CN115799434A - Health illumination backlight source and preparation method thereof - Google Patents

Health illumination backlight source and preparation method thereof Download PDF

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Publication number
CN115799434A
CN115799434A CN202310048510.5A CN202310048510A CN115799434A CN 115799434 A CN115799434 A CN 115799434A CN 202310048510 A CN202310048510 A CN 202310048510A CN 115799434 A CN115799434 A CN 115799434A
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film layer
fluorescent
fluorescent film
light
fluorescent powder
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CN115799434B (en
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刘怀军
刘东顺
许瑞龙
谭晓华
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TECORE SYNCHEM Inc
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TECORE SYNCHEM Inc
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Priority to KR1020237039170A priority patent/KR20240122685A/en
Priority to PCT/CN2023/109927 priority patent/WO2024159725A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor
    • G01R31/2632—Circuits therefor for testing diodes
    • G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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Abstract

The invention discloses a health illumination backlight source and a preparation method thereof, wherein the health illumination backlight source comprises: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is positioned under the first fluorescent film layer, the first fluorescent film layer covers the light-emitting chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are positioned on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550). The wavelength range of the double-layer CSP light source obtained by the invention is 500-720nm, so that the spectrum is flat, the relative light intensity is high, the color saturation is high, the color rendering index is increased, the spectrum wavelength is in the visible spectrum range, ultraviolet light and infrared light are filtered, the skin is protected to a certain extent, and simultaneously, the activity of fiber cells in the skin can be enhanced by red light (the wavelength range is 640-720 nm) in the illumination backlight source.

Description

Health lighting backlight source and preparation method thereof
Technical Field
The invention relates to the field of LED illumination, the classification number of which is H01L33/26, in particular to a healthy illumination backlight source and a preparation method thereof.
Background
The LED has a wide application in the field of illumination and display due to its advantages of high luminous efficiency, long life, no pollution, compact structure, etc. At present, a mainstream white light LED light source is a fluorescence conversion white light LED, a blue LED chip is mainly adopted to excite a yellow fluorescent layer to form yellow light, and blue light and yellow light are mixed to form white light, but the spectrum of the scheme is discontinuous, the color rendering index is low, and then white light is obtained by compounding the blue LED chip, green fluorescent powder and red fluorescent powder, the problem of spectrum discontinuity still exists although the color rendering index can reach about 75-85 is also provided, and the two methods do not realize adjustment of color temperature parameters and relative light intensity.
Chinese patent CN105702837 discloses a sunlight spectrum-imitating LED light source, which realizes a full spectrum LED light source based on different chip wavelengths and different sizes of light emitting chips under different fluorescent powder materials by different proportions, and although the spectrum can reach a certain relative light intensity, the wavelength is wide, but the waveform of the spectrum is uneven, mainly used for illumination in people's daily life.
Disclosure of Invention
In order to solve the above problems, a first aspect of the present invention provides a health illumination backlight, the light source having: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is positioned under the first fluorescent film layer, the first fluorescent film layer covers the light-emitting chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are positioned on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550).
The applicant finds that, when the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550), the generated spectrum has wide and continuous coverage range, the wavelength range is increased from 480-630nm to 500-720nm, the formed spectrum is flat, and the relative light intensity is high.
Further preferably, the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is (350-400): (300-450).
Further preferably, the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is (380-400): (380-450).
Further preferably, the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is 380:420.
preferably, the light-emitting chip is a blue light chip, and the wavelength range is 455-462.5nm.
Further preferably, the wavelength of the blue light chip is 455nm.
Preferably, the raw materials for preparing the first fluorescent film layer comprise first fluorescent powder and silica gel, and the weight ratio of the first fluorescent powder to the silica gel is (15-60): (20-40).
Further preferably, the silica gel is LED packaging silica gel, and the weight ratio between the first phosphor and the silica gel is (30-50): (25-35).
Further preferably, the weight ratio of the first fluorescent powder to the silica gel is 50:30.
preferably, the first phosphor includes at least one of a blue phosphor, a green phosphor, a blue-green phosphor, an amber phosphor, a bright red phosphor and a red phosphor.
Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor.
More preferably, the wavelength range of the blue fluorescent powder is 475-480nm, the wavelength range of the green fluorescent powder is 490-495nm, the wavelength range of the blue-green fluorescent powder is 535-540nm, the wavelength range of the amber fluorescent powder is 600-610nm, the wavelength range of the bright red fluorescent powder is 630-635nm and the wavelength range of the red fluorescent powder is 655-660nm.
More preferably, the wavelength of the blue phosphor is 478nm, the wavelength of the green phosphor is 593nm, the wavelength of the blue-green phosphor is 537nm, the wavelength of the amber phosphor is 605nm, the wavelength of the bright red phosphor is 632nm and the wavelength of the red phosphor is 658nm.
Preferably, the first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, and the weight ratio of the six fluorescent powders is (2-8): (3-10): (10-20): (1-5): (1-5): (0.1-1).
Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor, and the weight ratio of the six phosphors is (4-6): (5-10): (15-20): (2-4): (1-3): (0.5-1).
The applicant finds that when the content of the blue-green phosphor is too much, spectral depression is generated, and the suspected reason is that the content of the blue-green phosphor is too much, so that defoaming and stirring are not easy, and the spectral shape is further influenced, and when the blue phosphor, the green phosphor, the blue-green phosphor, the amber phosphor, the bright red phosphor and the red phosphor are mixed according to the weight ratio of (4-6): (5-10): (15-20): (2-4): (1-3): (0.5-1), under the combined action of the first fluorescent film layer, the spectrum continuity is good, the blue light is greatly reduced, the eyes are prevented from being damaged, and the color rendering index of the light source is improved.
Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor, and the weight ratio of the six phosphors is 6:7:20:3:3:1.
preferably, the preparation raw materials of the second fluorescent film layer comprise second fluorescent powder and silica gel, and the weight ratio of the second fluorescent powder to the silica gel is (30-60): (10-40). The applicant finds that the color rendering index of the CSP light source may decrease due to the shift of color points and the discontinuity of spectrum, which may cause obvious color difference and decrease of color rendering index, and that the content of the second phosphor is too low and may cause too high color temperature, and the applicant finds that, when the weight ratio of the second phosphor to the silica gel is (30-60): (10-40), under the combined action of the first fluorescent film layer, the color point does not shift, the color rendering index is increased, and the color temperature is reduced.
Further preferably, the silica gel is LED packaging silica gel, and the weight ratio of the second phosphor to the LED packaging silica gel is (30-50): (20-40).
Further preferably, the weight ratio of the second phosphor to the LED packaging silica gel is 40:20.
preferably, the wavelength range of the second fluorescent powder is 720-745nm.
Further preferably, the wavelength range of the second fluorescent powder is 725-735nm.
Further preferably, the wavelength range of the second phosphor is 730nm.
The invention provides a preparation method of a healthy illumination backlight source, which comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 170-190s under the condition that the rotation number is 1000-1400rpm/min, repeating for 2-3 times, regulating the rotation number to 900-1200rpm/min, continuously stirring for 170-190s under the vacuum condition, making the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 350-400um, and placing the fluorescent glue film in an oven at 70-90 ℃ for baking for 12-18min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength range of 720-745nm and silica gel according to the weight ratio, stirring for 170-190 seconds under the condition that the rotating speed is 1000-1400rpm/min, repeating for 2-3 times, adjusting the rotating speed to 900-1200rpm/min, continuously stirring for 170-190 seconds under the vacuum condition, making the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 400-450 mu m, placing the fluorescent glue film in an oven with the temperature of 70-90 ℃ and baking for 12-18 minutes to obtain a second fluorescent film layer.
(3) Arranging light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3500-4000, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the pressure range is 5-7KN, cutting after lamination to obtain a single-layer CSP light source, and then carrying out current test.
(4) And (4) using a press-fit mold to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) to obtain a double-layer CSP light source, and then carrying out current testing.
Preferably, the pressing time in the steps (3) and (4) is 3-10min, and the pressing temperature is 80-150 ℃.
Further preferably, the pressing time in the steps (3) and (4) is 5-7min, and the pressing temperature is 100-120 ℃.
Further preferably, the pressing time in the steps (3) and (4) is 6min, and the pressing temperature is 110 ℃.
Preferably, the current range in the step (3) is 3-750mA.
Further preferably, the current in the step (3) is in the range of 350-750mA.
Further preferably, the current in the step (3) is 350 mA.
Has the beneficial effects that:
according to the invention, through the optimized design of the first fluorescent film layer and the second fluorescent film layer, the wavelength range of the obtained double-layer CSP light source is 500-720nm, the emitted spectrum is flat, the relative light intensity is high, the spectrum wavelength is in the visible spectrum range, ultraviolet light and infrared light are filtered, the skin is protected to a certain extent, meanwhile, through the reasonable proportion of the first fluorescent powder, the continuity of the spectrum is good, the blue light is greatly reduced, the eyes are prevented from being damaged, and the color saturation is high, the color rendering index is increased, and in addition, the red light (with the wavelength range of 640-720 nm) in the illumination backlight source provided by the invention can enhance the activity of fiber cells in the skin.
Drawings
FIG. 1 is a schematic diagram of a single layer CSP light source fabricated according to example 1.
Fig. 2 is a schematic structural view of a two-layer CSP light source fabricated according to example 1.
FIG. 3 is a spectral plot of a single layer CSP light source made according to example 1.
Fig. 4 is a spectrum diagram of a two-layer CSP light source made according to example 1.
In fig. 1:1. the light-emitting chip 2 is a first fluorescent film layer; the arrows indicate the direction of emission of the single-layer CSP light source
In fig. 2: 1. light emitting chip 2, first fluorescent film layer 3, second fluorescent film layer
Detailed Description
Example 1
A health-lighting backlight, the light source having: the LED fluorescent lamp comprises a light emitting chip 1, a first fluorescent film layer 2 and a second fluorescent film layer 3, wherein the light emitting chip 1 is located under the first fluorescent film layer 2, the first fluorescent film layer 2 covers the light emitting chip 1 to form an arch shape and is connected with the second fluorescent film layer 3, the gravity centers of the light emitting chip 1, the first fluorescent film layer 2 and the second fluorescent film layer 3 are located on the same vertical line, and the thickness ratio of the first fluorescent film layer 2 to the second fluorescent film layer 3 is 390:350.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 33.7:30, the LED packaging silica gel is purchased from Beijing kang Mei Tech technologies, inc., and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between the six is 5:6:17:3:2:0.7. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1# -490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the rotation number is 1200rpm/min, repeating for 2 times, adjusting the rotation number to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 2
A health-lighting backlight, the light source having: the LED fluorescent lamp comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers the blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are located on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 380:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 50:30. the LED packaging silica gel is purchased from Beijing kang Mei technology Co., ltd, and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between six is 6:7:20:3:3:1. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the rotation number is 1200rpm/min, repeating for 2 times, adjusting the rotation number to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with thickness of 420um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging the light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 3
A health-lighting backlight, the light source having: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers over a blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are located on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 38:35, the LED packaging silica gel is purchased from Beijing kang Mei Tech technologies, inc., and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between six is 5:6:20:3:3:1 the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1# -490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 4
A health-lighting backlight, the light source having: the LED fluorescent lamp comprises a light emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers the blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 30:30, the LED packaging silica gel is purchased from Beijing kang Mei technology Co., ltd, and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between the six is 4:6:16:2:1:1. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1# -490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 60: and 40, the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging the light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 5
A health-lighting backlight, the light source having: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers over a blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are located on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 44:30. the LED packaging silica gel is purchased from Beijing Kangmeit technology Co., ltd, and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between six is 6:10:20:4:3:1. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 6
A health-lighting backlight, the light source having: the LED fluorescent lamp comprises a light emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers the blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
First fluorescence rete includes first phosphor powder and LED encapsulation silica gel, the weight ratio between first phosphor powder and the LED encapsulation silica gel is 31.4:30, the LED packaging silica gel is purchased from Beijing kang Mei Tech technologies, inc., and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between six is 5:6:17:3:0.2:0.2. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 20:20, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 730nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, manufacturing the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging the light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 7
A health-lighting backlight, the light source having: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers over a blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are located on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 36:30, the LED packaging silica gel is purchased from Beijing kang Mei technology Co., ltd, and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between six is 5:6:17:3:3:2. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 21:10, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 8
A health-lighting backlight, the light source having: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers over a blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are located on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 35.5:30, the LED packaging silica gel is purchased from Beijing kang Mei technology Co., ltd, and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between six is 5:6:17:3:4:0.5. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, and the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type is 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 390um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 730nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, manufacturing the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 420um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging the light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Example 9
A health-lighting backlight, the light source having: the LED chip comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers over the blue light chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are located on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 450:350.
the light-emitting chip is a blue light chip with the wavelength of 455nm, is purchased from Sanan photoelectricity corporation and has the model of S-32ABFUD.
First fluorescence rete includes first phosphor powder and LED encapsulation silica gel, the weight ratio between first phosphor powder and the LED encapsulation silica gel is 33.7: and 50, the LED packaging silica gel is purchased from Beijing kang Mei technology Limited company, and has the model of HM-0892.
The first fluorescent powder is blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder's mixture, blue fluorescent powder's wavelength is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio between the six is 5:6:17:3:2:0.7. the first fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm,658nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, the wavelength of the second fluorescent powder is 730nm. The second fluorescent powder is purchased from Shandong Yingguang New Material Co., ltd, and the type is 723nm:8#720.
A preparation method of a health lighting backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition that the revolution is 1200rpm/min, repeating for 2 times, regulating the revolution to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with the thickness of 450um, and placing the fluorescent gel film in an oven at 80 ℃ for baking for 15min to obtain a first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with wavelength of 723nm and the silica gel according to the weight ratio, stirring for 180s under the condition that the rotating speed is 1200rpm/min, repeating for 2 times, adjusting the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition that the vacuum degree is-95 KPa, making the fluorescent gel after vacuum stirring into a fluorescent gel film with thickness of 350um, and placing the fluorescent gel film in an oven with the temperature of 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer obtained in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination to obtain a single-layer CSP light source, and then testing is carried out under the current of 350 mA to obtain the spectrum of the single-layer CSP light source.
(4) And (4) carrying out vacuum lamination and cutting on the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) by using a lamination mold, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA so as to obtain the spectrum of the double-layer CSP light source.
Evaluation of Properties
Spectroscopic test instrument using spectroscopic test: WY + HAAS2000-V1-USB; the state of the instrument: the scanning wavelength range is 350-1000nm, the waveform accuracy is +/-0.3 nm, the relative light intensity, the color temperature and the color rendering index of the double-layer CSP light source are measured, and the test data are shown in the following table 1.
TABLE 1
Figure SMS_1

Claims (10)

1. A health-care lighting backlight, the light source comprising: the LED display panel comprises a light-emitting chip, a first fluorescent film layer and a second fluorescent film layer, wherein the light-emitting chip is positioned under the first fluorescent film layer, the first fluorescent film layer covers the light-emitting chip to form an arch shape and is connected with the second fluorescent film layer, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are positioned on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 200-500:250-550.
2. The backlight source of claim 1, wherein the light emitting chips are blue light emitting chips and have a wavelength ranging from 455 to 462.5nm.
3. The backlight source of claim 1 or 2, wherein the first phosphor layer is prepared from a first phosphor and a silica gel, and the weight ratio of the first phosphor to the silica gel is 15-60:20-40.
4. The backlight of claim 3, wherein the first phosphor comprises at least one of a blue phosphor, a green phosphor, a blue-green phosphor, an amber phosphor, a bright red phosphor, and a red phosphor.
5. The health-lighting backlight source of claim 4, wherein the first phosphor is a mixture of blue, green, cyan, amber, bright red and red phosphors, and the weight ratio of the blue to the green to the amber to the bright red is 2-8:3-10:10-20:1-5:1-5:0.1-1.
6. The backlight source of claim 1, wherein the raw materials for preparing the second phosphor layer comprise second phosphor and silica gel, and the weight ratio of the second phosphor to the silica gel is 30-60:10-40.
7. A health-care lighting backlight as claimed in claim 6, wherein the wavelength of the second phosphor is in the range of 720-745nm.
8. The method for preparing a health lighting backlight source as claimed in claim 1, wherein the steps are as follows:
(1) Mixing and stirring the first fluorescent powder and the silica gel according to the weight ratio, and baking to obtain a first fluorescent film layer;
(2) Mixing and stirring the second fluorescent powder and the silica gel according to the weight ratio, and baking to obtain a second fluorescent film layer;
(3) Laminating and cutting the first fluorescent film layer and the light-emitting chip in the step (1) to obtain a single-layer CSP light source, and then carrying out current test;
and (3) pressing and cutting the second fluorescent film layer obtained in the step (2) and the single-layer CSP light source obtained in the step (3) to obtain a double-layer CSP light source, and then carrying out current testing.
9. The method for preparing a health lighting backlight source as claimed in claim 8, wherein the pressing time in steps (3) and (4) is 3-10min, and the pressing temperature is 80-150 ℃.
10. The method as claimed in claim 8, wherein the current in step (3) is in the range of 3-750mA.
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