CN204011481U - The separated also high reflectance circuit board of integrated LED chip of electric heating - Google Patents
The separated also high reflectance circuit board of integrated LED chip of electric heating Download PDFInfo
- Publication number
- CN204011481U CN204011481U CN201420328940.9U CN201420328940U CN204011481U CN 204011481 U CN204011481 U CN 204011481U CN 201420328940 U CN201420328940 U CN 201420328940U CN 204011481 U CN204011481 U CN 204011481U
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- China
- Prior art keywords
- led chip
- led
- solder joint
- circuit layer
- separated
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- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The high reflectance circuit board of the separated and integrated LED chip of electric heating, comprising: the heat dissipating layer of pressing, insulating barrier and circuit layer successively; The one side that described heat dissipating layer contacts with described insulating barrier is specular aluminium; On described circuit layer, possesses the hole slot that at least one is communicated to described specular aluminium; Be positioned in the specular aluminium of described hole slot at least one LED chip is installed; Described circuit layer is provided with at least one LED solder joint, the mutual independence of described LED solder joint and be arranged on the outside of described hole slot; The P utmost point of described LED chip is connected with described LED solder joint by gold thread respectively with the N utmost point; On described circuit layer, be also provided with an anodal and negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
Description
Technical field
The utility model relates to LED and manufactures field, relates in particular to a kind of LED circuit plate.
Background technology
Along with the progress of LED technology, heat radiation becomes the important bottleneck that restriction LED technology continues development.In traditional handicraft, on LED substrate, there is the aluminium lamination of being divided into, insulating barrier and copper foil layer; Copper and aluminium possess good thermal conductivity as metal material, but the existence due to insulating barrier, the thermal conductivity of this bi-material reduces greatly, and the heat that has therefore caused LED chip to produce cannot distribute in time, and high temperature has seriously shortened the life-span of LED chip for a long time.
Meanwhile, in traditional LED manufacture craft, each LED core all needs to connect encapsulation separately after both positive and negative polarity, has caused cost of manufacture increase, and anodally can block with negative pole the light that a part of LED chip sends, and causes luminous efficiency reduction.
In addition in traditional LED manufacture craft, with epoxy coating, reflect the light that LED chip sends, but the reflection efficiency of epoxy coating is lower, and can absorbs the light that a LED chip sends, caused traditional LED chip luminous efficiency not high.
Utility model content
Technical problem underlying to be solved in the utility model is to provide a kind of LED circuit plate, can realize high heat conduction, high reflection, and without each LED chip is encapsulated separately, increase the luminous efficiency of LED chip.
In order to solve above-mentioned technical problem, the utility model provides electric heating the separated also high reflectance circuit board of integrated LED chip, comprising:
The heat dissipating layer of pressing, insulating barrier and circuit layer successively; The one side that described heat dissipating layer contacts with described insulating barrier is specular aluminium; On described circuit layer, possesses the hole slot that at least one is communicated to described specular aluminium;
Be positioned in the specular aluminium of described hole slot at least one LED chip is installed;
Described circuit layer is provided with at least one LED solder joint, the mutual independence of described LED solder joint and be arranged on the outside of described hole slot; The P utmost point of described LED chip is connected with described LED solder joint by gold thread respectively with the N utmost point;
On described circuit layer, be also provided with an anodal and negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
In a preferred embodiment: the material of described circuit layer is Copper Foil; The material of described insulating barrier is epoxy resin.
In a preferred embodiment: described LED chip is flip LED chips.
Compared to prior art, the technical solution of the utility model possesses following beneficial effect:
1. it is separated that the technical scheme that the utility model provides has realized electric heating, because LED chip is directly installed on heat dissipating layer, so the heat that LED chip produces can pass by heat dissipating layer very in time.
2. in the technical scheme that the utility model provides, the one side that heat dissipating layer contacts with insulating barrier is specular aluminium, and reflectivity has reached 100%, so the light that LED chip sends can be reflected away completely, has increased luminous efficiency.
3. in the technical scheme that the utility model provides, LED chip shares a positive pole and a negative pole, so without LED chip is encapsulated separately, saved cost.Also avoid positive pole and negative pole to luminous the blocking of LED chip, improved luminous efficiency.
4. in the technical scheme that the utility model provides, LED chip adopts reverse installation process fixed installation, has further improved luminous efficiency.
Accompanying drawing explanation
Fig. 1 is the hierarchical diagram of circuit board in the utility model preferred embodiment;
Fig. 2 is the overall structure figure of circuit board in the utility model preferred embodiment.
Embodiment
Below with embodiment, the utility model is described further by reference to the accompanying drawings.
With reference to figure 1, Fig. 2.The separated also high reflectance circuit board of integrated LED chip of electric heating, comprising:
The heat dissipating layer 1 of pressing, insulating barrier 3 and circuit layer 4 successively; The one side that described heat dissipating layer 1 contacts with described insulating barrier 3 is specular aluminium 2; On described circuit layer 4, possesses at least one hole slot that is communicated to described specular aluminium 2 41; In the present embodiment, the material of described circuit layer 4 is Copper Foil; The material of described insulating barrier 3 is epoxy resin.
Be positioned in the specular aluminium 2 of described hole slot 41 at least one LED chip 43 is installed;
Described circuit layer is provided with at least one LED solder joint 42, the mutual independence of described LED solder joint 42 and be arranged on the outside of described hole slot 41; The P utmost point of described LED chip 43 is connected with described LED solder joint 42 by gold thread 44 respectively with the N utmost point; In the present embodiment, described LED chip 43 is flip LED chips.
On described circuit layer 4, be also provided with anodal 45 and one negative pole 46, described anodal 45 are connected with LED solder joint 42 described in each by circuit with negative pole 46.
The separated also high reflectance circuit board of integrated LED chip of electric heating providing in the present embodiment, LED chip 43 is directly installed on to heat dissipating layer 1 surface, and electrode is connected to circuit layer 4 by gold thread 44, thereby it is separated to have realized thermoelectricity, utilize the high thermal conduction characteristic of heat dissipating layer 1, the heat that LED chip 43 is produced is derived by heat dissipating layer 1 fast, has greatly increased radiating effect.
Meanwhile, the one side that heat dissipating layer contacts with insulating barrier is specular aluminium, and reflectivity is up to 100%, and light that LED chip sends can be reflected by specular aluminium completely like this, has increased the luminous efficiency of LED chip 43.In addition LED chip 43 shares a positive pole 45 and a negative pole 46, so without LED chip 43 is encapsulated separately, saved cost.Also avoid positive pole and negative pole to luminous the blocking of LED chip 43, further improved luminous efficiency.Finally, LED chip 43 adopts reverse installation process fixed installation, has also improved luminous efficiency.
So, the electric heating high reflectance circuit board contrast traditional handicraft separated and integrated LED chip providing in the present embodiment has promoted luminous efficiency greatly, thereby reach same luminous flux, the needed LED lamp of the technical solution of the utility model pearl quantity greatly reduces, so also reduce the whole caloric value of LED lamp pearl, increased the life-span of LED chip.
The above, it is only utility model preferred embodiment, not the technical scope of utility model is imposed any restrictions, therefore any trickle modification that every foundation technical spirit of the present utility model is done above example, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
Claims (3)
1. the high reflectance circuit board of the separated and integrated LED chip of electric heating, is characterized in that comprising:
The heat dissipating layer of pressing, insulating barrier and circuit layer successively; The one side that described heat dissipating layer contacts with described insulating barrier is specular aluminium; On described circuit layer, possesses the hole slot that at least one is communicated to described specular aluminium;
Be positioned in the specular aluminium of described hole slot at least one LED chip is installed;
Described circuit layer is provided with at least one LED solder joint, the mutual independence of described LED solder joint and be arranged on the outside of described hole slot; The P utmost point of described LED chip is connected with described LED solder joint by gold thread respectively with the N utmost point;
On described circuit layer, be also provided with an anodal and negative pole, described positive pole is connected with LED solder joint described in each by circuit with negative pole.
2. the separated also high reflectance circuit board of integrated LED chip of electric heating according to claim 1, is characterized in that: the material of described circuit layer is Copper Foil; The material of described insulating barrier is epoxy resin.
3. the separated also high reflectance circuit board of integrated LED chip of electric heating according to claim 1, is characterized in that: described LED chip is flip LED chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420328940.9U CN204011481U (en) | 2014-06-19 | 2014-06-19 | The separated also high reflectance circuit board of integrated LED chip of electric heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420328940.9U CN204011481U (en) | 2014-06-19 | 2014-06-19 | The separated also high reflectance circuit board of integrated LED chip of electric heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011481U true CN204011481U (en) | 2014-12-10 |
Family
ID=52051439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420328940.9U Expired - Fee Related CN204011481U (en) | 2014-06-19 | 2014-06-19 | The separated also high reflectance circuit board of integrated LED chip of electric heating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204011481U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280794A (en) * | 2014-06-19 | 2016-01-27 | 厦门汇耕电子工业有限公司 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
| CN107231743A (en) * | 2017-07-26 | 2017-10-03 | 中航海信光电技术有限公司 | Signal wire wiring method for module |
-
2014
- 2014-06-19 CN CN201420328940.9U patent/CN204011481U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280794A (en) * | 2014-06-19 | 2016-01-27 | 厦门汇耕电子工业有限公司 | Electric-thermal separated, LED chip integrated and high-reflectivity circuit board and manufacture method thereof |
| CN107231743A (en) * | 2017-07-26 | 2017-10-03 | 中航海信光电技术有限公司 | Signal wire wiring method for module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20180619 |
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| CF01 | Termination of patent right due to non-payment of annual fee |