CN202633302U - Led device - Google Patents
Led device Download PDFInfo
- Publication number
- CN202633302U CN202633302U CN2012201844901U CN201220184490U CN202633302U CN 202633302 U CN202633302 U CN 202633302U CN 2012201844901 U CN2012201844901 U CN 2012201844901U CN 201220184490 U CN201220184490 U CN 201220184490U CN 202633302 U CN202633302 U CN 202633302U
- Authority
- CN
- China
- Prior art keywords
- led chip
- heat sink
- blue
- led
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Provided by the utility model is an LED device that comprises an LED chip unit, a packaging body, an anode pin and a cathode pin. The packaging body includes a plastic support and a heat sink; and the inner terminals of the anode pin and the cathode pin are embedded into the plastic support and the anode pin and the cathode pin are connected with the LED chip unit by leads. Because a heat sink installation groove is arranged in the plastic support, the heat sink is embedded into the plastic support and is installed in the heat sink installation groove; and the whole or a portion of the outer side surface of the heat sink is exposed out of the plastic support through the opening of the installation groove. The LED chip unit includes LED chips with more than two colors or LED chip groups with more than two colors. The LED devices provided by the utility model is one with good heat dissipation performance and a high color rendering index. Therefore, heat generated during the working of the LED chips can be conducted rapidly and fully by the heat sink, thereby ensuring that the work temperatures of the LED chips can be stabilized at a low level, reducing the LED device damage risk caused by high work temperatures, and prolonging the actual service life of the LED device.
Description
Technical field
The utility model relates to a kind of LED matrix, particularly relates to a kind of LED matrix that comprises the high-power LED chip unit.
Background technology
Traditional white light LEDs device generally is to add yellow fluorescent powder by blue-light LED chip to be made; The white light of being sent out only includes gold-tinted and blue spectrum; Spectral width is less and discontinuous, particularly owing to lack the spectrum of dark red light, causes the color rendering index of LED matrix effectively to improve.
A kind of method of head it off is to add red light fluorescent powder, to reach the effect of spectrally compensating, still because the launching efficiency of red light fluorescent powder is lower, causes the luminous efficiency of LED matrix to reduce.Light efficiency to causing owing to the use red light fluorescent powder in the said method reduces problem, and another kind of method is that increase is provided with red LED chip, that is to say, is provided with the plurality of LEDs chip in the LED matrix.But this scheme exists following not enough: led chip is installed in the relatively poor package support of thermal conductivity, causes the integral heat sink property of LED matrix relatively poor, thereby this technical scheme is not suitable for and has than the high-power LED device.
Summary of the invention
The purpose of the utility model is to provide a kind of LED matrix, and color rendering index is high, and has excellent heat dispersion performance.
The utility model is realized through following technical scheme:
LED matrix includes: led chip unit, packaging body, anodal pin and negative pole pin; Said packaging body includes plastic stent and heat sink, and the inner of anodal pin and negative pole pin embeds in the plastic stent, and is connected with the led chip unit through lead; Wherein, be provided with heat sink mounting groove in the said plastic stent, heat sink mounting groove has opening, and in the said heat sink embedding plastic stent and be installed in heat sink mounting groove place, the whole or local opening through mounting groove of heat sink outer surface exposes the plastic stent outside; The led chip unit is arranged on the heat sink side surface; Said led chip unit comprises the led chip or the led chip group of two or more colors, and wherein a kind of is red LED chip or red LED chip group.
The beneficial effect of the utility model is following:
The LED matrix of the utility model, owing to be provided with heat sink mounting groove in the plastic stent, in the heat sink embedding plastic stent and be installed in heat sink mounting groove place, the whole or local opening through mounting groove of heat sink outer surface exposes the plastic stent outside; Simultaneously, said led chip unit comprises the led chip or the led chip group of two or more colors; Therefore, the LED matrix of utility model is a kind of high color rendering index (CRI) LED matrix with excellent heat dispersion performance.Thus; The heat that led chip when work produces can through heat sink fast, conduct fully; Thereby the working temperature that guarantees led chip is stabilized in lower level, reduces the LED matrix that causes because of working temperature is too high and damages risk and be improved the actual life of LED.
Description of drawings
Fig. 1 is the structural representation of the utility model LED matrix preferred embodiment.
Description of reference numerals:
10, LED matrix, 20, packaging body, 21, heat sink, 22, plastic stent; 31, second blue-light LED chip, 32, red LED chip, 33, first blue-light LED chip, 40, the yellow fluorescence silica gel layer; 50, heat conductive insulating layer, 231, the negative pole pin, 232, anodal pin.
Embodiment
In order to solve prior art problems, a kind of LED matrix has been proposed, include: led chip unit, packaging body, anodal pin and negative pole pin; Said packaging body includes plastic stent and heat sink, and the inner of anodal pin and negative pole pin embeds in the plastic stent, and is connected with the led chip unit through lead; Wherein, be provided with heat sink mounting groove in the said plastic stent, heat sink mounting groove has opening, and in the said heat sink embedding plastic stent and be installed in heat sink mounting groove place, the whole or local opening through mounting groove of heat sink outer surface exposes the plastic stent outside; The led chip unit is arranged on the heat sink side surface; Said led chip unit comprises the led chip or the led chip group of two or more colors, and wherein a kind of is red LED chip or red LED chip group.
Further, said led chip unit comprises that a red LED chip and two above blue-light LED chips are connected in series between said red LED chip and the said blue-light LED chip; Said red LED chip and said blue-light LED chip are arranged at said heat sink inner surface.
Further, the power of said LED matrix is more than the 0.1W.Preferably, the power of said LED matrix is more than or equal to 1W.
The said red LED chip of said heat sink electrical connection and blue-light LED chip wherein.
The quantity of said blue-light LED chip is two, and promptly said led chip unit comprises first blue-light LED chip and second blue-light LED chip.
Said first blue-light LED chip and second blue-light LED chip lay respectively at the relative both sides of said red LED chip.
The positive pole of said first blue-light LED chip is electrically connected with said anodal pin, and negative pole is connected with the positive electrical of said red LED chip; The positive pole of the negative pole of said red LED chip and said second blue-light LED chip respectively with said heat sink the electrical connection; The negative pole of said second blue-light LED chip is electrically connected with said negative pole pin.
Said LED matrix also comprises the yellow fluorescence silica gel layer that covers said led chip unit.
Further, said yellow fluorescence silica gel layer is a kind of silica gel structure layer that is attached with yellow fluorescent powder; Perhaps, said yellow fluorescence silica gel layer is a kind of structure sheaf of being processed by yellow fluorescent powder and silica gel composite material.
Said LED matrix also comprises the heat conductive insulating layer that covers said heat sink outer surface.
Said heat sink employing conductive metallic material is prepared from.
Embodiment one:
The structure of the LED matrix preferred embodiment of the utility model is as shown in Figure 1; LED matrix 10 comprises packaging body 20, anodal pin 232 and negative pole pin 231; Packaging body 20 has plastic stent 22 and heat sink 21; Heat sink 21 are prepared from conductive metallic material, and the inner of anodal pin 232 and negative pole pin 231 embeds in the plastic stent 22.
Be connected in series through lead or heat sink formation between red LED chip 32, first blue-light LED chip 33 and second blue-light LED chip 31.Concrete, the positive pole of first blue-light LED chip 33 is electrically connected with anodal pin 232, and negative pole is connected with the positive electrical of red LED chip 32; The positive pole of the negative pole of red LED chip 32 and second blue-light LED chip 31 is electrically connected with heat sink 21 respectively; The negative pole of second blue-light LED chip 31 is electrically connected with negative pole pin 231.
The utility model LED matrix 10 can be that power is the above LED matrix of 1W; Because all led chips all are arranged on heat sink 21; The heat that led chip produces can be through heat sink 21 in time, conducted fully; Even be the great power LED device more than the 1W for power therefore, the technical scheme of the utility model also can make it have good heat-radiation effect.
The said LED matrix 10 whole cylindrical shape structures that adopt; Heat sink 21 adopt bowl structure; Red LED chip 32, first blue-light LED chip 33 and second blue-light LED chip 31 are arranged on the inner surface of heat sink 21 bottoms, and heat conductive insulating layer 50 is fitted in the outer surface of heat sink 21 bottoms;
The LED matrix of the utility model adopts blue-light LED chip and red LED chip to be connected in series, and yellow fluorescent powder covers the technical scheme of blue-light LED chip and red LED chip.In this scheme; The blue-light excited yellow fluorescent powder that blue-light LED chip sends sends the white light that lacks dark red light; The ruddiness that red LED chip sends can not send visible light by the laser yellow fluorescent powder, thus, and the spectrum of dark red light in being equivalent in the white-light spectrum that lacks dark red light, add; The color reducibility of LED matrix is good, and color rendering index is high.
Embodiment two:
Can also carry out following simple structural change to the above-mentioned preferred embodiment of the utility model, for example: the quantity of blue-light LED chip can be for more than 3, and are evenly distributed on around the red LED chip in a circumferential direction; The power of LED matrix is controlled in the middle power bracket of 0.1W to 1W, and can make LED matrix obtain longer useful life because the heat that led chip work produces is less relatively this moment.
The said LED matrix 10 whole cube structures that adopt; Heat sink 21 adopt the box like structure with top opening; Red LED chip 32, first blue-light LED chip 33 and second, third blue-light LED chip 31 are arranged on the inner surface of heat sink 21 bottoms, and heat conductive insulating layer 50 is fitted in the outer surface of heat sink 21 bottoms.
The above embodiment has only expressed several kinds of execution modes of the utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to the protection range of the utility model.Therefore, the protection range of the utility model patent should be as the criterion with accompanying claims.
Claims (10)
1.LED device includes: led chip unit, packaging body, anodal pin and negative pole pin; Said packaging body includes plastic stent and heat sink, and the inner of anodal pin and negative pole pin embeds in the plastic stent, and is connected with the led chip unit through lead; It is characterized in that; Be provided with heat sink mounting groove in the said plastic stent; Heat sink mounting groove has opening, and in the said heat sink embedding plastic stent and be installed in heat sink mounting groove place, the whole or local opening through mounting groove of heat sink outer surface exposes the plastic stent outside; The led chip unit is arranged on the heat sink side surface; Said led chip unit comprises the led chip or the led chip group of two or more colors, and wherein a kind of is red LED chip or red LED chip group.
2. LED matrix according to claim 1 is characterized in that, said led chip unit comprises that a red LED chip and two above blue-light LED chips are connected in series between said red LED chip and the said blue-light LED chip; Said red LED chip and said blue-light LED chip are arranged at said heat sink inner surface.
3. LED matrix according to claim 2 is characterized in that the power of said LED matrix is more than or equal to 1W.
4. LED matrix according to claim 2 is characterized in that, the said red LED chip of said heat sink electrical connection and blue-light LED chip wherein.
5. LED matrix according to claim 4 is characterized in that, the quantity of said blue-light LED chip is two, and promptly said led chip unit comprises first blue-light LED chip and second blue-light LED chip.
6. LED matrix according to claim 5 is characterized in that, said first blue-light LED chip and second blue-light LED chip lay respectively at the relative both sides of said red LED chip.
7. according to claim 5 or 6 described LED matrixs, it is characterized in that the positive pole of said first blue-light LED chip is electrically connected with said anodal pin, negative pole is connected with the positive electrical of said red LED chip; The positive pole of the negative pole of said red LED chip and said second blue-light LED chip respectively with said heat sink the electrical connection; The negative pole of said second blue-light LED chip is electrically connected with said negative pole pin.
8. according to any one described LED matrix in the claim 1 to 6, it is characterized in that said LED matrix also comprises the yellow fluorescence silica gel layer that covers said led chip unit.
9. LED matrix according to claim 8 is characterized in that, said yellow fluorescence silica gel layer is a kind of silica gel structure layer that is attached with yellow fluorescent powder; Perhaps, said yellow fluorescence silica gel layer is a kind of structure sheaf of being processed by yellow fluorescent powder and silica gel composite material.
10. LED matrix according to claim 8 is characterized in that, said LED matrix also comprises the heat conductive insulating layer that covers said heat sink outer surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201844901U CN202633302U (en) | 2012-04-26 | 2012-04-26 | Led device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201844901U CN202633302U (en) | 2012-04-26 | 2012-04-26 | Led device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202633302U true CN202633302U (en) | 2012-12-26 |
Family
ID=47386460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201844901U Expired - Fee Related CN202633302U (en) | 2012-04-26 | 2012-04-26 | Led device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202633302U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103579462A (en) * | 2013-11-12 | 2014-02-12 | 奇瑞汽车股份有限公司 | Light source of LED steering lamp of automobile |
| CN104037300A (en) * | 2013-03-08 | 2014-09-10 | 群创光电股份有限公司 | Light-emitting diode device, display device and electronic equipment |
| CN104241497A (en) * | 2013-06-19 | 2014-12-24 | 江苏稳润光电有限公司 | Novel high-luminous-efficiency, high-reliability and high-radiating-efficiency white light LED manufacturing method |
| CN105355760A (en) * | 2014-11-11 | 2016-02-24 | 易美芯光（北京）科技有限公司 | Light emitting diode (LED) device characterized by wide color gamut display |
| CN112599514A (en) * | 2020-12-31 | 2021-04-02 | 南京工业大学 | High-quality full-color semiconductor light source |
-
2012
- 2012-04-26 CN CN2012201844901U patent/CN202633302U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104037300A (en) * | 2013-03-08 | 2014-09-10 | 群创光电股份有限公司 | Light-emitting diode device, display device and electronic equipment |
| CN104241497A (en) * | 2013-06-19 | 2014-12-24 | 江苏稳润光电有限公司 | Novel high-luminous-efficiency, high-reliability and high-radiating-efficiency white light LED manufacturing method |
| CN103579462A (en) * | 2013-11-12 | 2014-02-12 | 奇瑞汽车股份有限公司 | Light source of LED steering lamp of automobile |
| CN105355760A (en) * | 2014-11-11 | 2016-02-24 | 易美芯光（北京）科技有限公司 | Light emitting diode (LED) device characterized by wide color gamut display |
| CN112599514A (en) * | 2020-12-31 | 2021-04-02 | 南京工业大学 | High-quality full-color semiconductor light source |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202633302U (en) | Led device | |
| CN101692448B (en) | Multi-chip LED centralized-encapsulated radiating structure and encapsulation technology thereof | |
| CN201180951Y (en) | Low-color temperature white light LED device | |
| CN203351667U (en) | Isolated cob light source module | |
| CN202013881U (en) | Integrated packaging structure with vertically structured LED chips | |
| CN204029855U (en) | A kind of LED lamp | |
| CN201190979Y (en) | LED light-emitting device with high thermal diffusivity | |
| CN202769331U (en) | Semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp | |
| CN101363609B (en) | Light source assembly of high-power LED lamp and installation method thereof in lamp holder | |
| CN101988637A (en) | White-light light-emitting diode (LED) light sourceS, manufacturing method thereof and street lamp using white-light LED sources | |
| CN201629332U (en) | Multi-chip LED package radiating structure | |
| CN202167489U (en) | Chip on board (COB) matrix packaging structure of large power light-emitting diode (LED) | |
| CN201093214Y (en) | Direct inserting type LED | |
| CN201655843U (en) | LED encapsulation structure | |
| CN205065472U (en) | A superconductive aluminium base board of thermoelectric separation for projecting lamp | |
| CN203659925U (en) | High brightness surface mount device light-emitting diode | |
| CN201757295U (en) | LED lamp structure | |
| CN201526823U (en) | White light LED light source and street lamp applying same | |
| CN201547725U (en) | Heat dissipation device of LED lamp | |
| CN202001932U (en) | Light-emitting diode (LED) street lamp of high luminous efficiency and high color-rendering property | |
| CN201946592U (en) | White light emitting diode (LED) packaging structure | |
| CN201496917U (en) | High-power LED street lamp cap adopting water-cooling heat dissipation | |
| CN205208179U (en) | Automatic cooling control's high -power LED lamp | |
| CN205122633U (en) | High -power LED's COB encapsulation | |
| CN205264751U (en) | Low thermal resistance LED light source |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: YANGZHOU DEHAO RUNDA OPTOELECTRONIC CO., LTD. Free format text: FORMER OWNER: GUANGDONG ELECTECH INTERNATIONAL INC. Effective date: 20131023 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 519000 ZHUHAI, GUANGDONG PROVINCE TO: 225000 YANGZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131023 Address after: Nanyuan Hanjiang Economic Development Zone, Jiangsu province Yangzhou two longitudinal road 225000 No. eight Patentee after: Yangzhou Dehao Runda Optoelectronic Co., Ltd. Address before: 519000 Guangdong city of Zhuhai province tangjiewan Jinfeng Road No. 1 Patentee before: Guangdong Electech International Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121226 Termination date: 20180426 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |