CN211017116U - L packaging substrate for ED lamp strip and packaging structure containing substrate - Google Patents
L packaging substrate for ED lamp strip and packaging structure containing substrate Download PDFInfo
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- CN211017116U CN211017116U CN201921414879.9U CN201921414879U CN211017116U CN 211017116 U CN211017116 U CN 211017116U CN 201921414879 U CN201921414879 U CN 201921414879U CN 211017116 U CN211017116 U CN 211017116U
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Abstract
The utility model discloses a high-power L ED packaging substrate for lamp strip, including first transparent substrate, be provided with the second base plate on the first transparent substrate, first transparent substrate's width an is more than or equal to 1.5 times of second base plate width b (an is more than or equal to 1.5b), closely compound together through the tie coat between first transparent substrate and the second base plate, first base plate or second base plate both ends are provided with the metal terminal.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor lighting technology, a high-power L ED lamp strip packaging structure is related to, specifically speaking relate to a packaging substrate for high-power L ED lamp strip, contain the packaging structure of this base plate and the preparation technology of base plate.
Background
In recent years, with the rapid development of L ED industry, L ED lamps gradually replace traditional lighting tools and gradually become mainstream lighting sources and are widely applied to the fields of commercial lighting, outdoor lighting, industrial lighting and the like, however, the traditional L ED lamps have the characteristics of point light sources, directivity and the like and cannot form large-angle light-emitting lighting like incandescent lamps, in order to realize large-angle and omnibearing light emission, a L ED filament lamp appears in the market in two years, a L ED chip is packaged on a transparent substrate to form a L ED filament, and then a plurality of filaments are combined and connected to present a light-emitting angle of 360 degrees and excellent illumination brightness, and the light-emitting effect similar to the incandescent lamp can be obtained by assembling the lamp in a bulb lamp or a candle lamp, so that people are more and more concerned.
At present, filament lamp products gradually expand the application to the industrial lighting field, the power of L ED lamp strip is also higher and higher, in order to solve the heat dissipation problem of high-power lamp strip, the conventional scheme is to lengthen and widen the ceramic substrate of lamp strip, coat the fluorescent glue layer on the widened substrate after the solid crystal bonding wire, the fluorescent glue layer also becomes very wide, when concentrating many lamp strips of widening ceramic substrate together and using, because the space is limited, the light that the lamp strip sent can be reflected and absorbed by the fluorescent glue layer that other lamp strips widen, lead to the bad heat dissipation and heat accumulation on the contrary, can not use in high-power lighting products.
Disclosure of Invention
Therefore, the utility model aims to solve the technical problem that many of the high-power lamp strip that widen lead to the heat to gather because of the resorption and the reflection of light when concentrating the use, can't use widely in high-power L ED lamp, and the lamp strip of narrow base plate is although the influence each other of light reduces, nevertheless because heat radiating area also can't be effectively used in high-power product inadequately, thereby propose a compromise heat radiating area, reduce the packaging substrate that the high-power L ED lamp strip that light influenced each other simultaneously used, contain this packaging substrate's packaging structure and use this packaging structure lamp's high-power L ED lamp.
In order to solve the technical problem, the utility model adopts the technical scheme that:
the utility model provides an L ED packaging substrate for lamp strip, including first transparent substrate 1, be provided with second base plate 2 on the first transparent substrate 1, first transparent substrate 1 and second base plate 2 closely compound together through tie coat 3, 1.5 times (an is more than or equal to 1.5b) of width an more than or equal to second base plate 2 width b of first transparent substrate 1, first base plate or second base plate both ends are provided with metal terminal 4.
Preferably, the first transparent substrate is one of a glass substrate, a sapphire substrate, a transparent ceramic substrate, a transparent natural mica substrate, a transparent fluorine crystal mica substrate, a silica gel substrate, an epoxy resin substrate, a PMMA substrate, a PC substrate, and a polyimide substrate.
Preferably, the second substrate is one of a ceramic substrate, a glass substrate, a sapphire substrate, a transparent ceramic substrate, a transparent natural mica substrate, a transparent fluorine crystal mica substrate, a polyimide substrate, an iron substrate, a copper substrate, and a mirror aluminum substrate.
Preferably, the first transparent substrate has a width of 2mm to 20mm and a thickness of 0.2mm to 5 mm.
Preferably, the second substrate has a width of 0.5mm to 5mm and a thickness of 0.1mm to 2 mm.
L ED lamp strip packaging substrate, the first transparent substrate 1 and the second substrate 2 are closely combined together through the bonding layer 3, the main component of the bonding layer is phosphor powder and one of organic binder or inorganic binder, the thickness of the bonding layer is 0.05 mm-0.4 mm.
Preferably, the organic binder is one of silica gel, epoxy resin, acrylate and polyurethane.
Preferably, the inorganic binder is Y2O3、CeO2、SiO2、Al2O3ZnO or MgO nanoparticles in an ethanol or aqueous solution or Na2SiO3An aqueous solution.
Preferably, the fluorescent powder is at least one of YAG fluorescent powder, silicate fluorescent powder and nitride fluorescent powder, and the particle size of the fluorescent powder is 5-50 μm.
More preferably, the adhesive layer has a thickness of 0.05mm to 0.25 mm.
The utility model also provides a contain packaging structure of packaging substrate, it includes first transparent substrate, first transparent substrate top surface is provided with the second base plate, and first transparent substrate's width an more than or equal to 1.5 times (an is more than or equal to 1.5b) of second base plate width b, closely compound together through the tie coat between first transparent substrate and the second base plate, and first transparent substrate or second base plate both ends are provided with the metal terminal, second base plate surface is provided with at least two L ED chips, and luminous chip surface coating fluorescence glue film, fluorescence glue film only cover the surface of second base plate and do not cover other transparent surfaces of first transparent substrate, realize through the metal conductor that chip and base plate both ends metal terminal's electricity is connected.
The utility model also provides a preparation high-power L ED packaging substrate's for lamp strip technology, it includes following step:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder with an organic binder or an inorganic binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through screen printing, spraying process or dispensing process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Compared with the prior art, the technical scheme of the utility model have following advantage:
(1) packaging substrate for high-power L ED lamp strip, it includes first transparent substrate 1, be provided with second base plate 2 on the first transparent substrate 1, first transparent substrate 1 and second base plate 2 are closely compound together through tie coat 3, 1.5 times (a is more than or equal to 1.5b) of width an more than or equal to 2 width b of second base plate of first transparent substrate 1, first base plate or second base plate both ends are provided with metal terminal 4. heat radiating area has been taken into account to this base plate structure, the light that the lamp strip sent simultaneously can pass at the transparent part of other lamp strip base plates, the heat that leads to when having reduced many lamp strips and concentrating the use because the resorption of light and reflection is gathered, the influence each other of light has been reduced, can use in high-power L ED illumination product.
(2) Contain this packaging substrate's packaging structure, set up luminous chip at the solid brilliant setting of second base plate surface, luminous chip outside sets up the fluorescence glue film, the fluorescence glue film only covers the surface of second base plate and does not cover other transparent surfaces of first transparent base plate, the light that luminous chip sent passes through the fluorescence glue film and is forming white light, owing to bond the second base plate that will be provided with luminous chip on the first transparent base plate that has bigger heat radiating area, make heat radiating area obtain effective increase, effectively reduce the junction temperature of chip, the life-span of device has been prolonged, a low price, excellent performance's filament lamp is with encapsulation device.
(3) High-power L ED packaging substrate's for lamp strip preparation method, its preparation simple process, the simple silk screen printing of tie coat accessible, spraying or the preparation of gluing, easily operation, production efficiency is high, low cost does benefit to the popularization and application of L ED filament lamp.
Drawings
In order to make the content of the invention more clearly understood, the invention will now be described in further detail with reference to specific embodiments thereof, in conjunction with the accompanying drawings, in which
Fig. 1 is a schematic structural diagram of a package substrate for a high power L ED light bar according to an embodiment of the present invention;
fig. 2 is a schematic view of a package structure including a package substrate for a high-power L ED light bar according to an embodiment of the present invention.
In the figure, reference numerals are represented as 1-first transparent substrate, 2-second substrate, 3-bonding layer, 4-metal terminal, 5-L ED chip, 6-fluorescent glue layer and 7-wire.
Detailed Description
Example 1
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a glass substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a ceramic substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 3mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is 1mm, and the thickness of the second transparent substrate 2 is 0.35mm, the first transparent substrate 1 and the second substrate 2 are closely combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is YAG yellow fluorescent powder, the particle size of the fluorescent powder is 15 μm, the adhesive is organic silica gel, and the thickness of the adhesive layer is 0.2 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic silica gel binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a dispensing process to manufacture an adhesive layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 2
In this embodiment, a package substrate for a high-power L ED light bar is provided, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in this embodiment, the first transparent substrate 1 is a glass substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a sapphire substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in this embodiment, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2The width of the first transparent substrate 1 is 5mm, the thickness of the first transparent substrate is 0.7mm, the width of the second substrate 2 is 0.8mm, the thickness of the second transparent substrate is 0.35mm, the first transparent substrate 1 and the second substrate 2 are tightly compounded together through the bonding layer 3, the bonding layer 3 is prepared by mixing fluorescent powder and a binder, in the embodiment, the fluorescent powder is YAG yellow fluorescent powder, the particle size of the fluorescent powder is 15 mu m, and the binder is SiO2An aqueous solution of nanoparticles, the thickness of the binding layer being 0.07 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, mixing the fluorescent powder with SiO2Uniformly mixing the aqueous solution binder of the nano particles;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a screen printing process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 3
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a glass substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a transparent ceramic substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 10mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is 1mm, and the thickness of the second transparent substrate 2 is 0.35mm, the first transparent substrate 1 and the second substrate 2 are closely combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and a binder, in the embodiment, the fluorescent powder is a yellow fluorescent powder, a particle size of the fluorescent powder is 15 μm, and the binder is Al YAG2O3Ethanol solution of nanoparticles, the thickness of the bonding layer being0.12mm。
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, mixing the fluorescent powder with Al2O3Uniformly mixing ethanol solution binder of the nano particles;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a screen printing process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 4
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a glass substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a glass substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 7mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is lmm, the thickness of the second transparent substrate is 0.35mm, the first transparent substrate 1 and the second substrate 2 are closely combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a YAG yellow fluorescent powder, the particle size of the fluorescent powder is 15 μm, the adhesive is an aqueous solution of ZnO nanoparticles, and the thickness of the adhesive layer is 0.18 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the aqueous solution binder of the ZnO nanoparticles;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a spraying process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 5
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a glass substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a ceramic substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 6mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is 1.5mm, and the thickness of the second transparent substrate 2 is 0.35mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through a bonding layer 3, the bonding layer 3 is prepared by mixing a fluorescent powder and a bonding agent, in the embodiment, the fluorescent powder is a yellow fluorescent powder, a particle size of the fluorescent powder is 15 μm, the bonding agent is an ethanol solution of MgO nano-particles, and the thickness of the YAG bonding layer is.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the ethanol solution binder of the MgO nano-particles;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a spraying process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 6
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent natural mica substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a fluorine crystal mica substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times (a is greater than or equal to 1.5b) of a width b of the second substrate 2, in the embodiment, the width of the first transparent substrate 1 is 3mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is 1mm, the thickness of the second transparent substrate is 0.35mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a YAG yellow fluorescent powder, the particle size of the fluorescent powder is 15 μm, the adhesive is an organic silica gel, and the thickness of the adhesive layer is 0..
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic silica gel binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a dispensing process to manufacture an adhesive layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 7
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a fluorophlogopite substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a transparent natural mica substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times (a is greater than or equal to 1.5b) of a width b of the second substrate 2, in the embodiment, the width of the first transparent substrate 1 is 3mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is 1mm, the thickness of the second transparent substrate is 0.35mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a YAG yellow fluorescent powder, the particle size of the fluorescent powder is 15 μm, the adhesive is an organic silica gel, and the thickness of the adhesive layer is.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic silica gel binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a dispensing process to manufacture an adhesive layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 8
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a glass substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a ceramic substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 5mm, the thickness of the first transparent substrate 1 is 0.7mm, the width of the second substrate 2 is 1.5mm, and the thickness of the first transparent substrate 1 is 0.35mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a yellow fluorescent powder, the particle size of the fluorescent powder is 15 μm, and the adhesive is Na YAG2SiO3Aqueous solution, the thickness of the bonding layer is 0.08 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, mixing fluorescent powder and Na2SiO3Uniformly mixing the aqueous solution binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a screen printing process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 9
In this embodiment, a package substrate for a high-power L ED light bar is provided, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in this embodiment, the first transparent substrate 1 is a sapphire substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a glass substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in this embodiment, the first transparent substrate 1 has a width of 2mm and a thickness of 0.2mm, the second substrate 2 has a width of 0.5mm and a thickness of 0.1mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a phosphor and a binder, in this embodiment, the phosphor is a mixture of a yellow phosphor and a red nitride phosphor, a particle size of the phosphor is 5 μm, and the binder is CeO2An aqueous solution of nanoparticles, the thickness of the bonding layer being 0.05 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, mixing the fluorescent powder with CeO2Uniformly mixing the aqueous solution binder of the nano particles;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a screen printing process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 10
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in fig. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent ceramic substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a sapphire substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times (a is greater than or equal to 1.5b) of a width b of the second substrate 2, in the embodiment, the width of the first transparent substrate 1 is 5mm, the thickness of the first transparent substrate 1 is 2mm, the width of the second substrate 2 is 0.5mm, the thickness of the first transparent substrate 1 is 0.1mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a silicate yellow fluorescent powder, a particle size of the fluorescent powder is 10 μm, and the adhesive is Y2O3Ethanol solution of nanoparticles, the thickness of the adhesive layer being 0.4 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, mixing the fluorescent powder with Y2O3Uniformly mixing ethanol solution binder of the nano particles;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a spraying process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 11
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent silica gel substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a transparent ceramic substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 10mm, the thickness of the first transparent substrate 2 is 2mm, the width of the second substrate 2 is 5mm, the thickness of the second transparent substrate is 2mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a nitride yellow fluorescent powder, the particle size of the fluorescent powder is 30 μm, the adhesive is an organic acrylate, and the thickness of the adhesive layer is 0.3 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic acrylate adhesive;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a spraying process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 12
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent epoxy resin substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a polyimide substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times (a is greater than or equal to 1.5b) of a width b of the second substrate 2, in the embodiment, the width of the first transparent substrate 1 is 4.5mm, the thickness of the first transparent substrate 1 is 1mm, the width of the second substrate 2 is 3mm, the thickness of the second transparent substrate is 0.1mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a yellow fluorescent powder, the particle size of the fluorescent powder is 20 μm, the adhesive is an organic epoxy resin, and the thickness of the YAG is 0.15 mm.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic epoxy resin binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a screen printing process to manufacture a bonding layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 13
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent PMMA substrate, a second substrate 2 is arranged on the top surface of the first transparent substrate 1, the second substrate 2 is an iron substrate, the width a of the first transparent substrate 1 is greater than or equal to 1.5 times (a is greater than or equal to 1.5b) of the width b of the second substrate 2, in the embodiment, the width of the first transparent substrate 1 is 12mm, the thickness of the first transparent substrate 1 is 4mm, the width of the second substrate 2 is 2mm, and the thickness of the second transparent substrate is 0.5mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a YAG yellow fluorescent powder, the particle size of the fluorescent powder is 40 μm, the adhesive is organic polyurethane, and the thickness of the adhesive layer is 0.3.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic polyurethane adhesive;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a dispensing process to manufacture an adhesive layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 14
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent PC substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a copper substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times a width b of the second substrate 2 (a is greater than or equal to 1.5b), in the embodiment, the width of the first transparent substrate 1 is 15mm, the thickness of the first transparent substrate 1 is 3mm, the width of the second substrate 2 is 3mm, and the thickness of the second transparent substrate is 0.7mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and an adhesive, in the embodiment, the fluorescent powder is a YAG yellow fluorescent powder, the particle size of the fluorescent powder is 40 μm, the adhesive is an organic silica gel, and the thickness of the adhesive layer is 0..
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic silica gel binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a dispensing process to manufacture an adhesive layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 15
The embodiment provides a package substrate for a high-power L ED light bar, which is a composite substrate, as shown in FIG. 1, the composite substrate includes a first transparent substrate 1, in the embodiment, the first transparent substrate 1 is a transparent polyimide substrate, a second substrate 2 is disposed on a top surface of the first transparent substrate 1, the second substrate 2 is a mirror-surface aluminum substrate, a width a of the first transparent substrate 1 is greater than or equal to 1.5 times (a is greater than or equal to 1.5b) of a width b of the second substrate 2, in the embodiment, the width of the first transparent substrate 1 is 18mm, the thickness of the first transparent substrate 2 is 2mm, the width of the second substrate 2 is 4mm, the thickness of the second transparent substrate is 1.2mm, the first transparent substrate 1 and the second substrate 2 are tightly combined together through an adhesive layer 3, the adhesive layer 3 is prepared by mixing a fluorescent powder and a binder, in the embodiment, the fluorescent powder is a YAG yellow fluorescent powder, the particle size of the fluorescent powder is 40 μm, the binder is an organic epoxy resin, and the thickness of the adhesive layer is.
The embodiment also provides a method for manufacturing the packaging substrate for the high-power L ED light bar, which comprises the following steps:
s1, providing a second substrate;
s2, uniformly mixing the fluorescent powder and the organic epoxy resin binder;
s3, coating the mixture obtained in the step S2 on the surface of the second substrate through a dispensing process to manufacture an adhesive layer;
and S4, pressing the first transparent substrate on the bonding layer of the second substrate, and heating and curing to compound the first transparent substrate and the second substrate together.
Example 16
This embodiment provides a package structure including a package substrate as described in any of embodiments 1 to 15, as shown in fig. 2, the package structure includes the package substrate, where the surface of the second substrate 2 in the package substrate is fixedly provided with L ED chips 5 through a die attach adhesive, the L ED chip 5 is a blue chip, the L ED chip 5 is externally provided with a phosphor glue layer 6, the phosphor glue layer 6 only covers the surface of the second substrate and does not cover other transparent surfaces of the first transparent substrate, the phosphor glue is a phosphor glue with yellow phosphor powder to emit white light by being combined with the blue chip, as a changeable implementation manner, the L ED chip 5 may also be an ultraviolet chip, a red chip, etc., accordingly, the light color of the phosphor powder in the phosphor glue layer 6 may be matched and combined with the light emitting color of the chip to form white light, the adjacent L ED chips 5 are connected through metal wires 7, and the L ED chips 5 at the edge are connected with metal pins 4, so as to be connected with an external power supply.
L ED packaging structure, blue light L ED chip 5 solid brilliant on composite substrate's second base plate 2, the heat that the blue light chip sent spreads to whole first transparent substrate 1 through second base plate 2 fast, blue light chip surface coating fluorescence glue film 6, the blue light that L ED sent is converted into white light through positive fluorescence glue film, the blue light that passes through the 2 backs of second base plate passes through tie coat 3 and converts into white light, because fluorescence glue film 6 only covers the surface of second base plate and does not cover other transparent surfaces of first transparent substrate, when having taken into account heat radiating area, the light that the lamp strip sent can pass at the transparent part of other lamp strip base plates, the heat accumulation that leads to because the resorption and the reflection of light when having reduced many lamp strips and concentrating the use, the mutual influence of light has been reduced, be favorable to the heat dissipation of packaging device, can use in high-power ED L illumination product.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (7)
1. The utility model provides an L ED packaging substrate for lamp strip, its characterized in that includes first transparent substrate, is provided with the second base plate on the first transparent substrate, and width a of first transparent substrate is more than or equal to 1.5 times of second base plate width b, closely compounds together through the tie coat between first transparent substrate and the second base plate, and first base plate or second base plate both ends are provided with metal terminal.
2. The packaging substrate for the L ED light bar of claim 1, wherein the first transparent substrate is one of a glass substrate, a sapphire substrate, a transparent ceramic substrate, a transparent natural mica substrate, a transparent fluorine crystal mica substrate, a silica gel substrate, an epoxy resin substrate, a PMMA substrate, a PC substrate, and a polyimide substrate.
3. The packaging substrate of claim 1, wherein the second substrate is one of a ceramic substrate, a glass substrate, a sapphire substrate, a transparent ceramic substrate, a transparent natural mica substrate, a transparent fluorophlogopite substrate, a polyimide substrate, an iron substrate, a copper substrate, and a mirror aluminum substrate.
4. The packaging substrate for the L ED light bar of claim 1, wherein the first transparent substrate has a width of 2 mm-20 mm and a thickness of 0.2 mm-5 mm.
5. The packaging substrate for the L ED light bar of claim 1, wherein the second substrate has a width of 0.5mm to 5mm and a thickness of 0.1mm to 2 mm.
6. The packaging substrate for the L ED light bar of claim 1, wherein the adhesive layer has a thickness of 0.05mm to 0.4 mm.
7. A packaging structure comprising the packaging substrate according to any one of claims 1 to 6, wherein a second substrate is disposed on the top surface of the first transparent substrate, the width a of the first transparent substrate is greater than or equal to 1.5 times the width b of the second substrate, the first transparent substrate and the second substrate are tightly combined together through an adhesive layer, metal terminals are disposed at two ends of the first substrate or the second substrate, at least two L ED chips are disposed on the surface of the second substrate, a fluorescent glue layer is coated on the surface of the light-emitting chip, the fluorescent glue layer only covers the surface of the second substrate but not covers other transparent surfaces of the first transparent substrate, and the electrical connection between the chip and the metal terminals at two ends of the substrate is realized through metal wires.
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| CN201921414879.9U CN211017116U (en) | 2019-08-22 | 2019-08-22 | L packaging substrate for ED lamp strip and packaging structure containing substrate |
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| CN201921414879.9U CN211017116U (en) | 2019-08-22 | 2019-08-22 | L packaging substrate for ED lamp strip and packaging structure containing substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620170A (en) * | 2019-08-22 | 2019-12-27 | 深圳市艾迪恩科技有限公司 | Packaging substrate for LED lamp strip, packaging structure containing substrate and manufacturing process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110620170A (en) * | 2019-08-22 | 2019-12-27 | 深圳市艾迪恩科技有限公司 | Packaging substrate for LED lamp strip, packaging structure containing substrate and manufacturing process |
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