CN204558524U - For the bar-shaped LED support of flip-chip - Google Patents

For the bar-shaped LED support of flip-chip Download PDF

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Publication number
CN204558524U
CN204558524U CN201520278187.1U CN201520278187U CN204558524U CN 204558524 U CN204558524 U CN 204558524U CN 201520278187 U CN201520278187 U CN 201520278187U CN 204558524 U CN204558524 U CN 204558524U
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CN
China
Prior art keywords
led chip
electrode
chip
support
flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201520278187.1U
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Chinese (zh)
Inventor
郭盛辉
苏水源
郑成亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Dacol Photoelectronics Technology Co Ltd
Original Assignee
Xiamen Dacol Photoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Xiamen Dacol Photoelectronics Technology Co Ltd filed Critical Xiamen Dacol Photoelectronics Technology Co Ltd
Priority to CN201520278187.1U priority Critical patent/CN204558524U/en
Application granted granted Critical
Publication of CN204558524U publication Critical patent/CN204558524U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of bar-shaped LED support for flip-chip, it comprises substrate, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, silver coating is provided with as stent electrode in crystal bonding area, and crystal bonding area forms an insulating barrier in a presumptive area, stent electrode is divided into two conductive regions by this insulating barrier, is designated as the first stent electrode and the second stent electrode; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.

Description

For the bar-shaped LED support of flip-chip
Technical field
The utility model belongs to LED and manufactures field, specifically a kind of bar-shaped LED support for flip-chip.
Background technology
Along with the fast development of LED technology, the performance such as brightness, life-span of LED is obtained for great lifting, make the application of LED more and more extensive, from outdoor lightings such as street lamps to room lightings such as decorative lamps, use all one after another or be replaced with LED as light source.Meanwhile, LED has that efficiency is high, life-span length, power and energy saving, vibration strength is good, reaction speed is fast, reliability is high, Environmental Safety, not containing advantages such as harmful substance such as Hg, be applied in the every field of illumination more and more widely.
The encapsulating structure of LED surface attaching type (SMD) has become main packing forms due to advantages such as its application are convenient and volume is little.LED surface surface mount package structure conventional in prior art, generally comprises a support, has one and be mounted on LED chip in support by die bond technique in support.Rack surface is provided with metal lead wire, and the metal lead wire of LED chip both sides is provided with electrode, and the positive and negative electrode of LED chip is electrically connected with the electrode on support respectively by gold thread.In above-mentioned existing this encapsulating structure, there is following problem in it: because support adopts metallic support to be substrate, form also to cut after jetting plastic groove or the sealing of mold casting forming mode, therefore its temperature tolerance is not good, thermal diffusivity is not ideal enough, and microminiaturization not easily makes again.
Therefore, for solving the defect of above-mentioned existing encapsulating structure, Flip-Chip(flip-chip is created) encapsulation technology.Flip-chip is a kind of without pin configuration, generally containing circuit unit, is designed for the tin ball (conductive adhesive covered) be positioned on its face by right quantity, on electric and be mechanically connected to circuit.In conventional LED chip support, its electrode is located at the top of LED chip, can realize series connection by the mode of gold thread bonding.What flip-chip adopted is the mode that eutectic welds, and bonding chip bottom electrode and stent electrode, for flip-chip, as shown in Figure 1, label 1 is ambroin, and label 2 is LED chip, and label 31 mod sum label 32 is respectively the positive and negative electrode of support, as seen from the figure, electrode in the below of LED chip 2, therefore, its with conventional stent realize multiple chip be connected in parallel time, the most multipotency of quantity 3-4 in parallel, can not meet the occasion of some needs more chips parallel connections.
Utility model content
Therefore, for above-mentioned problem, the utility model proposes the bar-shaped LED support for flip-chip, the support of existing flip-chip is improved, thus realize the parallel connection of multiple flip-chip.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopts is, a kind of bar-shaped LED support for flip-chip, comprise substrate, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, is provided with silver coating as stent electrode in crystal bonding area, and crystal bonding area forms an insulating barrier in a presumptive area, stent electrode is divided into two conductive regions by this insulating barrier, is designated as the first stent electrode and the second stent electrode; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.
Further, each LED chip all has the first electrode and the second electrode (positive pole and negative pole), the first Electrode connection first stent electrode of LED chip, the second Electrode connection second stent electrode of LED chip.Like this, just achieve between each chip and be connected in parallel.Wherein, the first electrode of support can as support positive pole, and the second electrode of support is as the negative pole of support.
Further, described insulating barrier is the insulating barrier that PPA ambroin is made.
Further, described substrate is silver-plated copper substrate.
Further, described LED chip is coated with packing colloid, this packing colloid is by filling fluorescent material and sealing and formed in groove.
The bar-shaped LED support that the utility model adopts such scheme to realize, can realize the parallel connection of multiple flip-chip.Its structure is simple, easily makes, has good practicality.
Accompanying drawing explanation
Fig. 1 is the flip-chip support schematic diagram of prior art;
Fig. 2 is the schematic diagram (containing LED chip) of flip-chip support of the present utility model;
Fig. 3 is the vertical view (not containing LED chip) of flip-chip support of the present utility model.
Embodiment
Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.
As a specific embodiment, see Fig. 2 and Fig. 3, a kind of bar-shaped LED support for flip-chip, comprise substrate 100, substrate 100 upper surface is provided with one for placing the crystal bonding area of LED chip, is provided with silver coating as stent electrode in crystal bonding area, and crystal bonding area forms an insulating barrier 101 in a presumptive area, stent electrode is divided into two conductive regions by this insulating barrier 101, is designated as the first stent electrode 201 and the second stent electrode 202; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip 300 upside-down mounting is on this LED chip 300 fixed bit; The mode that LED chip 300 is welded by eutectic is by LED chip bottom electrode and support bonding.
See Fig. 2, in the present embodiment, have four LED chips 300, each LED chip all has the first electrode and the second electrode (positive pole and negative pole), the positive pole of LED chip 300 connects the first stent electrode 201, and the negative pole of LED chip 300 connects the second stent electrode 202.Wherein, the first electrode 201 of support is as support positive pole, and the second electrode 202 of support is as the negative pole of support.The support of application the present embodiment, LED chip 300 can arrange down in turn, realizes the scheme being greater than 4 chips in parallel.
Wherein, insulating barrier 101 is realized by PPA material (ambroin).Substrate 100 can be realized by silver-plated copper substrate.
In addition, LED chip is also coated with packing colloid, this packing colloid is by filling fluorescent material and sealing and formed in groove.
Although specifically show in conjunction with preferred embodiment and describe the utility model; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.

Claims (5)

1. the bar-shaped LED support for flip-chip, it is characterized in that: comprise substrate, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, silver coating is provided with as stent electrode in crystal bonding area, and crystal bonding area forms an insulating barrier in a presumptive area, stent electrode is divided into two conductive regions by this insulating barrier, is designated as the first stent electrode and the second stent electrode; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.
2. the bar-shaped LED support for flip-chip according to claim 1, it is characterized in that: each LED chip all has the first electrode and the second electrode, first Electrode connection first stent electrode of LED chip, the second Electrode connection second stent electrode of LED chip.
3. the bar-shaped LED support for flip-chip according to claim 1, is characterized in that: described insulating barrier is the insulating barrier that PPA ambroin is made.
4. the bar-shaped LED support for flip-chip according to claim 1, is characterized in that: described substrate is silver-plated copper substrate.
5. the bar-shaped LED support for flip-chip according to claim 1, is characterized in that: described LED chip is coated with packing colloid.
CN201520278187.1U 2015-05-04 2015-05-04 For the bar-shaped LED support of flip-chip Expired - Fee Related CN204558524U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520278187.1U CN204558524U (en) 2015-05-04 2015-05-04 For the bar-shaped LED support of flip-chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520278187.1U CN204558524U (en) 2015-05-04 2015-05-04 For the bar-shaped LED support of flip-chip

Publications (1)

Publication Number Publication Date
CN204558524U true CN204558524U (en) 2015-08-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520278187.1U Expired - Fee Related CN204558524U (en) 2015-05-04 2015-05-04 For the bar-shaped LED support of flip-chip

Country Status (1)

Country Link
CN (1) CN204558524U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114242870A (en) * 2021-12-22 2022-03-25 鸿利智汇集团股份有限公司 Wafer support, wafer support plate and wafer packaging method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114242870A (en) * 2021-12-22 2022-03-25 鸿利智汇集团股份有限公司 Wafer support, wafer support plate and wafer packaging method

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150812

Termination date: 20200504