diode 120 can be identical with the wave-length coverage of second wavelength of second light-emitting diode 130, promptly the light that sent of first light-emitting diode 120 and second light-emitting diode 130 is same color.Therefore, first light with the illuminating ray that second light is mixed is and first light and the identical color of second light, it is various photochromic for example to obtain cold white light, warm white, imitative daylight white light etc., and this illuminating ray has the characteristic of high color color rendering, the wave-length coverage of two light-emitting diodes 120,130 light that sent can be 360 nanometers (nm) to the short-wavelength light between 550 nanometers (nm), or is positioned at the long wavelength light of 580 nanometers (nm) to 640 nanometers (nm); Or the wave-length coverage of first wavelength of first light-emitting diode 120 can be different with the wave-length coverage of second wavelength of second light-emitting diode 130, and promptly the light that sent of first light-emitting diode 120 and second light-emitting diode 130 is different colours.Therefore, first light and the illuminating ray that second light is mixed are according to the actual color of first light and second light and corresponding colour generation, for example obtain cold white light, warm white, imitative daylight white lights etc. are various photochromic, and this illuminating ray has the characteristic of high color color rendering, a light-emitting diode 120 wherein, the wave-length coverage of 130 light that sent can be 360 nanometers (nm) to the short-wavelength light between 550 nanometers (nm), and another light-emitting diode 120, the wave-length coverage of 130 light that sent can be and is positioned at the long wavelength light of 580 nanometers (nm) to 640 nanometers (nm).Illuminating ray of the present invention possesses the total reflection effect of vertical reflection and horizontal reflection by fence 111, avoids illuminating ray to produce too much optical loss in refracting process.

The material of resin material 140 of the present invention can be epoxy resin (epoxy) or silica gel macromolecular materials such as (silicone), but not as limit.Resin material 140 is loaded in configuring area 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.

Figure 1B is depicted as the cross sectional side view of the different aspects of first embodiment of the invention, and package structure for LED 100 includes a substrate 110, one first light-emitting diode 120, one second light-emitting diode 130, reaches a resin material 140.Wherein, substrate 110 more is concaved with a storage tank 113, and be arranged in the storage tank 113 with the fence 111 that transparent material is made, first light-emitting diode 120 and second light-emitting diode 130 are arranged in the fence 111, therefore, first light-emitting diode 120 and second light-emitting diode 130 also electrically are arranged in the storage tank 113.Resin material 140 is loaded in configuring area 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.Reflex to when illuminating ray on the wall of storage tank 113, storage tank 113 provides the usefulness of more good reflection ray.

Fig. 1 C is the cross sectional side view of the different aspects of first embodiment of the invention.As shown in the figure, package structure for LED 100 includes a substrate 110, one first light-emitting diode 120, one second light-emitting diode 130, reaches a resin material 140.Wherein, the top surface of substrate 110 is equipped with a fence 111, and surrounds formation one configuring area 112 on the surface of substrate 110, and fence 111 is to make with transparent material.First light-emitting diode 120 and second light-emitting diode 130 all are arranged in the configuring area 112, and promptly two light-emitting diodes 120,130 are positioned at the inside of fence 111.First light-emitting diode 120 and second light-emitting diode 130 be by the driving of voltage, and send first light with first wavelength and second light with second wavelength respectively.

Resin material 140 is loaded in configuring area 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.Wherein, more can add the fluorescent material 141 of powder kenel in the resin material 140, and fluorescent material 141 is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: EuaSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming, but the material of fluorescent material 141 is selected for use not as limit, and the kenel of fluorescent material 141 is not exceeded with the disclosed powder of present embodiment yet, those skilled in the art, can correspondingly according to the actual fabrication demand adopt various kenels to be added in the resin material 140, for example be covered on the top surface of resin material 140 with colloid.When resin material 140 was crossed in the illuminating ray break-through, the fluorescent material 141 that is mixed in the resin material 140 provided illuminating ray more good reflecting effect.

Fig. 2 A is the cross sectional side view of second embodiment of the invention.As shown in the figure, the package structure for LED 100 of second embodiment of the invention includes a substrate 110, at least one first light-emitting diode 120, at least one second light-emitting diode 130, reaches a resin material 140.The material of substrate 110 can be selected from wherein a kind of material of metal material, ceramic material, diamond material, class brill material with carbon element or printed circuit board (PCB), but not as limit.The top surface of substrate 110 is equipped with a fence 111 and partition wall 114, fence 111 surrounds on the surface of substrate 110 and forms a zone, dividing wall 114 is slightly contour with fence 111, and dividing wall 114 is arranged in the fence 111, this zone is divided into again two adjacent configuring areas 112.The material of fence 111 of the present invention is transparent material (transparent material), the material of dividing wall 114 can be transparent material or opaque material, and those skilled in the art can be designed to various geometries with configuring area 112 according to actual user demand.

In addition, the fence 111 of second embodiment shown in Fig. 2 A is a rectangular plate shape structure, and is orthogonal relation between fence 111 and the substrate 110.Yet fence 111 of the present invention also can be designed to be arranged at kenel on the substrate 110 with an angle of inclination shown in Fig. 2 D, or the fence shown in Fig. 2 E 111 is similar trapezoidal structure, and its purpose all is in order to reach the optimization of light reflection.Therefore, those skilled in the art, can be according to actual user demand fence 111 of the present invention more being derived is designed to various geometries and different form of putting angle, does not exceed with disclosed each embodiment of the present invention.

Please continue to consult Fig. 2 A, first light-emitting diode 120 is arranged at wherein in the configuring area 112, and second light-emitting diode 130 is arranged in another configuring area 112, and meaning i.e. two light-emitting diodes 120,130 all is positioned at the inside of fence 111.First light-emitting diode 120 and second light-emitting diode 130 are electrically connected to a voltage respectively, and first light-emitting diode 120 and second light-emitting diode 130 send first light with first wavelength and second light with second wavelength respectively by the driving of this voltage.

It is noted that the wave-length coverage of first wavelength of first light-emitting diode 120 can be identical with the wave-length coverage of second wavelength of second light-emitting diode 130, promptly the light that sent of first light-emitting diode 120 and second light-emitting diode 130 is same color.Therefore, first light with the illuminating ray that second light is mixed is and first light and the identical color of second light, it is various photochromic for example to obtain cold white light, warm white, imitative daylight white light etc., and this illuminating ray has the characteristic of high color color rendering, the wave-length coverage of two light-emitting diodes 120,130 light that sent can be 360 nanometers (nm) to the short-wavelength light between 550 nanometers (nm), or is positioned at the long wavelength light of 580 nanometers (nm) to 640 nanometers (nm); Or the wave-length coverage of first wavelength of first light-emitting diode 120 can be different with the wave-length coverage of second wavelength of second light-emitting diode 130, and promptly the light that sent of first light-emitting diode 120 and second light-emitting diode 130 is different colours.Therefore, the illuminating ray that first light and second light are mixed is according to the actual color of first light and second light and corresponding colour generation, for example obtain cold white light, warm white, imitative daylight white lights etc. are various photochromic, and this illuminating ray has the characteristic of high color color rendering, two light-emitting diodes 120 wherein, the wave-length coverage of 130 a light that is sent can be 360 nanometers (nm) to the short-wavelength light between 550 nanometers (nm), and another light-emitting diode 120, the wave-length coverage of 130 light that sent can be and is positioned at the long wavelength light of 580 nanometers (nm) to 640 nanometers (nm).Illuminating ray of the present invention possesses the total reflection effect of vertical reflection and horizontal reflection by fence 111, avoids illuminating ray to produce too much optical loss in refracting process.

Wherein, first light-emitting diode 120 of present embodiment and the configuration quantity of second light-emitting diode 130 can be according to actual user demand corresponding its quantity of increase and decrease, as long as the wave-length coverage of the light-emitting diode in the same configuring area 112 is identical.

The material of resin material 140 of the present invention can be epoxy resin (epoxy) or silica gel macromolecular materials such as (silicone), but not as limit.Resin material 140 is loaded in two configuring areas 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.

Fig. 2 B is depicted as the cross sectional side view of the different aspects of second embodiment of the invention, and package structure for LED 100 includes a substrate 110, at least one first light-emitting diode 120, at least one second light-emitting diode 130, reaches a resin material 140.Wherein, substrate 110 more is concaved with a storage tank 113, and fence 111 and dividing wall 114 are arranged in the storage tank 113, first light-emitting diode 120 and second light-emitting diode 130 are arranged in the fence 111, therefore, first light-emitting diode 120 and second light-emitting diode 130 also electrically are arranged in the storage tank 113.Resin material 140 is loaded in two configuring areas 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.Reflex to when illuminating ray on the wall of storage tank 113, storage tank 113 provides the usefulness of more good reflection ray.

Fig. 2 C is the cross sectional side view of the different aspects of second embodiment of the invention.As shown in the figure, package structure for LED 100 includes a substrate 110, at least one first light-emitting diode 120, at least one second light-emitting diode 130, reaches a resin material 140.Wherein, the top surface of substrate 110 is equipped with a fence 111 and partition wall 114, and surround to form two configuring areas 112 on the surface of substrate 110, and fence 111 is made with transparent material.First light-emitting diode 120 and second light-emitting diode 130 are arranged at respectively in two configuring areas 112, and promptly two light-emitting diodes 120,130 are positioned at the inside of fence 111.First light-emitting diode 120 and second light-emitting diode 130 be by the driving of voltage, and send first light with first wavelength and second light with second wavelength respectively.

Resin material 140 is loaded in two configuring areas 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.Wherein, more can add the fluorescent material 141 of powder kenel in the resin material 140, and fluorescent material 141 is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6C L2: EuZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming, but the material of fluorescent material 141 is selected for use not as limit, and the kenel of fluorescent material 141 is not exceeded with the disclosed powder of present embodiment yet, those skilled in the art can correspondingly according to the actual fabrication demand adopt various kenels to be added in the resin material 140, for example are covered on the top surface of resin material 140 with colloid.When resin material 140 was crossed in the illuminating ray break-through, the fluorescent material 141 that is mixed in the resin material 140 provided illuminating ray more good reflecting effect.

Fig. 3 A is the cross sectional side view of third embodiment of the invention.As shown in the figure, the package structure for LED 100 of third embodiment of the invention includes a substrate 110, at least one first light-emitting diode 120, at least one second light-emitting diode 130, reaches a resin material 140.The material of substrate 110 can be selected from wherein a kind of material of metal material, ceramic material, diamond material, class brill material with carbon element or printed circuit board (PCB), but not as limit.The top surface of substrate 110 is equipped with two adjacent fences 111, and surrounds two configuring areas 112 that formation is separated from each other respectively on the surface of substrate 110.The material of fence 111 of the present invention is transparent material (transparent material), and those skilled in the art, can configuring area 112 be designed to various geometries according to actual user demand.

In addition, the fence 111 of the 3rd embodiment shown in Fig. 3 A is a rectangular plate shape structure, and is orthogonal relation between fence 111 and the substrate 110.Yet fence 111 of the present invention also can be designed to be arranged at kenel on the substrate 110 with an angle of inclination shown in Fig. 3 D, or the fence shown in Fig. 3 E 111 is similar trapezoidal structure, and its purpose all is in order to reach the optimization of light reflection.Therefore, those skilled in the art, can be according to actual user demand fence 111 of the present invention more being derived is designed to various geometries and different form of putting angle, does not exceed with disclosed each embodiment of the present invention.

Please continue to consult Fig. 3 A, first light-emitting diode 120 is arranged at wherein in the configuring area 112, and second light-emitting diode 130 is arranged in another configuring area 112, and meaning i.e. two light-emitting diodes 120,130 all is positioned at the inside of fence 111.First light-emitting diode 120 and second light-emitting diode 130 are electrically connected to a voltage respectively, and first light-emitting diode 120 and second light-emitting diode 130 send first light with first wavelength and second light with second wavelength respectively by the driving of this voltage.

It is noted that the wave-length coverage of first wavelength of first light-emitting diode 120 can be identical with the wave-length coverage of second wavelength of second light-emitting diode 130, promptly the light that sent of first light-emitting diode 120 and second light-emitting diode 130 is same color.Therefore, first light with the illuminating ray that second light is mixed is and first light and the identical color of second light, it is various photochromic for example to obtain cold white light, warm white, imitative daylight white light etc., and this illuminating ray has the characteristic of high color color rendering, the wave-length coverage of two light-emitting diodes 120,130 light that sent can be 360 nanometers (nm) to the short-wavelength light between 550 nanometers (nm), or is positioned at the long wavelength light of 580 nanometers (nm) to 640 nanometers (nm); Or the wave-length coverage of first wavelength of first light-emitting diode 120 can be different with the wave-length coverage of second wavelength of second light-emitting diode 130, and promptly the light that sent of first light-emitting diode 120 and second light-emitting diode 130 is different colours.Therefore, the illuminating ray that first light and second light are mixed is according to the actual color of first light and second light and corresponding colour generation, for example obtain cold white light, warm white, imitative daylight white lights etc. are various photochromic, and this illuminating ray has the characteristic of high color color rendering, two light-emitting diodes 120 wherein, the wave-length coverage of one of 130 light that sent can be 360 nanometers (nm) to the short-wavelength light between 550 nanometers (nm), and another light-emitting diode 120, the wave-length coverage of 130 light that sent can be and is positioned at the long wavelength light of 580 nanometers (nm) to 640 nanometers (nm).Illuminating ray of the present invention possesses the total reflection effect of vertical reflection and horizontal reflection by fence 111, avoids illuminating ray to produce too much optical loss in refracting process.

Wherein, first light-emitting diode 120 of present embodiment and the configuration quantity of second light-emitting diode 130 can be according to actual user demand corresponding its quantity of increase and decrease, as long as the wave-length coverage of the light-emitting diode in the same configuring area 112 is identical.

The material of resin material 140 of the present invention can be epoxy resin (epoxy) or silica gel macromolecular materials such as (silicone), but not as limit.Resin material 140 is loaded in two configuring areas 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.

Fig. 3 B is depicted as the cross sectional side view of the different aspects of third embodiment of the invention, and package structure for LED 100 includes a substrate 110, at least one first light-emitting diode 120, at least one second light-emitting diode 130, reaches a resin material 140.Wherein, substrate 110 more is concaved with a storage tank 113, and two fences 111 are arranged in the storage tank 113, first light-emitting diode 120 and second light-emitting diode 130 all are arranged in the fence 111, and therefore first light-emitting diode 120 and second light-emitting diode 130 also electrically are arranged in the storage tank 113.Resin material 140 is loaded in two configuring areas 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.Reflex to when illuminating ray on the wall of storage tank 113, storage tank 113 provides the usefulness of more good reflection ray.

Fig. 3 C is the cross sectional side view of the different aspects of third embodiment of the invention.As shown in the figure, package structure for LED 100 includes a substrate 110, at least one first light-emitting diode 120, at least one second light-emitting diode 130, reaches a resin material 140.Wherein, the top surface of substrate 110 is equipped with two adjacent fences 111, form two configuring areas 112 that are separated from each other to surround respectively on the surface of substrate 110, and fence 111 is to make with transparent material.First light-emitting diode 120 and second light-emitting diode 130 are arranged at respectively in two configuring areas 112, and promptly two light-emitting diodes 120,130 are positioned at the inside of fence 111.First light-emitting diode 120 and second light-emitting diode 130 be by the driving of voltage, and send first light with first wavelength and second light with second wavelength respectively.

Resin material 140 is loaded in two configuring areas 112, and covers first light-emitting diode 120 and second light-emitting diode 130 fully, to constitute complete package structure for LED 100.Wherein, more can add the fluorescent material 141 of powder kenel in the resin material 140, and fluorescent material 141 is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4C L2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aSend out one of them or the above-mentioned clouding of forming closes material, but the material of fluorescent material 141 is selected for use not as limit, and the kenel of fluorescent material 141 is not exceeded with the disclosed powder of present embodiment yet, those skilled in the art, can correspondingly according to the actual fabrication demand adopt various kenels to be added in the resin material 140, for example be covered on the top surface of resin material 140 with colloid.When resin material 140 was crossed in the illuminating ray break-through, the fluorescent material 141 that is mixed in the resin material 140 provided illuminating ray more good reflecting effect.

Send out fence and on substrate, constitute at least one configuring area by the present invention, at least two light-emitting diodes pipings are arranged in the configuring area, and behind the mutual mixed light of the light that light-emitting diode sent and can obtain required photochromic illuminating raies such as cold white light, warm white, imitative daylight white light or other various coloured light.

In addition, the technological means of light-emitting diode is lived by the present invention system by the fence corral with light transmission features, make package structure for LED of the present invention quite simple, thereby significantly simplify making step and will hang down manufacturing cost, improved the whole lighting efficiency of package structure for LED simultaneously.

Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of claim of the present invention.

Claims (24)

1. a package structure for LED is characterized in that, includes:
One substrate, a surface of this substrate is provided with a fence, and this fence surrounds on this substrate and forms a configuring area, and the material of this fence is a transparent material;
One first light-emitting diode is arranged in this configuring area, and this first light-emitting diode sends one first light with one first wavelength;
One second light-emitting diode is arranged in this configuring area and is adjacent to this first light-emitting diode, and this second light-emitting diode sends one second light with one second wavelength, and is mixed into an illuminating ray with this first light; And
One resin material is arranged in this configuring area, and this resin material covers this first light-emitting diode and this second light-emitting diode.
2. package structure for LED according to claim 1 is characterized in that this substrate more is concaved with a storage tank, and this fence is arranged in this storage tank.
3. package structure for LED according to claim 1 is characterized in that, more contains a fluorescent material in this resin material.
4. package structure for LED according to claim 3 is characterized in that this fluorescent material is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: EuBAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming.
5. package structure for LED according to claim 1 is characterized in that, the wave-length coverage of this first wavelength is identical with the wave-length coverage of this second wavelength.
6. package structure for LED according to claim 1 is characterized in that, the wave-length coverage of the wave-length coverage of this first wavelength and this second wavelength is different.
7. package structure for LED according to claim 1 is characterized in that, the material of this substrate be selected from metal material, ceramic material, diamond material, class bore material with carbon element or printed circuit board (PCB) one of them.
8. package structure for LED according to claim 1 is characterized in that, the material of this resin material is epoxy resin or silica gel.
9. a package structure for LED is characterized in that, includes:
One substrate, a surface of this substrate is provided with a fence and partition wall, and this dividing wall is arranged in this fence, forms two configuring areas to surround on this substrate, and the material of this fence is a transparent material;
At least one first light-emitting diode is arranged at wherein in this configuring area, and this first light-emitting diode sends one first light with one first wavelength;
At least one second light-emitting diode is arranged in another this configuring area, and this second light-emitting diode sends one second light with one second wavelength, and is mixed into an illuminating ray with this first light; And
One resin material is arranged in this two configuring area, and this resin material covers this first light-emitting diode and this second light-emitting diode.
10. package structure for LED according to claim 9 is characterized in that this substrate more is concaved with a storage tank, and this fence is arranged in this storage tank.
11. package structure for LED according to claim 9 is characterized in that, more contains a fluorescent material in this resin material.
12. package structure for LED according to claim 11 is characterized in that, this fluorescent material is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming.
13. package structure for LED according to claim 9 is characterized in that, the wave-length coverage of this first wavelength is identical with the wave-length coverage of this second wavelength.
14. package structure for LED according to claim 9 is characterized in that, the wave-length coverage of the wave-length coverage of this first wavelength and this second wavelength is different.
15. package structure for LED according to claim 9 is characterized in that, the material of this substrate be selected from metal material, ceramic material, diamond material, class bore material with carbon element or printed circuit board (PCB) one of them.
16. package structure for LED according to claim 9 is characterized in that, the material of this resin material is epoxy resin or silica gel.
17. a package structure for LED is characterized in that, includes:
One substrate, a surface of this substrate is provided with two adjacent fences, and this two fence surrounds respectively on this substrate and forms two configuring areas, and the material of this two fence is a transparent material;
At least one first light-emitting diode is arranged at wherein in this configuring area, and this first light-emitting diode sends has one of one first wavelength first light;
At least one second light-emitting diode is arranged in another this configuring area, and this second light-emitting diode sends one second light with one second wavelength, and is mixed into an illuminating ray with this first light; And
One resin material is arranged in this two configuring area, and this resin material covers this first light-emitting diode and this second light-emitting diode.
18. package structure for LED according to claim 17 is characterized in that, this substrate more is concaved with a storage tank, and this fence is arranged in this storage tank.
19. package structure for LED according to claim 17 is characterized in that, more contains a fluorescent material in this resin material.
20. package structure for LED according to claim 19 is characterized in that, this fluorescent material is selected from Sr 1-x-yBa xCa ySiO 4: Eu 2+F, (Sr 1-x-yEu xMn y) P 2+zO 7: Eu 2+F, (Ba, Sr, Ca) Al 2O 4: Eu, ((Ba, Sr, Ca) (Mg, Zn)) Si 2O 7: Eu, SrGa 2S 4: Eu, ((Ba, Sr, Ca) 1-xEu x) (Mg, Zn) 1-xMn x)) Al 10O 17, Ca 8Mg (SiO 4) 4Cl 2: Eu, Mn, ((Ba, Sr, Ca, Mg) 1-xEu x) 2SiO 4, Ca 2MgSi 2O 7: Cl, SrSi 3O 82SrCl 2: Eu, BAM:Eu, Sr-Aluminate:Eu, Thiogallate:Eu, Chlorosilicate:Eu, Borate:Ce, Tb, Sr 4Al 14O 25: Eu, YBO 3: Ce, Tb, BaMgAl 10O 17: Eu, Mn, (Sr, Ca, Ba) (Al, Ga) 2S 4: Eu, Ca 2MgSi 2O 7: Cl, Eu, Mn, (Sr, Ca, Ba, Mg) 10(PO 4) 6Cl 2: Eu ZnS:Cu, Al, (Y, Gd, Tb, Lu, Yb) (Al yGa 1-y) 5O 12: Ce, (Sr 1-x-y-zBa xCa yEu z) 2SiO 4, and (Sr 1-a-bCa bBa c) Si xN yO z: Eu aSr 5(PO 4) 3Cl:Eu aOne of them or the above-mentioned made from mixed materials of forming.
21. package structure for LED according to claim 17 is characterized in that, the wave-length coverage of this first wavelength is identical with the wave-length coverage of this second wavelength.
22. package structure for LED according to claim 17 is characterized in that, the wave-length coverage of the wave-length coverage of this first wavelength and this second wavelength is different.
23. package structure for LED according to claim 17 is characterized in that, this substrate send out material be selected from metal material, ceramic material, diamond material, class bore material with carbon element or printed circuit board (PCB) one of them.
24. package structure for LED according to claim 17 is characterized in that, the material of this resin material is epoxy resin or silica gel.
CN2010101972267A 2010-06-02 2010-06-02 Packaging structure of light-emitting diode CN102270627A (en)

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Application publication date: 20111207