CN115799433A - Red light packaging structure, red light LED light source and packaging method - Google Patents
Red light packaging structure, red light LED light source and packaging method Download PDFInfo
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Abstract
The invention discloses a red light packaging structure, a red light LED light source and a packaging method, wherein a normally-mounted chip in the red light packaging structure is a normally-mounted chip, light is directly emitted upwards, the light parameter efficiency and the brightness of the LED light source can be increased without reflection, at least two fluorescent powder layers are formed by dispensing on the surface of the normally-mounted LED chip, through the design of the at least two fluorescent powder layers, the effective red light waveband generated by a light-emitting unit is wider, the optical power of the red light waveband is more than or equal to 80% of the maximum optical power, and the red light packaging structure has very important significance for effectively providing a red light physiotherapy effect.
Description
Technical Field
The invention relates to the technical field of illumination, in particular to a red light packaging structure, a red light LED light source and a packaging method.
Background
The red light physiotherapy is a method for improving the physiological condition of a human body by irradiating the human body with red light. The red light has certain penetrating power to skin and subcutaneous tissues, and the warm effect of the red light to muscles, subcutaneous tissues and the like can accelerate blood circulation, promote metabolism and cell proliferation, and have the effects of diminishing inflammation, easing pain, massaging, promoting scar softening, relieving scar contracture and the like.
The traditional red light therapeutic apparatus mostly adopts a light filtering method to obtain red light, and has the defects of limited service life of light filtering liquid, low luminous efficiency, small irradiation area, stroboflash, complex structure, unmodulatable light intensity and frequency and the like. The LED light source has the advantages of high efficiency, narrow band, direct current, energy conservation, environmental protection and the like, and becomes an artificial light source which is widely applied in the fields of medical treatment and cosmetology.
Fig. 1 is a spectrogram of a red light LED light source in the prior art, as shown in fig. 1, the spectrogram of the red light LED light source in the prior art has a steep peak shape and an excessively narrow peak shape, and the red light power around the peak is rapidly reduced along with the wavelength change, so that when the spectrogram of the red light LED light source in the prior art is used for physical therapy, only red light in a narrow wave band around the peak can generate a physical therapy effect, the effective wave band of the physical therapy is excessively narrow, and the physical therapy effect of the red light cannot be further improved.
The LED chip in the LED light source device is mainly divided into a forward mounting mode and an inverted mounting mode. When the flip-chip type LED light source device is adopted, emitted light is emitted downwards firstly, then is emitted upwards after being reflected, and part of light can be lost, so that the light parameter efficiency of the LED light source device is not high, the brightness is low, and therefore the forward packaging of an LED chip is paid more and more attention.
However, in the normal packaging of the LED chip, the fluorescent powder is sprayed on the chip to form a fluorescent powder film layer on the chip, but the spraying process has high requirements on equipment and great difficulty in process operation.
Therefore, the LED chip is packaged in a normal mode, the equipment requirement can be reduced, the process difficulty can be controlled, and a red light source with a wide red light effective waveband can be formed.
Disclosure of Invention
The invention aims to: the method aims at the technical problems that in an LED light source with a chip normally installed in the prior art, the requirement on fluorescent powder layer preparation equipment is high, the process difficulty is high, the peak shape in a spectrogram of a red light source is steep and too narrow, the red light power before and after the peak is rapidly reduced along with the wavelength change, the effective band of physical therapy is too narrow, and the physical therapy effect is poor. A red light packaging structure, a red light LED light source and a method for packaging LEDs are provided. The utility model provides a just adorn the chip for just adorning the chip of form among the ruddiness packaging structure, light directly upwards launches, need not pass through the reflection, can increase LED light source light parameter efficiency and luminance, and the point is glued on this application and is formed at least two-layer phosphor layer just adorns LED chip surface, and this application is through the design on at least two-layer point phosphor layer, and the light that the luminescence unit that acquires sends the effective waveband broad of ruddiness that the luminescence unit produced, the luminous power of ruddiness waveband is greater than or equal to 80% of maximum luminous power, simultaneously, compares with other packaging technology, and this technology can reduce the equipment requirement when reaching corresponding technical requirement, reduces the technology degree of difficulty.
In order to achieve the purpose, the invention adopts the technical scheme that:
a red light packaging structure comprises at least one light-emitting unit, wherein the light-emitting unit comprises a front chip and at least two layers of fluorescent powder layers which are sequentially formed by dispensing from bottom to top on the front chip, the wavelength of a red light effective waveband generated by the light-emitting unit is 600-700 nm, and the optical power of the red light waveband is greater than or equal to 80% of the maximum optical power.
This application is just adorning the chip of chip for just adorning the form among the ruddiness packaging structure, and light directly upwards launches, need not pass through the reflection, can increase LED light source light parameter efficiency and luminance, and this application is just adorning LED chip surface point and is glued and form two-layer at least phosphor layer, and the research discovers that one deck point glues phosphor layer and is the ruddiness that can't launch the broad band, and this application is through the design of two-layer at least point gluey phosphor layer, the effective wave band broad of ruddiness that luminescence unit produced, the luminous power of ruddiness wave band is more than or equal to 80% of maximum luminous power, has very important meaning to effectively providing ruddiness physiotherapy effect, simultaneously, compares with other packaging technology, and this technology can reduce the equipment requirement when reaching corresponding technical requirement, reduces the technology degree of difficulty.
Furthermore, 2-3 layers of fluorescent powder layers are sequentially formed on the upright chip by dispensing from bottom to top. A large number of experimental researches find that one fluorescent powder layer cannot form red light with a wider waveband, the manufacturing cost is excessively increased when the number of the fluorescent powder layers exceeds three, and the error rate is high.
Further, the light-emitting wavelength of the front-mounted chip is 440nm to 475nm; the light-emitting unit comprises three fluorescent powder layers, namely a first fluorescent powder layer, a second fluorescent powder layer and a third fluorescent powder layer from bottom to top along the front chip;
the first fluorescent powder layer comprises fluorescent powder A, fluorescent powder B and fluorescent powder D1;
the second fluorescent powder layer comprises fluorescent powder C, fluorescent powder D2 and fluorescent powder E1;
the third fluorescent powder layer comprises fluorescent powder D3, fluorescent powder E2 and fluorescent powder F;
the light emitting wavelength of the fluorescent powder A is 600nm to 640nm;
the light-emitting wavelength of the fluorescent powder B is 650nm to 660nm;
the light-emitting wavelength of the fluorescent powder C is 670nm to 700nm;
the luminescent wavelengths of the fluorescent powder D1, the fluorescent powder D2 and the fluorescent powder D3 are 710nm to 730nm independently;
the emission wavelengths of the fluorescent powder E1, the fluorescent powder E2 and the fluorescent powder F are independently more than 730nm and less than or equal to 800nm.
Further, in the first phosphor layer, the mass ratio of the phosphor A, the phosphor B and the phosphor D1 is (5 to 25): (5 to 30): (8 to 45); and/or
In the second fluorescent powder layer, the mass ratio of the fluorescent powder C to the fluorescent powder D2 to the fluorescent powder E1 is (10 to 35): (10 to 35): (15 to 45); and/or
In the third fluorescent powder layer, the mass ratio of the fluorescent powder D3 to the fluorescent powder E2 to the fluorescent powder F is (13-35): (12 to 35): (18 to 50).
Preferably, in the first phosphor, the mass ratio of the phosphor A to the phosphor B to the phosphor D1 is (10 to 25): (15 to 30): (20 to 35); and/or
In the second fluorescent powder, the mass ratio of the fluorescent powder C to the fluorescent powder D2 to the fluorescent powder E1 is (20 to 35): (20 to 35): (20 to 40); and/or
In the third fluorescent powder, the mass ratio of the fluorescent powder D3 to the fluorescent powder E2 to the fluorescent powder F is (20 to 30): (20 to 35): (35 to 50).
The application provides the fluorescent ratio of the three fluorescent powder layers, and the mass ratio of the first fluorescent powder, the second fluorescent powder and the third fluorescent powder is controlled, so that the effective red light wave band generated by the light-emitting unit is wider, and the light power of the red light wave band is greater than or equal to 80% of the maximum light power.
Further, the light-emitting wavelength of the front-mounted chip is 440-475 nm, the light-emitting unit comprises two phosphor layers, and a fourth phosphor layer and a fifth phosphor layer are sequentially arranged along the front-mounted chip from bottom to top;
the fourth phosphor layer comprises phosphor G, phosphor H and phosphor I, the light emitting wavelength of the phosphor G is 488 nm-492 nm, the light emitting wavelength of the phosphor H is 533 nm-537 nm, and the light emitting wavelength of the phosphor I is 658 nm-662 nm;
the fifth phosphor layer comprises phosphor J, phosphor K and phosphor L, the light-emitting wavelength of the phosphor J is 718nm to 722nm, the light-emitting wavelength of the phosphor K is 738nm to 742nm, and the light-emitting wavelength of the phosphor L is 658nm to 662nm.
Further, in the fourth phosphor layer, the mass ratio of the phosphor G to the phosphor H to the phosphor I is 10 to 80; and/or in the fifth phosphor layer, the mass ratio of the phosphor J, the phosphor K and the phosphor L is 20-120. Preferably, in the fourth phosphor layer, the mass ratio of the phosphor G to the phosphor H to the phosphor I is 10 to 70; and/or in the fifth phosphor layer, the mass ratio of the phosphor J, the phosphor K and the phosphor L is 30-120.
Furthermore, the thickness of each layer of fluorescent powder layer is less than or equal to 0.25mm. Researches find that the fluorescent powder layer is too thick, and the red light spectrum with a wider waveband is not easy to obtain. Preferably, the thickness of each phosphor layer is 0.1mm to 0.25mm. More preferably, the thickness of each phosphor layer is 0.15mm to 0.25mm.
Further, each layer of phosphor layer comprises phosphor and glue.
Furthermore, the total mass of the fluorescent powder in each layer of fluorescent powder layer accounts for 50-80%.
Further, when more than two light-emitting units are included, the difference of the peak wavelengths of at least two upright chips is more than 5 nm.
Furthermore, the peak wavelengths of all the upright chips are different, and the peak wavelength interval between any two upright chips is more than 5 nm.
Another object of the present invention is to provide the above red LED light source including the above red light package structure.
A red light LED light source comprises at least one red light packaging structure and an electric connector electrically connected with the red light packaging structure.
The invention discloses a red light LED light source which comprises at least one red light packaging structure and an electric connecting piece electrically connected with the red light packaging structure. The generated red light has wider effective wave band, and the light power of the red light wave band is more than or equal to 80 percent of the maximum light power, thereby having very important significance for effectively providing red light physiotherapy effect.
The invention further aims to provide a packaging method of the red LED light source.
A packaging method of a red LED light source is characterized by comprising the following steps:
and 3, sequentially dispensing on the surface of the normally installed chip from bottom to top to form at least two layers of fluorescent powder layers.
The invention discloses a packaging method of a red light source, which comprises the following steps: step 1, fixing the normally installed chips in all red light packaging structures on a support; step 2, electrically connecting the upright chips and the bracket by using an electric connecting piece; and 3, sequentially dispensing on the surface of the upright chip from bottom to top to form at least two fluorescent powder layers. The packaging method is simple to operate and convenient to control.
Further, still include on the support, the outside circumference installation of blue light chip sets up the box dam.
Further, when the two adjacent fluorescent powder layers are subjected to dispensing, a drying and curing process is carried out at intervals.
Explanation of technical terms:
spectral power:
the spectrum emitted by a light source is often not a single wavelength, but consists of a mixture of many different wavelengths of radiation. The spectral radiation of the light source in wavelength order and the intensity distribution of the individual wavelengths is referred to as the spectral power distribution of the light source.
The parameters for characterizing the magnitude of the spectral power are divided into absolute spectral power and relative spectral power. And then the absolute spectral power distribution curve: refers to a curve made of absolute values of the energy of various wavelengths of the spectral radiation;
relative spectral power distribution curve: the spectral power distribution curve is a spectral power distribution curve that compares energies of various wavelengths of a light source radiation spectrum with each other, and changes radiation power only within a predetermined range after normalization processing. The relative spectral power with the maximum radiation power is 1, and the relative spectral power of other wavelengths is less than 1.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. this application is just adorning the chip for just adorning the chip of form among the ruddiness packaging structure, and light directly upwards launches, need not pass through the reflection, can increase LED light source light parameter efficiency and luminance, and this application is just adorning LED chip surface point and is glued and form two-layer at least phosphor powder layer, and the research finds that one deck point glues the phosphor powder layer and is the ruddiness that can't launch the broad wave band, and this application is through the design of two-layer at least point gluey phosphor powder layer, the effective wave band broad of ruddiness that luminescence unit produced, the wavelength is 600nm ~700nm, and the luminous power of ruddiness wave band is greater than or equal to 80% of maximum luminous power. The method has very important significance for effectively providing red light physiotherapy effect, and simultaneously, compared with other packaging processes, the process can reduce equipment requirements and process difficulty while meeting corresponding technical requirements.
2. The invention discloses a red light LED light source which comprises at least one red light packaging structure and an electric connecting piece electrically connected with the red light packaging structure. The generated red light has wider effective wave band, and the light power of the red light wave band is more than or equal to 80 percent of the maximum light power, thereby having very important significance for effectively providing red light physiotherapy effect.
3. The invention discloses a packaging method of a red light LED light source, which comprises the following steps: step 1, fixing the normally installed chips in all red light packaging structures on a support; step 2, electrically connecting the upright chips and the bracket by using an electric connecting piece; and 3, sequentially dispensing on the surface of the normally installed chip from bottom to top to form at least two layers of fluorescent powder layers. The packaging method is simple to operate and convenient to control.
Drawings
FIG. 1 is a prior art red LED light source spectrum;
fig. 2 is a schematic top view of a group of red light package structures according to embodiment 11.
Fig. 3 is a schematic sectional structure view of fig. 2.
Fig. 4 is a schematic top view of the red light package structures of embodiment 12.
FIG. 5 is a spectrum diagram of a set of red light package structures according to example 21.
FIG. 6 is a spectrum diagram of a set of red package structures of EXAMPLE 22.
Fig. 7 is a schematic top view illustrating a group of red light packages according to embodiment 23.
Fig. 8 is a schematic cross-sectional structure of fig. 7.
FIG. 9 is a spectrum of a red light package of example 23.
FIG. 10 is a spectrum of example 24 red light package structures.
Fig. 11 is a spectrum diagram of the formation of the red light package structure in example 1.
Icon: 1-a scaffold; 11-a groove; 2-assembling the chip; 21-gold wire; 3-a box dam; 4-a first phosphor layer; 5-a second phosphor layer; 6-a third phosphor layer; 7-a fourth phosphor layer; 8-fifth phosphor layer.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
In the following embodiments, it is understood that the light emitting wavelength of the phosphor refers to a wavelength corresponding to a peak of a main peak of a spectrum generated by photon excitation of the phosphor.
In the following examples, the phosphors involved may include nitride, Y 3 AL 12 : c and fluoride. The fluorescent powder can be directly purchased or prepared according to the wavelength value.
Example 1
The red light package structure provided in embodiment 1 includes a light emitting unit, which may be one or more light emitting units, where the light emitting unit includes a front-mounted chip 2 and two phosphor layers formed by dispensing sequentially from bottom to top on the front-mounted chip 2, and an effective red light waveband generated by the light emitting unit is wider and optical power of the red light waveband is greater than or equal to 80% of the maximum optical power.
Specifically, as shown in fig. 2 and 3, an embodiment 11 group provides a red light packaging structure, including a support 1, a groove 11 is provided in the middle of the support 1, an inner wall of the groove is inclined toward the middle, a light emitting unit is provided in the groove 11, the front chip 2 is provided at the bottom of the groove 11, and a gold wire 21 is connected between the front chip 2 and the bottom surface of the groove 11; and sequentially dispensing along the front chip 2 from bottom to top to form a fourth fluorescent powder layer 7 and a fifth fluorescent powder layer 8, wherein the total mass ratio of the fluorescent powder in each fluorescent powder layer is 65%, and the thickness of each fluorescent powder layer is 0.25mm.
Specifically, as shown in fig. 4, an embodiment 12 provides a red light packaging structure, which includes a support 1, a groove 11 is formed in the middle of the support 1, an inner wall of the groove inclines toward the middle, three light emitting units are arranged in the groove 11, and a dam 3 is arranged between the three light emitting units; the three light-emitting units have the same structure, and are sequentially dispensed along the front-mounted chip 2 from bottom to top to form a fourth fluorescent powder layer 7 and a fifth fluorescent powder layer 8, the total mass ratio of the fluorescent powder in each fluorescent powder layer is 50%, and the thickness of each fluorescent powder layer is 0.2mm.
Specifically, the light-emitting wavelength of the front-mounted chip is 440-475 nm, the light-emitting unit comprises two phosphor layers, and a fourth phosphor layer and a fifth phosphor layer are sequentially arranged along the front-mounted chip from bottom to top;
the fourth phosphor layer comprises phosphor G, phosphor H and phosphor I, the light emitting wavelength of the phosphor G is 488 nm-492 nm, the light emitting wavelength of the phosphor H is 533 nm-537 nm, and the light emitting wavelength of the phosphor I is 658 nm-662 nm;
the fifth phosphor layer comprises phosphor J, phosphor K and phosphor L, the light-emitting wavelength of the phosphor J is 718nm to 722nm, the light-emitting wavelength of the phosphor K is 738nm to 742nm, and the light-emitting wavelength of the phosphor L is 658nm to 662nm.
Specifically, in the fourth phosphor layer, the mass ratio of the phosphor G to the phosphor H to the phosphor I is 10 to 80; in the fifth phosphor layer, the mass ratio of the phosphor J, the phosphor K, and the phosphor L is 20 to 120. The resulting spectrum is shown in FIG. 11.
Example 2
The red light package structure provided in embodiment 2 includes a light emitting unit, which may be one or more light emitting units, where the light emitting unit includes a front-mounted chip 2 and three phosphor layers formed by sequentially dispensing on the front-mounted chip 2 from bottom to top, and an effective red light waveband generated by the light emitting unit is wider and optical power of the red light waveband is greater than or equal to 80% of the maximum optical power.
Specifically, the light-emitting wavelength of the front-mounted chip is 440nm to 475nm; the light-emitting unit comprises three phosphor layers, namely a first phosphor layer, a second phosphor layer and a third phosphor layer from bottom to top along the front chip;
the first fluorescent powder layer comprises fluorescent powder A, fluorescent powder B and fluorescent powder D1;
the second fluorescent powder layer comprises fluorescent powder C, fluorescent powder D2 and fluorescent powder E1;
the third fluorescent powder layer comprises fluorescent powder D3, fluorescent powder E2 and fluorescent powder F;
the luminescent wavelength of the fluorescent powder A is 600nm to 640nm;
the luminous wavelength of the fluorescent powder B is 650nm to 660nm;
the light-emitting wavelength of the fluorescent powder C is 670nm to 700nm;
the luminescent wavelengths of the fluorescent powder D1, the fluorescent powder D2 and the fluorescent powder D3 are 710nm to 730nm independently;
the light-emitting wavelengths of the fluorescent powder E1, the fluorescent powder E2 and the fluorescent powder F are independently more than 730nm and less than or equal to 800nm.
Specifically, in example 21 group to example 24, the first phosphor includes phosphor a, phosphor B, and phosphor D1. (Ca, sr) AlSiN with luminescent wavelength of 630nm of phosphor A 3 (Ca, sr) AlSiN with luminescent wavelength of 660nm of phosphor B 3 (Ca, sr) AlSiN with 720nm light-emitting wavelength of the fluorescent powder D1 3 。
The second phosphor includes phosphor C, phosphor D2, and phosphor E1. Emission wavelength of phosphor C679nm of (Ca, sr) AlSiN 3 (Ca, sr) AlSiN with luminous wavelength of 720nm of fluorescent powder D2 3 (Ca, sr) AlSiN with the luminescence wavelength of 740nm of the fluorescent powder E1 3 。
The third phosphor includes phosphor D3, phosphor E2, and phosphor F. (Ca, sr) AlSiN with luminous wavelength of 720nm of fluorescent powder D3 3 (Ca, sr) AlSiN with 740nm of luminous wavelength of fluorescent powder E2 3 (Ca, sr) AlSiN with light-emitting wavelength of 795nm of fluorescent powder F 3 。
The red phosphor compositions of examples 21 to 29 contain the mass ratio of the phosphor a, the phosphor B and the phosphor D1 in the first phosphor, the mass ratio of the phosphor C, the phosphor D2 and the phosphor E1 in the second phosphor, and the mass ratio of the phosphor D3, the phosphor E2 and the phosphor F in the third phosphor in table 1 below.
Specifically, an embodiment 21 provides a red light package structure, including a light emitting unit, which is sequentially dispensed from bottom to top along the front chip 2 to form a first phosphor layer 4, a second phosphor layer 5, and a third phosphor layer 6; the total mass of the fluorescent powder in each fluorescent powder layer accounts for 60%, and the thickness of each fluorescent powder layer is 0.15 nm. The resulting spectrum is shown in FIG. 5.
Specifically, embodiment 22 provides a red light package structure, including a light emitting unit, which is sequentially dispensed from bottom to top along the front chip 2 to form a first phosphor layer 4, a second phosphor layer 5, and a third phosphor layer 6; the total mass of the fluorescent powder in each fluorescent powder layer accounts for 70%, and the thickness of each fluorescent powder layer is 0.15 nm. The resulting spectrum is shown in FIG. 6.
Specifically, as shown in fig. 7 and 8, an embodiment 23 provides a red light packaging structure, which includes a support 1, a groove 11 is formed in the middle of the support 1, an inner wall of the groove inclines toward the middle, and four light emitting units are arranged in the groove 11. A dam 3 is arranged among the four light-emitting units; the structure of each light-emitting unit is the same, the upper row of two light-emitting units are arranged at intervals, the lower row of two light-emitting units are arranged at intervals, the upright chip 2 is arranged at the bottom of the groove 11, and a gold wire 21 is connected between the upright chip 2 and the bottom surface of the groove 11; the four light-emitting units are sequentially glued along the front chip 2 from bottom to top to form a first fluorescent powder layer 4, a second fluorescent powder layer 5 and a third fluorescent powder layer 6; the total mass of the fluorescent powder in each fluorescent powder layer is 55%, and the thickness of each fluorescent powder layer is 0.1 nm. The resulting spectrum is shown in FIG. 9.
Specifically, embodiment 24 provides a red light package structure, which includes a light emitting unit, and a first phosphor layer 4, a second phosphor layer 5, and a third phosphor layer 6 are sequentially formed by dispensing along the front chip 2 from bottom to top; the total mass of the fluorescent powder in each fluorescent powder layer is 70%, and the thickness of each fluorescent powder layer is 0.15 nm. The resulting spectrum is shown in FIG. 10.
TABLE 1
In embodiment 2, the spectrum emitted by the red light packaging structure has a flat peak shape in a wider waveband around the peak, the absolute spectrum of the red light in the waveband is close to the maximum absolute spectrum value of the red light (if the optical power or the absolute relative spectrum value of the waveband is greater than or equal to 80% of the maximum optical power or the maximum absolute relative spectrum value), and during physiotherapy, the red light in the waveband can generate physiotherapy effect, the waveband is an effective waveband, and the red light generated by the red light LED light source has a wide effective waveband and good physiotherapy effect.
Example 3
The support 1 may be a hard substrate such as a printed circuit board, an aluminum substrate, or a flexible substrate, and may be flexibly selected according to the use requirement. The electrical connection members may be circuits formed on the surface of the holder 1, or may be electrodes mounted on the surface of the holder 1. The connection mode of the electrical connector and the bracket 1 can be determined according to the material of the electrical connector and the bracket and the installation mode of the light emitting component, which are the prior art and are not described herein again. And each light-emitting component is electrically connected with an external power supply through the electric connecting piece. The number of the light emitting components is one group, two groups or more, and the structures and functions of the light emitting components are consistent.
Example 4
and 3, sequentially dispensing on the surface of the upright chip 2 from bottom to top to form at least two fluorescent powder layers.
In some embodiments, the method further comprises the step of installing and arranging a dam 3 on the support 1 at the outer periphery of the front chip 2. The box dam 3 may be installed in advance when the bracket 1 is prepared, or may be installed after the normal chip 2 is installed.
Further, when the two adjacent fluorescent powder layers are subjected to dispensing, a drying and curing process is performed at intervals.
Just adorning chip 2 among this application ruddiness packaging structure and being just adorning the chip of form, light directly upwards launches, need not pass through the reflection, can increase LED light source light parameter efficiency and luminance, and this application is just adorning LED chip surface point and is glued and form two-layer at least phosphor layer, can reduce the equipment requirement, reduces the technology degree of difficulty. Research finds that one layer of dispensing fluorescent powder layer cannot emit red light with a wider waveband, the application has the advantages that through the design of at least two layers of dispensing fluorescent powder layers, the effective waveband of the red light generated by the light-emitting unit is wider, the luminous power of the red light waveband is greater than or equal to 80% of the maximum luminous power, the application has very important significance for effectively providing the red light physiotherapy effect, and meanwhile, compared with other packaging processes, the process can reduce equipment requirements and process difficulty while meeting corresponding technical requirements.
The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the invention, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (13)
1. A red light packaging structure is characterized by comprising at least one light-emitting unit, wherein the light-emitting unit comprises a front chip and at least two layers of fluorescent powder layers sequentially formed on the front chip by dispensing from bottom to top, the wavelength of a red light effective waveband generated by the light-emitting unit is 600-700 nm, and the optical power of the red light waveband is greater than or equal to 80% of the maximum optical power.
2. The red light package structure of claim 1, wherein 2 to 3 phosphor layers are sequentially dispensed on the front-mounted chip from bottom to top.
3. The red light package structure of claim 1, wherein the light emitting wavelength of the front chip is 440nm to 475nm; the light-emitting unit comprises three phosphor layers, namely a first phosphor layer, a second phosphor layer and a third phosphor layer from bottom to top along the front chip;
the first fluorescent powder layer comprises fluorescent powder A, fluorescent powder B and fluorescent powder D1;
the second fluorescent powder layer comprises fluorescent powder C, fluorescent powder D2 and fluorescent powder E1;
the third fluorescent powder layer comprises fluorescent powder D3, fluorescent powder E2 and fluorescent powder F;
the luminescent wavelength of the fluorescent powder A is 600nm to 640nm;
the light-emitting wavelength of the fluorescent powder B is 650nm to 660nm;
the light-emitting wavelength of the fluorescent powder C is 670nm to 700nm;
the luminescent wavelengths of the fluorescent powder D1, the fluorescent powder D2 and the fluorescent powder D3 are 710nm to 730nm independently;
the emission wavelengths of the fluorescent powder E1, the fluorescent powder E2 and the fluorescent powder F are independently more than 730nm and less than or equal to 800nm.
4. The red light package structure of claim 3,
in the first fluorescent powder layer, the mass ratio of the fluorescent powder A to the fluorescent powder B to the fluorescent powder D1 is (5-25): (5 to 30): (8 to 45); and/or
In the second fluorescent powder layer, the mass ratio of the fluorescent powder C to the fluorescent powder D2 to the fluorescent powder E1 is (10 to 35): (10 to 35): (15 to 45); and/or
In the third phosphor layer, the mass ratio of the phosphor D3 to the phosphor E2 to the phosphor F is (13 to 35): (12 to 35): (18 to 50).
5. The red light package structure of claim 4,
in the first fluorescent powder, the mass ratio of the fluorescent powder A to the fluorescent powder B to the fluorescent powder D1 is (10 to 25): (15 to 30): (20 to 35); and/or
In the second fluorescent powder, the mass ratio of the fluorescent powder C to the fluorescent powder D2 to the fluorescent powder E1 is (20 to 35): (20 to 35): (20 to 40); and/or
In the third fluorescent powder, the mass ratio of the fluorescent powder D3, the fluorescent powder E2 and the fluorescent powder F is (20 to 30): (20 to 35): (35 to 50).
6. The red light package structure of claim 1, wherein the emission wavelength of the front-mounted chip is 440nm to 475nm, the light-emitting unit includes two phosphor layers, and a fourth phosphor layer and a fifth phosphor layer are sequentially disposed along the front-mounted chip from bottom to top;
the fourth fluorescent powder layer comprises fluorescent powder G, fluorescent powder H and fluorescent powder I, the light-emitting wavelength of the fluorescent powder G is 488 nm-492 nm, the light-emitting wavelength of the fluorescent powder H is 533 nm-537 nm, and the light-emitting wavelength of the fluorescent powder I is 658 nm-662 nm;
the fifth fluorescent powder layer comprises fluorescent powder J, fluorescent powder K and fluorescent powder L, the light-emitting wavelength of the fluorescent powder J is 718 nm-722 nm, the light-emitting wavelength of the fluorescent powder K is 738 nm-742 nm, and the light-emitting wavelength of the fluorescent powder L is 658 nm-662 nm.
7. The red light package structure of claim 6, wherein in the fourth phosphor layer, the mass ratio of the phosphor G to the phosphor H to the phosphor I is 10 to 80; and/or in the fifth phosphor layer, the mass ratio of the phosphor J, the phosphor K and the phosphor L is 20-120.
8. The red light package structure of claim 1, wherein the thickness of each phosphor layer is less than or equal to 0.25mm.
9. The red light package structure of claim 1, wherein when more than two light emitting units are included, the peak wavelengths of at least two of the front-mounted chips differ by more than 5 nm.
10. The red light package structure of claim 9, wherein the peak wavelengths of all the front-mounted chips are different, and the peak wavelength interval between any two front-mounted chips is greater than or equal to 5 nm.
11. A red LED light source comprising at least one red LED package structure according to any of claims 1-10 and an electrical connector electrically connected to the red LED package structure.
12. The method of packaging a red LED light source of claim 11, comprising the steps of:
step 1, fixing the normally-installed chips in all red light packaging structures on a support;
step 2, electrically connecting the upright chips and the bracket by using an electric connecting piece;
and 3, sequentially dispensing on the surface of the upright chip from bottom to top to form at least two fluorescent powder layers.
13. The method of claim 12, further comprising circumferentially mounting a dam on the outer side of the front mounted chip on the support.
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