CN103956421A - LED lamp based on transparent fluorescent ceramics - Google Patents
LED lamp based on transparent fluorescent ceramics Download PDFInfo
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- CN103956421A CN103956421A CN201410161313.5A CN201410161313A CN103956421A CN 103956421 A CN103956421 A CN 103956421A CN 201410161313 A CN201410161313 A CN 201410161313A CN 103956421 A CN103956421 A CN 103956421A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 67
- 239000004568 cement Substances 0.000 claims abstract description 17
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 14
- 229910052777 Praseodymium Inorganic materials 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 229910052596 spinel Inorganic materials 0.000 claims abstract description 5
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 claims description 19
- 229910020068 MgAl Inorganic materials 0.000 claims description 12
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 claims description 11
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000002223 garnet Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- 239000011777 magnesium Substances 0.000 claims description 2
- -1 magnesium aluminate Chemical class 0.000 claims description 2
- 239000011029 spinel Substances 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 14
- 239000000741 silica gel Substances 0.000 abstract description 14
- 229910002027 silica gel Inorganic materials 0.000 abstract description 14
- 239000000843 powder Substances 0.000 abstract description 13
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910026161 MgAl2O4 Inorganic materials 0.000 abstract 3
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- 238000004020 luminiscence type Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Luminescent Compositions (AREA)
Abstract
Disclosed is an LED lamp based on transparent fluorescent ceramics. The LED lamp is composed of LED lamp filaments, electrode leads and a lampshade and is characterized in that the strip-shaped transparent fluorescent ceramics serve as the substrate of the LED lamp filaments, the width of the transparent fluorescent ceramics is equal to that of LED chips, then the blue LED chips (including leads) are sequentially fixed to the transparent fluorescent ceramic battens in an adhering mode, and identical transparent fluorescent ceramic strips adhere to the other sides of the LED chips or the other sides of the LED chips are coated with fluorescent optical cement. The transparent fluorescent ceramics can be Ce : YAG (including the situation when Ce ion concentration is zero), or Ce : Tb3Al5O12, or Ce, Cr : YAG, or Ce, Pr : YAG, or Ce : YAG+MgAl2O4, or Ce, Pr : YAG+MgAl2O4, or Ce, Cr : YAG +MgAl2O4. According to the LED lamp based on the transparent fluorescent ceramics, luminous decay of a fluorescent powder silica gel resin mixture phosphor can be effectively avoided, the performance of the LED lamp can be improved, and the service life of the LED lamp can be prolonged.
Description
Technical field
The present invention relates to LED lighting technical field, especially a kind of LED lamp based on transparent fluorescent ceramic.
Background technology
Tradition LED encapsulating structure is because its support is made up of the heat sink material such as Cu, Al, this structure LED can only one side bright dipping, under adopting that lens are balanced and sending out situation photodistributed, light emitting anger is generally also no more than 165 °, Japan's oxtail light source imitative conventional incandescent that is formed filament by LED lamp pearl that took the lead in 2008 having released, cause that industry greatly pays close attention to, and realized mass production.As documents 1 (application for a patent for invention number: disclose a kind of LED filament lamp structure 201310239213.5), it comprises substrate, be fixed on the luminescence unit (blue light and red LED chip) at least one side of substrate, and be coated on the outer field adhesive layer of luminescence unit.And this LED filament adopts traditional sealing of fluorescent material+silica gel (or resin), dispel the heat poor, the light decay problem that makes fluorescent material transformant high power white LED exist following two aspects to cause, from blue-light LED chip under high Injection Current by the caused decay of luminescence of effect such as defect, auger electrons-vacancy be compound with from phosphor material powder heat fade at high temperature, comprise the light decay causing such as aging of the temperature cancellation of fluorescent material itself and organic silica gel resin.Therefore, its high-quality that is difficult to realize long stable effect is luminous.In addition, documents 2 (application for a patent for invention number: 201220717834.0) propose to adopt glass as filament stem stem, and settle at least one with the filament of vertical direction inclination certain angle, to improve light intensity spatial distribution, but still without improving, therefore still there is the thermo-optical of the fluorescent material problem that declines on phosphor material powder.So improve LED filament make the fields such as the long-acting stabilized illumination of lamp ball still have a large amount of problems need solve.
The present invention is directed to existing LED filament because conventional fluorescent powder+silica gel (resin) sealing that weak heat-dissipating causes is difficult to realize the luminous problem of long-acting stable high-quality, a kind of LED filamentray structure based on transparent fluorescent ceramic is proposed, adopt transparent fluorescent ceramic as substrate, be different from documents 1, it is the outside that substrate is positioned at LED chip, in playing substrate effect, play the effect of fluorescent material, can effectively solve the Problem of Phosphor Decay in Rare Earth of LED filament lamp.
Summary of the invention
The object of the present invention is to provide a kind of LED lamp based on fluorescence ceramics, in order to realize filament LED lamp in the situation that improving or at least not reducing radiating effect, solve the luminous heat fade of fluorescent material, improve the long-acting stability of high-capacity LED illumination.
The technical scheme that the present invention proposes is:
A kind of LED lamp based on transparent fluorescent ceramic, comprise the filament of LED lamp, its feature is that the filament of described LED lamp is the blue-light LED chip of bonding multiple series windings successively on the substrate of strip transparent fluorescent ceramic, the bonding transparent ceramic bar identical with it or apply fluorescence optical cement formation again on multiple blue-light LED chips.
Described transparent fluorescent ceramic is to mix cerium garnet phase structure, or mixes cerium garnet and magnesium aluminate spinel mixing phase structure.
The phase structure of described transparent fluorescent ceramic comprises Ce:YAG, Ce:TAG, Ce, Cr:YAG or Ce, Pr:YAG.
The mixing phase structure of described transparent fluorescent ceramic comprises Ce:YAG+MgAl
2o
4, Ce, Pr:YAG+MgAl
2o
4, or Ce, Cr:YAG+MgAl
2o
4.
Technique effect of the present invention:
LED lamp of the present invention can be realized the white light bright dipping of nearly full azimuth, compares glass and plastic base, and transparent fluorescent ceramic has higher thermal conductivity, can improve to a certain extent heat radiation.The more important thing is, it is luminous that this fluorescence ceramics still can efficient stable in high temperature (150 DEG C) workplace of high-capacity LED, and the thermo-optical that can effectively solve current fluorescent powder silica gel resin compound fluorophor declines, thereby improves performance and the life-span of current filament LED lamp ball.
Brief description of the drawings
Fig. 1 is the LED modulated structure schematic diagram that the present invention is based on fluorescence ceramics.
Fig. 2 is the structural representation of the first embodiment of filament of the present invention
Fig. 3 is the structural representation of the second embodiment of filament of the present invention.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is described in further detail
Referring to Fig. 1～Fig. 3, for the present invention is based on the LED lamp of fluorescence ceramics, comprise blue-light LED chip 1, upper and lower fluorescence ceramics bar 2, lead-in wire 3, upper and lower fluorescence silica gel 4, lampshade 5.
Embodiment 1
In upper and lower fluorescence ceramics bar 2, adopt: Ce:YAG fluorescence ceramics is processed into two of the rectangular thin slices of 30mm × 1.5mm × 0.38mm, as shown in Figure 2, form LED filament.Because the thermal conductivity of Ce:YAG fluorescence ceramics is than glass, the substrates such as plastics are high a lot, can improve to a certain extent the heat radiation of LED filament lamp.And, there is not the problems such as aging, the variable color of conventional fluorescent powder+silica gel (or resin) encapsulation in fluorescence ceramics, the more important thing is, Ce:YAG fluorescence ceramics, suitably also can effectively improving light decay problem under doping content, can ensure the long-acting steady operation performance and used life of LED filament lamp.
Embodiment 2
In upper and lower fluorescence ceramics bar 2, adopt: Ce, Pr:YAG fluorescence ceramics is processed into two of the rectangular thin slices of 30mm × 1.5mm × 0.38mm, as shown in Figure 2, forms LED filament.
Embodiment 3
In upper and lower fluorescence ceramics bar 2, adopt: Ce, Cr:YAG fluorescence ceramics is processed into two of the rectangular thin slices of 40mm × 2mm × 0.38mm, as shown in Figure 2, forms LED filament.
Embodiment 4
In upper and lower fluorescence ceramics bar 2, adopt: Ce:YAG+MgAl
2o
4mix two of the rectangular thin slices that phase fluorescence ceramics is processed into 40mm × 1.5mm × 0.38mm, as shown in Figure 2, form LED filament.
Embodiment 5
In upper and lower fluorescence ceramics bar 2, adopt: Ce, Pr:YAG+MgAl
2o
4mix two of the rectangular thin slices that phase fluorescence ceramics is processed into 30mm × 1.5mm × 0.38mm, as shown in Figure 2, form LED filament.
Embodiment 6
In upper and lower fluorescence ceramics bar 2, adopt: Ce, Cr:YAG+MgAl
2o
4mix two of the rectangular thin slices that phase fluorescence ceramics is processed into 35mm × 2.0mm × 0.38mm, as shown in Figure 2, form LED filament.
Embodiment 7
In upper (lower) fluorescence ceramics bar 2, adopt Ce:YAG fluorescence ceramics to be processed into the rectangular thin slice of 30mm × 1.6mm × 0.38mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on this transparent fluorescent ceramic lath, on blue-light LED chip, apply again fluorescent powder silica gel optical cement, (on) fluorescence optical cement 4, as shown in Figure 2, form LED filament.
Embodiment 8
In upper (lower) fluorescence ceramics bar 2, adopt Ce, Pr:YAG fluorescence ceramics is processed into the rectangular thin slice of 35mm × 1.5mm × 0.4mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on this transparent fluorescent ceramic lath, on blue-light LED chip, apply again fluorescent powder silica gel optical cement, (on) fluorescence optical cement 4, as shown in Figure 2, form LED filament.
Embodiment 9
In upper (lower) fluorescence ceramics bar 2, adopt Ce, Cr:YAG fluorescence ceramics is processed into the rectangular thin slice of 40mm × 1.5mm × 0.4mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on this transparent fluorescent ceramic lath, on blue-light LED chip, apply again fluorescent powder silica gel optical cement, (on) fluorescence optical cement 4, as shown in Figure 2, form LED filament.
Embodiment 10
In upper (lower) fluorescence ceramics bar 2, adopt Ce:YAG+MgAl
2o
4mix the rectangular thin slice that phase fluorescence ceramics is processed into 35mm × 1.5mm × 0.4mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on this transparent fluorescent ceramic lath, on blue-light LED chip, apply again fluorescent powder silica gel optical cement, (on) fluorescence optical cement 4, as shown in Figure 2, form LED filament.
Embodiment 11
In upper (lower) fluorescence ceramics bar 2, adopt Ce, Pr:YAG+MgAl
2o
4mix the rectangular thin slice that phase fluorescence ceramics is processed into 30mm × 1.5mm × 0.38mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on this transparent fluorescent ceramic lath, on blue-light LED chip, apply again fluorescent powder silica gel optical cement, (on) fluorescence optical cement 4, as shown in Figure 2, form LED filament.
Embodiment 12
In upper (lower) fluorescence ceramics bar 2, adopt Ce, Cr:YAG+MgAl
2o
4mix the rectangular thin slice that phase fluorescence ceramics is processed into 45mm × 1.7mm × 0.38mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on this transparent fluorescent ceramic lath, on blue-light LED chip, apply again fluorescent powder silica gel optical cement, (on) fluorescence optical cement 4, as shown in Figure 2, form LED filament.
Embodiment 13
In upper and lower fluorescence ceramics bar 2, adopt: YAG transparent ceramic is processed into the rectangular thin slice of 30mm × 1.5mm × 0.38mm, then some blue-light LED chips (comprising lead-in wire) are adhesively fixed on the thin lath of this YAG transparent ceramic, and the above-mentioned YAG transparent ceramic slice that installs blue-light LED chip is wrapped in Ce:YAG fluorescent powder silica gel optical cement, it is fluorescence optical cement 4, as shown in Figure 3, form LED filament.
Claims (4)
1. the LED lamp based on transparent fluorescent ceramic, comprise the filament of LED lamp, the filament that it is characterized in that described LED lamp is the blue-light LED chip of bonding multiple series windings successively on the substrate of strip transparent fluorescent ceramic, the bonding transparent ceramic bar identical with it or apply fluorescence optical cement formation again on multiple blue-light LED chips.
2. LED lamp as claimed in claim 1, is characterized in that, described transparent fluorescent ceramic is to mix cerium garnet phase structure, or mixes cerium garnet and magnesium aluminate spinel mixing phase structure.
3. LED lamp as claimed in claim 2, is characterized in that, the phase structure of described transparent fluorescent ceramic comprises Ce:YAG, Ce:TAG, Ce, Cr:YAG or Ce, Pr:YAG.
4. LED lamp as claimed in claim 2, is characterized in that, the mixing phase structure of described transparent fluorescent ceramic comprises Ce:YAG+MgAl
2o
4, Ce, Pr:YAG+MgAl
2o
4, or Ce, Cr:YAG+MgAl
2o
4.
Priority Applications (1)
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| CN201410161313.5A CN103956421A (en) | 2014-04-22 | 2014-04-22 | LED lamp based on transparent fluorescent ceramics |
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| CN201410161313.5A CN103956421A (en) | 2014-04-22 | 2014-04-22 | LED lamp based on transparent fluorescent ceramics |
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Family
ID=51333671
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| CN201410161313.5A Pending CN103956421A (en) | 2014-04-22 | 2014-04-22 | LED lamp based on transparent fluorescent ceramics |
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Cited By (36)
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| CN104253193A (en) * | 2014-08-06 | 2014-12-31 | 浙江英特来光电科技有限公司 | High-light effect and high-performance LED (light-emitting diode) |
| CN104609848A (en) * | 2015-02-10 | 2015-05-13 | 中国科学院上海光学精密机械研究所 | Composite-phase transparent ceramic for white light LED (light-emitting diode) fluorescence conversion and preparation method thereof |
| CN105405949A (en) * | 2014-08-29 | 2016-03-16 | 无锡华润华晶微电子有限公司 | Light-emitting diode lamp filament and preparation method therefor |
| WO2016127673A1 (en) * | 2015-02-12 | 2016-08-18 | 苏州晶品新材料股份有限公司 | Three-dimensional luminous led point light source and illuminating device |
| WO2016197901A1 (en) * | 2015-06-10 | 2016-12-15 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Led filament, led filament assembly and led bulb |
| CN106449625A (en) * | 2016-11-30 | 2017-02-22 | 上海应用技术大学 | Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof |
| CN106549093A (en) * | 2016-10-25 | 2017-03-29 | 江苏师范大学 | A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material |
| CN107540369A (en) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | The preparation method of luminescent ceramic, LED encapsulation structure and luminescent ceramic |
| CN107540368A (en) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | The preparation method and LED module of complex phase translucent fluorescent ceramics |
| CN108947516A (en) * | 2018-08-29 | 2018-12-07 | 江苏师范大学 | A kind of (Cu, Ce): YAG transparent fluorescent ceramic and the preparation method and application thereof |
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