CN203351667U - Isolated cob light source module - Google Patents
Isolated cob light source module Download PDFInfo
- Publication number
- CN203351667U CN203351667U CN 201320466061 CN201320466061U CN203351667U CN 203351667 U CN203351667 U CN 203351667U CN 201320466061 CN201320466061 CN 201320466061 CN 201320466061 U CN201320466061 U CN 201320466061U CN 203351667 U CN203351667 U CN 203351667U
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- CN
- China
- Prior art keywords
- silica gel
- light source
- isolated
- source module
- cob light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 235000007466 Corylus avellana Nutrition 0.000 title claims abstract description 20
- 240000007582 Corylus avellana Species 0.000 title claims abstract description 20
- 239000000741 silica gel Substances 0.000 claims abstract description 66
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 66
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 238000009434 installation Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000002310 reflectometry Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000002035 prolonged Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Abstract
An isolated COB light source module comprises a substrate, a plurality of LED chips, a silica gel isolating layer and a silica gel fluorescent layer. A dam circle is arranged on the substrate, and a chip installing region is formed between the dam circle and the substrate. The plurality of LED chips are all attached to the chip installing region, the chip installing region is covered with the silica gel isolating layer, and the silica gel isolating layer is covered with the silica gel fluorescent layer. The silica gel isolating layer of the above utility model isolates the LED chips with the silica gel fluorescent layer, so that the silica gel fluorescent layer is far away from a heating unit, and accordingly, the heat radiated by the LED chips and the heat generated by the silica gel fluorescent layer are prevented from gathering to cause the silica gel fluorescent layer at a high temperature, and the temperature of the silica gel fluorescent layer can be prevented from influencing the LED chips, and the service lives of the LED chips are conductive to being prolonged.
Description
Technical field
The utility model relates to a kind of isolated COB light source module.
Background technology
The COB light source generally comprises a plurality of blue-light LED chips, is coated with the yellow fluorescent powder layer of silica gel on LED chip.The blue-light excited yellow fluorescent powder that blue-light LED chip sends sends green-yellow light, and the blue light that this yellow-green light and blue-light LED chip send forms white light.This LED chip directly contacts with fluorescent material, and while using due to LED chip, this,, as heater, makes fluorescent material be influenced by heat in long-term use procedure and cause light decay more serious, thereby having influence on the quality of LED.In addition, in the LED chip use procedure, the loss of blue-light excited fluorescent material meeting produce power, and then generation heat, the heat accumulation that this heat and LED chip produce is in this fluorescent powder silica gel layer, because silica gel is bad radiator, make the temperature of this fluorescent powder silica gel layer can be up to 220 ℃, this temperature can affect life-span and the quality of LED chip to a great extent.This thermal effect has reduced the quantum efficiency of fluorescent material, and then has influence on whole luminous efficiency.
The utility model content
For the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of isolated COB light source module, its good heat dissipation effect, the high and long service life of luminous efficiency.
For achieving the above object, the utility model adopts following technical scheme:
A kind of isolated COB light source module, it comprises substrate, some LED chips, silica gel separator and silica gel fluorescence coating; This substrate is provided with a box dam circle, form a chip installation area territory between this box dam circle and this substrate, some LED chips all are mounted on this chip installation area territory, and this silica gel separator is covered on this chip installation area territory, and this silica gel fluorescence coating is covered on this silica gel separator.
Further, the refractive index of this silica gel separator is more than or equal to the refractive index of this silica gel fluorescence coating.
Further, the thickness of this silica gel separator is 0.85mm to 1.05mm.
Further, the thickness of this silica gel fluorescence coating is between 0.5mm to 0.8mm.
Further, this LED chip is blue-light LED chip, and the wavelength of the blue light that it sends is 450nm to 460nm, and this silica gel fluorescence coating is the yellow fluorescence layer of silica gel.
Further, the aluminium base that this substrate is the printing ink reflectivity more than 98%.
Further, the height of this box dam circle is 1.5mm to 2.5mm.
Further, all LED chips form crisscross chip array, are positioned at the same LED chip of walking crosswise and are connected in series, and the LED chip that is positioned at same file is connected in parallel.
The beneficial effects of the utility model are as follows:
The silica gel separator of above-mentioned utility model is kept apart LED chip and this silica gel fluorescence coating, make the silica gel fluorescence coating away from heater, and then the heat of avoiding LED chip to send is assembled mutually and is caused silica gel fluorescence coating high temperature with the heat of this silica gel fluorescence coating generation, and can avoid the temperature of silica gel fluorescence coating to have influence on LED chip, be conducive to extend the useful life of LED chip.The refractive index of this silica gel separator is greater than the refractive index of this silica gel fluorescence coating, with the light of avoiding LED chip to send in silica gel separator generation total reflection, thereby increase luminous flux, optimize light utilization efficiency.
The accompanying drawing explanation
The generalized section of the better embodiment that Fig. 1 is the isolated COB light source of the utility model module.
The electrical principle schematic diagram of the COB light source module that Fig. 2 is Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described further:
Refer to Fig. 1, the utility model relates to a kind of isolated COB light source module, and its better embodiment comprises substrate 10, some LED chips 20, silica gel separator 30 and silica gel fluorescence coating 40.
This substrate 10 is provided with a box dam circle 15, form a chip installation area territory between this box dam circle 15 and this substrate 10, some LED chips 20 all are mounted on this chip installation area territory, this silica gel separator 30 is covered on this chip installation area territory, this silica gel fluorescence coating 40 is covered on this silica gel separator 30, and the refractive index of this silica gel separator 30 is more than or equal to the refractive index of this silica gel fluorescence coating 40, at silica gel separator 30, total reflection occurs with the light of avoiding LED chip 20 to send, thereby the increase luminous flux, optimize light utilization efficiency.This silica gel separator 30 is kept apart LED chip 20 and this silica gel fluorescence coating 40, make silica gel fluorescence coating 40 away from heater, and then the heat of avoiding LED chip 20 to send is assembled mutually and is caused silica gel fluorescence coating 40 high temperature with the heat of these silica gel fluorescence coating 40 generations, and the temperature that can avoid silica gel fluorescence coating 40 has influence on LED chip 20, be conducive to extend the useful life of LED chip 20.
For obtaining maximum light extraction efficiency, the thickness of this silica gel separator 30 is 0.85mm to 1.05mm.The side-play amount minimum of chromaticity coordinates when making temperature raise, the thickness of this silica gel fluorescence coating 40 is 0.5mm to 0.8mm.
In the present embodiment, this LED chip 20 is blue-light LED chip, and the wavelength of the blue light that it sends is 450nm to 460nm, and this silica gel fluorescence coating 40 is the yellow fluorescence layer of silica gel, so that the adjustable reference color temperature of this COB light source is wide.The aluminium base that this substrate 10 is the printing ink reflectivity more than 98%, in order to the light of LED chip 20 is reflected to layer of silica gel, thus the temperature of reduction LED chip 20, and then the useful life of prolongation LED chip 20.The height of this box dam circle 15 is 1.5mm to 2.5mm, to facilitate the making of two-layer layer of silica gel.
Refer to Fig. 2, all LED chips 20 form crisscross chip array, are positioned at the same LED chip of walking crosswise and are connected in series, the LED chip that is positioned at same file is connected in parallel, so, even wherein a LED chip 20 damages, this COB light source also can continue luminous, does not substantially affect its luminous flux.
For a person skilled in the art, can make other various corresponding changes and distortion according to technical scheme described above and design, and these all changes and the distortion all should belong to the protection range of the utility model claim within.
Claims (8)
1. an isolated COB light source module, it is characterized in that: it comprises substrate, some LED chips, silica gel separator and silica gel fluorescence coating; This substrate is provided with a box dam circle, form a chip installation area territory between this box dam circle and this substrate, some LED chips all are mounted on this chip installation area territory, and this silica gel separator is covered on this chip installation area territory, and this silica gel fluorescence coating is covered on this silica gel separator.
2. isolated COB light source module as claimed in claim 1, it is characterized in that: the refractive index of this silica gel separator is more than or equal to the refractive index of this silica gel fluorescence coating.
3. isolated COB light source module as claimed in claim 1, it is characterized in that: the thickness of this silica gel separator is 0.85mm to 1.05mm.
4. isolated COB light source module as claimed any one in claims 1 to 3, it is characterized in that: the thickness of this silica gel fluorescence coating is between 0.5mm to 0.8mm.
5. isolated COB light source module as claimed in claim 1, it is characterized in that: this LED chip is blue-light LED chip, and its blue light wavelength sent is 450nm to 460nm, and this silica gel fluorescence coating is the yellow fluorescence layer of silica gel.
6. isolated COB light source module as claimed in claim 1, is characterized in that: the aluminium base that this substrate is the printing ink reflectivity more than 98%.
7. isolated COB light source module as claimed in claim 1, it is characterized in that: the height of this box dam circle is 1.5mm to 2.5mm.
8. isolated COB light source module as claimed in claim 1, it is characterized in that: all LED chips form crisscross chip array, are positioned at the same LED chip of walking crosswise and are connected in series, and the LED chip that is positioned at same file is connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320466061 CN203351667U (en) | 2013-07-31 | 2013-07-31 | Isolated cob light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320466061 CN203351667U (en) | 2013-07-31 | 2013-07-31 | Isolated cob light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203351667U true CN203351667U (en) | 2013-12-18 |
Family
ID=49751524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320466061 Active CN203351667U (en) | 2013-07-31 | 2013-07-31 | Isolated cob light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203351667U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783820A (en) * | 2016-12-23 | 2017-05-31 | 广东晶科电子股份有限公司 | White light LEDs module chip and preparation method thereof and white light LEDs module |
| CN109119523A (en) * | 2018-10-09 | 2019-01-01 | 大连德豪光电科技有限公司 | The preparation method of backlight, liquid crystal display and backlight |
| WO2020029534A1 (en) * | 2018-08-09 | 2020-02-13 | 大连德豪光电科技有限公司 | Backlight source and liquid crystal display |
-
2013
- 2013-07-31 CN CN 201320466061 patent/CN203351667U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783820A (en) * | 2016-12-23 | 2017-05-31 | 广东晶科电子股份有限公司 | White light LEDs module chip and preparation method thereof and white light LEDs module |
| WO2020029534A1 (en) * | 2018-08-09 | 2020-02-13 | 大连德豪光电科技有限公司 | Backlight source and liquid crystal display |
| US11320695B2 (en) | 2018-08-09 | 2022-05-03 | Elec-Tech Photoelectric Technology (Dalian) Co., Ltd. | Backlight and liquid crystal display |
| CN109119523A (en) * | 2018-10-09 | 2019-01-01 | 大连德豪光电科技有限公司 | The preparation method of backlight, liquid crystal display and backlight |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CP03 | Change of name, title or address |
Address after: 510000 Room 201, building A4, No. 11, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong Patentee after: Silicon energy photoelectric semiconductor (Guangzhou) Co.,Ltd. Address before: 510000 second floor, building A4, No. 11, Kaiyuan Avenue, Science City, Guangzhou high tech Industrial Development Zone, Guangzhou, Guangdong Province Patentee before: GUANGZHOU LEDTEEN OPTOELECTRONICS Co.,Ltd. |