CN104051601A - LED packaging light source free from damage to visual system and manufacturing method thereof - Google Patents
LED packaging light source free from damage to visual system and manufacturing method thereof Download PDFInfo
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- CN104051601A CN104051601A CN201410301444.9A CN201410301444A CN104051601A CN 104051601 A CN104051601 A CN 104051601A CN 201410301444 A CN201410301444 A CN 201410301444A CN 104051601 A CN104051601 A CN 104051601A
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- led
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- emitting phosphor
- glue
- green emitting
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 230000000007 visual effect Effects 0.000 title abstract description 8
- 238000004806 packaging method and process Methods 0.000 title abstract 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 48
- 239000003292 glue Substances 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000741 silica gel Substances 0.000 claims abstract description 17
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 17
- 239000000843 powder Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 10
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 238000004020 luminiscence type Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 238000001228 spectrum Methods 0.000 abstract description 16
- 238000009877 rendering Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 230000003595 spectral effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241001025261 Neoraja caerulea Species 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000258 photobiological effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging light source free from damage to a visual system and a manufacturing method of the LED packaging light source. LED fluorescent glue used for packaging is mainly formed by mixing silica gel, green phosphor, red phosphor and yellow phosphor. The green phosphor, the red phosphor and the yellow phosphor account for 20%-60% of the total amount of silica gel in total according to the weight ratio, the weight ratio of the yellow phosphor to the green phosphor to the red phosphor is 1:0.20-1.0:0.01-0.16, and the emitting peak wavelength of the green phosphor ranges from 510 nm to 550 nm. Due to the adoption of the LED fluorescent glue formed by mixing special phosphor, an emitted spectrum of the manufactured LED packaging light source is similar to the solar spectrum, and the light source can be conveniently applied to various lamps, meets indoor lighting requirements, and can effectively prevent blue light from damaging the visual system of a person.
Description
Technical field
The present invention relates to a kind of its manufacture method of LED packaged light source, particularly a kind of LED packaged light source without vision system harm and preparation method thereof.
Background technology
Because LED light source has energy-saving and environmental protection, the photochromic plurality of advantages such as adjustable, LED lighting source technology also develops rapidly.Along with LED light efficiency is largely increased, brightness is increasing, and the problem that the blue light in its utilizing emitted light can exert an influence to human visual system and other aspects is also known by the public gradually.
Blue light strength in LED packaged light source utilizing emitted light is all higher at present, and the LED light source blue light strength that especially colour temperature is higher is higher, under improper service condition, can cause irreversible harm moment to human visual system.To this, existing relevant criterion is for monitoring and assess the grade of blue light harm in the world.China has also put into effect the safe coherent detection standard of photo-biological and has had corresponding checkout equipment and detection method.But, the current also imperfection of examination criteria at home, and this standard is also only for reference, there is no the power of obligating.This causes most domestic LED product before selling, not carry out the detection of blue light harm.
Want to allow LED really can become the light source that the next generation can relieved application, its blue light harm must solve.And can not avoid the blue light in LED utilizing emitted light completely at present, because blue chip is the important component part of white light LEDs.Thereby how in encapsulation process, to reduce blue light as far as possible and seem particularly important.In addition, according to the long-term living environment adapting to of the mankind, this visible-range spectral power distribution of sending without the LED light source of vision system harm should approach the energy spectrum of sun institute radiation as far as possible, and we are referred to as class solar spectrum.Such light source will be conducive to human health more.
Summary of the invention
For addressing the above problem, the object of the invention is to can be to a kind of LED packaged light source without vision system harm and preparation method thereof is provided.The present invention can not only effectively reduce the blue light strength in LED utilizing emitted light, can make the spectrum of light source approach as much as possible solar spectrum simultaneously, and color rendering and light efficiency are all significantly increased.
The present invention solves the technical scheme that its problem adopts:
A kind of LED packaged light source without vision system harm, it encapsulates fluorescent glue used and is mainly mixed and formed by silica gel, green emitting phosphor, red fluorescence powder, yellow fluorescent powder, by weight, described green emitting phosphor, red fluorescence powder, yellow fluorescent powder amount to the 20%-60% that accounts for silica gel total amount, wherein the weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is: 1: 0.20-1.0: 0.01-0.16, wherein the emission peak wavelength of green emitting phosphor is 510-550nm.
Further, described silica gel is mainly made up of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
Further, described green emitting phosphor is TMG green emitting phosphor or GP green emitting phosphor or LuAG green emitting phosphor.
Particularly, also comprise PCB wiring board, on described PCB wiring board, be provided with blue led luminescence chip, on the luminous core of described blue led, scribble described LED fluorescent glue.
A manufacture method for the above-mentioned LED light source without vision system harm, is characterized in that comprising the following steps:
A, be ready to die bond, PCB wiring board or surface mount type lamp pearl support that bonding wire is good;
B, above-mentioned LED fluorescent glue ratio accurately weigh silica gel component and yellow fluorescent powder, green emitting phosphor and red fluorescence powder;
C, by the above-mentioned silica gel weighing, yellow fluorescent powder, green emitting phosphor and red fluorescence powder be stirred to few half an hour it is mixed and in vacuum defoamation equipment deaeration within 20 minutes, obtain required LED fluorescent glue;
D, the LED fluorescent glue of gained in step C is uniformly coated on to the PCB wiring board of A step or surface mount type lamp pearl with on support by spot gluing equipment manually or automatically, adds and subtracts glue amount by integrating sphere measurement data, until reach fixing parameter area;
E, for PCB wiring board encapsulation, observe PCB wiring board after gluing and whether go back remnants and have bubble, if also have bubble, carry out secondary deaeration to reach all bubbles of discharging in fluorescent glue;
F, the PCB wiring board of gained in the surface mount type lamp pearl support of gained in step D or step e is put into baking box toast, after completing, obtain final products.
The invention has the beneficial effects as follows:
A kind of LED light source without vision system harm that the present invention adopts, owing to having adopted special LED fluorescent glue of joining powder ratio, in the proportioning of LED fluorescent glue, the emission peak wavelength of green emitting phosphor is 510-550nm, and green emitting phosphor shared ratio in proportioning is heavier, therefore it is the illumination effect of class solar spectrum that the LED light source of making has the lower and emission spectrum of blue light strength, on the basis that meets room lighting, can effectively prevent the harm of blue light to human visual system, the LED packaged light source of therefore making can be applied in various light fixtures easily, especially be applicable to being applied to room lighting and desk lamp etc., can effectively prevent the harm of blue light to human visual system.
The manufacture method of a kind of LED light source without vision system harm that the present invention adopts, the LED light source of making by the method can be applied in various light fixtures easily, and can effectively prevent the harm of blue light to human visual system on the basis that meets room lighting.
Brief description of the drawings
Below in conjunction with accompanying drawing and example, the invention will be further described.
Fig. 1 is common LED test light spectrogram.
Fig. 2 is the encapsulating structure schematic diagram of the embodiment of the present invention.
Fig. 3 is that the embodiment of the present invention 1 is tested obtained spectrogram.
Fig. 4 is that the embodiment of the present invention 2 is tested obtained spectrogram.
Fig. 5 is that the embodiment of the present invention 3 is tested obtained spectrogram.
Embodiment
A kind of LED packaged light source without vision system harm of the present invention, it encapsulates fluorescent glue used mainly by silica gel, green emitting phosphor, red fluorescence powder, yellow fluorescent powder mixes composition, by weight, described green emitting phosphor, red fluorescence powder, yellow fluorescent powder amounts to the 20%-60% that accounts for silica gel total amount, wherein yellow fluorescent powder, green emitting phosphor, weight proportion between red fluorescence powder is: 1: 0.20-1.0: 0.01-0.16, wherein the emission peak wavelength of green emitting phosphor is 510-550nm, the emission peak wavelength of yellow fluorescent powder is 570-590nm, the emission peak wavelength of red fluorescence powder is 600-630nm.Described silica gel is mainly made up of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
Particularly, described green emitting phosphor is TMG green emitting phosphor or GP green emitting phosphor or LuAG green emitting phosphor.Yellow fluorescent powder and red fluorescence powder adopt common fluorescent material.
Utilize above-mentioned LED fluorescent glue, can produce the LED packaged light source without vision system harm, shown in Fig. 2, described LED packaged light source specifically comprises PCB wiring board, on described PCB wiring board, be provided with blue led luminescence chip, on the luminous core of described blue led, scribble above-mentioned LED fluorescent glue.In the present embodiment, describe as an example of making COB light source example, therefore on the wiring board of PCB described in Fig. 2, be provided with multiple LED luminescence chips, and on multiple LED luminescence chips the common last layer LED fluorescent glue that is coated with, LED light source can be also commonly use SMD, as 2835,3528,5730 etc.
The manufacture method concrete steps of making the above-mentioned LED packaged light source without vision system harm are as follows:
A, be ready to die bond, PCB wiring board or surface mount type lamp pearl support that bonding wire is good;
B, accurately weigh silica gel and yellow fluorescent powder, green emitting phosphor and red fluorescence powder in above-mentioned LED fluorescent glue ratio;
C, by the above-mentioned silica gel weighing, yellow fluorescent powder, green emitting phosphor and red fluorescence powder be stirred to few half an hour it is mixed and in vacuum defoamation equipment deaeration within 20 minutes, obtain required LED fluorescent glue;
D, the LED fluorescent glue of gained in step C is uniformly coated on to the PCB wiring board of A step or surface mount type lamp pearl with on support by spot gluing equipment manually or automatically, adds and subtracts glue amount by integrating sphere measurement data, until reach fixing parameter area;
E, for PCB wiring board encapsulation, observe PCB wiring board after gluing and whether go back remnants and have bubble, if also have bubble, carry out secondary deaeration to reach all bubbles of discharging in fluorescent glue;
F, the PCB wiring board of gained in the surface mount type lamp pearl support of gained in step D or step e is put into baking box toast, after completing, obtain final products.
Below for making three specific embodiments of COB light source:
Specific embodiment 1, red fluorescence powder adopts DAM, and accounting for yellow fluorescent powder usage ratio is 20%; Green emitting phosphor adopts TMG(silicate systems), unsulfided green emitting phosphor (GP) also may reach good experiment effect; Green emitting phosphor LuAG also can reach experiment effect, and consumption is 2.67 times of yellow fluorescent powder consumption; Yellow fluorescent powder adopts DAY, and LED chip adopts blue chip.A glue is 1:1 with the ratio of B glue.The spectrum test result of the COB packaged light source obtaining is as Fig. 3.Separately, the color rendering index of this packaged light source is 85.0, colour temperature 4122K left and right.From spectral power distribution Fig. 3 of test and contrast common LED Energy distribution Fig. 1 and can find out, the blue light strength of this packaged light source is very low, spectrum is class solar spectrum, and color rendering is better, and it will be very effective to the prevention of blue light harm that described packaged light source is applied in light fixture.
Specific embodiment 2, red fluorescence powder adopts DAM, and accounting for yellow fluorescent powder usage ratio is 20%; Green emitting phosphor adopts TMG, and consumption is 3.33 times of yellow fluorescent powder consumption; Yellow fluorescent powder adopts DAY, and LED chip adopts blue chip.A glue is 1:1 with the ratio of B glue.The spectrum test result of the COB packaged light source obtaining is as Fig. 4.Separately, the color rendering index of this packaged light source is 83.2, colour temperature 4542K left and right.From spectral power distribution Fig. 4 of test and contrast common LED spectral power distribution Fig. 1 and can find out, the blue light strength of this packaged light source is lower, spectrum is class solar spectrum, and color rendering is better, and it will be very effective to the prevention of blue light harm that described packaged light source is applied in light fixture.
Specific embodiment 3, red fluorescence powder adopts DAM, and accounting for yellow fluorescent powder usage ratio is 20%; Green emitting phosphor adopts TMG, and consumption is 2.67 times of yellow fluorescent powder consumption; Yellow fluorescent powder adopts YAG, and LED chip adopts blue chip.A glue is 1:1 with the ratio of B glue.The spectrum test result of the COB packaged light source obtaining is as Fig. 5.Separately, the color rendering index of this packaged light source is 83.0, colour temperature 4453K.From spectral power distribution Fig. 5 of test and contrast common LED spectral power distribution Fig. 1 and can find out, the blue light strength of this packaged light source is lower, spectrum is class solar spectrum, and color rendering is better, and it will be very effective to the prevention of blue light harm that described packaged light source is applied in light fixture.
Can find out from above embodiment result, the manufacture that adopts raw material described in this patent and technical matters to carry out the low blue light packaged light source of LED is feasible.Utilize different raw material proportionings can obtain the low blue-ray LED packaged light source of colour temperature from 3000K left and right to 5000K left and right through process parameter optimizing, and the color rendering properties of light source obtaining is better, can meet the requirement of various room lightings.Result has proved the broad applicability of this new method by experiment.If by experiment and the improvement of system, can also obtain more excellent experimental data.
The above, be preferred embodiment of the present invention, and the present invention is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present invention with identical means, all should belong to protection scope of the present invention.
Claims (5)
1. the LED packaged light source without vision system harm, it is characterized in that: it encapsulates fluorescent glue used and is mainly mixed and formed by silica gel, green emitting phosphor, red fluorescence powder, yellow fluorescent powder, by weight, described green emitting phosphor, red fluorescence powder, yellow fluorescent powder amount to the 20%-60% that accounts for silica gel total amount, wherein the weight proportion between yellow fluorescent powder, green emitting phosphor, red fluorescence powder is: 1: 0.20-1.0: 0.01-0.16, wherein the emission peak wavelength of green emitting phosphor is 510-550nm.
2. a kind of LED packaged light source without vision system harm according to claim 1, is characterized in that: described silica gel is mainly made up of A glue and B glue, and the weight ratio of described A glue and B glue is: 1:0.9-1.2.
3. a kind of LED packaged light source without vision system harm according to claim 1 and 2, is characterized in that: described green emitting phosphor is TMG green emitting phosphor or GP green emitting phosphor or LuAG green emitting phosphor.
4. a kind of LED packaged light source without vision system harm according to claim 1, is characterized in that: comprise PCB wiring board, on described PCB wiring board, be provided with blue led luminescence chip, scribble described LED fluorescent glue on the luminous core of described blue led.
5. a manufacture method for the arbitrary described LED light source without vision system harm of claim 1 to 4, is characterized in that comprising the following steps:
A, be ready to die bond, PCB wiring board or surface mount type lamp pearl support that bonding wire is good;
B, accurately weigh silica gel component and yellow fluorescent powder, green emitting phosphor and red fluorescence powder in the arbitrary described LED fluorescent glue ratio of claims 1 to 3;
C, by the above-mentioned silica gel weighing, yellow fluorescent powder, green emitting phosphor and red fluorescence powder be stirred to few half an hour it is mixed and in vacuum defoamation equipment deaeration within 20 minutes, obtain required LED fluorescent glue;
D, the LED fluorescent glue of gained in step C is uniformly coated on to the PCB wiring board of A step or surface mount type lamp pearl with on support by spot gluing equipment manually or automatically, adds and subtracts glue amount by integrating sphere measurement data, until reach fixing parameter area;
E, for PCB wiring board encapsulation, observe PCB wiring board after gluing and whether go back remnants and have bubble, if also have bubble, carry out secondary deaeration to reach all bubbles of discharging in fluorescent glue;
F, the PCB wiring board of gained in the surface mount type lamp pearl support of gained in step D or step e is put into baking box toast, after completing, obtain final products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410301444.9A CN104051601A (en) | 2014-06-26 | 2014-06-26 | LED packaging light source free from damage to visual system and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410301444.9A CN104051601A (en) | 2014-06-26 | 2014-06-26 | LED packaging light source free from damage to visual system and manufacturing method thereof |
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| CN104051601A true CN104051601A (en) | 2014-09-17 |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702837A (en) * | 2015-12-10 | 2016-06-22 | 广东新光源电子科技有限公司 | LED light source imitating spectrum of sunlight |
| CN105870303A (en) * | 2016-04-18 | 2016-08-17 | 佛山市中昊光电科技有限公司 | Full-spectrum LED light source |
| CN108899311A (en) * | 2018-06-27 | 2018-11-27 | 朗昭创新控股（深圳）有限公司 | A kind of LED light source manufacturing method |
| CN108922957A (en) * | 2018-06-27 | 2018-11-30 | 朗昭创新控股（深圳）有限公司 | Fluorescent glue, fluorescent film and preparation method thereof |
| CN109285937A (en) * | 2018-08-16 | 2019-01-29 | 佛山市国星光电股份有限公司 | LED white light parts and preparation method thereof, LED backlight mould group |
| CN109301050A (en) * | 2018-08-16 | 2019-02-01 | 佛山市国星光电股份有限公司 | LED white light parts and preparation method thereof, LED backlight mould group |
| CN109659420A (en) * | 2018-11-14 | 2019-04-19 | 五邑大学 | It is a kind of it is high colour developing, broad-spectrum white-light LED light source |
| CN110959201A (en) * | 2017-06-28 | 2020-04-03 | 京瓷株式会社 | Light emitting device and lighting device |
| CN112216779A (en) * | 2020-11-05 | 2021-01-12 | 安徽芯瑞达科技股份有限公司 | Full-spectrum LED for display backlight field |
| CN115799434A (en) * | 2023-01-31 | 2023-03-14 | 天津德高化成新材料股份有限公司 | Health illumination backlight source and preparation method thereof |
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| CN101806430A (en) * | 2009-02-17 | 2010-08-18 | 福建省苍乐电子企业有限公司 | High-color rendering white-light LED |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105702837B (en) * | 2015-12-10 | 2019-03-01 | 广东新光源电子科技有限公司 | A kind of imitative sunlight spectrum LED light source |
| CN105702837A (en) * | 2015-12-10 | 2016-06-22 | 广东新光源电子科技有限公司 | LED light source imitating spectrum of sunlight |
| CN105870303A (en) * | 2016-04-18 | 2016-08-17 | 佛山市中昊光电科技有限公司 | Full-spectrum LED light source |
| CN105870303B (en) * | 2016-04-18 | 2020-08-28 | 佛山市中昊光电科技有限公司 | Full-spectrum LED light source |
| CN110959201B (en) * | 2017-06-28 | 2023-05-09 | 京瓷株式会社 | Light emitting device and lighting device |
| CN110959201A (en) * | 2017-06-28 | 2020-04-03 | 京瓷株式会社 | Light emitting device and lighting device |
| CN108922957A (en) * | 2018-06-27 | 2018-11-30 | 朗昭创新控股（深圳）有限公司 | Fluorescent glue, fluorescent film and preparation method thereof |
| CN108899311A (en) * | 2018-06-27 | 2018-11-27 | 朗昭创新控股（深圳）有限公司 | A kind of LED light source manufacturing method |
| CN109301050A (en) * | 2018-08-16 | 2019-02-01 | 佛山市国星光电股份有限公司 | LED white light parts and preparation method thereof, LED backlight mould group |
| CN109285937A (en) * | 2018-08-16 | 2019-01-29 | 佛山市国星光电股份有限公司 | LED white light parts and preparation method thereof, LED backlight mould group |
| US11757069B2 (en) | 2018-08-16 | 2023-09-12 | Foshan Nationstar Optoelectronics Co., Ltd | LED white light device, preparation method thereof, and LED backlight module |
| CN109659420A (en) * | 2018-11-14 | 2019-04-19 | 五邑大学 | It is a kind of it is high colour developing, broad-spectrum white-light LED light source |
| CN109659420B (en) * | 2018-11-14 | 2020-05-08 | 五邑大学 | High-color-rendering and wide-spectrum white light LED light source |
| CN112216779A (en) * | 2020-11-05 | 2021-01-12 | 安徽芯瑞达科技股份有限公司 | Full-spectrum LED for display backlight field |
| CN115799434A (en) * | 2023-01-31 | 2023-03-14 | 天津德高化成新材料股份有限公司 | Health illumination backlight source and preparation method thereof |
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Application publication date: 20140917 |
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