CN202888235U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN202888235U CN202888235U CN2012205366966U CN201220536696U CN202888235U CN 202888235 U CN202888235 U CN 202888235U CN 2012205366966 U CN2012205366966 U CN 2012205366966U CN 201220536696 U CN201220536696 U CN 201220536696U CN 202888235 U CN202888235 U CN 202888235U
- Authority
- CN
- China
- Prior art keywords
- optical lens
- layer
- led
- silica gel
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model relates to an LED, and especially relates to an LED packaging structure that exhibits an excellent heat radiation effect. The LED packaging structure comprises an LED chip, a substrate, a silica gel layer, an optical lens layer and a system circuit board. The substrate is placed on the system circuit board. The substrate is provided with a cupped bowl for accommodation of the LED chip, a positive conductive pin and a negative conductive pin that are used for leading out an anode and a cathode of the LED chip via gold threads, and a pedestal wrapping the positive conductive pin and the negative conductive pin. The LED chip is disposed in the cupped bowl of the substrate. The silica gel layer is disposed on the LED chip and fully covers the LED chip. The optical lens layer is arranged on the silica gel layer. The LED packaging structure is applied to improvement of heat radiation performance of the LED packaging structure.
Description
Technical field
The utility model relates to LED(Light-Emitting Diode, light-emitting diode), particularly relate to a kind of LED encapsulating structure with good radiating effect.
Background technology
LED has the characteristics such as energy-conserving and environment-protective, the life-span is long, response is fast, small and light, it is the lighting technology of a new generation, be widely used in that Landscape Lighting, automobile market, traffic lights market, outdoor large screen show and the field such as particular job illumination, just towards the future development of high brightness, high chromaticity, high weather resistance, high uniformity of luminance.The realization of high brightness mainly relies on high power (〉 1W), and a LED illumination high powerization key issue in the urgent need to address is heat radiation.
Both at home and abroad the research and development personnel in this field have done a large amount of fruitful work at heat sink material exploitation and the aspects such as selection, structural design and optimization, device operation principle, and still in the past heat dissipation design nearly all concentrates on chip substrate-heat sink hot-fluid approach.We know that the packing forms of LED mainly contains pinned encapsulation, paster type encapsulation and three kinds of forms of power-type encapsulation.The chip heat of pinned encapsulation is distributed mainly and is delivered to printed circuit board (PCB) by electrode pin, paster type encapsulation is connected on the circuit board by plastic tape lead-in wire chip carrier or sheet type pin, the power-type encapsulation is current main flow, comprises eutectic and covers brilliant two types.The heat radiation approach of LED has four: (1) lens surface dispels the heat in air; (2) by ceramic substrate directly to system circuit board heat conduction; (3) gold thread heat conduction; (4) through hole is to system circuit board heat conduction.Wherein the heat dissipation capacity of path (2) is maximum, and this also is the main concern of present heat dissipation design.
LED lens or layer of silica gel are not less than the area of dissipation of chip substrate to airborne area of dissipation, and the encapsulated layer surface is considerable to airborne heat radiation potentiality.Encapsulating material generally adopts epoxy resin, silica gel or modifying epoxy resin by organosilicon at present, and epoxy resin mainly is the bisphenol A-type transparent epoxy resin, and lens material also comprises the materials such as Merlon, polymethyl methacrylate, glass.The conductive coefficient of the used organic material of above-mentioned encapsulation is between 0.1-1.0W/mK, and the conductive coefficient of glass material only has several W/mK.Therefore, the reduction of encapsulated layer thermal resistance has very large space.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of LED encapsulating structure with good radiating effect, reduction encapsulated layer thermal resistance, thereby the heat-sinking capability of raising encapsulated layer.
In order to address the above problem, the technical scheme that the utility model adopts is that a kind of LED encapsulating structure comprises led chip, substrate, layer of silica gel, optical lens layer and system circuit board.Wherein, described substrate places on the system circuit board; The positive conductive feet that described substrate is provided with the cup of placing led chip, draw the both positive and negative polarity of led chip by gold thread and negative conductive feet and the pedestal that coats above-mentioned positive conductive feet and negative conductive feet; Described led chip is positioned in the cup of described substrate, and described layer of silica gel is located on the described led chip, and described layer of silica gel covers described led chip fully, and described optical lens layer is located on the described layer of silica gel.
Further, described layer of silica gel is the soft silica gel of high index of refraction, and refractive index is greater than 1.45.Described optical lens layer is the high index of refraction optical lens, and its refractive index is greater than 1.4.
Further, described optical lens layer is ceramic optical lens.The preferred ceramic optical lens that uses high thermal conductivity coefficient.Described optical lens layer can also be epoxy resin optical lens or glass optical lens.
The utility model reduces the encapsulated layer thermal resistance by said structure, has good radiating effect, thereby has improved the heat-sinking capability of LED.
Description of drawings
Fig. 1 is the structural representation of embodiment of the present utility model.
Embodiment
Now with embodiment the utility model is further specified by reference to the accompanying drawings.
As a specific embodiment of the present utility model, as shown in Figure 1, a kind of LED encapsulating structure of the present utility model comprises led chip 1, substrate 2, layer of silica gel 3, optical lens layer 4 and system circuit board 5.Wherein, described substrate 2 places on the system circuit board 5; The positive conductive feet that described substrate 2 is provided with the cup of placing led chip 1, draw the both positive and negative polarity of led chip 1 by gold thread 6 and negative conductive feet and the pedestal that coats above-mentioned positive conductive feet and negative conductive feet; Described led chip 1 is positioned in the cup of described substrate 2, and described layer of silica gel 3 is located on the described led chip 1, and described layer of silica gel 3 covers described led chip 1 fully, and described optical lens layer 4 is located on the described layer of silica gel 3.
Wherein, described layer of silica gel 3 is the soft silica gel of high index of refraction, and refractive index is greater than 1.45.Described optical lens layer 4 is high index of refraction optical lenses, and its refractive index is greater than 1.4.
Described optical lens layer 4 can be selected ceramic optical lens or epoxy resin optical lens or the glass optical lens of high thermal conductivity coefficient.In addition, the encapsulating material of its use also can select the pottery of high thermal conductivity coefficient or epoxy resin or glass to make
In actual applications, the packaging method of LED employing of the present utility model comprises liquid phase method or vapor phase method.Liquid phase method comprises dip coating, hydro thermal method, chemical precipitation method, sol-gel process, and vapor phase method comprises various vacuum coating technologies such as evaporation, sputtering method, CVD, PLD.
Also have, in the process of embedding layer of silica gel 3, can be in the silica gel of layer of silica gel 3 or epoxide-resin glue or add nanometer or the hollow nano particle of high thermal conductivity coefficient.The utility model adopts such scheme, has greatly improved the heat dispersion of LED, has good practicality.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (5)
1. a LED encapsulating structure is characterized in that: comprise led chip, substrate, layer of silica gel, optical lens layer and system circuit board; Wherein, described substrate places on the system circuit board; The positive conductive feet that described substrate is provided with the cup of placing led chip, draw the both positive and negative polarity of led chip by gold thread and negative conductive feet and the pedestal that coats above-mentioned positive conductive feet and negative conductive feet; Described led chip is positioned in the cup of described substrate, and described layer of silica gel is located on the described led chip, and described layer of silica gel covers described led chip fully, and described optical lens layer is located on the described layer of silica gel.
2. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described layer of silica gel is the soft silica gel of high index of refraction, and refractive index is greater than 1.45.
3. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described optical lens layer is the high index of refraction optical lens, and its refractive index is greater than 1.4.
4. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described optical lens layer is ceramic optical lens.
5. a kind of LED encapsulating structure according to claim 1, it is characterized in that: described optical lens layer is epoxy resin optical lens or glass optical lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205366966U CN202888235U (en) | 2012-10-19 | 2012-10-19 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012205366966U CN202888235U (en) | 2012-10-19 | 2012-10-19 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202888235U true CN202888235U (en) | 2013-04-17 |
Family
ID=48079630
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012205366966U Expired - Fee Related CN202888235U (en) | 2012-10-19 | 2012-10-19 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202888235U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824850A (en) * | 2014-02-18 | 2014-05-28 | 张红卫 | LED light source packaged with thin-wall ceramic lens |
| CN105324057A (en) * | 2013-06-20 | 2016-02-10 | 肖特嘉姆创公司 | Modular luminaires for appliance lighting |
| CN115267986A (en) * | 2022-08-15 | 2022-11-01 | 武汉锐科光纤激光技术股份有限公司 | Packaging structure and optical fiber coupler |
-
2012
- 2012-10-19 CN CN2012205366966U patent/CN202888235U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105324057A (en) * | 2013-06-20 | 2016-02-10 | 肖特嘉姆创公司 | Modular luminaires for appliance lighting |
| US11920776B2 (en) | 2013-06-20 | 2024-03-05 | Gemtron Corporation | Modular luminaires for appliance lighting |
| CN103824850A (en) * | 2014-02-18 | 2014-05-28 | 张红卫 | LED light source packaged with thin-wall ceramic lens |
| CN115267986A (en) * | 2022-08-15 | 2022-11-01 | 武汉锐科光纤激光技术股份有限公司 | Packaging structure and optical fiber coupler |
| CN115267986B (en) * | 2022-08-15 | 2024-01-26 | 武汉锐科光纤激光技术股份有限公司 | Packaging structure and optical fiber coupler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20141019 |
|
| EXPY | Termination of patent right or utility model |