CN111968966A - Packaging structure of LED light source and manufacturing method thereof - Google Patents
Packaging structure of LED light source and manufacturing method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The invention discloses a packaging structure of an LED light source and a manufacturing method thereof, the packaging structure of the LED light source comprises a substrate, a first blue light chip, a second blue light chip and a fluorescent glue layer, the first blue light chip and the second blue light chip are both arranged on the substrate, the peak wavelength range of the first blue light chip is 440nm-465nm, the peak wavelength range of the second blue light chip is 465nm-495nm, and the fluorescent glue layer covers the first blue light chip and the second blue light chip, wherein after the fluorescent powder in the fluorescent glue layer is jointly excited by the first blue light chip and the second blue light chip, the generated light is mixed with the light emitted by the first blue light chip and the second blue light chip to form a healthy illumination spectrum beneficial to a human body, the spectrum weakens the harmful intensity of the blue light near 450nm and enhances the beneficial intensity of the blue light near 485nm-495 nm. Therefore, the harm effect of blue light on human eyes is reduced, the secretion of melatonin is effectively inhibited, people keep full of energy during learning or working, the efficiency is improved, and the human body is promoted to form a normal biological rhythm.
Description
Technical Field
The invention relates to the technical field of LED lighting, in particular to a packaging structure of an LED light source and a manufacturing method thereof.
Background
Compared with the prior generation of lighting products, the LED light source has the remarkable advantages of high luminous efficiency, high response speed, long service life, no toxic gas, no radiation, impact resistance, easy control and the like, and the application range and the market share of the LED light source are increasingly improved.
The existing conventional white light LED packaging system generally adopts a blue light chip with the wavelength range of 440nm-460nm to excite fluorescent powder with different wavelengths, thereby obtaining white light. By improving the wavelength of the used fluorescent powder, white light LED products with different color rendering indexes can be obtained.
The existing white light LED products generally pay attention to the improvement of color rendering index, and the negative effect of the blue light chip with the used wavelength range of 440nm-460nm on human health is ignored. Taking the spectrum of a conventional 4000K white LED as an example, as shown in fig. 4, the color rendering index Ra80 of the conventional 4000K white LED is poor in spectrum continuity compared with that of a 4000K standard light source, the relative intensity of the spectrum around the wavelength of 440nm to 460nm is very strong, and the relative intensity of the spectrum around the wavelength of 480nm to 490nm has a very significant decrease, so that the intensity of blue light around the wavelength of 480nm to 490nm is significantly insufficient. The ratio of the maximum at a spectral wavelength of 450nm to the minimum at a wavelength of 480nm exceeds 3.
The retina contains cone cells (cons) which can sense the light of three colors of red, green and blue, the ratio of the three cells is about 40:20:1 (red: green: blue), and the number of the photoreceptor cells of the blue light is the least. Generally, after receiving photons, the photoreceptor cells sensing red and green light will bleach themselves and no longer receive photons until they can resume their work after a series of metabolic processes. The photoreceptor cells sensing the blue light can absorb the photons again after receiving the photons, so that free radicals with certain oxidability released by the reaction of the photoreceptor cells sensing the blue light after absorbing the blue light are gradually accumulated, and the cells are easy to damage. Studies have shown that the peak of the blue light hazard weighting function curve is around the wavelength 440nm, i.e. the higher the intensity of blue light around the wavelength 440nm, the greater the hazard to the human eye. And the intensity of a blue light peak near the wavelength of 440nm-460nm in the spectrum of the conventional 4000K white light LED is higher, so that the harm degree to human eyes is higher.
The retina contains another type of photoreceptor cells called retina-specific photosensitive ganglion cells (ipRGCs) which contain Melanopsin (Melanopsin) which inhibits the secretion of melatonin upon absorption of light. Melatonin, also known as sleep hormones, can promote the formation of normal biological rhythms in the human body. When melatonin is less secreted, the human body can keep clear; when melatonin is secreted more, the human body will feel tired and sleepy. Studies have shown that the peak of the melanopsin sensitivity curve is around 490nm, i.e. the smaller the intensity of blue light around 490nm, the less melanopsin inhibits melatonin secretion. While the low-intensity blue light with the wavelength of 480nm-490nm in the conventional 4000K white light LED spectrum has great influence on the secretion activity of the melanopsin, and the low-intensity blue light with the wavelength of 490nm can cause the degree of the melanopsin inhibiting the secretion of the melatonin to be reduced, so that the human body feels tired and sleepy in the daytime, which is not beneficial to normal work or study of people in the daytime.
In addition, to quantify the effect of light on melatonin secretion, scientists have defined a new concept of illumination, the blackout photopic Lux (EML). The melanopsin illumination value is a measure of the sensitivity of retinal specialized photosensitive ganglion cells (ipRGCs) by weighting the overall spectral radiance according to the melanopsin sensitivity curve, thereby quantitatively describing the biological effect of light on humans. The Photopic illumination value (Photopic illumination) is obtained by weighting the overall radiation distribution of the spectrum according to the Photopic sensitivity curve of human eyes to measure the photosensitivity of the cone cells and quantitatively describe the light which can make human eyes see objects. To represent the relationship between blackout luminance and photopic luminance values, scientists have defined a blackout luminance Ratio (MP value), which reflects the Ratio of blackout luminance values to photopic luminance values. When the value of the blackout luminance ratio is higher, the degree of the light intensity suppressing the melanopsin is stronger, the melatonin secretion is less, and the person is more conscious.
Therefore, the present invention is directed to a package structure of an LED light source and a method for manufacturing the same to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a packaging structure of an LED light source and a manufacturing method thereof, which can reduce the harm of blue light to human eyes, effectively inhibit the secretion of melatonin, keep people energetic during learning or working, improve the efficiency and promote the human body to form a normal biological rhythm.
In order to achieve at least one of the advantages or other advantages, an embodiment of the invention provides a package structure of an LED light source, including a substrate, a first blue chip, a second blue chip, and a fluorescent glue layer, where the first blue chip and the second blue chip are both disposed on the substrate, a peak wavelength range of the first blue chip is 440nm to 465nm, a peak wavelength range of the second blue chip is 465nm to 495nm, and the fluorescent glue layer covers the first blue chip and the second blue chip, where when the fluorescent glue layer is excited by the first blue chip and the second blue chip to emit light, the fluorescent glue layer mixes with light generated by the first blue chip and the second blue chip to form an illumination spectrum, and the spectrum attenuates a blue light intensity near a wavelength of 450nm and enhances a blue light intensity near a wavelength of 485nm to 495 nm.
In some embodiments, the number ratio of the first blue light chips to the second blue light chips is 1:1, 1:2, 1:3, 2:1, or 3: 1.
In some embodiments, the half-wave widths of the first blue light chip and the second blue light chip are both 10nm-40nm, and the host material is gallium nitride.
In some embodiments, the color temperature range of the packaging structure of the LED light source is 1600K-10000K, the color rendering index Ra is 60-99, and the color rendering indexes R1-R15 can be all more than 90.
In some embodiments, the phosphor layer includes a first phosphor and glue, the first phosphor is green phosphor, yellow phosphor or red phosphor, wherein the first phosphor is mixed with the glue to form the phosphor layer, the weight percentage of the first phosphor in the phosphor layer is 10% to 80%, and the weight percentage of the glue in the phosphor layer is 20% to 90%.
In some embodiments, the phosphor layer includes a first phosphor, a second phosphor and glue, the first phosphor is a green phosphor, a yellow phosphor or a red phosphor, the second phosphor is a green phosphor, a yellow phosphor or a red phosphor, wherein a wavelength of the first phosphor is smaller than a wavelength of the second phosphor, the first phosphor and the second phosphor are mixed with the glue to form the phosphor layer, a weight percentage of the first phosphor in the phosphor layer is 5% to 50%, a weight percentage of the second phosphor in the phosphor layer is 1% to 30%, and a weight percentage of the glue in the phosphor layer is 20% to 94%.
In some embodiments, the phosphor layer is formed by mixing green phosphor, yellow phosphor, red phosphor and glue, wherein the green phosphor is 5-40% by weight of the phosphor layer, the yellow phosphor is 5-30% by weight of the phosphor layer, the red phosphor is 0.5-15% by weight of the phosphor layer, and the glue is 15-89.5% by weight of the phosphor layer.
In some embodiments, the green phosphor is aluminate, silicate or nitride, the yellow phosphor is aluminate, silicate or nitride, and the red phosphor is nitride or fluoride.
In some embodiments, the green phosphor has a wavelength in the range of 490nm to 545nm, the yellow phosphor has a wavelength in the range of 545nm to 580nm, and the red phosphor has a wavelength in the range of 580nm to 670 nm.
To achieve at least one of the above advantages or other advantages, another embodiment of the present invention further provides a method for manufacturing a package structure of an LED light source, including the following steps: fixing a first blue light chip with the peak wavelength range of 440nm-465nm and a second blue light chip with the peak wavelength range of 465nm-495nm on a substrate; and the fluorescent glue layer covers the first blue light chip and the second blue light chip, wherein when the fluorescent glue layer is excited by the first blue light chip and the second blue light chip to emit light, the fluorescent glue layer and the light generated by the first blue light chip and the second blue light chip are mixed to form an illumination spectrum, the spectrum weakens the blue light intensity near the wavelength of 450nm, and enhances the blue light intensity near the wavelength of 485nm-495 nm.
Therefore, by utilizing the packaging structure of the LED light source and the manufacturing method thereof provided by the invention, the peak intensity of the blue light chip with the wavelength of about 450nm in the spectrum of the conventional white light LED is reduced by the arrangement that the blue light chips with different peak wavelengths are matched with the specific fluorescent glue layer, and the damage effect of the blue light to human eyes is reduced; meanwhile, the intensity of blue light with a wavelength of 490nm which has important influence on melatonin secretion is enhanced, the black illumination ratio MP value is improved, the melatonin secretion is inhibited, people keep full of energy during learning or working, the efficiency is improved, and the normal biological rhythm of the human body is promoted.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described below in detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It should be apparent that the drawings in the following description are only examples of the present application and are not intended to limit the embodiments of the present invention, and that other drawings may be derived from the drawings by those skilled in the art without inventive faculty. The drawings comprise:
FIG. 1 is a schematic cross-sectional view of an LED light source package structure according to the present invention;
FIG. 2 is a schematic diagram of the spectrum of a 4000K full spectrum light of the present invention and a 4000K standard light source;
FIG. 3 is a schematic flow chart of a method for manufacturing a package structure of an LED light source according to the present invention; and
FIG. 4 is a spectrum diagram of a conventional 4000K white LED and a 4000K standard light source.
The attached drawings are marked as follows: 10-a package structure of the LED light source; 12-a substrate; 14-a first blue chip; 16-a second blue chip; 18-fluorescent glue layer.
Detailed Description
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present invention. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on those shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or component in question must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, the term "comprises" and any variations thereof mean "including at least".
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integrally formed connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a package structure 10 of an LED light source according to the present invention. To achieve at least one of the advantages or other advantages, an embodiment of the invention provides a package structure 10 for an LED light source. As shown in fig. 1, the package structure 10 of the LED light source includes a substrate 12, a first blue chip 14, a second blue chip 16, and a phosphor layer 18.
The first blue light chip 14 is disposed on the substrate 12, and a peak wavelength range of the first blue light chip 14 is 440nm to 465 nm. The second blue light chip 16 is disposed on the substrate 12, and a peak wavelength range of the second blue light chip 16 is 465nm to 495 nm. The fluorescent adhesive layer 18 covers the first blue light chip 14, the second blue light chip 16 and the substrate 12, after the power is on, the fluorescent adhesive layer 18 is excited by the first blue light chip 14 and the second blue light chip 16 to emit light, and the light generated by the first blue light chip 14 and the light generated by the second blue light chip 16 are mixed to form a healthy illumination spectrum beneficial to a human body, the spectrum can be understood that the light generated by the first blue light chip 14 and the light generated by the second blue light chip 16 penetrate through the fluorescent adhesive layer 18 to form a mixed light spectrum, the spectrum weakens the harmful blue light intensity near the wavelength of 450nm, and enhances the beneficial blue light intensity near the wavelength of 485nm-495 nm. This is explained in more detail in the paragraph corresponding to fig. 2.
In the present embodiment, the half-wave widths of the first blue light chip 14 and the second blue light chip 16 are both 10nm to 40nm, and the host material is gan. The number ratio of the first blue light chips 14 to the second blue light chips 16 is 1: 1. However, the present disclosure is not limited thereto, and the number ratio of the first blue-light dies 14 to the second blue-light dies 16 can be adjusted according to actual requirements, for example, the number ratio of the first blue-light dies 14 to the second blue-light dies 16 can also be 1:2, 1:3, 2:1, or 3:1, etc., so as to satisfy different illumination requirements.
Referring to fig. 2 in conjunction with fig. 1, fig. 2 is a schematic diagram of a spectrum of a 4000K full spectrum light and a 4000K standard light source according to the present invention. The specific parameters for realizing the 4000K full spectrum light are as follows: the peak wavelength of the first blue light chip 14 is 450nm, the peak wavelength of the second blue light chip 16 is 483nm, the phosphor layer 18 is formed by glue mixing green phosphor with a wavelength of 540nm, yellow phosphor with a wavelength of 560nm and red phosphor with a wavelength of 625nm, the weight ratio of the green phosphor in the phosphor layer 18 is 13.33%, the weight ratio of the yellow phosphor in the phosphor layer 18 is 9.71%, the weight ratio of the red phosphor in the phosphor layer 18 is 2.58%, and the weight ratio of the glue in the phosphor layer 18 is 74.38%.
As shown in fig. 2, the peak of the 4000K full spectrum light at the harmful blue chip around 450nm wavelength is reduced to be substantially equal to the spectrum of the 4000K standard light source. Compared with a conventional 4000K white light LED, the 4000K full-spectrum light has the advantages that the wave crest of a beneficial blue light chip with the wavelength of 490nm is enhanced, and the black illumination ratio (MP) can reach about 0.9. And the MP value of the conventional 4000K white light LED on the market is only about 0.6-0.7. In other words, if the 4000K full-spectrum light formed by the package structure 10 of the LED light source is used for illumination under the same photopic illumination, the blackout illumination value is about 28% -50% higher than that of the conventional 4000K white LED, which is helpful for keeping the human body energetic in the daytime and promoting the human body to form a normal biological rhythm effect.
In addition, the 4000K full spectrum light not only increases the intensity of the beneficial blue light near 490nm, but also has high coincidence degree with the curve of the 4000K standard light source, and has good color rendering performance, and the color rendering index Ra and R1-R15 of the light can be adjusted according to actual needs, for example, the proportion of green phosphor, yellow phosphor, red phosphor and glue in the phosphor glue layer 18 can be adjusted according to actual needs, so as to obtain the packaging structure 10 of the LED light source with the color temperature range of 1600K-10000K and the color rendering index Ra range of 60-99, and the color rendering indexes R1-R15 of the light can all be more than 90.
The present invention will be further described by referring to the following examples of 3 LED light source packages 10 of the present invention having the same color temperature and the same color rendering index Ra and 3 comparative examples of the existing LED products, wherein the proportions of the phosphors and glues (silica gel is used in the following comparative examples and examples) and the calculated MP value are as shown in table 1 below:
TABLE 1
Comparing the comparative example with the same color temperature and the same color rendering index Ra and the black illumination ratio MP value of the embodiment, it can be seen that the black illumination ratio MP value is significantly improved by using the package structure 10 of the LED light source of the present application, and using the first blue light chip 14 and the second blue light chip 16 in combination with the light source formed by the corresponding fluorescent glue layer 18. If the packaging structure 10 of the LED light source is adopted for illumination during work or study, the secretion of melatonin can be better inhibited, people can keep full of energy during study or work, and the efficiency is improved.
Further, the phosphor layer 18 may be formed by mixing green phosphor (green), yellow phosphor (yellow), red phosphor (red) and glue, wherein the green phosphor is 5-40 wt% in the phosphor layer 18, the yellow phosphor is 5-30 wt% in the phosphor layer 18, the red phosphor is 0.5-15 wt% in the phosphor layer 18, and the glue is 15-89.5 wt% in the phosphor layer 18.
In addition, in an embodiment, the phosphor layer 18 may be formed by mixing a first phosphor and glue, the first phosphor is selected from one of green phosphor, yellow phosphor and red phosphor, the weight percentage of the first phosphor in the phosphor layer 18 is 10% to 80%, and the weight percentage of the glue in the phosphor layer 18 is 20% to 90%.
The present invention will be further described by referring to the following 10 examples of 3 LED light source packages of the present invention having the same color temperature and the same color rendering index Ra and 3 comparative examples of the existing LED products, wherein the proportions of the phosphors and glues (silica gel is used in the following comparative examples and examples) of various colors and the calculated MP value are shown in table 2 below:
TABLE 2
Comparing the comparative example with the same color temperature and the same color rendering index Ra and the black illumination ratio MP value of the embodiment, it can be seen that the black illumination ratio MP value of the light source formed by the package structure 10 of the LED light source of the present application, the first blue light chip 14 and the second blue light chip 16 in combination with the corresponding fluorescent glue layer 18 (formed by mixing the first fluorescent powder and the glue) is significantly improved. If the packaging structure 10 of the LED light source is adopted for illumination during work or study, the secretion of melatonin can be better inhibited, people can keep full of energy during study or work, and the efficiency is improved.
In another embodiment, the phosphor layer 18 may also be formed by mixing a first phosphor, a second phosphor and glue, where the first phosphor is one of green phosphor, yellow phosphor and red phosphor, and the second phosphor is one of green phosphor, yellow phosphor and red phosphor. The wavelength of the first fluorescent powder is less than that of the second fluorescent powder, the weight percentage of the first fluorescent powder in the fluorescent glue layer 18 is 5-50%, the weight percentage of the second fluorescent powder in the fluorescent glue layer 18 is 1-30%, and the weight percentage of the glue in the fluorescent glue layer 18 is 20-94%.
The present invention will be further described by referring to 2 embodiments of the package structure 10 of the LED light source of the present invention with the same color temperature and the same color rendering index Ra and 2 comparative examples of the existing LED products, wherein the proportions of the phosphor and the glue of each color (silica gel is used in the following comparative examples and embodiments) and the MP value obtained by calculation are shown in table 3 below:
TABLE 3
Comparing the comparative example with the same color temperature and the same color rendering index Ra and the blackout illumination ratio MP value of the embodiment, it can be seen that the blackout illumination ratio MP value of the light source formed by the package structure 10 of the LED light source of the present application, the first blue light chip 14 and the second blue light chip 16 in combination with the corresponding fluorescent glue layer 18 (formed by mixing the first fluorescent powder, the second fluorescent powder and the glue) is significantly improved. If the packaging structure 10 of the LED light source is adopted for illumination during work or study, the secretion of melatonin can be better inhibited, people can keep full of energy during study or work, and the efficiency is improved.
It should be noted that the aforementioned encapsulating glue is silicone rubber, and the common silicone is a two-liquid thermosetting silicone resin composed of an agent a and an agent B, and when in use, A, B glue is mixed according to a certain proportion, and is uniformly mixed with the phosphor powder, and then covers the first blue-light chip 14, the second blue-light chip 16 and the substrate 12. The mixing proportion of the glue A and the glue B can be adjusted according to actual needs.
In addition, the green phosphor may be made of aluminate, silicate or nitride, the yellow phosphor may be made of aluminate, silicate or nitride, and the red phosphor may be made of nitride or fluoride. The wavelength range of the green fluorescent powder is 490-545 nm, the wavelength range of the yellow fluorescent powder is 545nm-580nm, and the wavelength range of the red fluorescent powder is 580nm-670 nm. The phosphor layer 18 may be dispensed, coated, molded, sprayed or remote coated to cover the first blue chip 14, the second blue chip 16 and the substrate 12.
In one embodiment, as shown in FIG. 2, the spectrum has a lower intensity of blue light at wavelengths around 450nm than at wavelengths around 485nm to 495 nm.
Referring to fig. 3, fig. 3 is a schematic flow chart illustrating a manufacturing method of a package structure of an LED light source according to the present invention. To achieve at least one of the advantages or other advantages, another embodiment of the present invention further provides a method for manufacturing a package structure of an LED light source. As shown in fig. 3, the manufacturing method of the package structure of the LED light source includes the following steps:
s1: fixing a first blue light chip with the peak wavelength range of 440nm-465nm and a second blue light chip with the peak wavelength range of 465nm-495nm on a substrate;
s2: and covering the first blue light chip and the second blue light chip by using a fluorescent glue layer.
In step S1, the half-wave widths of the first blue light chip and the second blue light chip are both 10nm to 40nm, the main material is gallium nitride, the structure can be a front-mounted structure, a flip-chip structure or a vertical structure, the first blue light chip and the second blue light chip are alternately arranged on the substrate in sequence through a die attach process, and the die attached substrate is subjected to a wire bonding process as required.
When the package structure of the LED light source is powered on, the fluorescent adhesive layer in step S2 is excited by the first blue light chip and the second blue light chip to emit light, and the light is mixed with the light generated by the first blue light chip and the second blue light chip to form a healthy full spectrum beneficial to the human body, which reduces the intensity of harmful blue light near 450nm and increases the intensity of beneficial blue light near 485nm to 495 nm. The fluorescent glue layer is formed by mixing fluorescent powder and glue in proportion, then vacuum stirring defoaming is carried out, the fluorescent glue layer covers the first blue light chip and the second blue light chip through processes of dispensing, coating, casting, spraying or far away from coating and the like, and cutting and light splitting are carried out after the fluorescent glue layer is baked and cured, so that the packaging structure of the LED light source with the high black-vision illumination ratio MP value can be obtained. The dispensing process can be a conventional dispensing process or a fluorescent powder sedimentation process.
In summary, by using the LED light source package structure 10 and the manufacturing method thereof provided by the present invention, the blue light chips with different peak wavelengths are arranged with the fluorescent glue layer 18, so that the peak of the blue light chip with a wavelength near 450nm in the existing conventional white light LED spectrum is reduced, and the harm of the blue light to human eyes is reduced; meanwhile, blue light with the wavelength of 490nm, which has important influence on melatonin secretion, is supplemented, the black illumination ratio MP value is improved, the melatonin secretion is inhibited, people keep full of energy during learning or working, the efficiency is improved, and the normal biological rhythm of the human body is promoted.
In addition, the color rendering index Ra and the values R1-R15 of the packaging structure 10 of the LED light source can be mixed with fluorescent powder according to actual needs, and a high color rendering index full-spectrum product with Ra >98 and R1-R15>90 can be obtained at most.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An LED light source packaging structure, comprising:
a substrate;
the first blue light chip is arranged on the substrate, and the peak wavelength range of the first blue light chip is 440nm-465 nm;
the second blue light chip is arranged on the substrate, and the peak wavelength range of the second blue light chip is 465nm-495 nm; and
and the fluorescent glue layer covers the first blue light chip and the second blue light chip, when the fluorescent glue layer is excited by the first blue light chip and the second blue light chip to emit light, the fluorescent glue layer and the light generated by the first blue light chip and the second blue light chip are mixed to form an illumination spectrum, the spectrum weakens the intensity of the blue light with the wavelength of 450nm and strengthens the intensity of the blue light with the wavelength of 485nm-495 nm.
2. The package structure of the LED light source of claim 1, wherein the number ratio of the first blue light chip to the second blue light chip is 1:1, 1:2, 1:3, 2:1, or 3: 1.
3. The package structure of an LED light source according to claim 1, wherein the first blue chip and the second blue chip have a half-wave width of 10nm to 40nm, and the first blue chip and the second blue chip are made of gan.
4. The LED light source package structure of claim 1, wherein the LED light source package structure has a color temperature ranging from 1600K to 10000K, a color rendering index Ra ranging from 60 to 99, and color rendering indices R1 to R15 all > 90.
5. The LED light source package structure of claim 1, wherein the phosphor layer comprises a first phosphor and glue, the first phosphor is a green phosphor, a yellow phosphor or a red phosphor, wherein the first phosphor is mixed with the glue to form the phosphor layer, the weight percentage of the first phosphor in the phosphor layer is 10% -80%, and the weight percentage of the glue in the phosphor layer is 20% -90%.
6. The LED light source package structure of claim 1, wherein the phosphor layer comprises a first phosphor, a second phosphor and glue, the first phosphor is a green phosphor, a yellow phosphor or a red phosphor, the second phosphor is a green phosphor, a yellow phosphor or a red phosphor, a wavelength of the first phosphor is smaller than a wavelength of the second phosphor, the first phosphor and the second phosphor are mixed with the glue to form the phosphor layer, a weight percentage of the first phosphor in the phosphor layer is 5% to 50%, a weight percentage of the second phosphor in the phosphor layer is 1% to 30%, and a weight percentage of the glue in the phosphor layer is 20% to 94%.
7. The LED light source package structure of claim 1, wherein the phosphor layer is formed by mixing green phosphor, yellow phosphor, red phosphor and glue, wherein the green phosphor is 5-40 wt% in the phosphor layer, the yellow phosphor is 5-30 wt% in the phosphor layer, the red phosphor is 0.5-15 wt% in the phosphor layer, and the glue is 15-89.5 wt% in the phosphor layer.
8. The LED light source package structure of any one of claims 5 to 7, wherein the green phosphor is aluminate, silicate or nitride, the yellow phosphor is aluminate, silicate or nitride, and the red phosphor is nitride or fluoride.
9. The LED light source package structure of any one of claims 5 to 7, wherein the wavelength range of the green phosphor is 490nm to 545nm, the wavelength range of the yellow phosphor is 545nm to 580nm, and the wavelength range of the red phosphor is 580nm to 670 nm.
10. A manufacturing method of an LED light source packaging structure is characterized by comprising the following steps:
fixing a first blue light chip with the peak wavelength range of 440nm-465nm and a second blue light chip with the peak wavelength range of 465nm-495nm on a substrate; and
and covering the first blue light chip and the second blue light chip by using a fluorescent glue layer, wherein when the fluorescent glue layer is excited by the first blue light chip and the second blue light chip to emit light, the fluorescent glue layer is mixed with the light generated by the first blue light chip and the second blue light chip to form an illumination spectrum, and the spectrum weakens the intensity of the blue light with the wavelength of 450nm and strengthens the intensity of the blue light with the wavelength of 485nm-495 nm.
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