CN204632800U

CN204632800U - For the series LED support of flip-chip

Info

Publication number: CN204632800U
Application number: CN201520278285.5U
Authority: CN
Inventors: 郭盛辉; 苏水源; 郑成亮
Original assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Current assignee: Xiamen Dacol Photoelectronics Technology Co Ltd
Priority date: 2015-05-04
Filing date: 2015-05-04
Publication date: 2015-09-09
Anticipated expiration: 2025-05-04

Abstract

The utility model discloses a kind of series LED support for flip-chip, it comprises substrate, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, silver coating is provided with as stent electrode in crystal bonding area, and crystal bonding area forms two insulating barriers in a presumptive area, be designated as the first insulating barrier and the second insulating barrier, stent electrode is divided into three conductive regions by the first insulating barrier and the second insulating barrier, is designated as the first stent electrode, the second stent electrode and the 3rd stent electrode; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.

Description

For the series LED support of flip-chip

Technical field

The utility model belongs to LED and manufactures field, specifically a kind of series LED support for flip-chip.

Background technology

Along with the fast development of LED technology, the performance such as brightness, life-span of LED is obtained for great lifting, make the application of LED more and more extensive, from outdoor lightings such as street lamps to room lightings such as decorative lamps, use all one after another or be replaced with LED as light source.Meanwhile, LED has that efficiency is high, life-span length, power and energy saving, vibration strength is good, reaction speed is fast, reliability is high, Environmental Safety, not containing advantages such as harmful substance such as Hg, be applied in the every field of illumination more and more widely.

The encapsulating structure of LED surface attaching type (SMD) has become main packing forms due to advantages such as its application are convenient and volume is little.LED surface surface mount package structure conventional in prior art, generally comprises a support, has one and be mounted on LED chip in support by die bond technique in support.Rack surface is provided with metal lead wire, and the metal lead wire of LED chip both sides is provided with electrode, and the positive and negative electrode of LED chip is electrically connected with the electrode on support respectively by gold thread.In above-mentioned existing this encapsulating structure, there is following problem in it: because support adopts metallic support to be substrate, form also to cut after jetting plastic groove or the sealing of mold casting forming mode, therefore its temperature tolerance is not good, thermal diffusivity is not ideal enough, and microminiaturization not easily makes again.

Therefore, for solving the defect of above-mentioned existing encapsulating structure, Flip-Chip(flip-chip is created) encapsulation technology.Flip-chip is a kind of without pin configuration, generally containing circuit unit, is designed for the tin ball (conductive adhesive covered) be positioned on its face by right quantity, on electric and be mechanically connected to circuit.In conventional LED chip support, its electrode is located at the top of LED chip, can realize series connection by the mode of gold thread bonding.What flip-chip adopted is the mode that eutectic welds, bonding chip bottom electrode and stent electrode, for flip-chip, as shown in Figure 1, label 1 is ambroin, label 2 is LED chip, label 31 mod sum label 32 is respectively positive and negative electrode, and as seen from the figure, electrode is in the below of LED chip 2, therefore, it cannot realize series connection by conventional stent.

Utility model content

Therefore, for above-mentioned problem, the utility model proposes the series LED support for flip-chip, the support of existing flip-chip is improved, thus realize the series connection of flip-chip.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopts is, a kind of series LED support for flip-chip, comprise substrate, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, silver coating is provided with as stent electrode in crystal bonding area, and crystal bonding area forms two insulating barriers in a presumptive area, be designated as the first insulating barrier and the second insulating barrier, stent electrode is divided into three conductive regions by the first insulating barrier and the second insulating barrier, is designated as the first stent electrode, the second stent electrode and the 3rd stent electrode; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.LED chip has the first electrode and the second electrode (positive pole and negative pole), is electrically connected respectively with stent electrode.

Further, described LED chip is provided with two, be designated as the first chip and the second chip respectively, the positive pole of the first chip connects the first stent electrode, the negative pole of the first chip connects the second stent electrode, the positive pole of the second chip connects the second stent electrode, and the negative pole of the second chip connects the 3rd stent electrode, thus realizes being connected in series of the first chip and the second chip; Wherein, the first stent electrode of support can as support positive pole, and the 3rd stent electrode of support is as the negative pole of support.

Further, described insulating barrier is the insulating barrier that PPA ambroin is made.

Further, described substrate is silver-plated copper substrate.

Further, described LED chip is coated with packing colloid, this packing colloid is by filling fluorescent material and sealing and formed in groove.

Existing traditional LED support (during for flip-chip) can only realize the scheme of monocrystalline or polycrystalline parallel connection, cannot realize tandem plan, and the utility model adopts scheme, frame bottom electrode is divided into three regions, can realizes the series connection of flip-chip.Its structure is simple, easily makes, has good practicality.

Accompanying drawing explanation

Fig. 1 is the flip-chip support schematic diagram of prior art;

Fig. 2 is the schematic diagram (containing LED chip) of flip-chip support of the present utility model;

Fig. 3 is the vertical view (not containing LED chip) of flip-chip support of the present utility model.

Embodiment

Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.

In the support of flip-chip of the prior art, flip-chip adopts the mode of eutectic weldering, bonding chip bottom electrode and stent electrode, and chip electrode is in the below of LED chip, and therefore, it cannot realize series connection by conventional stent, can only realize monocrystalline or polycrystalline parallel connection.The utility model overcomes this problem just, proposes a kind of LED support that can realize flip-chip series connection.

Scheme of the present utility model is that frame bottom electrode is divided into three regions, can realize the series connection of flip-chip.As a specific embodiment, see Fig. 2 and Fig. 3, a kind of series LED support for flip-chip, comprise substrate 100, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, silver coating is provided with as stent electrode in crystal bonding area, and crystal bonding area forms two insulating barriers in a presumptive area, be designated as the first insulating barrier 101 and the second insulating barrier 102, stent electrode is divided into three conductive regions by the first insulating barrier 101 and the second insulating barrier 102, is designated as the first stent electrode 201, second stent electrode 202 and the 3rd stent electrode 203; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.

In the present embodiment, described LED chip is provided with two, be designated as the first chip 301 and the second chip 302 respectively, the positive pole of the first chip 301 connects the first stent electrode 201, the negative pole of the first chip connects the second stent electrode, the negative pole that the positive pole of the second chip connects the second stent electrode 202, second chip connects the 3rd stent electrode 203, thus realizes being connected in series of the first chip 301 and the second chip 302; Wherein, the first stent electrode 201 of support can as support positive pole, and the 3rd stent electrode 203 of support is as the negative pole of support.

Wherein, insulating barrier 13 is realized by PPA material (ambroin).Substrate can be realized by silver-plated copper substrate.

In addition, LED chip is also coated with packing colloid, this packing colloid is by filling fluorescent material and sealing and formed in groove.

Although specifically show in conjunction with preferred embodiment and describe the utility model; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.

Claims

1. the series LED support for flip-chip, it is characterized in that: comprise substrate, upper surface of base plate is provided with one for placing the crystal bonding area of LED chip, silver coating is provided with as stent electrode in crystal bonding area, and crystal bonding area forms two insulating barriers in a presumptive area, be designated as the first insulating barrier and the second insulating barrier, stent electrode is divided into three conductive regions by the first insulating barrier and the second insulating barrier, is designated as the first stent electrode, the second stent electrode and the 3rd stent electrode; Be provided with multiple LED chip fixed bit in crystal bonding area, LED chip upside-down mounting is on this LED chip fixed bit; The mode that LED chip is welded by eutectic is by LED chip bottom electrode and support bonding.

2. the series LED support for flip-chip according to claim 1, it is characterized in that: described LED chip is provided with two, be designated as the first chip and the second chip respectively, the positive pole of the first chip connects the first stent electrode, the negative pole of the first chip connects the second stent electrode, the positive pole of the second chip connects the second stent electrode, and the negative pole of the second chip connects the 3rd stent electrode, thus realizes being connected in series of the first chip and the second chip.

3. the series LED support for flip-chip according to claim 1, is characterized in that: described insulating barrier is the insulating barrier that PPA ambroin is made.

4. the series LED support for flip-chip according to claim 1, is characterized in that: described substrate is silver-plated copper substrate.

5. the series LED support for flip-chip according to claim 1, is characterized in that: described LED chip is coated with packing colloid.