CN205429001U - LEDCOB light source packaging structure - Google Patents
LEDCOB light source packaging structure Download PDFInfo
- Publication number
- CN205429001U CN205429001U CN201620283630.9U CN201620283630U CN205429001U CN 205429001 U CN205429001 U CN 205429001U CN 201620283630 U CN201620283630 U CN 201620283630U CN 205429001 U CN205429001 U CN 205429001U
- Authority
- CN
- China
- Prior art keywords
- chip
- flip
- light source
- packaging structure
- copper layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000004411 aluminium Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 235000007466 Corylus avellana Nutrition 0.000 abstract description 14
- 240000007582 Corylus avellana Species 0.000 abstract description 14
- 239000011810 insulating material Substances 0.000 abstract 1
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006011 modification reaction Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000000630 rising Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Abstract
The utility model discloses a LEDCOB light source packaging structure, junction temperature that it can the greatly reduced LED chip for the life of COB light source increases, and it is many that the chip goes out the light quantity. This kind of LEDCOB light source packaging structure, it includes from the last face down chip who sets gradually extremely down, electrically conductive copper layer, insulating layer, aluminium base board, face down chip includes a plurality of face down chip that the array was arranged, every face down chip's electrode is connected with electrically conductive copper layer through the welding material, forms the hole under the face down chip, and the high thermally conductive insulating material who packs coefficient of heat conductivity >= 0.2W (m K) in the hole forms high thermal insulation portion.
Description
Technical field
The utility model belongs to the technical field of LED illumination light source product, light fixture or equipment, more particularly to a kind of LEDCOB illuminating source packaging structure.
Background technology
LED integrated optical source, also COB light source it is, as shown in Figure 1, it is by plurality of LEDs chip 1 array arrangement, circular or square, directly stick on one piece of underlay substrate, chip is to be welded with to connect by gold thread or line layer to couple together each other, then being coupled together by the both positive and negative polarity pad 11,12 on substrate and power supply, cover fluorescent powder silica gel layer 7 at non-electrode place, periphery is provided with box dam glue 8.
As in figure 2 it is shown, the structure of upside-down mounting COB light source is flip-chip 1 (i.e. LED chip), welding material 2, conductive copper layer 3, insulating barrier 4, aluminium base 5 the most successively.During hole 13 die bond of the wherein lower section of flip-chip unsettled, point glue after the most unsettled or by low heat conduction silica gel (as shown in Figure 3) fill, when causing flip-chip to light work, central hot quantity set gathers too high, transmits heat to aluminium base without excellent transmitting medium.It is known that the junction temperature of LED chip and life-span are inversely, temperature is the highest, and the life-span is the shortest；Meanwhile, the most inversely, temperature is the highest for the junction temperature of LED chip and luminous flux, and chip light-emitting amount is the fewest.Visible existing upside-down mounting COB light source structurally inferior position is obvious, and junction temperature is high, and service life is short, and chip light-emitting amount is few.
Summary of the invention
Technology of the present utility model solves problem: overcome the deficiencies in the prior art, it is provided that a kind of LEDCOB illuminating source packaging structure, and it can be substantially reduced the junction temperature of LED chip so that the service life of COB light source increases, and chip light-emitting amount is many.
Technical solution of the present utility model is: this LEDCOB illuminating source packaging structure, it flip-chip including setting gradually from top to bottom, conductive copper layer, insulating barrier, aluminium base；Flip-chip includes multiple flip-chips that array is arranged, the electrode of each flip-chip is connected with conductive copper layer by welding material, flip-chip be formed immediately below hole, in hole fill thermal conductivity factor >=0.2W/ (m K) High-heat-conductiviinsulation insulation material form high heat conductive insulating portion.
The utility model is filled the High-heat-conductiviinsulation insulation material of thermal conductivity factor >=0.2W/ (m K) in hole and is formed high heat conductive insulating portion, the amount of heat that flip-chip can be made to distribute when working is gone out by high heat conductive insulating portion Quick diffusing, junction temperature during LED chip work can be effectively reduced, thus improve the service life of COB light source, improve the amount of light of flip LED.
Accompanying drawing explanation
Fig. 1 shows the top view of existing COB light source encapsulating structure.
Fig. 2 shows the partial lengthwise sectional view of existing a kind of COB light source encapsulating structure.
Fig. 3 shows the partial lengthwise sectional view of existing another kind of COB light source encapsulating structure.
Fig. 4 shows the longitudinal sectional view according to the preferred embodiment carrying high performance LEDCOB illuminating source packaging structure of the present utility model.
Fig. 5 shows prior art and lumen fraction comparison diagram of the present utility model.
Fig. 6 shows prior art and relative luminous efficiency comparison diagram of the present utility model.
Detailed description of the invention
As shown in Figure 4, this LEDCOB illuminating source packaging structure, it flip-chip including setting gradually from top to bottom, conductive copper layer 3, insulating barrier 4, aluminium base 5；Flip-chip includes multiple flip-chips 1 that array is arranged, the electrode 11,12 of each flip-chip 1 is connected with conductive copper layer 3 by welding material 2, flip-chip be formed immediately below hole 13, in hole fill thermal conductivity factor >=0.2W/ (m K) High-heat-conductiviinsulation insulation material form high heat conductive insulating portion 6.
The utility model is filled the High-heat-conductiviinsulation insulation material of thermal conductivity factor >=0.2W/ (m K) in hole and is formed high heat conductive insulating portion, the amount of heat that flip-chip can be made to distribute when working is gone out by high heat conductive insulating portion Quick diffusing, junction temperature during LED chip work can be effectively reduced, thus improve the service life of COB light source, improve the amount of light of flip LED.As it is shown in figure 5, along with the rising of temperature, the lumen fraction of prior art and lumen fraction of the present utility model all present downward trend, but, lumen fraction of the present utility model is always above prior art.As shown in Figure 6, along with the rising of temperature, the relative luminous efficiency of prior art and relative luminous efficiency of the present utility model all present downward trend, but, relative luminous efficiency of the present utility model is always above prior art.
Specifically, described high heat conductive insulating portion can be high thermal conductive silicon glue or epoxy resin.
It addition, as shown in Figure 4, described conductive copper layer also includes extension 31, and it extends internally from conductive copper layer and contacts high heat conductive insulating portion 6.In Fig. 4, only left side extends internally, and the actually left and right sides all can extend internally, as long as not contacting.So can form the passage of heat from flip-chip junction temperature district to aluminium base with above-mentioned high conductive filler material, therefore, it is possible to junction temperature when more efficiently reducing LED chip work, thus improve the service life of COB light source, improve the amount of light of flip LED.
It addition, be additionally provided with white oil solder mask 9 between fluorescent powder silica gel layer 7 and conductive copper layer 3, prevent welding material from overflowing.
The utility model mainly has the advantage that
(1) amount of heat that flip-chip can be made to distribute when working is gone out by high heat conductive insulating portion Quick diffusing, it is possible to is effectively reduced junction temperature during LED chip work, thus improves the service life of COB light source, improves the amount of light of flip LED.
(2) by the extension of conductive copper layer, the passage of heat from flip-chip junction temperature district to aluminium base can be formed with above-mentioned high conductive filler material, therefore, it is possible to junction temperature when more efficiently reducing LED chip work, thus improve the service life of COB light source, improve the amount of light of flip LED.
The above; it it is only preferred embodiment of the present utility model; not the utility model is made any pro forma restriction; every any simple modification, equivalent variations and modification made above example according to technical spirit of the present utility model, the most still belongs to the protection domain of technical solutions of the utility model.
Claims (3)
1. a LEDCOB illuminating source packaging structure, it is characterised in that: it flip-chip (1) including setting gradually from top to bottom, conductive copper layer (3), insulating barrier (4), aluminium base (5)；Flip-chip includes multiple flip-chips (1) that array is arranged, the electrode (11,12) of each flip-chip (1) is connected with conductive copper layer (3) by welding material (2), flip-chip be formed immediately below hole (13), in hole fill thermal conductivity factor >=0.2W/ (m K) High-heat-conductiviinsulation insulation material form high heat conductive insulating portion (6).
LEDCOB illuminating source packaging structure the most according to claim 1, it is characterised in that: described high heat conductive insulating portion is high thermal conductive silicon glue or epoxy resin.
LEDCOB illuminating source packaging structure the most according to claim 1 and 2, it is characterised in that: described conductive copper layer also includes extension (31), and it extends internally from conductive copper layer and contacts high heat conductive insulating portion (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620283630.9U CN205429001U (en) | 2016-04-07 | 2016-04-07 | LEDCOB light source packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620283630.9U CN205429001U (en) | 2016-04-07 | 2016-04-07 | LEDCOB light source packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205429001U true CN205429001U (en) | 2016-08-03 |
Family
ID=56521153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620283630.9U Active CN205429001U (en) | 2016-04-07 | 2016-04-07 | LEDCOB light source packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205429001U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655465A (en) * | 2016-04-07 | 2016-06-08 | 易美芯光（北京）科技有限公司 | COB (chip on board) light source packaging structure for LED and manufacture method of COB light source packaging structure |
| CN111106225A (en) * | 2019-12-31 | 2020-05-05 | 厦门市三安光电科技有限公司 | Ultraviolet LED packaging structure |
-
2016
- 2016-04-07 CN CN201620283630.9U patent/CN205429001U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655465A (en) * | 2016-04-07 | 2016-06-08 | 易美芯光（北京）科技有限公司 | COB (chip on board) light source packaging structure for LED and manufacture method of COB light source packaging structure |
| CN111106225A (en) * | 2019-12-31 | 2020-05-05 | 厦门市三安光电科技有限公司 | Ultraviolet LED packaging structure |
| CN111106225B (en) * | 2019-12-31 | 2021-07-02 | 厦门市三安光电科技有限公司 | Ultraviolet LED packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |