CN108899311A - A kind of LED light source manufacturing method - Google Patents
A kind of LED light source manufacturing method Download PDFInfo
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- CN108899311A CN108899311A CN201810680598.1A CN201810680598A CN108899311A CN 108899311 A CN108899311 A CN 108899311A CN 201810680598 A CN201810680598 A CN 201810680598A CN 108899311 A CN108899311 A CN 108899311A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The present invention relates to LED technology fields, a kind of LED light source manufacturing method is provided, including preparing fluorescent glue, red fluorescence powder, green emitting phosphor and yellow-green fluorescence powder are mixed with silica gel, the total weight of red fluorescence powder, green emitting phosphor and yellow-green fluorescence powder accounts for the 17%~43% of fluorescent glue total weight；Multiple blue-light LED chips are fixed on lower jig；Fluorescent glue is coated on blue-light LED chip and forms fluorescent film, obtains white-light emitting body semi-finished product；White-light emitting body semi-finished product are subjected to scribing, obtain white-light emitting body；Red emitting luminophores are chosen, red emitting luminophores are for compensating the part that white-light emitting body lacks relative to natural light；White-light emitting body and red emitting luminophores are fixed on bearing substrate, LED light source is obtained；Fluorescent film and blue-light LED chip are fixed on bearing substrate again after multiple blue-light LED chip surfaces are unified into fluorescent film, it can guarantee the consistency of fluorescent film in film forming procedure, so that the consistency of different LED light sources is high, and the spectrum that LED light source generates is close with natural light.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a manufacturing method of an LED light source.
Background
The LED is a semiconductor solid-state light-emitting device, has the obvious advantages of long service life, energy conservation, safety, environmental protection, rich color, miniaturization and the like, and is more and more favored by the market.
The current LED packaging method and process are largely the same and different, and the specific technical route comprises the following steps: fixing the die, namely fixing the LED chip on the substrate or the bracket by using a die bonder; bonding wires, wherein the chip and the chip are connected with a circuit of the bracket by a wire bonding machine; dispensing, namely coating a mixture of the fluorescent powder and the glue prepared according to a certain proportion on a chip, and then curing to finish the basic packaging process. The LED packaging process is very common in packaging enterprises and various products, but the dispensing process is carried out after the chips are fixed on the base body or the support, so that dispensing can be carried out on each LED chip only when dispensing is carried out, the distribution of fluorescent glue on different LED chips is inconsistent, the consistency of light and color parameters of the prepared LED light source is low, and the yield of the LED light source cannot be guaranteed. Moreover, the white light illuminating product manufactured by the existing packaging method and process has the defects of still unsatisfactory illuminating effect, unnatural feeling and uncomfortable feeling.
The above disadvantages need to be improved.
Disclosure of Invention
The invention aims to provide a manufacturing method of an LED light source, and aims to solve the technical problems that the LED light source manufactured by the existing manufacturing process is poor in lighting comfort and low in LED light source consistency.
In order to achieve the purpose, the invention adopts the technical scheme that: provided is a method for manufacturing an LED light source, comprising the following steps:
preparing fluorescent glue, namely mixing red fluorescent powder, green fluorescent powder, yellow-green fluorescent powder and silica gel, wherein the total weight of the red fluorescent powder, the green fluorescent powder and the yellow-green fluorescent powder accounts for 17-43% of the fluorescent glue;
fixing blue LED chips, and fixing a plurality of blue LED chips on the lower jig;
coating the fluorescent glue on the blue light LED chip to form a fluorescent film, and obtaining a white light luminous body semi-finished product;
scribing the white light emitter semi-finished product to obtain white light emitters, wherein each white light emitter comprises at least one blue light LED chip and a fluorescent film coated on the surface of the blue light LED chip;
selecting a red light-emitting body which is used for compensating the part of the white light-emitting body which is lacked relative to natural light;
and fixing the white light luminous body and the red light luminous body on a bearing substrate to obtain the LED light source.
In one embodiment, the step of preparing the fluorescent glue comprises:
preparing raw materials, namely stirring and mixing the red fluorescent powder, the green fluorescent powder, the yellow-green fluorescent powder and the silica gel according to a specified weight ratio to form the raw materials;
the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.020-0.035): (0.018-0.030): (0.140-0.253);
and (3) defoaming the raw materials, namely defoaming the raw materials in a defoaming machine until no bubbles are generated on the surface of the raw materials to obtain the fluorescent glue.
In one embodiment, the raw material defoaming step further includes:
and (3) putting the fluorescent glue into a low-temperature drying oven, wherein the temperature of the low-temperature drying oven is not more than 0.5 ℃.
In one embodiment, the color coordinates of the red phosphor are (X: 0.660-0.716, Y: 0.286-0.340);
the color coordinate of the green fluorescent powder is (X: 0.064-0.081, Y: 0.488-0.507);
the color coordinate of the yellow-green fluorescent powder is (X: 0.367-0.424, Y: 0.545-0.571).
In one embodiment, the weight ratio of the red phosphor to the green phosphor to the yellow-green phosphor is (0.020-0.035): (0.018-0.030): (0.140-0.253);
or,
the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.010-0.022): (0.020 to 0.040): (0.080-0.140);
or,
the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.010-0.020): (0.030-0.068): (0.071-0.130).
In one embodiment, the step of fixing the LED chip comprises:
preparing a lower jig, cutting a double-sided adhesive tape with a size suitable for the lower jig, and attaching one surface of the double-sided adhesive tape to the lower jig;
attaching a gasket to the double-faced adhesive;
and placing a plurality of blue LED chips in the gasket for fixing.
In one embodiment, the step of coating the fluorescent glue on the blue LED chip to form a fluorescent film to obtain a white light emitter semi-finished product includes:
coating the fluorescent glue on a plurality of blue light LED chips;
pressing an upper jig on the surface of the fluorescent glue to ensure that the thickness of the fluorescent glue on the surface of the blue light LED chip is consistent, and connecting the upper jig and the lower jig and then placing the upper jig and the lower jig into an oven for baking;
taking the upper jig and the lower jig out of the oven for cooling, and forming fluorescent films with consistent thickness by the fluorescent glue to obtain a semi-finished white light emitter;
and taking down the semi-finished white light emitting body from the lower jig.
In one embodiment, the step of coating the fluorescent glue on the plurality of blue light LED chips and the step of pressing the upper jig on the surface of the fluorescent glue, and the step of connecting the upper jig and the lower jig and then baking the upper jig and the lower jig in an oven further include:
and placing the lower jig into a defoaming machine for defoaming until no bubbles are generated on the surface of the fluorescent glue.
In one embodiment, an anti-sticking layer which avoids sticking with the fluorescent glue is attached to the surface of the upper jig.
In one embodiment, the step of removing the semi-finished white light emitter from the lower jig comprises:
separating the upper jig from the lower jig;
placing the lower jig with the white light luminous body semi-finished product on a heating table for foaming, and separating the double faced adhesive tape attached to the lower jig from the lower jig;
and taking down the semi-finished white light emitting body from the lower jig.
The manufacturing method of the LED light source has the beneficial effects that:
(1) the fluorescent film and the blue light LED chips are fixed on the bearing substrate after the fluorescent film is unified on the surfaces of the blue light LED chips, so that the consistency of the fluorescent film can be ensured in the film forming process, the consistency of white light luminous bodies in different LED light sources is high, and the consistency of parameters such as light, color and the like of the LED light sources is ensured to be high.
(2) The fluorescent powder comprises red fluorescent powder, green fluorescent powder and yellow-green fluorescent powder, the weight of the fluorescent powder accounts for 17% -43% of the total weight of the fluorescent glue, when the LED light source works, the blue light is generated after the blue light LED chip is powered on, the fluorescent film absorbs the blue light and is excited, other colored light is generated, white light is formed after the colored light is mixed, the white light is mixed with red light generated by a red light luminous body, near natural light is generated, the relative spectral power of the red light in the near natural light is greater than 0.60, the relative spectral power of the cyan light is greater than 0.30, the relative spectral power of the blue light is less than 0.75, compared with the spectrum generated by the existing white light LED light source, the relative spectral power of each waveband is obviously improved and is closer to the natural light, and a user is more comfortable and natural when the LED light source is used for.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flow chart illustrating a method for manufacturing an LED light source according to an embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a process of preparing a fluorescent glue in a method for manufacturing an LED light source according to an embodiment of the present invention;
fig. 3 is a schematic flow chart of fixing a blue LED chip in a method for manufacturing an LED light source according to an embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating a process of coating a fluorescent glue on a blue LED chip to form a fluorescent film to obtain a semi-finished white light emitter in the method for manufacturing an LED light source according to the embodiment of the present invention;
fig. 5 is a schematic spectrum diagram of an LED light source of a method for manufacturing an LED light source according to an embodiment of the present invention;
FIG. 6 is a graph comparing the spectrum of an LED light source with natural light according to the method for manufacturing an LED light source provided by the embodiment of the invention;
fig. 7 is a first schematic spectrum diagram of a white light emitter according to a method for manufacturing an LED light source of the present invention;
fig. 8 is a second schematic spectrum diagram of a white light emitter according to the method for manufacturing an LED light source of the present invention;
FIG. 9 is a schematic spectrum diagram of a conventional white LED light source;
fig. 10 is a first schematic structural diagram of an LED light source manufactured by using the LED light source manufacturing method according to the embodiment of the present invention;
fig. 11 is a second schematic structural diagram of an LED light source manufactured by the LED light source manufacturing method according to the embodiment of the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
The concept for relative spectral power is as follows: since the spectrum emitted by a light source is often not a single wavelength, but rather consists of a mixture of many different wavelengths, the spectral radiation of the light source in wavelength order and the intensity distribution of the individual wavelengths is referred to as the spectral power distribution of the light source. The parameters for characterizing the spectral power can be divided into absolute spectral power and relative spectral power, wherein an absolute spectral power distribution curve refers to a curve made by absolute values of the energy of various wavelengths of the spectral radiation; the relative spectral power distribution curve refers to a spectral power distribution curve in which the energies of various wavelengths of the light source radiation spectrum are compared with each other, and the radiation power is changed only in a specified range after normalization processing, wherein the relative spectral power with the maximum radiation power is 1, and the relative spectral powers of other wavelengths are all less than 1.
The concept of color ratio is as follows: any white light can be obtained by mixing the three primary colors of red (R), green (G) and blue (B) in corresponding proportions, and chromaticity coordinates R, G and B are introduced to represent the relative proportions of the three primary colors of R, G, B in the total amount of white light, wherein R is R/(R + G + B), G is G/(R + G + B), B is B/(R + G + B), R + G + B is 1, R is the red color ratio, G is the green color ratio, and B is the blue color ratio.
Referring to fig. 1, a method for manufacturing an LED light source includes:
step S10: preparing fluorescent glue, mixing red fluorescent powder, green fluorescent powder, yellow-green fluorescent powder and silica gel, wherein the total weight of the red fluorescent powder, the green fluorescent powder and the yellow-green fluorescent powder accounts for 17-43% of the total weight of the fluorescent glue;
step S20: fixing blue LED chips, and fixing a plurality of blue LED chips on the lower jig;
step S30: coating the fluorescent glue on a blue light LED chip to form a fluorescent film, and obtaining a white light luminous body semi-finished product;
step S40: scribing the white light emitter semi-finished product to obtain white light emitters, wherein each white light emitter comprises at least one blue light LED chip and a fluorescent film coated on the surface of the blue light LED chip;
step S50: selecting a red light-emitting body which is used for compensating the part of the white light-emitting body which is lacked relative to natural light;
step S60: and fixing the white light luminous body and the red light luminous body on the bearing substrate to obtain an LED light source, wherein the obtained LED light source is a near-natural light LED light source.
On one hand, when an existing LED light source is manufactured, a method that LED chips are fixedly connected to a base body at first and then the LED chips are subjected to dispensing is generally adopted, and since only one LED chip can be subjected to dispensing at a time in the dispensing process, the consistency of the dispensing process of all the LED chips cannot be ensured in the dispensing process, so that the dispensing is not uniform, the consistency of a light-emitting body in the formed LED light source is poor, and the consistency of light and color parameters of the LED light source is low. In the embodiment, the fluorescent film is unified on the surfaces of the blue light LED chips and then the fluorescent film and the blue light LED chips are fixed on the bearing substrate, so that the consistency of the fluorescent film can be ensured in the film forming process, the consistency of the white light luminous body in different LED light sources is high, and the consistency of parameters such as light, color and the like of the LED light sources is ensured to be high.
On the other hand, in the field of LED illumination, it is one of the development trends in this field to research an illumination source close to natural light, and many researchers and units are always in the direction of effort, and some illumination sources dedicated to close to natural light appear in the prior art, and usually, the light generated by such a light source is referred to as "close to natural light", where the close to natural light refers to a spectral shape (relative spectral power of a corresponding waveband) close to natural light, and at least part of optical parameters are close to natural light, and the degree of the close is not limited to a certain value.
However, the LED light source prepared by the existing packaging method and process has a spectrum that is very different from the spectrum of natural light, so that near-natural light cannot be obtained (as shown in fig. 9). In the LED light source prepared by the LED light source manufacturing method provided in this embodiment, the phosphor includes red phosphor, green phosphor and yellow-green phosphor, and the weight of the phosphor accounts for 17% -43% of the total weight of the phosphor, when the LED light source works, the blue light LED chip generates blue light after being connected with a power supply, the fluorescent film is excited after absorbing the blue light, thereby generating other color lights, mixing a plurality of color lights to form white light, mixing the white light with the red light generated by the red light luminous body, thereby generating near-natural light, wherein the relative spectral power of red light in the near-natural light is more than 0.60, the relative spectral power of cyan light is more than 0.30, the relative spectral power of blue light is less than 0.75, compared with the spectrum generated by the existing white light LED light source, the relative spectral power of each wave band is obviously improved, closer to natural light (see fig. 5), users are more comfortable and natural when using LED light sources for illumination.
Further, the red light emitting body comprises a red light LED chip, the wavelength range of the red light LED chip is 640 nm-700 nm, and the central wavelength of the red light LED chip can be 690nm +/-5 nm, 680nm +/-5 nm, 670nm +/-5 nm and the like. By improving the relative spectral power of the red light, the spectrum is closer to natural light, the 640 nm-700 nm red light has a health care function, and the health level of near-natural light illumination is further improved.
The damage of blue light to human eyes is very serious, the damage to the eyesight of immature students and children is obvious, when the blue light in the spectrum is too high, the color weakness of the children can be caused, the color discrimination capability of the children is reduced, and the myopia rate of the immature people is increased. Meanwhile, too high blue light can also affect the visual perception and mental state of people, and the discomfort such as dizziness, fatigue and the like can be easily caused when people are in the environment for a long time. The existing LED light source has high proportion of blue light, so the damage to human eyes is very serious. The relative spectral power of blue light is less than 0.75 in the spectrum that the LED light source provided of this embodiment produced, and blue light colour ratio b is less than 5.7% to under the circumstances that ensures that the spectrum is close to with the natural light, effectively reduced the blue light proportion in the spectrum, the visual sensation is more comfortable, is favorable to user's healthy.
Referring to fig. 2, step S10 further includes:
step S101: preparing raw materials, namely stirring and mixing red fluorescent powder, green fluorescent powder, yellow-green fluorescent powder and silica gel according to a specified weight ratio, wherein the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.020-0.035): (0.018-0.030): (0.140-0.253);
step S102: and (3) defoaming the raw materials, namely defoaming the raw materials in a defoaming machine until no bubbles are generated on the surface of the raw materials to obtain the fluorescent glue.
In one embodiment, the silica gel is preferably an AB silica gel, and the AB silica gel is obtained by combining an a-type silica gel and a B-type silica gel which are prepared from monomers such as vinyl and auxiliaries such as silicon dioxide, and the like, and the silica gel has good mechanical strength and light transmittance, can fix the phosphor on the surface of the LED chip well, and does not affect the performance of the phosphor.
In one embodiment, the stirring time is usually 15-30 min when the red phosphor, the green phosphor and the yellow-green phosphor are mixed with the silica gel, so that on one hand, the raw materials can be uniformly stirred, and on the other hand, the waste of time is avoided, so that the preparation process is more compact on the whole and the efficiency is higher.
The process of degassing the raw material is to extract the gas in the raw material. In one embodiment, when the raw material is placed in the defoaming machine, the defoaming machine may be vacuumized, and the gas in the raw material is pumped out until no more bubbles emerge from the surface of the raw material, i.e. the gas is completely discharged, and the defoaming time is usually 30min to 40 min. The defoaming treatment can ensure that the red fluorescent powder, the green fluorescent powder, the yellow-green fluorescent powder and the silica gel in the raw materials are stirred more uniformly, and the consistency of the fluorescent film after film formation in the subsequent steps is high.
Further, after step S102, the method further includes:
step S103: the fluorescent glue is placed into a low-temperature drying oven for storage and standby, and the temperature of the low-temperature drying oven is not more than-0.5 ℃, so that the fluorescent glue can be well stored.
Furthermore, the color coordinate of the red fluorescent powder is (X: 0.660-0.716, Y: 0.286-0.340);
the color coordinate of the green fluorescent powder is (X: 0.064-0.081, Y: 0.488-0.507);
the color coordinate of the yellow-green phosphor is (X: 0.367-0.424, Y: 0.545-0.571).
Since the phosphor provided by the embodiment is composed of the red phosphor, the green phosphor and the yellow-green phosphor with specific color coordinates, the phosphor obtained by combining the three phosphors in the weight ratio range can be well matched with the blue LED chip, and the white light with more optimized relative spectral distribution and close to natural light can be obtained by mixing the light generated by the phosphor when being excited by the blue light generated by the blue LED chip and the blue light. Specifically, in the white light spectrum, the relative spectrum of the wavelength band between 480nm and 500nm is greater than 0.3, and the relative spectrum of the wavelength band between 500nm and 640nm is greater than 0.6 (see fig. 7). On the one hand, compare with current white light LED light source, the relative spectral power of each wave band of white light that the LED light source that this embodiment provided produced all obviously promotes to effectively promoted color rendering index, and the white light that the white light LED light source produced is closer with the natural light, therefore the colour of object and environment is truer, can make people more comfortable, has effectively ensured healthy with the eye. On the other hand, the relative spectral proportion of the blue light part of 480-500 nm in the white light spectrum of the LED light source provided by the embodiment is higher than that of the traditional white light LED light source, the problem of low blue light existing in near-natural light research for a long time is solved, the white light generated by the LED light source is closer to real natural light, the color rendering index R12 is further improved, when the LED light source is used for illumination, the proportion of the blue light part is improved, the vision of children can be effectively improved, and the vision defect is avoided.
Further, the red phosphor is preferably a nitride red phosphor, and more preferably, the nitride red phosphor includes CaSrAlSiN3(structure 1113). The green phosphor is preferably oxynitride green phosphor, and more preferably, the oxynitride green phosphor comprises BaSi2O2N2(1222 structure). The yellow-green phosphor comprises Y3Al5Ga5O12(i.e., gallium-doped yttrium aluminum garnet). CaSrAlSiN3Nitride-like red phosphor, BaSi2O2N2Oxynitride-like green phosphor and Y3Al5Ga5O12The yellow-green fluorescent powder can reach the color coordinates required by the respective fluorescent powder, has better luminous intensity and stability, is very suitable for the fluorescent glue of the embodiment, and the types of the fluorescent powder can be purchased on the market.
In one embodiment, the particle size of the red phosphor is not greater than 15 μm, the particle size of the green phosphor is not greater than 15 μm, and the particle size of the yellow-green phosphor is not greater than 15 μm. In the particle size range, the fluorescent glue with more uniform dispersion can be obtained by mixing the three fluorescent powders, and the consistency of the fluorescent film in the subsequent steps is improved. More preferably, the particle size of the red phosphor is 11-15 μm, the particle size of the green phosphor is 11-15 μm, and the particle size of the yellow-green phosphor is 11-15 μm.
In one embodiment, the weight ratio of the red phosphor to the green phosphor to the yellow-green phosphor in the fluorescent glue is (0.020-0.035): (0.018-0.030): (0.140-0.253), after the fluorescent composition in the weight ratio range is excited by blue light, white light which is near natural light and has a color temperature of 2700K-3000K can be formed, in the white light spectrum, the relative spectrum of 480-500 nm wave bands is larger than 0.30, the relative spectrum of 500-640 nm wave bands is larger than 0.70, and the obtained white light spectrum is closer to the white light spectrum of the natural light.
In one embodiment, the weight ratio of the red phosphor to the green phosphor to the yellow-green phosphor in the fluorescent glue is (0.010-0.022): (0.020 to 0.040): (0.080-0.140), after the fluorescent composition in the weight ratio range is excited by blue light, the fluorescent composition can form white light which is near natural light and has the color temperature of 4000K-4200K, in the white light spectrum, the relative spectrum of 480-500 nm wave bands is larger than 0.45, the relative spectrum of 500-640 nm wave bands is larger than 0.65, and the obtained white light spectrum is closer to the white light spectrum of the natural light.
In one embodiment, the weight ratio of the red phosphor to the green phosphor to the yellow-green phosphor in the fluorescent glue is (0.010-0.020): (0.030-0.068): (0.071-0.130), after the fluorescent composition in the weight ratio range is excited by blue light, a near-natural-light white light with a color temperature of 5500K-6000K can be formed, in the white light spectrum, the relative spectrum of 480-500 nm wave band is larger than 0.40, the relative spectrum of 500-640 nm wave band is larger than 0.60, and the obtained white light spectrum is closer to the white light spectrum of natural light.
Example 1 as fluorescent glue:
a fluorescent gel contains AB silica gel and CaSrAlSiN3Red phosphor (color coordinate, X: 0.660-0.716, Y: 0.286-0.340), BaSi2O2N2Green phosphor (color coordinate, X: 0.064-0.081, Y: 0.488-0.507) and Y3Al5Ga5O12Yellow-green phosphor (color coordinate, X: 0.367-0.424, Y: 0.545-0.571); wherein, CaSrAlSiN3Red phosphor, BaSi2O2N2Green phosphor and Y3Al5Ga5O12The weight ratio of the yellow-green fluorescent powder is (0.020-0.035): (0.018-0.030): (0.140-0.253), and the mass percentage of the three kinds of fluorescent powder in the fluorescent layer is 33-43%.
The fluorescent layer is excited by blue light, and white light of near natural light with the color temperature of 2700K-3000K can be obtained: in the spectrum, the relative spectrum of 480-500 nm wave band is more than 0.30, and the relative spectrum of 500-640 nm wave band is more than 0.70.
Example 2 as fluorescent glue
A fluorescent gel contains AB silica gel and CaSrAlSiN3Red phosphor (color coordinate, X: 0.660-0.716, Y: 0.286-0.340), BaSi2O2N2Green phosphor (color coordinate, X: 0.064-0.081, Y: 0.488-0.507) and Y3Al5Ga5O12Yellow-green phosphor (color coordinate, X: 0.367-0.424, Y: 0.545-0.571); wherein, CaSrAlSiN3Red phosphor, BaSi2O2N2Green phosphor and Y3Al5Ga5O12The weight ratio of the yellow-green fluorescent powder is (0.010-0.022): (0.020 to 0.040): (0.080-0.140), and the mass percentage of the three kinds of fluorescent powder in the fluorescent layer is 25-35%.
The fluorescent glue can obtain near-natural-light white light with the color temperature of 4000K-4200K through the excitation of blue light: in the spectrum, the relative spectrum of 480-500 nm wave band is more than 0.45, and the relative spectrum of 500-640 nm wave band is more than 0.65.
Example 3 as fluorescent glue
A fluorescent gel contains AB silica gel and CaSrAlSiN3Red phosphor (color coordinate, X: 0.660-0.716, Y: 0.286-0.340), BaSi2O2N2Green phosphor (color coordinate, X: 0.064-0.081, Y: 0.488-0.507) and Y3Al5Ga5O12Yellow-green phosphor (color coordinate, X: 0.367-0.424, Y: 0.545-0.571); wherein, CaSrAlSiN3Red phosphor, BaSi2O2N2Green phosphor and Y3Al5Ga5O12The weight ratio of the yellow-green fluorescent powder is (0.010-0.020): (0.030-0.068): (0.071-0.130) and the mass percentage of the three kinds of fluorescent powder in the fluorescent layer is 17-27%.
The fluorescent glue can obtain white light of near natural light with color temperature of 5500K-6000K by blue light excitation: in the spectrum, the relative spectrum of 480-500 nm wave band is more than 0.40, and the relative spectrum of 500-640 nm wave band is more than 0.60.
In one embodiment, the blue LED chip has a wavelength range of 457.5nm to 480nm, and at least 457.5nm to 460nm, so that the proportion of cyan light can be further increased. In many white LED light sources, the blue light ratio is difficult to increase, and the blue light ratio is more difficult to increase, and the color rendering index R12 corresponding to the blue light is also difficult to increase. The embodiment breaks through the traditional convention (the traditional white light LED light source usually adopts a blue light chip of 450 nm-455 nm), selects the blue light chip of 457.5 nm-480 nm, and simultaneously focuses on the development of the fluorescent glue, and the fluorescent glue is adopted to manufacture a fluorescent film, so that the relative spectral power of the blue light in the spectrum emitted by the LED light source is obviously improved through the mutual matching of the two aspects. Meanwhile, due to the improvement of cyan light, the color rendering index R12 is also improved, and the blue light can be restrained and the higher color temperature can be kept to a certain extent. While the relative spectral power of the blue light in the white light generated by the conventional near-natural light source is lower than 0.3 (as shown in fig. 9), the relative spectral power of the blue light in the white light generated by the white LED light source provided by the present embodiment can be increased to 0.4 or more (as shown in fig. 8).
Referring to fig. 3, step S20 further includes:
step S201, preparing a lower jig, cutting a double-sided adhesive tape with the size suitable for the lower jig, attaching one surface of the double-sided adhesive tape to the lower jig, attaching a transparent film to the other surface of the double-sided adhesive tape, and arranging the surface attached with the transparent film to face upwards, preferably, the double-sided adhesive tape is a Riv α double-sided adhesive tape, one surface of a foaming adhesive tape (with the thickness of 36 microns) of the double-sided adhesive tape faces towards the lower jig and is attached to the surface of the lower jig, and one surface of an acrylic adhesive tape (with the thickness of 50 microns) of the double-sided adhesive tape faces upwards and is used for connecting with a gasket in the subsequent step.
Step S202: tearing off the transparent film adhered to the double-sided adhesive tape of the lower jig, and adhering the gasket to the double-sided adhesive tape, wherein the gasket is provided with an inner frame, and the blue light LED chip can be arranged in the inner frame.
Step S203: and placing a plurality of blue LED chips in the gasket for fixing. By arranging the gasket, on one hand, the position of the blue light LED chip can be fixed, and the fluorescent glue can be coated on the surface of the blue light LED chip in the subsequent steps; on the other hand, the direct fixed connection of the blue LED chip on the double-sided adhesive is avoided.
In one embodiment, the step S201 and the step S202 further include detecting whether the double-sided tape is completely attached to the lower jig, and the specific method includes:
toast lower tool, will laminate the lower tool that has the double faced adhesive tape and toast in putting into the oven, the condition of toasting is: baking at 100 deg.C for 20 min;
observing whether bubbles exist between the double-faced adhesive tape and the lower jig;
if bubbles are generated, the double-sided adhesive tape is torn off from the lower jig, then the double-sided adhesive tape is pasted on the lower jig again, and the steps are repeated;
if no bubble is generated, it indicates that the double-sided tape is well adhered to the lower jig, and the process continues to step S202.
Referring to fig. 4, step S30 further includes:
step S301: coating fluorescent glue on a plurality of blue light LED chips; the blue light LED chips are arranged on the gasket according to a preset sequence, the fluorescent glue is filled into the injector and is dripped on the surfaces of the blue light LED chips through the injector, so that the surfaces of the blue light LED chips are coated with the fluorescent glue.
Step S302, pressing an upper jig on the surface of a fluorescent glue to ensure that the thickness of the fluorescent glue on the surface of a blue light LED chip is consistent, and placing the upper jig and a lower jig into an oven for baking after the upper jig and the lower jig are connected, wherein the surface of the upper jig is attached with an anti-sticking layer which avoids being stuck with the fluorescent glue, in one embodiment, the anti-sticking layer is a double-sided adhesive tape, one side of the double-sided adhesive tape is attached with the surface of the upper jig, the other side of the double-sided adhesive tape is attached with a transparent film, the transparent film is in contact with the fluorescent glue in the pressing process, but the fluorescent glue is not stuck on the surface of the transparent film, so that the fluorescent glue is attached to the surface of the blue light LED chip in the pressing process, preferably, the double-sided adhesive tape is Riv α double-sided adhesive, one side of a foaming glue (the thickness of 36 mu m) of the double-sided adhesive tape faces the upper jig and is attached to the surface of the upper jig, one side of the acrylic glue (the thickness of 50 mu m) of the double-sided adhesive tape is arranged downwards, and the transparent film is attached to the surface of the acrylic glue, when the upper jig and the lower.
Step S303: the upper jig and the lower jig are cooled after being taken out of the oven, the fluorescent glue forms a fluorescent film with the same thickness, and a white light luminous body semi-finished product is obtained after the fluorescent glue is taken out of the lower jig, so that the thickness of the fluorescent film on the surface of each blue light LED chip is ensured to be consistent. Preferably, the thickness of the fluorescent film is not more than 0.3mm, more preferably 0.1mm to 0.3 mm.
In an embodiment, defoaming the fluorescent glue between the step S301 and the step S302 is further included, that is, in the process of coating the fluorescent glue on the plurality of blue LED chips, air may enter the fluorescent glue again, and in order to ensure the film forming quality in the subsequent fluorescent glue film forming process, the lower jig is placed into a defoaming machine for defoaming for 30 to 40min until no bubble is generated on the surface of the fluorescent glue, so as to ensure that the air in the fluorescent glue can be completely discharged.
In one embodiment, step S303 includes:
placing the upper jig and the lower jig on a cooling table for cooling;
after cooling, separating the upper jig from the lower jig, and taking the upper jig down from the lower jig through tweezers in the process;
placing the lower jig with the white light illuminant semi-finished product on a heating table for foaming, wherein the foaming temperature is 200 ℃, so that the double faced adhesive tape on the lower jig is separated from the lower jig;
and taking down the semi-finished white light emitting body from the lower jig.
Further, after obtaining the white light emitter semi-finished product, measuring the white light emitter semi-finished product, and checking whether the thickness of the white light emitter semi-finished product meets the requirement; if the thickness meets the requirement, carrying out the subsequent scribing step; if the thickness does not meet the requirement, the thickness is directly abandoned, and the quality of the LED light source is ensured to be finally obtained.
Further, the process of slicing the white light emitter semi-finished product in step S40 is performed on a cutting film, that is, the white light emitter semi-finished product is firstly attached to the cutting film, and then is diced according to a preset requirement, so as to be divided into a plurality of white light emitters, wherein each white light emitter comprises at least one blue light LED chip and a fluorescent film coated on the surface of the blue light LED chip. The dicing film is preferably an ELPNBD-5172 dicing film, but other types of dicing films may be used, and are not limited thereto. Preferably, each white light emitter contains one LED chip.
Further, in step S50, the white light emitter and the red light emitter may be mounted on the carrier substrate in a face-up or flip-chip manner.
When the flip-chip mode is adopted, the blue light LED chip in the white light emitting body and the red light LED chip in the red light emitting body are correspondingly connected with the circuit on the bearing substrate, the operation is simple and convenient, and the size of the white light emitting body can be reduced. Preferably, the width of the fluorescent film is smaller than 0.8mm, the height of the fluorescent film and the height of the blue light LED chip are smaller than 0.3mm, the width of the LED light source is smaller than 1mm, the height of the LED light source is smaller than 0.5mm, on one hand, the whole size is small, on the other hand, light rays generated by the blue light LED chip are emitted after all the light rays pass through the fluorescent film, and the homogenization of the emitted light rays is ensured. Of course, the size of the phosphor film can be adjusted according to actual needs, and is not limited to the above case. Adopt flip chip's mode, be favorable to blue light LED chip and bear the weight of the base member effective connection on the one hand, the heat that on the other hand blue light LED chip during operation produced also can be conducted to the outside through bearing the weight of the base member fast to be favorable to high-efficient heat dissipation, the surperficial film-forming uniformity of blue light LED chip is good when preparing simultaneously, and then can avoid just installing the problem that the point of chip dispensing process caused the uniformity poor. Moreover, the flip chip can also enable different products to be in the same BIN position when the color temperature is the same, and the color temperature consistency is good.
When the normal installation mode is adopted, because a gold thread needs to be arranged on the front surface of the blue light LED chip, the gold thread needs to be used for the connecting part connected with the bearing base body in advance to be arranged outside the fluorescent film.
Further, when the white light emitting body and the red light emitting body are fixed on the bearing substrate, the white light emitting body and the red light emitting body can be connected in series or in parallel, preferably in series, that is, the same positive and negative pins are connected, and the same current drive is unified, so that different driving currents do not need to be configured for different light emitting bodies, a control circuit does not need to be added on the bearing substrate, and power supply only needs to be carried out according to the corresponding currents. Therefore, the LED light source is simpler in structure, further reduced in size, simpler, more convenient and more flexible to apply and lower in cost. Of course, the white light emitting body and the red light emitting body may also be connected in parallel, that is, the white light emitting body and the red light emitting body are respectively connected to different positive and negative pins and are separately driven, and at this time, the respective driving currents may be the same or different.
Further, after the white light emitter and the red light emitter are fixed on the carrier substrate in step S60, a glue may be dot-packaged on the carrier substrate, so as to package the white light emitter and the red light emitter, and make the structures of the white light emitter and the red light emitter more stable.
The LED light source prepared by the method for manufacturing an LED light source provided in this embodiment is as follows:
referring to fig. 10 and 11, the LED light source includes a substrate layer 10, at least one group of light emitting elements 20 disposed on the substrate layer 10, and a circuit 30 electrically connected to the light emitting elements 20, each group of light emitting elements 20 includes a white light emitting body 201 and a red light emitting body 202, the white light emitting body 201 includes a blue LED chip 2011 and a fluorescent film 2012 covering the blue LED chip 2011, and the red light emitting body 202 includes a red LED chip. The white light emitted by the white light emitter 201 is mixed with the red light emitted by the red light emitter 202, and the red light is used for compensating the missing red light part of the white light relative to the natural spectrum to form near-natural light; the relative spectral power of red light in the near-natural light is greater than 0.60, the relative spectral power of cyan light in the near-natural light is greater than 0.30, and the relative spectral power of blue light in the near-natural light is less than 0.75 (see fig. 5). Each set of light emitting assemblies 20 can emit near natural light, and thus, in the case of an LED light source comprising a plurality of sets of light emitting assemblies 20, the LED light source can emit near natural light as well.
Referring to fig. 5 and fig. 6, the light generated by the LED light source is optimized in each wavelength band, and has strict requirements on optical parameters, such as color temperature, color tolerance, color rendering index Ra, color rendering index R9, color rendering index R12, blue light color ratio, and the like. Wherein, the color temperature of the near natural light comprises 2500K to 6500K, the color tolerance is less than 5, and the blue light color ratio is less than 5.7 percent. The color rendering index Ra is greater than 95, the color rendering index RR9 is greater than 90, and the color rendering index R12 is greater than 80.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method of manufacturing an LED light source, comprising:
preparing fluorescent glue, namely mixing red fluorescent powder, green fluorescent powder, yellow-green fluorescent powder and silica gel, wherein the total weight of the red fluorescent powder, the green fluorescent powder and the yellow-green fluorescent powder accounts for 17-43% of the fluorescent glue;
fixing blue LED chips, and fixing a plurality of blue LED chips on the lower jig;
coating the fluorescent glue on the blue light LED chip to form a fluorescent film, and obtaining a white light luminous body semi-finished product;
scribing the white light emitter semi-finished product to obtain white light emitters, wherein each white light emitter comprises at least one blue light LED chip and a fluorescent film coated on the surface of the blue light LED chip;
selecting a red light-emitting body which is used for compensating the part of the white light-emitting body which is lacked relative to natural light;
and fixing the white light luminous body and the red light luminous body on a bearing substrate to obtain the LED light source.
2. The method of manufacturing an LED light source of claim 1, wherein the step of preparing a phosphor paste comprises:
preparing raw materials, namely stirring and mixing the red fluorescent powder, the green fluorescent powder, the yellow-green fluorescent powder and the silica gel according to a specified weight ratio to form the raw materials;
the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.020-0.035): (0.018-0.030): (0.140-0.253);
and (3) defoaming the raw materials, namely defoaming the raw materials in a defoaming machine until no bubbles are generated on the surface of the raw materials to obtain the fluorescent glue.
3. The method for manufacturing an LED light source according to claim 2, further comprising, after the step of defoaming the raw material:
and (3) putting the fluorescent glue into a low-temperature drying oven, wherein the temperature of the low-temperature drying oven is not more than 0.5 ℃.
4. The method for manufacturing an LED light source according to claim 2, wherein the color coordinate of the red phosphor is (X: 0.660-0.716, Y: 0.286-0.340);
the color coordinate of the green fluorescent powder is (X: 0.064-0.081, Y: 0.488-0.507);
the color coordinate of the yellow-green fluorescent powder is (X: 0.367-0.424, Y: 0.545-0.571).
5. The method for manufacturing an LED light source according to claim 2, wherein the weight ratio of the red phosphor to the green phosphor to the yellow-green phosphor is (0.020-0.035): (0.018-0.030): (0.140-0.253);
or,
the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.010-0.022): (0.020 to 0.040): (0.080-0.140);
or,
the weight ratio of the red fluorescent powder to the green fluorescent powder to the yellow-green fluorescent powder is (0.010-0.020): (0.030-0.068): (0.071-0.130).
6. The method of manufacturing an LED light source of claim 1, wherein the step of fixing the LED chip comprises:
preparing a lower jig, cutting a double-sided adhesive tape with a size suitable for the lower jig, and attaching one surface of the double-sided adhesive tape to the lower jig;
attaching a gasket to the double-faced adhesive;
and placing a plurality of blue LED chips in the gasket for fixing.
7. The method for manufacturing the LED light source according to any one of claims 1 to 6, wherein the step of coating the fluorescent glue on the blue LED chip to form a fluorescent film to obtain a white light emitting body semi-finished product comprises:
coating the fluorescent glue on a plurality of blue light LED chips;
pressing an upper jig on the surface of the fluorescent glue to ensure that the thickness of the fluorescent glue on the surface of the blue light LED chip is consistent, and connecting the upper jig and the lower jig and then placing the upper jig and the lower jig into an oven for baking;
taking the upper jig and the lower jig out of the oven for cooling, and forming fluorescent films with consistent thickness by the fluorescent glue to obtain a semi-finished white light emitter;
and taking down the semi-finished white light emitting body from the lower jig.
8. The method for manufacturing an LED light source according to claim 7, wherein the steps of coating the fluorescent glue on the plurality of blue LED chips and pressing the upper jig on the surface of the fluorescent glue, and the step of connecting the upper jig and the lower jig and then baking the connected upper jig and the lower jig in an oven further comprise:
and placing the lower jig into a defoaming machine for defoaming until no bubbles are generated on the surface of the fluorescent glue.
9. The method for manufacturing an LED light source according to claim 7, wherein an anti-sticking layer for preventing sticking to the fluorescent glue is attached to the surface of the upper jig.
10. The method according to claim 7, wherein the step of removing the semi-finished white light emitter from the lower fixture comprises:
separating the upper jig from the lower jig;
placing the lower jig with the white light luminous body semi-finished product on a heating table for foaming, and separating the double faced adhesive tape attached to the lower jig from the lower jig;
and taking down the semi-finished white light emitting body from the lower jig.
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| PCT/CN2018/095308 WO2020000513A1 (en) | 2018-06-27 | 2018-07-11 | Led light source manufacturing method |
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