CN205752232U - A kind of COB light module - Google Patents
A kind of COB light module Download PDFInfo
- Publication number
- CN205752232U CN205752232U CN201620418457.9U CN201620418457U CN205752232U CN 205752232 U CN205752232 U CN 205752232U CN 201620418457 U CN201620418457 U CN 201620418457U CN 205752232 U CN205752232 U CN 205752232U
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- Prior art keywords
- silica gel
- light module
- slide glass
- cob light
- fluorescence coating
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Abstract
The utility model discloses a kind of COB light module, this COB light module includes LED chip, circuit substrate, silica gel fluorescence coating, box dam, transparent silicon glue-line and pad, described circuit substrate Shang You slide glass district, described slide glass district is circuit substrate upper groove, described silica gel fluorescence coating is positioned at slide glass district, and described box dam is positioned at the periphery of transparent silicon glue-line.Described pad includes that positive terminal pad and negative terminal pad, described LED chip are arranged on slide glass district, and the positive pole of described LED chip is electrically connected with positive terminal pad by gold thread, and described LED chip negative pole is electrically connected with negative terminal pad by gold thread.This utility model solves the heat radiation of fluorescent material, it is to avoid colloid temperature overstep the extreme limit temperature cause colloid cracking problem;And this COB light module can improve hot spot, reduce cost, improve production efficiency.Silica gel fluorescence coating is put transparent silica gel and realizes less beam angle and bigger central light strength, promote the light efficiency of COB light module.
Description
Technical field
This utility model belongs to light emitting diode product encapsulation field, particularly relates to a kind of COB
Light module.
Background technology
In LED application, LED module is because of its super brightness, low-power consumption, service life
The features such as length, simple installation, are widely used in advertising lamp box, mark signboard, publicity instruction
The places such as mark, along with the gradually maturation of LED module technology, its range of application will be more
Extensively, in LED module, Chang Shiyong's is exactly COB encapsulation, but current COB encapsulating light emitting
Efficiency is low, and lighting angle is big, and hot spot is obvious, radiating effect is poor;And little light-emitting area is high-power
COB light source cost high, production efficiency is low.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is to provide one
COB light module, its light efficiency that can solve COB is not enough, fluorescent colloid due to temperature too high and
Cause the problem that colloid ftractures.
The purpose of this utility model realizes by the following technical solutions:
A kind of COB light module, including LED chip, circuit substrate, silica gel fluorescence coating, encloses
Dam, transparent silicon glue-line and pad, described circuit substrate has a slide glass district, described slide glass district are
A groove on circuit substrate, described silica gel fluorescence coating is positioned at slide glass district, described transparent silicon glue-line position
On silica gel fluorescence coating, described box dam is positioned at the periphery of transparent silicon glue-line;Described pad includes
Positive terminal pad and negative terminal pad, described LED chip is arranged on slide glass district, described LED chip
Positive pole is electrically connected with positive terminal pad by gold thread, and described LED chip negative pole passes through gold thread with negative
Pole pad is electrically connected with.
Preferably, the height of described silica gel fluorescence coating is identical with slide glass district height.Can be further
Solve the technical problem of the thickness of silica gel fluorescence coating.
Preferably, described box dam and transparent silicon glue-line is generally circular in shape.Can solve further to enclose
The problem of the shape of dam and transparent silicon glue-line.
Preferably, described transparent silicon glue-line covers silica gel fluorescence coating.Silica gel can be solved further glimmering
Photosphere and the size issue of transparent silicon glue-line.
Preferably, the projection on circuit substrate of the described transparent silicon glue-line and silica gel fluorescence coating are at electricity
On base board, projection overlaps.The size that can solve silica gel fluorescence coating and transparent silicon glue-line further is asked
Topic.
Compared to existing technology, the beneficial effects of the utility model are:
The COB light source of employing fluorescent material near field of the present utility model coating processes solves fluorescent material
Heat radiation, it is to avoid colloid temperature overstep the extreme limit temperature cause colloid cracking problem;And this COB
Light module can improve hot spot, reduces cost, improves production efficiency.Point on silica gel fluorescence coating
Transparent silica gel realizes less beam angle and bigger central light strength, promotes the light of COB light module
Effect.
Accompanying drawing explanation
Fig. 1 is the front view of this utility model a kind of COB light module;
Fig. 2 is the top view of this utility model a kind of COB light module.
Reference: 1, LED chip;2, circuit substrate;3, silica gel fluorescence coating;4、
Box dam;5, transparent silicon glue-line;6, positive terminal pad;7, negative terminal pad.
Detailed description of the invention
Below, in conjunction with accompanying drawing and detailed description of the invention, this utility model is described further:
As depicted in figs. 1 and 2, this utility model additionally provides a kind of COB light module, bag
Include LED chip 1, circuit substrate 2, silica gel fluorescence coating 3, box dam 4, transparent silicon glue-line 5 and
Pad, it is on circuit substrate 2 one that described circuit substrate 2 has a slide glass district, described slide glass district
Groove, described silica gel fluorescence coating 3 fills up slide glass district, the height of described silica gel fluorescence coating 3 and load
Section height is identical, that is to say that fluorescent glue is filled in slide glass district, fill up slide glass district and with slide glass district
Tie, fill and lead up the groove on script circuit substrate 2.It is glimmering that described transparent silicon glue-line 5 is positioned at silica gel
On photosphere 3, described silica gel fluorescence coating 3 and the transparent silicon glue-line 5 throwing on circuit substrate 2
The size of shadow is identical, and transparent silicon glue-line 5 primarily serves the effect of protection silica gel fluorescence coating 3 at this,
Described box dam 4 is positioned at the periphery of transparent silicon glue-line 5;Described box dam 4 and transparent silicon glue-line 5
Generally circular in shape, described box dam 4 is to prevent silica gel fluorescence coating 4 excessive.Described pad bag
Including positive terminal pad 6 and negative terminal pad 7, described LED chip 1 is arranged on slide glass district, described LED
The positive pole of chip 1 is electrically connected with positive terminal pad 6 by gold thread, described LED chip 1 negative pole
It is electrically connected with negative terminal pad 7 by gold thread.
It will be apparent to those skilled in the art that can technical scheme as described above and structure
Think, make other various corresponding changes and deformation, and all these changes and deformation
Within all should belonging to this utility model scope of the claims.
Claims (5)
1. a COB light module, it is characterised in that include LED chip, circuit substrate,
Silica gel fluorescence coating, box dam, transparent silicon glue-line and pad, described circuit substrate has a slide glass district,
Described slide glass district is a groove on circuit substrate, and described silica gel fluorescence coating fills up slide glass district, described
Transparent silicon glue-line is positioned on silica gel fluorescence coating, and described box dam is positioned at the periphery of transparent silicon glue-line;
Described pad includes that positive terminal pad and negative terminal pad, described LED chip are arranged on slide glass district, institute
The positive pole stating LED chip is electrically connected with positive terminal pad by gold thread, described LED chip negative pole
It is electrically connected with negative terminal pad by gold thread.
2. COB light module as claimed in claim 1, it is characterised in that described silica gel is glimmering
The height of photosphere is identical with slide glass district height.
3. COB light module as claimed in claim 1, it is characterised in that described box dam and
Transparent silicon glue-line generally circular in shape.
4. COB light module as claimed in claim 1, it is characterised in that described transparent silicon
Glue-line covers silica gel fluorescence coating.
5. COB light module as claimed in claim 4, it is characterised in that described transparent silicon
Glue-line projection on circuit substrate overlaps with the projection on circuit substrate of the silica gel fluorescence coating.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620418457.9U CN205752232U (en) | 2016-05-09 | 2016-05-09 | A kind of COB light module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620418457.9U CN205752232U (en) | 2016-05-09 | 2016-05-09 | A kind of COB light module |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205752232U true CN205752232U (en) | 2016-11-30 |
Family
ID=57370879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201620418457.9U Active CN205752232U (en) | 2016-05-09 | 2016-05-09 | A kind of COB light module |
Country Status (1)
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CN (1) | CN205752232U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105826453A (en) * | 2016-05-09 | 2016-08-03 | 广州硅能照明有限公司 | Preparation method of COB optical module and COB optical module |
CN107482000A (en) * | 2017-08-10 | 2017-12-15 | 广州硅能照明有限公司 | A kind of LED light source and preparation method thereof |
CN108565325A (en) * | 2018-02-01 | 2018-09-21 | 广州硅能照明有限公司 | COB substrate |
CN109817789A (en) * | 2018-12-25 | 2019-05-28 | 广州硅能照明有限公司 | A kind of COB encapsulation and preparation method thereof |
-
2016
- 2016-05-09 CN CN201620418457.9U patent/CN205752232U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105826453A (en) * | 2016-05-09 | 2016-08-03 | 广州硅能照明有限公司 | Preparation method of COB optical module and COB optical module |
CN107482000A (en) * | 2017-08-10 | 2017-12-15 | 广州硅能照明有限公司 | A kind of LED light source and preparation method thereof |
CN108565325A (en) * | 2018-02-01 | 2018-09-21 | 广州硅能照明有限公司 | COB substrate |
CN109817789A (en) * | 2018-12-25 | 2019-05-28 | 广州硅能照明有限公司 | A kind of COB encapsulation and preparation method thereof |
CN109817789B (en) * | 2018-12-25 | 2022-08-16 | 硅能光电半导体(广州)有限公司 | COB package and preparation method thereof |
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Legal Events
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 510000 Room 201, building A4, No. 11, Kaiyuan Avenue, Huangpu District, Guangzhou, Guangdong Patentee after: Silicon energy photoelectric semiconductor (Guangzhou) Co.,Ltd. Address before: 510000 second floor, building A4, No. 11, Kaiyuan Avenue, Science City, Guangzhou Development Zone, Guangzhou, Guangdong Patentee before: GUANGZHOU LEDTEEN OPTOELECTRONICS Co.,Ltd. |