CN112242473A - LED filament light source, manufacturing method thereof and lamp - Google Patents
LED filament light source, manufacturing method thereof and lamp Download PDFInfo
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- CN112242473A CN112242473A CN202011271715.2A CN202011271715A CN112242473A CN 112242473 A CN112242473 A CN 112242473A CN 202011271715 A CN202011271715 A CN 202011271715A CN 112242473 A CN112242473 A CN 112242473A
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- circuit board
- light source
- led chip
- led
- filament light
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 55
- 238000004806 packaging method and process Methods 0.000 claims abstract description 35
- 238000000034 method Methods 0.000 claims abstract description 34
- 230000008569 process Effects 0.000 claims abstract description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000741 silica gel Substances 0.000 claims abstract description 23
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000005507 spraying Methods 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000008393 encapsulating agent Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 239000003292 glue Substances 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The application discloses LED filament light source includes: a circuit board; an LED chip; the fixing part is used for connecting the LED chip and the circuit board; the first fluorescent powder layer covers the surface of the LED chip; the second fluorescent powder layer is positioned on the surface, deviating from the LED sheet, of the circuit board; and the transparent packaging bodies are respectively positioned at two sides of the circuit board. According to the LED filament light source, the first fluorescent powder layer covers the surface of the LED chip, namely, the fluorescent powder is gathered on the surface of the LED chip, so that the heat generated by exciting the fluorescent powder is reduced, the heat generated by the LED chip can be quickly dissipated through the circuit board, and the light attenuation of the LED filament light source is reduced; in addition, a second fluorescent powder layer is distributed on the surface of the circuit board, which is far away from the LED chip, namely, fluorescent powder is not contained in the transparent packaging bodies on the two sides of the circuit board, and the fluorescent powder cannot be settled in the process of curing the silica gel, so that the color temperature deviation is reduced. The application also provides a manufacturing method and a lamp with the advantages.
Description
Technical Field
The application relates to the technical field of lighting, in particular to an LED filament light source, a manufacturing method thereof and a lamp.
Background
The light source is visible everywhere in daily life of people, and is an indispensable part in life.
An LED (Light Emitting Diode) filament Light source is a novel Light source, a cross-sectional view of an existing LED filament Light source is shown in fig. 1, an LED chip 2 is fixed on a circuit board 3, the upper surfaces of the LED chip 2 and the circuit board 3 are first packaging adhesive 1 formed by first packaging, and the lower surface of the circuit board 3 is second packaging adhesive 4 formed by second packaging, wherein the first packaging adhesive 1 and the second packaging adhesive 4 are both a mixture of silica gel and fluorescent powder. The LED chip 2 generates heat after being lighted, the light emitted by the LED chip 2 excites the fluorescent powder to generate heat, the fluorescent powder is distributed in the silica gel, and the heat generated by the LED chip 2 and the heat generated by light radiation (the heat generated by exciting the fluorescent powder) cannot be quickly conducted out through the first packaging adhesive 1 and the second packaging adhesive 4 due to poor heat conductivity of the silica gel, so that the light attenuation of the LED filament light source is finally large; and moreover, due to the adoption of the dispensing packaging process, the fluorescent powder has a sedimentation process in the silica gel in the baking process, and the color temperature difference of the LED filament light source is large due to different sedimentation speeds, so that the LED filament light source has large color difference.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
Disclosure of Invention
The application aims to provide an LED filament light source, a manufacturing method thereof and a lamp, so that light attenuation and chromatic aberration of the LED filament light source are reduced.
In order to solve the above technical problem, the present application provides an LED filament light source, including:
a circuit board;
an LED chip;
the fixing part is used for connecting the LED chip and the circuit board;
the first fluorescent powder layer covers the surface of the LED chip;
the second fluorescent powder layer is positioned on the surface, deviating from the LED sheet, of the circuit board;
and the transparent packaging bodies are respectively positioned at two sides of the circuit board.
Optionally, the circuit board is a flexible circuit board.
Optionally, when the front mounting die bonding process is adopted, the method further includes:
and the wire is used for electrically connecting the LED chip and the circuit board.
Optionally, the wire is a gold wire.
Optionally, the fixing portion is an insulating glue fixing portion or a conductive silver glue fixing portion.
Optionally, when a flip chip die attach process is adopted, the fixing portion is a solder paste fixing portion.
Optionally, the viscosity of the transparent encapsulant is greater than 3.0Pa · s.
Optionally, the LED chip is a blue LED chip.
The application also provides a manufacturing method of the LED filament light source, which comprises the following steps:
obtaining a circuit board;
printing a fixing part on the upper surface of the circuit board;
fixing the LED chip on the upper surface of the circuit board by using a fixing part through a die bonding process;
forming a first fluorescent powder layer on the surface of the LED chip by using a powder spraying process;
packaging the upper surface of the circuit board by using silica gel, and baking to solidify the silica gel to form a transparent packaging body;
forming a second fluorescent powder layer on the lower surface of the circuit board by using a powder spraying process;
and packaging the lower surface of the circuit board by using silica gel, and baking to solidify the silica gel to form a transparent packaging body to obtain the LED filament light source.
The application also provides a lamp, which comprises any one of the LED filament light source.
The application provides a LED filament light source includes: a circuit board; an LED chip; the fixing part is used for connecting the LED chip and the circuit board; the first fluorescent powder layer covers the surface of the LED chip; the second fluorescent powder layer is positioned on the surface, deviating from the LED sheet, of the circuit board; and the transparent packaging bodies are respectively positioned at two sides of the circuit board.
Therefore, in the LED filament light source, the first fluorescent powder layer covers the surface of the LED chip, namely, the fluorescent powder is gathered on the surface of the LED chip, so that the thermal radiation energy generated by exciting the fluorescent powder is reduced, the heat generated by the LED chip is quickly dissipated through the circuit board, and the light attenuation of the LED filament light source is reduced; in addition, a second fluorescent powder layer is distributed on the surface of the circuit board, which is far away from the LED chip, namely, the transparent packaging bodies on the two sides of the circuit board do not contain fluorescent powder, and the fluorescent powder does not settle in the process of curing silica gel, so that the color temperature deviation of the LED filament light source is reduced, namely, the color difference is reduced.
In addition, the application also provides a manufacturing method of the LED filament light source and a lamp with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a conventional LED filament light source;
fig. 2 is a schematic structural diagram of an LED filament light source according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a method for manufacturing an LED filament light source according to an embodiment of the present disclosure;
in the figure, 1, a first packaging adhesive, 2, an LED chip, 3, a circuit board, 4, a second packaging adhesive, 5, a first phosphor layer, 6, a second phosphor layer, and 7, a transparent package body.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
As described in the background art, in the conventional LED filament light source, fluorescent powder is distributed in the first packaging adhesive and the second packaging adhesive, the LED chip generates heat after being lighted, and the light emitted by the LED chip excites the fluorescent powder to generate heat, so that the heat generated by the LED chip 2 and the heat generated by light radiation cannot be quickly conducted out through the first packaging adhesive and the second packaging adhesive due to poor thermal conductivity of silica gel, and finally the light attenuation of the LED filament light source is large; and moreover, due to the adoption of the dispensing packaging process, the fluorescent powder has a sedimentation process in the silica gel in the baking process, and the color temperature difference of the LED filament light source is large due to different sedimentation speeds, so that the LED filament light source has large color difference.
In view of the above, the present application provides an LED filament light source, please refer to fig. 2, and fig. 2 is a schematic structural diagram of an LED filament light source according to an embodiment of the present application, including:
a circuit board 3;
an LED chip 2;
a fixing part for connecting the LED chip 2 and the circuit board 3;
a first fluorescent powder layer 5 covering the surface of the LED chip 2;
a second fluorescent powder layer 6 positioned on the surface of the circuit board 3, which is far away from the LED chip;
and the transparent packaging bodies 7 are respectively positioned at two sides of the circuit board 3.
Note that the kind of the phosphor included in the first phosphor layer 5 is not limited in the present application, and may be selected by itself according to the desired light and the LED chip 2. Similarly, the kind of the phosphor contained in the second phosphor layer 6 is not limited in this application, and can be selected by the LED chip 2 according to the required light. It is understood that the area of the second phosphor layer 6 that covers the wiring board 3 at least needs to correspond to the LED chip 2.
Optionally, the LED chip 2 is a blue LED chip. For example, when white light is required and the LED chip 2 is a blue LED chip, red and green phosphors are selected from the first phosphor layer 5 and the second phosphor layer 6; when light of other colors is required, the type of the LED chip 2, the first phosphor layer 5, and the second phosphor layer 6 may be set as needed. .
The transparent package 7 is formed of pure silica gel and is not doped with phosphor.
In the present application, the number of the LED chips 2 is not particularly limited, and may be one or more, as the case may be.
When the LED chip 2 is fixed on the circuit board 3 by adopting the flip chip die bonding process, the fixing part is a solder paste fixing part for fixing the LED chip 2, so that the LED chip 2 is helped to dissipate heat, and meanwhile, the LED chip 2 plays a role in electric conduction, so that the LED chip 2 is communicated with a circuit on the circuit board 3.
When the LED chip 2 is a normal LED chip, the method further includes:
and the wire is used for electrically connecting the LED chip 2 and the circuit board 3.
Optionally, the wire is a gold wire, but the wire is not particularly limited in this application, and the wire may also be a silver wire, a copper wire, or the like.
It should be noted that, when the LED chip 2 is fixed on the circuit board 3 by the normal die bonding process, the type of the fixing portion is not particularly limited in this application, and the fixing portion is, for example, an insulating adhesive fixing portion or a conductive silver adhesive fixing portion.
In the LED filament light source, the first fluorescent powder layer 5 covers the surface of the LED chip 2, namely, the fluorescent powder is gathered on the surface of the LED chip 2, so that the heat generated by exciting the fluorescent powder is reduced, the heat generated by the LED chip 2 can be rapidly dissipated through the circuit board 3, and the light attenuation of the LED filament light source is reduced; in addition, a second fluorescent powder layer 6 is distributed on the surface of the circuit board 3 deviating from the LED chip 2, namely, the transparent packaging bodies on the two sides of the circuit board 3 do not contain fluorescent powder, and the fluorescent powder does not settle in the process of curing silica gel, so that the color temperature deviation of the LED filament light source is reduced, namely, the color difference is reduced.
On the basis of the above embodiment, in an embodiment of the present application, the circuit board 3 is a flexible circuit board 3, so that the LED filament light source can rotate at any angle, and is suitable for lamps of various shapes, and the application range is increased.
On the basis of any of the above embodiments, in an embodiment of the present application, the viscosity of the transparent sealing body 7 in the LED filament light source is greater than 3.0Pa · s, so as to enhance the adhesion between the transparent sealing body 7 and the circuit board 3, and improve the quality of the LED filament light source.
Referring to fig. 3, fig. 3 is a flowchart of a method for manufacturing an LED filament light source according to an embodiment of the present application, where the method includes:
step S101: and obtaining the circuit board.
The wiring board is not particularly limited in this application, as the case may be. For example, the circuit board can be a flexible circuit board, so that the LED filament light source can rotate at any angle, the LED filament light source is suitable for lamps in various shapes, the application range is enlarged, or a common hard circuit board is adopted.
Step S102: and printing a fixing part on the upper surface of the circuit board.
Specifically, the fixing part is selected according to the die bonding process of the LED chip. For example, when the LED chip is flipped, the fixing part is a solder paste fixing part; when the LED chip is positively mounted, the fixing part is an insulating glue fixing part or a conductive silver glue fixing part.
Step S103: and fixing the LED chip on the upper surface of the circuit board by using a fixing part through a die bonding process.
The LED chip is fixed on the circuit board in an inverted or normal installation mode, and when the LED chip is in the normal installation mode, a step of welding wires is needed, namely the LED chip is electrically connected with the circuit board through a lead. The number of the LED chips is not particularly limited in the present application, and may be one or more.
The specific die bonding process is well known to those skilled in the art and will not be described in detail herein.
Step S104: and forming a first fluorescent powder layer on the surface of the LED chip by using a powder spraying process.
It should be noted that the powder spraying process is a mature technology, which is well known to those skilled in the art, and will not be described in detail herein.
Step S105: and packaging the upper surface of the circuit board by using silica gel, and baking to solidify the silica gel to form a transparent packaging body.
Step S106: and forming a second fluorescent powder layer on the lower surface of the circuit board by using a powder spraying process.
Step S107: and packaging the lower surface of the circuit board by using silica gel, and baking to solidify the silica gel to form a transparent packaging body to obtain the LED filament light source.
According to the LED filament light source manufactured by the LED filament light source manufacturing method, the first fluorescent powder layer covers the surface of the LED chip, namely, the fluorescent powder is gathered on the surface of the LED chip, so that the heat generated by the excitation of the fluorescent powder is reduced, the heat generated by the LED chip can be quickly dissipated through the circuit board, and the light attenuation of the LED filament light source is reduced; in addition, a second fluorescent powder layer is distributed on the surface of the circuit board, which is far away from the LED chip, namely, the transparent packaging bodies on the two sides of the circuit board do not contain fluorescent powder, and the fluorescent powder does not settle in the process of curing silica gel, so that the color temperature deviation of the LED filament light source is reduced, namely, the color difference is reduced.
The application further provides a lamp which comprises the LED filament light source in any one of the embodiments.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The LED filament light source, the manufacturing method thereof, and the lamp provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. An LED filament light source, comprising:
a circuit board;
an LED chip;
the fixing part is used for connecting the LED chip and the circuit board;
the first fluorescent powder layer covers the surface of the LED chip;
the second fluorescent powder layer is positioned on the surface, deviating from the LED sheet, of the circuit board;
and the transparent packaging bodies are respectively positioned at two sides of the circuit board.
2. The LED filament light source of claim 1 wherein the circuit board is a flexible circuit board.
3. The LED filament light source of claim 1 further comprising, when a positive die attach process is employed:
and the wire is used for electrically connecting the LED chip and the circuit board.
4. The LED filament light source of claim 3 wherein the wire is a gold wire.
5. The LED filament light source of claim 4, wherein the fixing portion is an insulating adhesive fixing portion or a conductive silver adhesive fixing portion.
6. The LED filament light source of claim 1 wherein the anchor is a solder paste anchor when a flip chip bonding process is employed.
7. The LED filament light source of any of claims 1 to 6, wherein the viscosity of the transparent encapsulant is greater than 3.0 Pa-s.
8. The LED filament light source of claim 7 wherein the LED chip is a blue LED chip.
9. A manufacturing method of an LED filament light source is characterized by comprising the following steps:
obtaining a circuit board;
printing a fixing part on the upper surface of the circuit board;
fixing the LED chip on the upper surface of the circuit board by using a fixing part through a die bonding process;
forming a first fluorescent powder layer on the surface of the LED chip by using a powder spraying process;
packaging the upper surface of the circuit board by using silica gel, and baking to solidify the silica gel to form a transparent packaging body;
forming a second fluorescent powder layer on the lower surface of the circuit board by using a powder spraying process;
and packaging the lower surface of the circuit board by using silica gel, and baking to solidify the silica gel to form a transparent packaging body to obtain the LED filament light source.
10. A luminaire comprising an LED filament light source as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011271715.2A CN112242473A (en) | 2020-11-13 | 2020-11-13 | LED filament light source, manufacturing method thereof and lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011271715.2A CN112242473A (en) | 2020-11-13 | 2020-11-13 | LED filament light source, manufacturing method thereof and lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112242473A true CN112242473A (en) | 2021-01-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011271715.2A Pending CN112242473A (en) | 2020-11-13 | 2020-11-13 | LED filament light source, manufacturing method thereof and lamp |
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| Country | Link |
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| CN (1) | CN112242473A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023080925A1 (en) * | 2021-11-02 | 2023-05-11 | Ledvance Llc | Light emitting diode filament with reduced amount of phosphor |
| WO2023080929A1 (en) * | 2021-11-02 | 2023-05-11 | Ledvance Llc | Lamp including reduced phosphor light emitting diode filaments |
-
2020
- 2020-11-13 CN CN202011271715.2A patent/CN112242473A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023080925A1 (en) * | 2021-11-02 | 2023-05-11 | Ledvance Llc | Light emitting diode filament with reduced amount of phosphor |
| WO2023080929A1 (en) * | 2021-11-02 | 2023-05-11 | Ledvance Llc | Lamp including reduced phosphor light emitting diode filaments |
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