CN205122633U - High -power LED's COB encapsulation - Google Patents
High -power LED's COB encapsulation Download PDFInfo
- Publication number
- CN205122633U CN205122633U CN201520950148.1U CN201520950148U CN205122633U CN 205122633 U CN205122633 U CN 205122633U CN 201520950148 U CN201520950148 U CN 201520950148U CN 205122633 U CN205122633 U CN 205122633U
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- CN
- China
- Prior art keywords
- light source
- metal substrate
- led
- elargol
- printed layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a high -power LED's COB encapsulation, main to solve current LED encapsulation heat dissipation poor, with high costs, the problem of life weak point. It includes metal substrate (1), insulating layer (2), printing layer (3), light source (4), connecting wire (5) and protection gluey (6), its characterized in that: being equipped with insulating layer (2) on metal substrate (1), being equipped with on insulating layer (2) and printing layer (3), glue on metal substrate (1) through the elargol light source (4), and the fourth periderm insulating layer (2) and printing layer (3) encirclement formation recess, and electroplate recessed wall and bottom surface has silver, and light source (4) link to each other with printing layer (3) through connecting wire (5), and the protection is glued (6) and is covered on recess, light source (4) and connecting wire (5). The utility model discloses an elargol bonds LED chip and metal substrate, has realized the quick heat dissipation of LED chip, has strengthened the reliability of LED encapsulation when reducing the encapsulation cost, has lengthened LED's life.
Description
Technical field
The utility model relates to LED technology field, particularly a kind of COB encapsulation of great power LED.
Background technology
LED package refers to the encapsulation of luminescence chip, and comparing integrated antenna package has relatively big difference, the encapsulation not only claimed wick of LED, but also can printing opacity, and the encapsulation of high-power LED also needs to consider its heat dissipation problem.Electric energy conversion is that the efficiency of luminous energy probably can only reach 30% to 40% by current LED, and remaining energy is converted mainly into heat energy.The useful life of LED can reduce along with the rising of temperature, and when temperature is higher than time to a certain degree, the luminous efficiency of LED can reduce, and therefore, the heat dissipation problem of great power LED is particularly important.Existing SMD (SurfaceMountedDevices) paster type encapsulation, be pasted onto on MCPCB (MetalCorePCB) metal base printed board by scolding tin and heat-conducting silicone grease, but because the heat conductivility of heat-conducting silicone grease is limited, contact area is less, and heat dispersion is extremely limited.And COB (ChipOnBoard) encapsulation by plurality of LEDs chip direct package on metal base printed board, directly can be dispelled the heat by metal base printed board, not only can reduce costs, its heat dispersion can also be strengthened.But, metal base printed board is made up of metal substrate, thermally conductive insulating layer and printed layers, the thermal conductivity of printed layers and metal substrate is good, but the thermal conductivity of thermally conductive insulating layer is poor, the heat that LED sends is obstructed at thermally conductive insulating layer place, well heat can not be shed, more limited in high-power LED application.
Summary of the invention
The purpose of this utility model is, for the deficiency of above-mentioned existing COB encapsulation, to propose a kind of COB encapsulation of great power LED, to strengthen radiating effect, extend the useful life of LED, ensure the brightness of LED.
For achieving the above object, the utility model comprises metal substrate 1, insulating barrier 2, printed layers 3, light source 4, connecting line 5 and protecting glue 6; It is characterized in that: metal substrate 1 is provided with insulating barrier 2; insulating barrier 2 is provided with printed layers 3; light source 4 sticks on metal substrate 1 by elargol; and its four periderms insulating barrier 2 and printed layers 3 surround formation groove; groove inner wall and bottom surface are electroplate with silver; light source 4 is connected with printed layers 3 by connecting line 5, and protecting glue (6) to be covered on groove and to cover light source 4 and connecting line 5.
Described metal substrate 1 is aluminium base or copper base.
Described light source 4 comprises positive-installed or flip-over type: the connected mode that positive-installed is mixed by serial or parallel connection or the connection in series-parallel of or many packed LED chips forms; Flip-over type light source comprises one or many flip LED chips 41 and aluminum nitride ceramic substrate 42, this or many flip LED chips 41 are linked together by the mode of serial or parallel connection or connection in series-parallel mixing, and bonding on aluminum nitride ceramic substrate 42 by elargol, aluminum nitride ceramic substrate 42 is bonded on metal substrate 1 by elargol again.
Described connecting line 5 comprises wire or sheet metal, is connected by the positive pole of light source 4 with negative pole with printed layers 3.
Described protecting glue 6 comprises silica gel and fluorescent material.
The utility model compared with prior art has the following advantages:
(1) the utility model is owing to adopting elargol that LED chip is bonding with metal substrate, and make the heat of LED chip to be directly transmitted on metal substrate by elargol, thermal conductivity is better;
(2) the utility model is owing to adopting the integrative packaging structure of metal base printed board and LED, and packaging cost is reduced, and reliability is higher;
Accompanying drawing explanation
Fig. 1 is the COB encapsulating structure schematic diagram that the utility model adopts positive-installed light source;
Fig. 2 is the COB encapsulating structure schematic diagram that the utility model adopts flip-over type light source.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is further described.
Embodiment 1
With reference to Fig. 1, COB encapsulation of the present utility model, comprises metal substrate 1, insulating barrier 2, printed layers 3, light source 4, connecting line 5 and protecting glue 6;
Wherein, metal substrate 1 is aluminium base or copper base, and it is provided with insulating barrier 2 on the surface, and insulating barrier 2 is provided with printed layers 3.The connected mode that light source 4 is mixed by serial or parallel connection or the connection in series-parallel of one or many packed LED chips forms, and is sticked on metal substrate 1 by elargol.Four periderm insulating barriers 2 of light source 4 and printed layers 3 are surrounded and are formed groove, and groove inner wall and bottom surface are electroplate with silver.Connecting line 5 is wire or sheet metal, is connected by the positive pole of light source 4 with negative pole with printed layers 3.Protecting glue 6 adopts silica gel and doped with fluorescent material, to be covered on groove and to cover on light source 4 and connecting line 5, playing a protective role.
When LED chip is lit, sends blue light and activate the light-emitting phosphor in protecting glue 6; The heat produced in this process is delivered on metal substrate 1 by elargol; Because the heat conductivility of elargol and metal substrate 1 is all very excellent, the heat that LED chip produces can be fallen by conduction very soon and can not be obstructed, and can ensure that it is operated in lower temperature, the luminous efficiency of LED chip is ensured, meanwhile, useful life is extended
Embodiment 2
With reference to Fig. 2, metal substrate 1 adopts aluminium base, and itself and insulating barrier 2, printed layers 3 form aluminium base printed board;
Light source 4 adopts flip-over type structure, it comprises one or many flip LED chips (41) and aluminum nitride ceramic substrate (42), this or many flip LED chips (41) are linked together by the mode of serial or parallel connection or connection in series-parallel mixing, and bonding on aluminum nitride ceramic substrate (42) by elargol, aluminum nitride ceramic substrate (42) is bonded on metal substrate (1) by elargol again.Connecting line 5 adopts sheet metal printed layers 3 to be connected with ceramic substrate 42, and many strip metals sheet is connected with negative pole with the positive pole of flip LED chips 41 respectively by the electric conducting material on ceramic substrate 42 surface; Protecting glue 6 adopts silica gel and doped with fluorescent material, is coated on LED chip 41, and covers connecting line 5, plays a protective role.
When LED is lit, sends blue light and activate the light-emitting phosphor in protecting glue 6; The heat produced in this process is delivered on aluminum nitride ceramic substrate 42 by elargol, and heat is delivered on metal substrate 1 by elargol again by aluminum nitride ceramic substrate 42; Because the heat conductivility of elargol, aluminum nitride ceramic substrate 42, metal substrate 1 is all very excellent, the heat that flip LED chips 41 produces can be fallen by conduction very soon and can not be obstructed, can ensure that it is operated in lower temperature, the luminous efficiency of LED chip is ensured, meanwhile, useful life is extended.
On be only two preferred example of the present utility model, do not form any restriction of the present utility model, obviously under design of the present utility model, different changes and improvement can be carried out to its structure, but these be all at the row of protection of the present utility model.
Claims (5)
1. the COB encapsulation of a great power LED, comprises metal substrate (1), insulating barrier (2), printed layers (3), light source (4), connecting line (5) and protecting glue (6); It is characterized in that: metal substrate (1) is provided with insulating barrier (2); insulating barrier (2) is provided with printed layers (3); light source (4) sticks on metal substrate (1) by elargol; and its four periderms insulating barrier (2) and printed layers (3) surround formation groove; groove inner wall and bottom surface are electroplate with silver; light source (4) is connected with printed layers (3) by connecting line (5), and protecting glue (6) to be covered on groove and to cover light source (4) and connecting line (5).
2. COB encapsulation according to claim 1, is characterized in that described metal substrate (1) is aluminium base or copper base.
3. COB encapsulation according to claim 1, is characterized in that described light source (4) comprises positive-installed or flip-over type;
The connected mode that described positive-installed is mixed by serial or parallel connection or the connection in series-parallel of one or many packed LED chips forms;
Described flip-over type light source comprises one or many flip LED chips (41) and aluminum nitride ceramic substrate (42), this or many flip LED chips (41) are linked together by the mode of serial or parallel connection or connection in series-parallel mixing, and bonding on aluminum nitride ceramic substrate (42) by elargol, aluminum nitride ceramic substrate (42) is bonded on metal substrate (1) by elargol again.
4. COB encapsulation according to claim 1, is characterized in that described connecting line (5) comprises wire or sheet metal, is connected by the positive pole of light source (4) with negative pole with printed layers (3).
5. COB encapsulation according to claim 1, is characterized in that described protecting glue (6) comprises silica gel and fluorescent material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520950148.1U CN205122633U (en) | 2015-11-25 | 2015-11-25 | High -power LED's COB encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520950148.1U CN205122633U (en) | 2015-11-25 | 2015-11-25 | High -power LED's COB encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205122633U true CN205122633U (en) | 2016-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520950148.1U Active CN205122633U (en) | 2015-11-25 | 2015-11-25 | High -power LED's COB encapsulation |
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| Country | Link |
|---|---|
| CN (1) | CN205122633U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355758A (en) * | 2015-11-25 | 2016-02-24 | 海盐丽光电子科技有限公司 | COB packaging for large power LED |
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2015
- 2015-11-25 CN CN201520950148.1U patent/CN205122633U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355758A (en) * | 2015-11-25 | 2016-02-24 | 海盐丽光电子科技有限公司 | COB packaging for large power LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180123 Address after: Haiyan County of Jiaxing city in Zhejiang province 314308 in the northern end of the old town bridge building 1 Patentee after: Jiaxing Mi Shi Technology Co., Ltd. Address before: 314308 Haiyan County, Jiaxing City, Zhejiang Province, No. 7, Xiao Qiao Road, town Patentee before: HAIYAN LIGUANG ELECTRONIC TECHNOLOGY CO., LTD. |