CN202769331U - Semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp - Google Patents
Semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp Download PDFInfo
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- CN202769331U CN202769331U CN2012203212855U CN201220321285U CN202769331U CN 202769331 U CN202769331 U CN 202769331U CN 2012203212855 U CN2012203212855 U CN 2012203212855U CN 201220321285 U CN201220321285 U CN 201220321285U CN 202769331 U CN202769331 U CN 202769331U
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- led lamp
- heat
- lamp holder
- semiconductor refrigeration
- heat conduction
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Abstract
The utility model discloses a semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp which comprises an LED lamp cap and a lamp seat which is used for mounting and fixing of the LED lamp cap, wherein the lamp seat comprises a heat conduction substrate and a refrigeration plate, the refrigeration plate is arranged between the LED lamp cap and the heat conduction substrate, the refrigeration plate is connected with the heat conduction substrate and a heat sink heat conductor of the LED lamp cap, and the outer side face of the heat conduction substrate is provided with heat dissipation fins. The semiconductor refrigeration and thermal dissipation LED lamp can effectively ensure operating temperature of the LED lamp cap through the refrigeration plate arranged on the lamp seat, improves practical performance of the LED lamp, and prolongs service life.
Description
Technical field
The utility model relates to a kind of lighting device, relates in particular to a kind of LED lamp of semiconductor refrigeration radiating.
Background technology
The LED lamp compare with illuminations such as traditional incandescent lamp, fluorescent lamps have that luminance is high, power consumption less, applicability is strong, the response time is short, environmentally safe, the advantage such as multicolor luminous, therefore in lighting field, obtain using more and more widely.The LED lamp is the same with other light fixture, to produce heat in the luminescence process, high-power LED lamp such as LED street lamp and Tunnel Lamp, in luminous, produce especially a large amount of heat, thereby gathering of heat can make the luminous generation depletion of led chip affect serviceability and the service life of LED lamp, in the prior art for overcoming the above problems, high-power LED lamp is generally with the heat-conducting substrate that the is provided with radiating fin lamp socket as the LED lamp holder, adopt free convection and thermal-radiating mode to make the heat of LED lamp holder be delivered to external environment condition by heat-conducting substrate and radiating fin successively, radiating effect is relatively poor, can't guarantee the operating temperature of LED lamp holder, cause the serviceability of LED lamp poor, the life-span is short.
Therefore, need to be improved existing LED modulated structure, to guarantee the operating temperature of LED lamp holder, be improved the utility model of LED lamp, be increased the service life.
The utility model content
In view of this, the purpose of this utility model provides a kind of LED lamp of semiconductor refrigeration radiating, can guarantee the operating temperature of LED lamp holder, improves the utility model of LED lamp, increases the service life.
The LED lamp of semiconductor refrigeration radiating of the present utility model comprises the LED lamp holder and is used for installing the lamp socket of fixing described LED lamp holder; Described lamp socket comprises heat-conducting substrate and cold plate, and cold plate is arranged between LED lamp holder and the heat-conducting substrate, and cold plate and heat-conducting substrate are connected heat sink heat conduction and are connected setting with the LED lamp holder, and the lateral surface of heat-conducting substrate is provided with radiating fin.
Further, described cold plate is for connecting the semiconductor temperature difference cooling piece of dc source, and its cold junction is connected with the heat sink heat conduction of LED lamp holder, and the hot junction is connected with heat-conducting substrate heat conduction;
Further, the cold end surface that is positioned at the semiconductor temperature difference cooling piece is provided with the circuit groove, and the circuit insulation of LED lamp holder is arranged in the circuit groove, and the circuit of LED lamp holder is provided with the contact of fitting with the electrodes conduct of LED lamp holder;
Further, the cold end surface of described semiconductor temperature difference cooling piece cast high temperature insulation sealant layer, its thickness is no more than the root of LED lamp holder;
Further, the high temperature insulation sealant layer is epoxy resin layer;
Further, the cold junction of the heat sink and semiconductor temperature difference cooling piece of described LED lamp holder is fixedly connected with by soldering heat conduction.
The beneficial effects of the utility model are: the LED lamp of semiconductor refrigeration radiating of the present utility model, can effectively guarantee the operating temperature of LED lamp holder by being arranged at cold plate on the lamp socket, and improve the utility model of LED lamp, increase the service life.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further described:
Fig. 1 is structural representation of the present utility model.
The specific embodiment
Fig. 1 is structural representation of the present utility model, and as shown in the figure: the LED lamp of the semiconductor refrigeration radiating of the present embodiment comprises LED lamp holder 1 and is used for installing the lamp socket of fixing described LED lamp holder 1; Described lamp socket comprises heat-conducting substrate 3 and cold plate 2, and cold plate 2 is arranged between LED lamp holder 1 and the heat-conducting substrate 3, and cold plate 2 is connected setting with heat sink 11 heat conduction that heat-conducting substrate 3 is connected with the LED lamp holder, and the lateral surface of heat-conducting substrate 3 is provided with radiating fin 31.
In the present embodiment, described cold plate 2 is for connecting the semiconductor temperature difference cooling piece of dc source, its cold junction 21 is connected with heat sink 11 heat conduction of LED lamp holder 1, hot junction 22 is connected with heat-conducting substrate 3 heat conduction, the semiconductor temperature difference cooling piece of the present embodiment adopts single-stage thermoelectric cooling, can make its cold junction 21 and hot junction 22 form 60 ~ 70 ℃ of temperature difference after connecting dc source, dispel the heat with heat transferred heat-conducting substrate 3 and by free convection and thermal-radiating form in hot junction 22, cold junction 21 can significantly reduce heat sink 11 temperature with heat sink 11 effects by heat exchange of LED lamp holder 1, and then LED lamp holder 1 is more effectively cooled off.
In the present embodiment, cold junction 21 surfaces that are positioned at the semiconductor temperature difference cooling piece are provided with circuit groove 23, the circuit insulation of LED lamp holder 1 is arranged in the circuit groove 23, the circuit of LED lamp holder 1 is provided with the contact of fitting with electrode 12 conductions of LED lamp holder 1, make the electrode 12 of LED lamp holder 1 directly stretch out the purpose that can reach electrical connection, simple and compact for structure, the complexity when reducing by 1 manufacturing of LED lamp holder, and simplify installation and removal.
In the present embodiment; the cold junction 21 surface casting high temperature insulation sealant layers 4 of described semiconductor temperature difference cooling piece; its thickness is no more than the root of LED lamp holder 1; LED lamp holder 1 is had reinforcing and circuit is had sealing function, play the purpose of protection LED lamp holder 1 and circuit, and when guaranteeing sealing effectiveness and installation strength; do not interfere the luminous of lamp pearl; further reduce light loss, fabrication and installation are comparatively convenient, reduce and use and installation cost.
In the present embodiment, high temperature insulation sealant layer 4 is epoxy resin layer.
In the present embodiment, heat sink 11 of described LED lamp holder 1 is fixedly connected with by soldering heat conduction with the cold junction 21 of semiconductor temperature difference cooling piece, and welding process is simple, changes the method for available technology adopting heat-conducting silicone grease, reduces the heat conduction link, improves heat transfer efficiency.
In the present embodiment, can be positioned at a plurality of LED lamp holders 1 are set on the lamp socket, circuit groove 23 corresponding all LED lamp holders 1 arrange, and also can be provided for installing according to actual operation requirements the lamp bracket and the lampshade that covers in lamp socket and 1 outside seal of LED lamp holder of fixed lamp-socket, can realize different purposes.
Explanation is at last, above embodiment is only unrestricted in order to the technical solution of the utility model to be described, although with reference to preferred embodiment the utility model is had been described in detail, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement the technical solution of the utility model, and not breaking away from aim and the scope of technical solutions of the utility model, it all should be encompassed in the middle of the claim scope of the present utility model.
Claims (6)
1. the LED lamp of a semiconductor refrigeration radiating is characterized in that: comprise the LED lamp holder and be used for installing the lamp socket of fixing described LED lamp holder; Described lamp socket comprises heat-conducting substrate and cold plate, and cold plate is arranged between LED lamp holder and the heat-conducting substrate, and cold plate and heat-conducting substrate are connected heat sink heat conduction and are connected setting with the LED lamp holder, and the lateral surface of heat-conducting substrate is provided with radiating fin.
2. the LED lamp of semiconductor refrigeration radiating according to claim 1 is characterized in that: described cold plate is for connecting the semiconductor temperature difference cooling piece of dc source, and its cold junction is connected with the heat sink heat conduction of LED lamp holder, and the hot junction is connected with heat-conducting substrate heat conduction.
3. the LED lamp of semiconductor refrigeration radiating according to claim 2, it is characterized in that: the cold end surface that is positioned at the semiconductor temperature difference cooling piece is provided with the circuit groove, the circuit insulation of LED lamp holder is arranged in the circuit groove, and the circuit of LED lamp holder is provided with the contact of fitting with the electrodes conduct of LED lamp holder.
4. the LED lamp of semiconductor refrigeration radiating according to claim 3 is characterized in that: the cold end surface cast high temperature insulation sealant layer of described semiconductor temperature difference cooling piece, its thickness is no more than the root of LED lamp holder.
5. the LED lamp of semiconductor refrigeration radiating according to claim 4, it is characterized in that: the high temperature insulation sealant layer is epoxy resin layer.
6. the LED lamp of semiconductor refrigeration radiating according to claim 5, it is characterized in that: the cold junction of the heat sink and semiconductor temperature difference cooling piece of described LED lamp holder is fixedly connected with by pressing heat conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203212855U CN202769331U (en) | 2012-07-04 | 2012-07-04 | Semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203212855U CN202769331U (en) | 2012-07-04 | 2012-07-04 | Semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202769331U true CN202769331U (en) | 2013-03-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203212855U Expired - Fee Related CN202769331U (en) | 2012-07-04 | 2012-07-04 | Semiconductor refrigeration and thermal dissipation light-emitting diode (LED) lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202769331U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103644554A (en) * | 2013-12-23 | 2014-03-19 | 袁曦明 | System and device of intelligent heat dissipation for super-power LEDs |
| CN104747950A (en) * | 2015-03-25 | 2015-07-01 | 胡振强 | Low-power-consumption high-brightness LED |
| CN110715180A (en) * | 2019-10-12 | 2020-01-21 | 刘丽爽 | LED lamp that heat dispersion is high |
| CN111189018A (en) * | 2020-04-20 | 2020-05-22 | 朱旭阳 | LED street lamp |
-
2012
- 2012-07-04 CN CN2012203212855U patent/CN202769331U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103644554A (en) * | 2013-12-23 | 2014-03-19 | 袁曦明 | System and device of intelligent heat dissipation for super-power LEDs |
| CN103644554B (en) * | 2013-12-23 | 2015-09-02 | 袁曦明 | A kind of super-high-power LED intelligent heat dissipation system and device |
| CN104747950A (en) * | 2015-03-25 | 2015-07-01 | 胡振强 | Low-power-consumption high-brightness LED |
| CN110715180A (en) * | 2019-10-12 | 2020-01-21 | 刘丽爽 | LED lamp that heat dispersion is high |
| CN111189018A (en) * | 2020-04-20 | 2020-05-22 | 朱旭阳 | LED street lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130306 Termination date: 20160704 |
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| CF01 | Termination of patent right due to non-payment of annual fee |