CN106449625A - Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof - Google Patents
Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof Download PDFInfo
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- CN106449625A CN106449625A CN201611082152.6A CN201611082152A CN106449625A CN 106449625 A CN106449625 A CN 106449625A CN 201611082152 A CN201611082152 A CN 201611082152A CN 106449625 A CN106449625 A CN 106449625A
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- flip led
- fluorescence substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Abstract
The invention relates to a fluorescent-substrate-based inverted LED lamp filament and a packaging process thereof. The inverted LED lamp filament comprises a long-strip-shaped fluorescent substrate; and welding plates are arranged at the two sides of the fluorescent substrate. The inverted LED lamp filament is characterized in that at least one metal line with two ends connected with the welding plates in series or in parallel is arranged on one surface of the fluorescent substrate; and a plurality of inverted LED chips are arranged on each metal line, wherein the plurality of inverted LED chips on the metal line is located on the same straight line. Besides, one surface, with the welding plates and the metal lines, of the fluorescent substrate is coated with a fluorescent adhesive; and the inverted LED chips are packaged on the fluorescent substrate by the fluorescent adhesive in a single-surface coating manner. In addition, the packaging process for the fluorescent-substrate-based inverted LED lamp filament includes steps: step A, carrying out die bonding; step B, carrying out welding; and step C, carrying out adhesive coating. The fluorescent-substrate-based inverted LED lamp filament and the packaging process thereof have the following advantages: the luminance is uniform; the production efficiency is improved; and the service life is prolonged.
Description
Technical field
The present invention relates to a kind of flip LED filament based on fluorescence substrate and its packaging technology, particularly to based on fluorescence
The flip LED filamentray structure of substrate and its method for packing.
Background technology
Light emitting diode（Light Emitting Diode）It is a kind of 21 century most promising cold light source, because
The advantages of its energy-saving and environmental protection, reliability height and flexible design, obtains extensive exploitation and application in lighting field.With prohibitting the use of
The implementation of electric filament lamp plan, tungsten electric filament lamp is about to disappear, and LED filament lamp progressively replaces ground in the minds of people for the tungsten lamp
Position, flip LED filament be no stroboscopic, no blue light release, low grade fever, the long-life, the new light of LED illumination of new generation of the characteristic such as slow decay
Source, likes and pursues because its upside-down mounting and planar coating process and 360 ° of stereo luminous features win the people missed old times or old friends.
Flip LED product is mainly filament and lamp piece at present, and commercialization flip LED filament using white pottery porcelain as substrate is
Main flow, the manufacture method of white light LEDs typically excites fluorescent glue using light source based on blue-ray LED.Flip LED filament
Manufacture method be mainly on ceramic substrate print silver wire, blue LED flip chip is fixed on by pottery by die bond technique
On substrate, more sufficient fluorescent material and silica gel will be mixed and be respectively coated on the two sides of ceramic substrate by dual coating technique, fill
Form flip LED filament after dividing baking.The flip LED filament being obtained as substrate using pottery, because ceramic substrate is one side
Light-transmitting materials, make the basic light source that blue-ray LED sends can not be fully used, lead to the luminous flux of flip LED filament low.Adopt
The flip LED filament obtaining in this way, because coating method is dual coating, that is, there is fluorescence on the two sides of ceramic substrate
Glue, the heat that chip back produces needs just can distribute after ceramic substrate and fluorescent glue, and radiating is bad to lead to chip
Temperature rising further results in fluorescent material performance degradation makes fluorescent glue accelerated ageing lead to transmitance to decline, and flip LED filament makes
Use the lost of life.Simultaneously as the inhomogeneities that fluorescent material is distributed in colloid, occur between different white light flip LED filaments
The inconsistent problem of white light quality.Although improving uniformity, stability, aging and the filament heat dispersion of encapsulation at this stage
Aspect has certain progress, but still can not meet specular removal, high color rendering index (CRI), long-life large power white light LED filament photograph
Bright growth requirement.
Ceramic substrate compared by fluorescence substrate, and to have the excellent luminescent properties of fluorescent material and good calorifics, physics, chemistry steady
Qualitative and light transmittance is good, launching efficiency is high, packaging technology is simple, is highly suitable as the replacement of traditional LED lamp silk ceramic substrate
Material simultaneously is suitable for producing in enormous quantities.
Content of the invention
The technical problem to be solved in the present invention is to provide a kind of flip LED filament based on fluorescence substrate and its encapsulation work
Skill, for improving the stability of Conventional flip LED filament, extends the service life of filament.
The technical scheme is that：A kind of flip LED filament based on fluorescence substrate, including the fluorescent base in strip
Plate, is respectively arranged at two ends with pad it is characterised in that the one side in fluorescence substrate is provided with least one two ends and divides in fluorescence substrate
Not being connected with described pad and for metallic circuit in series or in parallel, be respectively equipped with every wires road some fall
Fill LED chip, and some flip LED chips being arranged on metallic circuit are located along the same line, and are provided with weldering in fluorescence substrate
The one side of disk and metallic circuit scribbles fluorescent glue, and flip LED chips are packaged in fluorescence substrate with one side coating method by fluorescent glue
On.
Described fluorescence substrate is fluorescent crystal, fluorescence ceramics, fluorescent glass pottery, any one in fluorescence membrane.
The both sides of fluorescence substrate are covered by described fluorescent glue, from fluorescent glue and fluorescent base after flip LED chips are energized
What plate projected light is white light, and the colour temperature of both white lights is identical.
Described fluorescent glue is that redness is prepared by fully mixing with silica gel according to setting ratio with green emitting phosphor.
Described flip LED chips are blue chip, a size of 06milx20mil or 08milx20mil, and the ripple of this chip
A length of 440-460nm.
A kind of packaging technology of the flip LED filament based on fluorescence substrate, comprises the following steps：
A, in described metallic circuit corresponding position tin cream bonding flip LED chips, make described flip LED chips be fixed on institute
State on fluorescence substrate；
B, the described fluorescence substrate after die bond is welded, welding manner is Reflow Soldering；
C, described fluorescent glue is stirred after carry out deaeration process with vacuum degasing machine；
D, described fluorescence substrate corresponding position one side coat described fluorescent glue carry out dispensing operation；
E, the described flip LED filament after dispensing is toasted two hours at 160 DEG C after transfer to rebake two hours at 180 DEG C.
After step B, fluorescence substrate good for die bond is down to 25 DEG C, falls to described in described fluorescence substrate and its connection
Dress LED chip is detected, the filament bad to die bond carries out mending brilliant and repair welding operation.
After step D, the semi-finished product filament not toasted after the completion of dispensing is detected, require to not meeting product colour temperature
The ratio of described fluorescent glue be adjusted.
The present invention has the advantages that using after said structure and packaging technology：
(1) substitute the technical scheme of ceramic substrate with fluorescence substrate, have excitation-emission efficiency high, physical and chemical performance stable,
The series of advantages such as high homogeneity, thermal conductivity are high, aftertreatment technology is simple, overcomes the stability of ceramic substrate poor, easily aging
The problems such as.
(2) flip LED chips, die bond process is simple are adopted, it is to avoid filament is in encapsulation or transportation due to bonding wire
The damage that fracture causes.
(3) present invention can by change fluorescent material and silica gel ratio thus reach different luminous fluxes, colour temperature, aobvious finger with
And photochromic requirement.Meet real life environments to luminous requirement.
(4) this flip LED filament encapsulating structure is simple, and its processing technology is simple, suitable large-scale industrial production.
（5）In invention, described fluorescence substrate is than the good heat dissipation effect of traditional ceramic substrate, and has good radiating
Property,.After encapsulating face bonding fluorescent glue, energy 3D is omnibearing luminous, has stereo luminous effect, and luminous uniform, and light decay is less, can
Higher by property.
Brief description
Structural representation after the series filament encapsulation that Fig. 1 provides for the present invention；
Structural representation after the filaments connected in parallel encapsulation that Fig. 2 provides for the present invention；
The unencapsulated structural representation of series filament that Fig. 3 provides for the present invention；
The unencapsulated structural representation of filaments connected in parallel that Fig. 4 provides for the present invention；
The series filament that Fig. 5 provides for the present invention does not paste the structural representation of chip；
The filaments connected in parallel that Fig. 6 provides for the present invention does not paste the structural representation of chip；
The filament lateral cross section structural representation that Fig. 7 provides for the present invention.
Specific embodiment
The following is being embodied as case and combining accompanying drawing of invention, technical scheme be further described,
But the present invention is not limited to these embodiments.
As Fig. 1, shown in 2, the flip LED filament based on fluorescence substrate of the present invention, including the fluorescence substrate in strip
1, be respectively arranged at two ends with pad 11 in fluorescence substrate 1, the one side of substrate 1 be provided with least one two ends respectively with described weldering
Disk 11 be connected and setting each other in series or parallel metallic circuit 12, every wires road 12 is respectively equipped with some fall
Fill LED chip 2, and some flip LED chips 2 being arranged on metallic circuit 12 are located along the same line, flip LED chips are
Blue chip, a size of 06milx20mil or 08milx20mil, and the wavelength of this chip is 440-460nm.It is arranged in parallel
The structure that the LED flip chip 2 that metallic circuit 12 combination is arranged on differently curved metallic circuit 12 is located along the same line can
So that the cost of the manufacturing is greatly reduced, meanwhile, it is easy to manufacture and using control.It is provided with pad 11 and metal in fluorescence substrate 1
The one side of circuit 12 scribbles fluorescent glue 3, and fluorescent glue 3 with one side coating method, flip LED chips 2 is packaged on fluorescence substrate 1.
The both sides of fluorescence substrate 1 are covered by fluorescent glue 3, after flip LED chips be energizeds from fluorescent glue 3 and fluorescence substrate 1 injection
Light is white light, and the colour temperature of both white lights is identical.Fluorescent glue 3 is that redness is filled with silica gel according to setting ratio with green emitting phosphor
Divide and mix.
As shown in fig. 7, being connected to form in semicircle with described fluorescence substrate 1 after fluorescence substrate 1 is encapsulated by fluorescent glue 3 circumference
The structure of column.Half-terete structural volume is little and low cost of manufacture, and packaged type is simple.This structure ensure that luminance
The uniformity of degree, thus improve practicality.
As shown in Figures 3 to 6, the pad 11 of the present embodiment is arranged on the one side of fluorescence substrate 1, and the two ends of metallic circuit
It is connected with the pad at two ends respectively.
The packaging technology of the flip LED filament based on fluorescence substrate of the present invention, comprises the steps：
A, in described metallic circuit 12 corresponding position tin cream bonding flip LED chips, make described flip LED chips 2 fixing
On described fluorescence substrate 1；
B, the described fluorescence substrate 1 after die bond is welded, welding manner is Reflow Soldering；
C, described fluorescent glue 3 is stirred after carry out deaeration process with vacuum degasing machine；
D, coat described fluorescent glue 3 in described fluorescence substrate 1 corresponding position one side and carry out dispensing operation；
E, the described flip LED filament after dispensing is toasted two hours at 160 DEG C after transfer to rebake two hours at 180 DEG C.
After step B, fluorescence substrate 1 good for die bond is down to 25 DEG C, to described in described fluorescence substrate 1 and its connection
Flip LED chips 2 are detected, the filament bad to die bond carries out mending brilliant and repair welding operation.
After step D, the semi-finished product filament not toasted after the completion of dispensing is detected, require to not meeting product colour temperature
The ratio of described fluorescent glue 3 be adjusted.
Claims (8)
1. a kind of flip LED filament based on fluorescence substrate, including the fluorescence substrate in strip（1）, in fluorescence substrate（1）'s
It is respectively arranged at two ends with pad（11）It is characterised in that in fluorescence substrate（1）One side be provided with least one two ends respectively with described
Pad（11）Connected and for metallic circuit in series or in parallel（12）, on every wires road（12）If on be respectively equipped with
Dry flip LED chips（2）, and it is arranged on metallic circuit（12）On some flip LED chips（2）It is located along the same line,
Fluorescence substrate（1）It is provided with pad（11）And metallic circuit（12）One side scribble fluorescent glue（3）, fluorescent glue（3）With one side coating
Mode is by flip LED chips（2）It is packaged in fluorescence substrate（1）On.
2. the flip LED filament based on fluorescence substrate according to claim 1 it is characterised in that：Described fluorescence substrate（1）
For any one in fluorescent crystal, fluorescence ceramics, fluorescent glass pottery, fluorescence membrane.
3. the flip LED filament based on fluorescence substrate according to claim 1 it is characterised in that：Described fluorescent glue（3）
By fluorescence substrate（1）Both sides cover, from fluorescent glue after flip LED chips are energized（3）With fluorescence substrate（1）Project light
It is white light, and the colour temperature of both white lights is identical.
4. the flip LED filament based on fluorescence substrate according to claim 1 it is characterised in that：Described fluorescent glue（3）For
Redness is prepared by fully mixing with silica gel according to setting ratio with green emitting phosphor.
5. the flip LED filament based on fluorescence substrate according to claim 1 it is characterised in that：Described flip LED chips
（2）For blue chip, a size of 06milx20mil or 08milx20mil, and the wavelength of this chip is 440-460nm.
6. the packaging technology of the flip LED filament based on fluorescence substrate described in a kind of any one of claim 1-5, its feature exists
In comprising the following steps：
A, in described metallic circuit（12）Corresponding position tin cream bonding flip LED chips, make described flip LED chips（2）
It is fixed on described fluorescence substrate（1）On；
B, to the described fluorescence substrate after die bond（1）Welded, welding manner is Reflow Soldering；
C, by described fluorescent glue（3）Carry out deaeration process with vacuum degasing machine after stirring；
D, in described fluorescence substrate（1）Corresponding position one side coats described fluorescent glue（3）Carry out dispensing operation；
E, the described flip LED filament after dispensing is toasted two hours at 160 DEG C after to transfer to rebake two at 180 DEG C little
When.
7. the flip LED filament based on fluorescence substrate according to claim 6 packaging technology it is characterised in that：Step B
Afterwards by fluorescence substrate good for die bond（1）It is down to 25 DEG C, to described fluorescence substrate（1）And its described flip LED core connecting
Piece（2）Detected, the filament bad to die bond carries out mending brilliant and repair welding operation.
8. the flip LED filament based on fluorescence substrate according to claim 6 packaging technology it is characterised in that：Step D
Afterwards the semi-finished product filament not toasted after the completion of dispensing is detected, to the described fluorescent glue not meeting the requirement of product colour temperature
（3）Ratio be adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082152.6A CN106449625A (en) | 2016-11-30 | 2016-11-30 | Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082152.6A CN106449625A (en) | 2016-11-30 | 2016-11-30 | Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof |
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| Publication Number | Publication Date |
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| CN106449625A true CN106449625A (en) | 2017-02-22 |
Family
ID=58223777
Family Applications (1)
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| CN201611082152.6A Pending CN106449625A (en) | 2016-11-30 | 2016-11-30 | Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895282A (en) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | Fluorescence membrane is used for the method that LED filament makes bulb lamp |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN108630797A (en) * | 2018-04-27 | 2018-10-09 | 上海应用技术大学 | A kind of die bond technique of upside-down mounting flexible LED filament |
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN109538972A (en) * | 2018-12-06 | 2019-03-29 | 上海应用技术大学 | A kind of LED intention bulb lamp |
| CN111146324A (en) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | White light LED device with ultrahigh color rendering index |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956421A (en) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | LED lamp based on transparent fluorescent ceramics |
| CN104051597A (en) * | 2014-06-13 | 2014-09-17 | 骆伟经 | Omnibearing LED device packaging method |
| CN204271077U (en) * | 2014-08-29 | 2015-04-15 | 王维昀 | All-round smooth LED light source |
-
2016
- 2016-11-30 CN CN201611082152.6A patent/CN106449625A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103956421A (en) * | 2014-04-22 | 2014-07-30 | 中国科学院上海光学精密机械研究所 | LED lamp based on transparent fluorescent ceramics |
| CN104051597A (en) * | 2014-06-13 | 2014-09-17 | 骆伟经 | Omnibearing LED device packaging method |
| CN204271077U (en) * | 2014-08-29 | 2015-04-15 | 王维昀 | All-round smooth LED light source |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895282A (en) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | Fluorescence membrane is used for the method that LED filament makes bulb lamp |
| CN108155106A (en) * | 2017-12-22 | 2018-06-12 | 珠海市大鹏电子科技有限公司 | A kind of length climbs the preparation process of electric light electric coupler |
| CN108630797A (en) * | 2018-04-27 | 2018-10-09 | 上海应用技术大学 | A kind of die bond technique of upside-down mounting flexible LED filament |
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN109538972A (en) * | 2018-12-06 | 2019-03-29 | 上海应用技术大学 | A kind of LED intention bulb lamp |
| CN111146324A (en) * | 2019-11-25 | 2020-05-12 | 华中科技大学鄂州工业技术研究院 | White light LED device with ultrahigh color rendering index |
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Application publication date: 20170222 |