CN202142578U - High power LED lamp silver based bonding wire packaging structure - Google Patents
High power LED lamp silver based bonding wire packaging structure Download PDFInfo
- Publication number
- CN202142578U CN202142578U CN201120211688U CN201120211688U CN202142578U CN 202142578 U CN202142578 U CN 202142578U CN 201120211688 U CN201120211688 U CN 201120211688U CN 201120211688 U CN201120211688 U CN 201120211688U CN 202142578 U CN202142578 U CN 202142578U
- Authority
- CN
- China
- Prior art keywords
- output pin
- base
- led chip
- plying
- negative pole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a high power LED (Light-Emitting Diode) lamp silver based bonding wire packaging structure, comprising an aluminium substrate base, an LED chip body, an anode output pin and a cathode output pin. The LED chip body is plastered on the upper surface of the aluminium substrate base through colloid; the anode and cathode of the LED chip body are respectively in electric connection with the anode output pin and the cathode output pin through metal lead wires; the anode output pin and the cathode output pin are respectively arranged on two sides above the LED chip body; the aluminium substrate base, the LED chip body, the anode output pin and the cathode output pin are all packed in a plastic-sealed body, and the ends of the anode output pin and the cathode output pin extend from the plastic-sealed body; the upper part and the lower part of the plastic-sealed body are respectively a transparent body and an opaque body; the LED chip body is located in the transparent body; the metal lead wires are silver based bonding wires. The utility model provides a high power LED lamp silver based bonding wire packaging structure which has a simple structure and low costs.
Description
(1), technical field: the utility model relates to a kind of LED encapsulating structure, and particularly a kind of high-powered LED lamp money base is good for the plying encapsulating structure.
(2), background technology: energy-conservation is the social concern of various countries, world today common concern with protecting environment, and it directly has influence on the sustainable development of human society.Lighting Industry to direct consumes energy; Hope to realize the green illumination of low energy consumption more; The birth of semiconductor green lighting source is described as the revolution of lighting field; Its sign is that semiconductor light-emitting-diode (LED) progresses into general lighting market as new type light source from special lighting market, and its market prospects are very wide.Fast development along with LED material epitaxy technology and chip technology makes the luminous efficiency of LED improve rapidly, and LED will replace conventional light source to become the green illumination light source of 21 century in the future.
But the LED production technology is comparatively complicated, and cost price is high, causes the LED slower development; At present, LED lamp on the market mostly is to encapsulate with the technology that the strong plying of auri is welded when encapsulating; Because the cost of the strong plying of auri is higher, thereby causes holding at high price of LED lamp.
(3), utility model content:
The technical problem that the utility model will solve is: not enough to prior art, and provide a kind of high-powered LED lamp money base simple in structure, that cost is low strong plying encapsulating structure.
The technical scheme of the utility model:
A kind of high-powered LED lamp money base is good for the plying encapsulating structure; Contain aluminium base base, led chip body, anodal output pin and negative pole output pin; The led chip body sticks on the upper surface of aluminium base base through colloid; The positive pole of led chip body and negative pole are connected electrically on anodal output pin and the negative pole output pin through metal lead wire respectively, and anodal output pin and negative pole output pin are separately positioned on the both sides of led chip body top, and aluminium base base, led chip body, anodal output pin and negative pole output pin all are encapsulated in the plastic-sealed body; And stretch out from plastic-sealed body the end of anodal output pin and negative pole output pin; The upper and lower of plastic-sealed body is respectively the transparent body and opaque body, and the led chip body is arranged in the transparent body, and metal lead wire is the strong plying of money base.
The both sides of aluminium base base are arranged in opaque body, and the middle part of aluminium base base, anodal output pin and negative pole output pin are positioned at the intersection of the transparent body and opaque body.
The material of the transparent body is for adding the transparent resin of fluorophor, perhaps for adding the transparent epoxy resin of fluorophor.
The content of silver is 99.99% in the strong plying of money base.
The beneficial effect of the utility model:
1. the utility model only is made up of aluminium base base, led chip body, anodal output pin, negative pole output pin and outside plastic-sealed body thereof; The upper and lower of plastic-sealed body is respectively the transparent body and opaque body, and it is simple in structure, cost of manufacture is low.
2. the metal lead wire in the utility model is the strong plying of money base, the strong plying cost of the strong relative auri of plying of money base is comparatively cheap, on the production line management more convenient, be difficult for losing; And the strong plying of money base extinction not, up to 90%, can increase the light of LED lamp 5%-10% to the reflectivity of visible light; The strong plying heat conduction of money base can reduce the temperature of led chip body than very fast, increases its life-span; The strong plying of money base can oxidation in air, and condition of storage is less demanding, and storage period is longer; The conjugation of the weld pad of aluminizing on strong plying of money base and the output pin is higher than the strong plying of auri, and good conductivity is fit to the encapsulation of high-powered LED lamp.
(4), description of drawings:
Fig. 1 is the structural representation of the strong plying encapsulating structure of high-powered LED lamp money base.
(5), embodiment:
Referring to Fig. 1; Among the figure; The strong plying encapsulating structure of high-powered LED lamp money base contains aluminium base base 4, led chip body 3, anodal output pin 2 and negative pole output pin 8; Led chip body 3 sticks on the upper surface of aluminium base base 4 through colloid 6; The positive pole of led chip body 3 and negative pole are connected electrically on anodal output pin 2 and the negative pole output pin 8 through metal lead wire 1,9 respectively, and anodal output pin 2 and negative pole output pin 8 are separately positioned on the both sides of led chip body 3 tops, and aluminium base base 4, led chip body 3, anodal output pin 2 and negative pole output pin 8 all are encapsulated in the plastic-sealed body; And stretch out from plastic-sealed body the end of anodal output pin 2 and negative pole output pin 8; The upper and lower of plastic-sealed body is respectively the transparent body 5 and opaque body 7, and led chip body 3 is arranged in the transparent body 5, and metal lead wire 1,9 is the strong plying of money base.
The both sides of aluminium base base 4 are arranged in opaque body 7, and the middle part of aluminium base base 4, anodal output pin 2 and negative pole output pin 8 are positioned at the intersection of the transparent body 5 and opaque body 7.
The material of the transparent body 5 is for adding the transparent resin of fluorophor.
The content of silver is 99.99% in the strong plying 1,9 of money base.
Claims (4)
1. a high-powered LED lamp money base is good for the plying encapsulating structure; Contain aluminium base base, led chip body, anodal output pin and negative pole output pin; The led chip body sticks on the upper surface of aluminium base base through colloid; The positive pole of led chip body and negative pole are connected electrically on anodal output pin and the negative pole output pin through metal lead wire respectively, it is characterized in that: anodal output pin and negative pole output pin are separately positioned on the both sides of led chip body top, and aluminium base base, led chip body, anodal output pin and negative pole output pin all are encapsulated in the plastic-sealed body; And stretch out from plastic-sealed body the end of anodal output pin and negative pole output pin; The upper and lower of plastic-sealed body is respectively the transparent body and opaque body, and the led chip body is arranged in the transparent body, and metal lead wire is the strong plying of money base.
2. high-powered LED lamp money base according to claim 1 is good for the plying encapsulating structure; It is characterized in that: the both sides of said aluminium base base are arranged in opaque body, and the middle part of aluminium base base, anodal output pin and negative pole output pin are positioned at the intersection of the transparent body and opaque body.
3. high-powered LED lamp money base according to claim 1 is good for the plying encapsulating structure, it is characterized in that: the material of the said transparent body is for adding the transparent resin of fluorophor, perhaps for adding the transparent epoxy resin of fluorophor.
4. high-powered LED lamp money base according to claim 1 is good for the plying encapsulating structure, it is characterized in that: the content of silver is 99.99% in the strong plying of said money base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120211688U CN202142578U (en) | 2011-06-22 | 2011-06-22 | High power LED lamp silver based bonding wire packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120211688U CN202142578U (en) | 2011-06-22 | 2011-06-22 | High power LED lamp silver based bonding wire packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202142578U true CN202142578U (en) | 2012-02-08 |
Family
ID=45553622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120211688U Expired - Fee Related CN202142578U (en) | 2011-06-22 | 2011-06-22 | High power LED lamp silver based bonding wire packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202142578U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103236486A (en) * | 2013-04-22 | 2013-08-07 | 立达信绿色照明股份有限公司 | LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure |
| CN103855144A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED filament and light-emitting device |
-
2011
- 2011-06-22 CN CN201120211688U patent/CN202142578U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103236486A (en) * | 2013-04-22 | 2013-08-07 | 立达信绿色照明股份有限公司 | LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure |
| CN103236486B (en) * | 2013-04-22 | 2017-04-26 | 厦门立达信绿色照明集团有限公司 | LED (light emitting diode) encapsulation method, encapsulation structure and LED lamp adopting encapsulation structure |
| CN103855144A (en) * | 2014-01-06 | 2014-06-11 | 深圳市瑞丰光电子股份有限公司 | LED filament and light-emitting device |
| CN103855144B (en) * | 2014-01-06 | 2016-08-17 | 深圳市瑞丰光电子股份有限公司 | LED filament and light-emitting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205752232U (en) | A kind of COB light module | |
| CN202142578U (en) | High power LED lamp silver based bonding wire packaging structure | |
| CN204696126U (en) | Based on the COB structure white light LED light source of ceramic phosphor encapsulation | |
| CN202474024U (en) | High-power LED packaging structure | |
| CN108321278A (en) | A kind of LED packagings | |
| CN201927603U (en) | Graphical LED (light-emitting diode) device | |
| CN204271135U (en) | The light source module that photoelectric conversion efficiency is high | |
| CN203589021U (en) | 360-degree light-transmitting LED lamp filament | |
| CN207967037U (en) | A kind of two-way LED encapsulation structure be connected | |
| CN202332954U (en) | Antistatic LED (light emitting diode) packaging structure | |
| CN206179896U (en) | Light emitting diode packaging structure | |
| CN201804862U (en) | Single three-chip LED particle | |
| CN201732811U (en) | LED packaging structure of solderless gold wire | |
| CN220209002U (en) | Energy-saving LED structure of nanometer optical chip | |
| CN201378598Y (en) | Encapsulation structure of high-power light emitting diode with high light emitting rate | |
| CN2835792Y (en) | High power LED lighting street lamp | |
| CN201696923U (en) | LED lamp with high light extracting rate | |
| CN205429005U (en) | Led packaging structure | |
| CN203883044U (en) | Novel surface mounted technology type LED | |
| CN202395031U (en) | High-power LED support structure | |
| CN203641936U (en) | LED bulb | |
| CN202423286U (en) | Integrated LED point light source | |
| CN213026171U (en) | High protection ultraviolet resistance's encapsulation pipe | |
| CN209180842U (en) | A kind of LED solar energy mushroom lamp | |
| CN207368008U (en) | Easy to the automobile lamp of glue dispensing and packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120208 Termination date: 20120622 |