CN201190979Y - LED light-emitting device with high thermal diffusivity - Google Patents
LED light-emitting device with high thermal diffusivity Download PDFInfo
- Publication number
- CN201190979Y CN201190979Y CNU200820101732XU CN200820101732U CN201190979Y CN 201190979 Y CN201190979 Y CN 201190979Y CN U200820101732X U CNU200820101732X U CN U200820101732XU CN 200820101732 U CN200820101732 U CN 200820101732U CN 201190979 Y CN201190979 Y CN 201190979Y
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- CN
- China
- Prior art keywords
- circuit board
- depressed part
- cooling base
- heat radiation
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
A LED lighting device of high heat radiation comprises heat radiation base, a LED chip and a circuit board, which is characterized in that the heat radiation base is provided with a concave, the LED chip is arranged at the bottom of the chamber of the concave of the heat radiation base and is combined with the heat radiation base, the circuit board is provided with a through hole fit with the concave on the heat radiation base, the circuit board is fixedly connected with the heat radiation base via the through hole sheathing the concave, the anode and the cathode wires of the LED chip are penetrated through relative wire holes on the heat radiation base to be connected with a wiring circuit on the circuit board, the chamber of the concave packages the LED chip and a transparent package body part of which are connected with wires. The LED chip is mounted on the inner bottom of the concave to be thermally combined with the heat radiation base, after installing a lamp, the heat radiation base is at the front part of the lamp, having a smooth heat radiation channel, thereby improving heat radiation effect. The chamber of the concave of the heat radiation base is beneficial for coating white light fluorescent powder and adjusting the emission angle of illumination light. The LED lighting device has simple structure, simple lamp assembly and simple lamp maintenance.
Description
Technical field
The utility model relates to a kind of light fixture, specifically is a kind of LED light-emitting device of high-cooling property.
Background technology
Along with the LED technical development, LED uses also diversification day by day, by early stage power supply indicator, advance to have power saving, the life-span is long, the LED illuminating product of visibility advantages of higher.Yet because the high-capacity LED input power only has fraction to convert light to, all the other convert heat to, if these heat are not discharged outside in good time, will make the led chip interface temperature too high and influence luminous efficiency and luminescent lifetime so.Traditional LED light-emitting device method for packing is, led chip is configured on the circuit board, and led chip two electrodes connect with board circuit respectively and form the loop, and circuit board bottom surface connects the high-cooling property cooling base.The heat energy that led chip sends is got rid of through cooling base by after the circuit board heat conduction again, but, because printed circuit board (PCB) is non-high heat conductive body, its thermal conductivity coefficient is low, heat dispersion is poor, the heat energy that causes led chip to produce can't in time be dredged and be got rid of, and directly causes the led chip junction temperature to raise, and light fixture hot polymerization effect and thermal resistance are excessive, cause led chip short and light decay phenomenon in service life easily, and therefore improve energy consumption.
In order to improve the heat radiation needs of LED light-emitting device, the patent No. is the light-emitting device that 02802732.9 patent of invention discloses a kind of LED of use, as shown in Figure 8: led chip 1 is loaded in the pockets 2b of aluminum cooling base 2 protuberance 2a, protuberance 2a is plugged among the circuit board 3 corresponding hole 3a, and cooling base 2 fits tightly together with circuit board 3; Perfusion transparent encapsulating body in the pockets 2b.The light-emitting device of this use LED, led chip on-line equipment are on cooling base, and the heat that led chip produces is directly got rid of by cooling base, have improved the radiating effect of light fixture to a certain extent.But because cooling base 2 fits tightly at the back of circuit board 3, after the lamp installation, cooling base is positioned at the back of light fixture, and its heat dissipation channel is not smooth, influences radiating effect; The transparent encapsulating body of one perfusion in the pockets 2b of cooling base 2 protuberance 2a and the circuit board hole 3a, complex structure, production process is loaded down with trivial details.Comprehensively above-mentioned, for existing LED light-emitting device encapsulating structure, still remain to be improved, with further raising radiating effect, simplified structure.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, and a kind of LED light-emitting device of high-cooling property is provided, and has good thermal diffusivity, prolongs the service life of LED; Simple in structure, be convenient to make and safeguard, reduce product cost.
The purpose of this utility model is achieved through the following technical solutions:
The LED light-emitting device of high-cooling property comprises cooling base, led chip, the circuit board of high-termal conductivity, and it is characterized in that: described cooling base is provided with the depressed part that is used for ccontaining led chip; Led chip fixedly is assemblied in the intracavity bottom of described depressed part by its radiating end; Circuit board is provided with the through hole that is sheathed on the cooling base depressed part outer peripheral face, and circuit board is fixed together by through hole and the cooling base that is set on the depressed part; The corresponding through wires hole that the wiring of described led chip positive and negative electrode is passed on the cooling base is connected with the wiring circuit of circuit board; The transparent encapsulating body of described depressed part inner chamber perfusion packaging LED chips, part wiring.
The depressed part of described cooling base is step-like, and wherein top loop is provided with step; Circuit board arrangement is laid wiring circuit in the middle and lower part of step and the one side relative with cooling base, and described through wires hole is opened on the step.
It is tapered that the depressed part of described cooling base is rounding, and the through hole of circuit board is sheathed on the top of depressed part, and the opposite face of circuit board and cooling base is close to and is fixed together, and the another side of circuit board is laid wiring circuit; Described through wires hole is opened on the depressed part sidewall of circuit board bottom.
It is tapered that the depressed part of described cooling base is rounding, and the through hole of circuit board is sheathed on the middle part of depressed part, and circuit board and cooling base have spacing, simultaneously lays wiring circuit with the circuit board opposed circuit boards; Described through wires hole is opened on the depressed part sidewall on circuit board top.
Apply reflection LED reflection of light film on the inner surface of described cooling base depressed part.
The utlity model has following beneficial effect:
The LED light-emitting device of high-cooling property, led chip are installed on the inner bottom surface of depressed part and combine with the cooling base direct heat, and circuit board is assemblied in the bottom of cooling base, after the lamp installation, cooling base is positioned at the front portion of light fixture, and its heat dissipation channel is unimpeded, reduces thermal impedance and improves radiating effect; The depressed part inner chamber of cooling base helps the coating of white emitting fluorescent powder and adjusts illuminating ray institute emission angle; Circuit board is provided with hole, is convenient to affixed cooling base, shortens the distance of wiring between led chip P, N level and the circuit board greatly; It is simple in structure, is convenient to the I﹠ M of light fixture, saves cost.This product can apply to general illumination or the LCD backlight is used; The thermoelectric chip that separates (P, N electrode) in the front, its little chip low current drives, and light efficiency is high than large chip, is well suited for this product of encapsulation.
Description of drawings
Below in conjunction with accompanying drawing the utility model is described in further detail.
Fig. 1 is the structure cutaway view of the utility model first embodiment.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the structural representation of the circuit board among Fig. 2.
Fig. 4 is the structure cutaway view of the utility model second embodiment.
Fig. 5 is the vertical view of Fig. 4.
Fig. 6 is the upward view of Fig. 4.
Fig. 7 is the structure cutaway view of the utility model the 3rd embodiment.
Fig. 8 is the structure cutaway view of the light-emitting device of existing use LED.
The specific embodiment
Embodiment 1: with reference to Fig. 1, Fig. 2.The LED light-emitting device of high-cooling property comprises led chip 1, cooling base 2, circuit board 3 and the transparent encapsulating body 4 that is used for packaging LED chips 1.Cooling base adopts the aluminium of high heat conduction or other metal material to make.
With reference to Fig. 1, Fig. 2.Cooling base 2 is provided with depressed part 21, and this depressed part 21 is step-like, and wherein top loop is provided with step 22; The depressed part of step 22 belows forms the tapered cavity of rounding that helps being coated with white emitting fluorescent powder; The both sides correspondence of step 22 is offered the through wires hole 23 that the wiring of the power supply utmost point is passed, and through wires hole 23 connects the thickness of step 22.Light reflectivity for improving, on the inner surface of depressed part 21, evenly apply reflection LED reflection of light film.
Referring to figs. 1 through Fig. 3.Correspondence offers through hole 31 (seeing Fig. 3 for details) on the circuit board 3, and through hole 31 tightly is enclosed within on the depressed part 21 of above-mentioned step 22 bottoms, and circuit board 3 and cooling base 2 are assembled together.Have the gap between circuit board 3 after the circuit board assembling and the step 22, this gap can prevent on the one hand short circuit guarantee circuit safe, can increase the efficiently radiates heat area of cooling base with the raising radiating effect on the other hand.Lay wiring circuit 5 with cooling base 2 opposed circuit boards 3 one sides, wiring circuit 5 extends near depressed part 21 outer peripheral faces.The wiring 6 and circuit board wiring circuit 5 electric connections of the positive and negative electrode of led chip 1 by passing corresponding through wires hole 23.The transparent encapsulating body 4 that infusion epoxy resin, silica gel or other transparent material are made in the inner chamber of depressed part 21 is with packaging LED chips 1 and part wiring 6.Packaging body 4 adopts epoxy resin, silica gel or other transparent material to make, and does not do concrete qualification at this.For guaranteeing to take place wiring safety, one perfusion transparent encapsulating body 4 in the through wires hole 23; But be not limited to this, also can pour into insulating cement in the through wires hole 23.
Embodiment 2: present embodiment as different from Example 1:
With reference to Fig. 4 to Fig. 6.Depressed part 21 integral body of cooling base 2 are an opening, and to be that light-emitting window is big, the bottom is rounding for a short time tapered, and depressed part 21 is not provided with step.The through hole 31 of circuit board 3 is sleeved on the top of depressed part 21; Circuit board 3 is close to the opposite face of cooling base 2 and is fixed together, and the another side of circuit board 3 is laid wiring circuit 5.Offer through wires hole 23 on depressed part 21 sidewalls of circuit board 3 bottoms.The wiring 6 and circuit board wiring circuit 5 electric connections of the positive and negative electrode of the led chip 1 of thermal device on depressed part 21 inner bottom surfaces by passing corresponding through wires hole 23.All the other structures are identical with embodiment 1, no longer are described in detail at this.
Embodiment 3: present embodiment as different from Example 1:
With reference to Fig. 7.Depressed part 21 integral body of cooling base 3 are an opening, and to be that light-emitting window is big, the bottom is rounding for a short time tapered, and depressed part 21 is not provided with step.The through hole 31 of circuit board 3 tightly is placed in the middle part of depressed part 21; Have certain spacing between circuit board 3 and the cooling base 2, lay wiring circuit 5 with cooling base 2 opposed circuit boards 3 one sides.Offer through wires hole 23 on depressed part 21 sidewalls on circuit board 3 tops.The wiring 6 and circuit board wiring circuit 5 electric connections of the positive and negative electrode of the led chip 1 of thermal device on depressed part 21 inner bottom surfaces by passing corresponding through wires hole 23.All the other structures are identical with embodiment 1, no longer are described in detail at this.
The above, it only is the utility model preferred embodiment, so can not limit the scope that the utility model is implemented with this, i.e. the equivalence of doing according to the utility model claim and description changes and modifies, and all should still belong in the scope that the utility model patent contains.
Claims (5)
1, the LED light-emitting device of high-cooling property comprises cooling base, led chip, the circuit board of high-termal conductivity, and it is characterized in that: described cooling base is provided with the depressed part that is used for ccontaining led chip; Led chip fixedly is assemblied in the intracavity bottom of described depressed part by its radiating end; Circuit board is provided with the through hole that is sheathed on the cooling base depressed part outer peripheral face, and circuit board is fixed together by through hole and the cooling base that is set on the depressed part; The corresponding through wires hole that the wiring of described led chip positive and negative electrode is passed on the cooling base is connected with the wiring circuit of circuit board; The transparent encapsulating body of described depressed part inner chamber perfusion packaging LED chips, part wiring.
2. the LED light-emitting device of high-cooling property according to claim 1, it is characterized in that: the depressed part of described cooling base is step-like, and wherein top loop is provided with step; Circuit board arrangement is laid wiring circuit in the middle and lower part of step and the one side relative with cooling base, and described through wires hole is opened on the step.
3. the LED light-emitting device of high-cooling property according to claim 1, it is characterized in that: it is tapered that the depressed part of described cooling base is rounding, the through hole of circuit board is sheathed on the top of depressed part, the opposite face of circuit board and cooling base is close to and is fixed together, and the another side of circuit board is laid wiring circuit; Described through wires hole is opened on the depressed part sidewall of circuit board bottom.
4. the LED light-emitting device of high-cooling property according to claim 1, it is characterized in that: it is tapered that the depressed part of described cooling base is rounding, the through hole of circuit board is sheathed on the middle part of depressed part, circuit board and cooling base have spacing, simultaneously lay wiring circuit with the circuit board opposed circuit boards; Described through wires hole is opened on the depressed part sidewall on circuit board top.
5. according to the LED light-emitting device of the arbitrary described high-cooling property of claim 1 to 4, it is characterized in that: apply reflection LED reflection of light film on the inner surface of described cooling base depressed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820101732XU CN201190979Y (en) | 2008-03-19 | 2008-03-19 | LED light-emitting device with high thermal diffusivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820101732XU CN201190979Y (en) | 2008-03-19 | 2008-03-19 | LED light-emitting device with high thermal diffusivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201190979Y true CN201190979Y (en) | 2009-02-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820101732XU Expired - Fee Related CN201190979Y (en) | 2008-03-19 | 2008-03-19 | LED light-emitting device with high thermal diffusivity |
Country Status (1)
| Country | Link |
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| CN (1) | CN201190979Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
| CN102095091A (en) * | 2010-09-30 | 2011-06-15 | 福建省万邦光电科技有限公司 | LED light source module packaging structure |
| CN102244074A (en) * | 2011-06-22 | 2011-11-16 | 福建省万邦光电科技有限公司 | Package structure of LED (light emitting diode) light source module of convex cup structure |
| CN104797121A (en) * | 2014-01-20 | 2015-07-22 | Tdk株式会社 | Power supply device |
| CN105371252A (en) * | 2015-12-16 | 2016-03-02 | 东莞市星曜光电照明科技有限公司 | Direct type integrally-encapsulated heat dissipation module |
-
2008
- 2008-03-19 CN CNU200820101732XU patent/CN201190979Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
| CN102095091A (en) * | 2010-09-30 | 2011-06-15 | 福建省万邦光电科技有限公司 | LED light source module packaging structure |
| WO2012040957A1 (en) * | 2010-09-30 | 2012-04-05 | 福建中科万邦光电股份有限公司 | Package structure of led light source module |
| CN102244074A (en) * | 2011-06-22 | 2011-11-16 | 福建省万邦光电科技有限公司 | Package structure of LED (light emitting diode) light source module of convex cup structure |
| CN102244074B (en) * | 2011-06-22 | 2015-12-16 | 福建省万邦光电科技有限公司 | Convex cup structure LED light source module package structure |
| CN104797121A (en) * | 2014-01-20 | 2015-07-22 | Tdk株式会社 | Power supply device |
| CN104797121B (en) * | 2014-01-20 | 2018-01-23 | Tdk株式会社 | Supply unit |
| CN105371252A (en) * | 2015-12-16 | 2016-03-02 | 东莞市星曜光电照明科技有限公司 | Direct type integrally-encapsulated heat dissipation module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090204 Termination date: 20150319 |
|
| EXPY | Termination of patent right or utility model |