CN115799434B - Healthy illumination backlight source and preparation method thereof - Google Patents
Healthy illumination backlight source and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a healthy illumination backlight and a preparation method thereof, wherein the healthy illumination backlight comprises the following components: the light-emitting chip is positioned under the first fluorescent film layer, the first fluorescent film layer is covered right above the light-emitting chip to form an arch shape and is connected with the second fluorescent film layer above the light-emitting chip, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550). The wavelength range of the obtained double-layer CSP light source is 500-720nm, so that the spectrum is flat, the relative light intensity is high, the color saturation is high, the color rendering index is increased, the spectrum wavelength is in the visible spectrum range, ultraviolet light and infrared light are filtered, the skin is protected to a certain extent, and meanwhile, the activity of fiber cells in the skin can be enhanced by illuminating red light (the wavelength range is 640-720 nm) in the backlight source.
Description
Technical Field
The invention relates to the field of LED illumination, and specifically relates to a healthy illumination backlight source and a preparation method thereof, wherein the classification number of the healthy illumination backlight source is H01L 33/26.
Background
The LED has the advantages of high luminous efficiency, long service life, no pollution, compact structure and the like, and has wide application in the fields of illumination and display. At present, the mainstream white light LED light source is a fluorescence conversion white light LED, a blue LED chip is mainly adopted to excite a yellow fluorescent layer to form yellow light, the blue light and the yellow light are mixed to form white light, but the scheme has discontinuous spectrum and lower color rendering index, the blue LED chip, the green fluorescent powder and the red fluorescent powder are further adopted to be compounded to obtain white light, the color rendering index can reach about 75-85, but the problem of spectrum discontinuity still exists, and the two methods do not realize the adjustment of color temperature parameters and relative light intensity.
Chinese patent CN105702837 discloses a sunlight spectrum imitating LED light source, and a full spectrum LED light source is realized by different proportions of light emitting chips with different wavelengths based on different chips under different fluorescent powder materials, and the spectrum of the full spectrum LED light source can reach a certain relative light intensity, has a wider wavelength, but has uneven waveform, and is mainly used for illumination in daily life of people.
Disclosure of Invention
In order to solve the above-described problems, a first aspect of the present invention provides a healthy illumination backlight having: the light-emitting chip is positioned under the first fluorescent film layer, the first fluorescent film layer is covered right above the light-emitting chip to form an arch shape and is connected with the second fluorescent film layer above the light-emitting chip, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is (200-500): (250-550).
The thickness of the first fluorescent film layer is too high, the concentration of the first fluorescent powder is increased, the peak emitted by the first fluorescent powder can cover the peak emitted by the second fluorescent powder, the spectrum range is reduced, the spectrum is discontinuous, the formed spectrum is uneven, the relative light intensity of the CSP light source can be influenced if the thickness of the first fluorescent film layer is too small, and the applicant finds that when the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is (200-500): and (250-550), the generated spectrum has wide and continuous coverage, the wavelength is increased from 480-630nm to 500-720nm, the formed spectrum is flat, and the relative light intensity is high.
Further preferably, the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is (350-400): (300-450).
Further preferably, the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is (380-400): (380-450).
Further preferably, the ratio of the thicknesses of the first fluorescent film layer and the second fluorescent film layer is 380:420.
preferably, the light emitting chip is a blue light chip, and the wavelength range is 455-462.5nm.
Further preferably, the wavelength of the blue light chip is 455nm.
Preferably, the preparation raw materials of the first fluorescent film layer comprise first fluorescent powder and silica gel, and the weight ratio of the first fluorescent powder to the silica gel is (15-60): (20-40).
Further preferably, the silica gel is LED package silica gel, and the weight ratio between the first fluorescent powder and the silica gel is (30-50): (25-35).
Further preferably, the weight ratio between the first fluorescent powder and the silica gel is 50:30.
preferably, the first phosphor includes at least one of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor.
Further preferably, the first phosphor is a mixture of blue phosphor, green phosphor, blue-green phosphor, amber phosphor, bright red phosphor and red phosphor.
Further preferably, the wavelength of the blue phosphor is in the range of 475-480nm, 490-495nm, 535-540nm, 600-610nm, 630-635nm and 655-660nm.
Further preferably, the wavelength of the blue phosphor is 478nm, green phosphor 593nm, blue-green phosphor 537nm, amber phosphor 605nm, bright red phosphor 632nm, and red phosphor 658nm.
Preferably, the first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is (2-8): (3-10): (10-20): (1-5): (1-5): (0.1-1).
Further preferably, the first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is (4-6): (5-10): (15-20): (2-4): (1-3): (0.5-1).
The applicant found that when the content of the blue-green phosphor is too large, a spectrum depression occurs, and it is suspected that the reason may be that the content of the blue-green phosphor is too large, and it is not easy to defoam and stir, thereby affecting the shape of the spectrum thereof, and when the blue phosphor, the green phosphor, the blue-green phosphor, the amber phosphor, the bright red phosphor and the red phosphor are in a weight ratio of (4-6): (5-10): (15-20): (2-4): (1-3): (0.5-1), under the combined action of the first fluorescent film layer, the spectrum continuity is good, blue light is greatly reduced, eyes are prevented from being injured, and the display of the light source is improved.
Further preferably, the first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, and the weight ratio of the blue fluorescent powder to the green fluorescent powder to the blue-green fluorescent powder is 6:7:20:3:3:1.
preferably, the preparation raw materials of the second fluorescent film layer comprise second fluorescent powder and silica gel, and the weight ratio of the second fluorescent powder to the silica gel is (30-60): (10-40). The applicant found that the color rendering index of the CSP light source may decrease due to the fact that the color point may shift, the spectrum is discontinuous, and the color may generate a significant color difference, the color rendering index decreases, and at the same time, the color temperature is too high due to the too low content of the second phosphor, and the applicant found that when the weight ratio of the second phosphor to the silica gel is (30-60): (10-40), under the combined action of the first fluorescent film layer, the color point does not shift, the color rendering index is increased, and the color temperature is reduced.
Further preferably, the silica gel is LED encapsulation silica gel, and the weight ratio of the second fluorescent powder to the LED encapsulation silica gel is (30-50): (20-40).
Further preferably, the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20.
preferably, the wavelength range of the second fluorescent powder is 720-745nm.
Further preferably, the wavelength of the second fluorescent powder is 725-735nm.
Further preferably, the wavelength range of the second fluorescent powder is 730nm.
The second aspect of the invention provides a method for preparing a healthy illumination backlight source, which comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 170-190s under the condition of 1000-1400rpm/min, repeating for 2-3 times, regulating the rotation to 900-1200rpm/min, continuously stirring for 170-190s under the vacuum condition, preparing the fluorescent gel after vacuum stirring into a fluorescent glue film with the thickness of 350-400um, and placing in an oven at 70-90 ℃ for baking for 12-18min to obtain the first fluorescent film layer.
(2) Mixing and stirring fluorescent powder with the wavelength range of 720-745nm and silica gel according to the weight ratio, stirring for 170-190s at the rotating speed of 1000-1400rpm/min, repeating for 2-3 times, adjusting the rotating speed to 900-1200rpm/min, continuously stirring for 170-190s under the vacuum condition, preparing the fluorescent glue with the thickness of 400-450um after vacuum stirring into a fluorescent glue film, and placing the fluorescent glue film in an oven at 70-90 ℃ for baking for 12-18min to obtain a second fluorescent film layer.
(3) Arranging the light-emitting chips on a glass substrate, wherein the number of the light-emitting chips is 3500-4000, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light-emitting chips arranged on the glass substrate, wherein the pressure range is 5-7KN, cutting after lamination to obtain a single-layer CSP light source, and then carrying out current test.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) to obtain a double-layer CSP light source, and then performing current test.
Preferably, the laminating time in the steps (3) and (4) is 3-10min, and the laminating temperature is 80-150 ℃.
Further preferably, the pressing time in the steps (3) and (4) is 5-7min, and the pressing temperature is 100-120 ℃.
Further preferably, the pressing time in the steps (3) and (4) is 6min, and the pressing temperature is 110 ℃.
Preferably, the current in the step (3) ranges from 3 mA to 750mA.
Further preferably, the current in the step (3) ranges from 350 mA to 750mA.
Further preferably, the current in the step (3) is 350 mA.
The beneficial effects are that:
the wavelength range of the obtained double-layer CSP light source is 500-720nm through the optimal design of the first fluorescent film layer and the second fluorescent film layer, so that the emitted spectrum is flat and has high relative light intensity, the spectrum wavelength is in the visible spectrum range, ultraviolet light and infrared light are filtered out, the skin is protected to a certain extent, meanwhile, through reasonable proportioning of the first fluorescent powder, the spectrum continuity is good, blue light is greatly reduced, the eyes are prevented from being damaged, the effect is softer, and then the weight ratio of the second fluorescent powder to the silica gel is optimized, so that the color saturation is high and the color rendering index is increased.
Drawings
Fig. 1 is a schematic diagram of the structure of a single-layer CSP light source obtained in example 1.
Fig. 2 is a schematic diagram of the structure of a double-layered CSP light source made in accordance with example 1.
FIG. 3 is a spectral diagram of a single layer CSP light source made in accordance with example 1.
Fig. 4 is a spectral diagram of a dual-layer CSP light source made according to example 1.
In fig. 1:1. a light emitting chip 2. A first fluorescent film layer; the arrow indicates the direction of emission of the single-layer CSP light source
In fig. 2: 1. light-emitting chip 2. First fluorescent film layer 3. Second fluorescent film layer
Detailed Description
Example 1
A healthy-lighting backlight, the light source having: the light emitting chip 1, the first fluorescent film layer 2 and the second fluorescent film layer 3, the light emitting chip 1 is located under the first fluorescent film layer 2, the first fluorescent film layer 2 is covered over the light emitting chip 1 to be in an arch shape and is connected with the second fluorescent film layer 3 above, the centers of gravity of the light emitting chip 1, the first fluorescent film layer 2 and the second fluorescent film layer 3 are on the same vertical line, and the thickness ratio of the first fluorescent film layer 2 to the second fluorescent film layer 3 is 390:350.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 33.7:30, wherein the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 5:6:17:3:2:0.7. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 2
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 380:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 50:30. the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 6:7:20:3:3:1. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 3
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 38:35, wherein the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 5:6:20:3:3:1, the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 4
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 30:30, wherein the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 4:6:16:2:1:1. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 60:40, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 5
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 44:30. the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 6:10:20:4:3:1. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 6
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 31.4:30, wherein the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 5:6:17:3:0.2:0.2. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 20:20, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring fluorescent powder with the wavelength of 730nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 7
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 36:30, wherein the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 5:6:17:3:3:2. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 21:10, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Examples8
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 390:420.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 35.5:30, wherein the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 5:6:17:3:4:0.5. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, wherein the wavelength of the second fluorescent powder is 723nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 390um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring fluorescent powder with the wavelength of 730nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 420um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Example 9
A healthy-lighting backlight, the light source having: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers right above the blue light chip to be in an arch shape and is connected with the second fluorescent film layer above, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 450:350.
the light-emitting chip is a blue light chip with the wavelength of 455nm and is purchased from Sanan photoelectric Co., ltd, and the model is S-32ABFUD.
The first fluorescent film layer comprises first fluorescent powder and LED packaging silica gel, and the weight ratio of the first fluorescent powder to the LED packaging silica gel is 33.7:50, the LED packaging silica gel is purchased from Beijing Kangmeite technology Co., ltd, and the model is HM-0892.
The first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder, the wavelength of the blue fluorescent powder is 478nm, green fluorescent powder 493nm, blue-green fluorescent powder 537nm, amber fluorescent powder 605nm, bright red fluorescent powder 632nm and red fluorescent powder 658nm, and the weight ratio of the blue fluorescent powder to the green fluorescent powder is 5:6:17:3:2:0.7. the first fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and the type of the fluorescent powder is 478nm:9#480, 493nm:1#490, 537nm;4#535,605nm:11#603, 632nm:5#630nm, 618 nm:6#660.
The second fluorescent film layer comprises second fluorescent powder and LED packaging silica gel, and the weight ratio of the second fluorescent powder to the LED packaging silica gel is 40:20, wherein the wavelength of the second fluorescent powder is 730nm. The second fluorescent powder is purchased from Shandong Ying optical New Material Co., ltd, and has the model of 723nm:8#720.
A preparation method of a healthy illumination backlight source comprises the following steps:
(1) Mixing and stirring blue, green, blue-green, amber, bright red and red fluorescent powder and silica gel according to the weight ratio, stirring for 180s under the condition of 1200rpm/min, repeating for 2 times, regulating the rotation to 1000rpm/min, continuing stirring for 180s under the condition of-95 KPa, preparing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 450um, and placing in an oven at 80 ℃ for baking for 15min to obtain the first fluorescent film layer.
(2) Mixing and stirring the fluorescent powder with the wavelength of 723nm and silica gel according to the weight ratio, stirring for 180s under the condition of the rotating speed of 1200rpm/min, repeating for 2 times, regulating the rotating speed to 1000rpm/min, continuously stirring for 180s under the condition of the vacuum degree of-95 KPa, manufacturing the fluorescent glue after vacuum stirring into a fluorescent glue film with the thickness of 350um, and placing the fluorescent glue film in an oven at 80 ℃ for baking for 15min to obtain a second fluorescent film layer.
(3) Arranging light emitting chips on a glass substrate, wherein the number of the light emitting chips is 3844, then carrying out vacuum lamination on the first fluorescent film layer in the step (1) and the light emitting chips arranged on the glass substrate, wherein the vacuum degree is-95 KPa, the pressure range is 6.4KN, the lamination time is 6min, the temperature is 110 ℃, cutting is carried out after lamination, a single-layer CSP light source is obtained, and then the spectrum of the single-layer CSP light source is obtained after testing under the current of 350 mA.
(4) And (3) using a pressing die to press and cut the second fluorescent film layer and the single-layer CSP light source obtained in the step (3) in vacuum, wherein the vacuum degree is-95 KPa, so as to obtain a double-layer CSP light source, and then testing under the current of 350 mA to obtain the spectrum of the double-layer CSP light source.
Evaluation of Performance
Spectroscopic test apparatus using spectroscopic test: WY+HAAS2000-V1-USB; instrument status: the relative light intensity, color temperature and color rendering index of the double-layer CSP light source were measured with a scanning wavelength range of 350-1000nm and a waveform accuracy of + -0.3 nm, and the test data are shown in Table 1 below.
TABLE 1
Claims (5)
1. A healthy-lighting backlight, characterized in that the light source has: the light-emitting chip is located under the first fluorescent film layer, the first fluorescent film layer covers the light-emitting chip and presents an arch shape, the first fluorescent film layer is connected with the second fluorescent film layer above the light-emitting chip, the centers of gravity of the light-emitting chip, the first fluorescent film layer and the second fluorescent film layer are on the same vertical line, and the thickness ratio of the first fluorescent film layer to the second fluorescent film layer is 200-500:250-550; the preparation raw materials of the first fluorescent film layer comprise first fluorescent powder and silica gel, wherein the weight ratio of the first fluorescent powder to the silica gel is 15-60:20-40 parts; the preparation raw materials of the second fluorescent film layer comprise second fluorescent powder and silica gel, wherein the weight ratio of the second fluorescent powder to the silica gel is 30-60:10-40 parts; the first fluorescent powder is a mixture of blue fluorescent powder, green fluorescent powder, blue-green fluorescent powder, amber fluorescent powder, bright red fluorescent powder and red fluorescent powder;
the wavelength range of the blue fluorescent powder is 478nm, the green fluorescent powder 493nm, the blue-green fluorescent powder 537nm, the amber fluorescent powder 605nm, the bright red fluorescent powder 632nm and the red fluorescent powder 658nm, and the weight ratio of the six is 2-8:3-10:10-20:1-5:1-5:0.1-1; the wavelength range of the second fluorescent powder is 720-745nm.
2. A healthy-light backlight as claimed in claim 1, wherein the light-emitting chip is a blue light chip with a wavelength in the range of 455-462.5nm.
3. A healthy-lighting backlight as claimed in claim 1, characterized in that the method for producing the healthy-lighting backlight comprises the following steps:
(1) Mixing and stirring the first fluorescent powder and silica gel according to the weight ratio, and baking to obtain a first fluorescent film layer;
(2) Mixing and stirring the second fluorescent powder and silica gel according to the weight ratio, and baking to obtain a second fluorescent film layer;
(3) Pressing and cutting the first fluorescent film layer and the light-emitting chip in the step (1) to obtain a single-layer CSP light source, and then performing current test;
(4) And (3) pressing and cutting the second fluorescent film layer obtained in the step (2) and the single-layer CSP light source obtained in the step (3) to obtain a double-layer CSP light source, and then carrying out current test.
4. A healthy-light backlight according to claim 3, wherein the press-fit time in steps (3) and (4) is 3 to 10min and the press-fit temperature is 80 to 150 ℃.
5. A healthy-lighting backlight according to claim 3, characterized in that the current in step (3) is in the range of 3-750mA.
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| CN104051601A (en) * | 2014-06-26 | 2014-09-17 | 江门朗天照明有限公司 | LED packaging light source free from damage to visual system and manufacturing method thereof |
| EP3227735B1 (en) * | 2014-12-02 | 2024-05-01 | Innovations in Optics, Inc. | High radiance light emitting diode light engine |
| CN105702837B (en) * | 2015-12-10 | 2019-03-01 | 广东新光源电子科技有限公司 | A kind of imitative sunlight spectrum LED light source |
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| CN108922954A (en) * | 2018-06-25 | 2018-11-30 | 江苏罗化新材料有限公司 | A kind of duplicature CSPLED production method |
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