CN204102900U - Integral LED lamp plate encapsulating structure - Google Patents
Integral LED lamp plate encapsulating structure Download PDFInfo
- Publication number
- CN204102900U CN204102900U CN201420544585.9U CN201420544585U CN204102900U CN 204102900 U CN204102900 U CN 204102900U CN 201420544585 U CN201420544585 U CN 201420544585U CN 204102900 U CN204102900 U CN 204102900U
- Authority
- CN
- China
- Prior art keywords
- chip
- led
- pcb board
- pedestal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Integral LED lamp plate encapsulating structure, comprises pcb board, LED-baseplate and LED chip.Pcb board is provided with equally spaced hole, LED-baseplate is provided with equally spaced pedestal, hole is corresponding with pedestal, base height and pcb board consistency of thickness, pedestal profile and size are mated with hole, pcb board is provided with drive circuit, and the constant current IC chip in drive circuit is the bare chip do not encapsulated, and accesses drive circuit by bonding gold thread B; LED chip is the bare chip do not encapsulated, and pedestal has chip groove, and LED chip is arranged in chip groove, is connected to drive circuit by bonding gold thread A; LED chip and constant current IC chip are coated with fluorescent adhesive layer; Fluorescent adhesive layer also covers bonding gold thread A and bonding gold thread B.This structure can reduce LED lamp panel thermal resistance, and improve lamp plate heat dispersion, prolonging service lives of lamps, reduces costs and complex process degree.
Description
Technical field
The utility model belongs to LED illumination and encapsulation technology, especially relevant with integral LED lamp plate encapsulating structure.
Background technology
Along with the universal of LED illumination lamp and high strength integrated circuit development, traditional LED lamp packaged type, no matter the growth requirement being cost and product stability have been difficult to meet LED illumination lamp.
Present stage, LED lamp panel packaged type was: by LED chip glue Surface Mount in cup-shape electrode metal or other substrate surfaces; then with superfine plain conductor by LED chip Electrode connection to electrode of substrate; high index of refraction colloid is utilized to fill whole substrate; play a protective role; just obtain on this basis one can be luminous LED element; then the LED element of single utilized series-parallel mode to be fixed on pcb board by Reflow Soldering or other welding manners, recycling Switching Power Supply or resistance-capacitance depressurization mode provide the condition of work of normal table.Due to present stage encapsulation, to there is equipment investment many with application technology, and manufacturing procedure is loaded down with trivial details just causes the high major reason of cost.The technique Surface Mount simultaneously packaged LED element being passed through again to weld is on PCB substrate, this operation turn increases the thermal resistance between LED-baseplate and pcb board, greatly reduce LED normal service life, again because contain multiple electric capacity and other electronic components in Switching Power Supply, reduce the stability of Total Product, and resistance-capacitance depressurization mode reactive loss is large.
Therefore, need a kind of saving of exploitation process costs, reduce LED lamp panel thermal resistance, the encapsulating structure in LED lamp life-span can be extended.
Utility model content
The utility model provides integral LED lamp plate encapsulating structure, realizes saving process costs, reduces LED lamp panel thermal resistance, extends the effect in LED lamp life-span.
In order to realize the purpose of this utility model, intend adopting following technology:
Integral LED lamp plate encapsulating structure, comprise pcb board (1), LED-baseplate (2) and LED chip (3), it is characterized in that: described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101); Described pcb board (1) is provided with drive circuit, and the constant current IC chip (7) in described drive circuit is the bare chip do not encapsulated, and described constant current IC chip (7) accesses drive circuit by bonding gold thread B (62); Described LED chip (3) is the bare chip do not encapsulated, described pedestal (201) there is chip groove (202), described LED chip (3) is arranged in chip groove (202), and described LED chip (3) is connected to drive circuit by bonding gold thread A (61);
Described LED chip (3) and constant current IC chip (7) are coated with fluorescent adhesive layer (5);
Described fluorescent adhesive layer (5) also covers bonding gold thread A (61) and bonding gold thread B (62).
Further, described hole (101) are circular hole or square hole, and the pedestal matched (201) is for circular or square.
Further, described LED chip (3) is fixed in chip groove (202) by die bond glue-line (4), achieve direct welding (fixing), eliminate traditional support, not only save raw material, also reduce the thermal resistance between LED chip (3) and LED-baseplate (2), the heat dispersion of whole LED lamp panel (chip) can be improved, described chip groove (202) is the truncated cone stood upside down, its sidewall inclination angle is 0 ° ~ 90 °, more by the side luminescence back of LED chip (3) out, the light extraction efficiency of whole LED lamp panel can be improved.
Further, described chip groove (202) is the truncated cone stood upside down, and its sidewall inclination angle is 0 ° ~ 90 °.
Further, described pcb board (1) is close to LED-baseplate (2) top, and pcb board (1) profile and size are mated with LED-baseplate (2).
The blue light that LED chip (3) sends, after fluorescent adhesive layer (5), sends white light, and meanwhile, fluorescent adhesive layer (5) can also play sealing and protective effect.
The beneficial effects of the utility model are:
1, LED chip is set directly in LED-baseplate, instead of the packaged type of traditional " chip+support+heat-radiating substrate ", decreases the thermal resistance from LED chip to LED-baseplate, improve the heat dispersion of LED lamp panel;
2, base height and pcb board consistency of thickness, after assembling, makes pcb board surfacing consistent, is convenient to full-filling fluorescent glue;
3, chip groove is the truncated cone stood upside down, and more by LED chip side luminescence back out, can improve the light extraction efficiency of whole LED lamp panel;
4, adopt the constant current IC chip do not encapsulated, be set directly on pcb board, utilize fluorescent glue to encapsulate, eliminate the loaded down with trivial details of individual packages constant current IC;
5, pcb board is provided with circuit, is convenient to the electrical connection carrying out LED chip, also directly can arrange the electronic devices and components needed for driving LED chip simultaneously on pcb board, realize integrative packaging.
Accompanying drawing explanation
Fig. 1 shows decomposition texture schematic diagram of the present invention.
Fig. 2 shows the cross section view of pedestal of the present invention.
Fig. 3 shows the combining structure schematic diagram of LED-baseplate of the present invention and pcb board.
Fig. 4 shows the combining structure schematic diagram that the present invention covers the LED-baseplate after fluorescent adhesive layer and pcb board.
Fig. 5 shows the structural representation of the embodiment of the present invention.
Embodiment
As shown in Fig. 1 ~ 5, integral LED lamp plate encapsulating structure, comprises pcb board (1), LED-baseplate (2) and LED chip (3).Described pcb board (1) is close to LED-baseplate (2) top, and pcb board (1) profile and size are mated with LED-baseplate (2).Described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, described hole (101) is circular hole or square hole, the pedestal (201) matched is for circular or square, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101); Described pcb board (1) is provided with drive circuit, and the constant current IC chip (7) in described drive circuit is the bare chip do not encapsulated, and described constant current IC chip (7) accesses drive circuit by bonding gold thread B (62); Described LED chip (3) is the bare chip do not encapsulated, described pedestal (201) there is chip groove (202), described LED chip (3) is arranged in chip groove (202), and described LED chip (3) is connected to drive circuit by bonding gold thread A (61); Described LED chip (3) and constant current IC chip (7) are coated with fluorescent adhesive layer (5); Described fluorescent adhesive layer (5) also covers bonding gold thread A (61) and bonding gold thread B (62).
Described LED chip (3) is fixed in chip groove (202) by die bond glue-line (4), achieve direct welding (fixing), eliminate traditional support, not only save raw material, also reduce the thermal resistance between LED chip (3) and LED-baseplate (2), the heat dispersion of whole LED lamp panel (chip) can be improved, described chip groove (202) is the truncated cone stood upside down, its sidewall inclination angle is 0 ° ~ 90 °, more by the side luminescence back of LED chip (3) out, the light extraction efficiency of whole LED lamp panel can be improved.
The blue light that LED chip (3) sends, after fluorescent adhesive layer (5), sends white light, and meanwhile, fluorescent adhesive layer (5) can also play sealing and protective effect.
Claims (5)
1. integral LED lamp plate encapsulating structure, comprises pcb board (1), LED-baseplate (2) and LED chip (3), it is characterized in that:
Described pcb board (1) is provided with equally spaced hole (101), described LED-baseplate (2) is provided with equally spaced pedestal (201), described hole (101) and pedestal (201) one_to_one corresponding, the height of described pedestal (201) and the consistency of thickness of pcb board (1), the profile of described pedestal (201) and size are mated with hole (101);
Described pcb board (1) is provided with drive circuit, and the constant current IC chip (7) in described drive circuit is the bare chip do not encapsulated, and described constant current IC chip (7) accesses drive circuit by bonding gold thread B (62);
Described LED chip (3) is the bare chip do not encapsulated, described pedestal (201) there is chip groove (202), described LED chip (3) is arranged in chip groove (202), and described LED chip (3) is connected to drive circuit by bonding gold thread A (61);
Described LED chip (3) and constant current IC chip (7) are coated with fluorescent adhesive layer (5);
Described fluorescent adhesive layer (5) also covers bonding gold thread A (61) and bonding gold thread B (62).
2. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described hole (101) are circular hole or square hole, and the pedestal matched (201) is for circular or square.
3. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described LED chip (3) is fixed in chip groove (202) by die bond glue-line (4).
4. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described chip groove (202) is the truncated cone stood upside down, and its sidewall inclination angle is 0 ° ~ 90 °.
5. integral LED lamp plate encapsulating structure according to claim 1, is characterized in that, described pcb board (1) is close to LED-baseplate (2) top, and pcb board (1) profile and size are mated with LED-baseplate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420544585.9U CN204102900U (en) | 2014-09-22 | 2014-09-22 | Integral LED lamp plate encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420544585.9U CN204102900U (en) | 2014-09-22 | 2014-09-22 | Integral LED lamp plate encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204102900U true CN204102900U (en) | 2015-01-14 |
Family
ID=52271306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420544585.9U Expired - Fee Related CN204102900U (en) | 2014-09-22 | 2014-09-22 | Integral LED lamp plate encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204102900U (en) |
-
2014
- 2014-09-22 CN CN201420544585.9U patent/CN204102900U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150114 Termination date: 20150922 |
|
| EXPY | Termination of patent right or utility model |