CN203883044U - Novel surface mounted technology type LED - Google Patents
Novel surface mounted technology type LED Download PDFInfo
- Publication number
- CN203883044U CN203883044U CN201420222145.1U CN201420222145U CN203883044U CN 203883044 U CN203883044 U CN 203883044U CN 201420222145 U CN201420222145 U CN 201420222145U CN 203883044 U CN203883044 U CN 203883044U
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- CN
- China
- Prior art keywords
- colloid
- chip
- electrode pin
- packing colloid
- luminescence chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005516 engineering process Methods 0.000 title abstract description 9
- 239000000084 colloidal system Substances 0.000 claims abstract description 54
- 238000012856 packing Methods 0.000 claims description 31
- 238000004020 luminiscence type Methods 0.000 claims description 30
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000005457 optimization Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a novel surface mounted technology type LED which comprises a light emitting chip, a package colloid and an electrode pin. The light emitting chip is wrapped by the package colloid and is packaged in the package colloid. The electrode pin is led out of the bottom of the light emitting chip, one end of the electrode pin is electrically connected with the chip, and the other end of the electrode pin is exposed out of the package colloid. According to the novel surface mounted technology type LED, the light emitting chip is directly packaged by the package colloid, and a substrate for package is saved. The structure of the product is optimized further, the reduction of production cost is facilitated, and the heat radiation efficiency is raised. According to the novel surface mounted technology type LED, the application of SMT can be directly carried out.
Description
Technical field
The utility model relates to luminescent device, relates in particular to a kind of Novel patch formula light-emitting diode.
Background technology
LED (Light Emitting Diode), light-emitting diode, is a kind of solid-state semiconductor device, its function is to be directly that luminous energy distributes by electric energy conversion.Utilize LED lamp that its principle makes with respect to traditional incandescent lamp have that volume is little, power consumption is low, the advantage such as long service life and environmental protection.LED product category is various, and paster type light emitting type is exactly one of these products.The advantages such as it is large that paster type light emitting type has lighting angle, and production efficiency is high, and accuracy is good, and rosin joint rate is low, and quality is light, and volume is little, so be widely used.
Chip diode of the prior art comprises substrate 1 ﹑ luminescence chip 2 ﹑ plain conductor 3 ﹑ packing colloids 4, and luminescence chip is arranged on substrate 1, and as shown in Figure 1, luminescence chip need to encapsulate and contain plain conductor and be electrically connected on substrate.Time easily there is short circuit or the easily loosening problem that is connected with chip in encapsulation in the plain conductor of above-mentioned chip diode, and the luminescence chip of chip diode need to carry out while encapsulating on substrate, is unfavorable for the optimization problem of product structure.In view of this, be necessary above-mentioned paster type light emitting type to be further improved.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of Novel patch formula light-emitting diode, easily loosening problem of the connection while mainly solving chip diode complex structure and chip package.
The technical scheme that the utility model adopts is: a kind of Novel patch formula light-emitting diode is provided, comprises luminescence chip, packing colloid and electrode pin, described packing colloid parcel luminescence chip is also packaged in luminescence chip in packing colloid; The bottom of described luminescence chip leads to electrode pin, and described electrode pin one end is electrically connected with chip, and its other end exposes packing colloid.
Wherein, after described packing colloid encapsulating light emitting chip, packing colloid top shape is rectangle or pentagon.
In a preferred scheme, also comprise outer package colloid, described outer package colloid wrapping and encapsulating colloid is also packaged in outer package colloid.
In a preferred scheme, the material of described packing colloid and outer package colloid is fluorescent glue or transparent adhesive tape.
Useful technique effect of the present utility model is: easily loosening problem of the connection while being different from chip diode complex structure of the prior art and chip package, the utility model provides a kind of Novel patch formula light-emitting diode, mainly comprise luminescence chip and packing colloid, direct extraction electrode pin on this luminescence chip, is electrically connected stable.Except the face at luminescence chip place, the light that luminescence chip sends can penetrate from other five faces, can improve light efficiency.The utility model utilizes the direct encapsulating light emitting chip of packing colloid, has saved the substrate of encapsulation use.This product structure has obtained further optimization, is conducive to reduce production costs, and improves radiating efficiency.Paster type light emitting type of the present utility model can directly carry out the application of SMT technology.
Brief description of the drawings
Fig. 1 is the structural representation of paster type light emitting type in prior art;
Fig. 2 is the structural representation of Novel patch formula light-emitting diode of the present utility model;
Fig. 3 is the structural representation of the utility model one embodiment.
Label declaration:
1-substrate, 2-luminescence chip, 3-plain conductor, 4-packing colloid, 5-electrode pin, 6-outer package colloid.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, being realized object and effect, below in conjunction with execution mode and coordinate accompanying drawing to be explained in detail.
Novel patch formula Light-Emitting Diode of the present utility model, adopts packing colloid 4 directly luminescence chip 2 to be encapsulated, and has optimized product structure, has saved substrate, and the light that luminescence chip 2 sends is sent from other five faces except luminescence chip 2 place faces; Add, motor pin is directly drawn in the bottom of luminescence chip 2, is electrically connected stable.
Refer to Fig. 2, present embodiment Novel patch formula light-emitting diode, comprises luminescence chip 2, packing colloid 4 and electrode pin 5, and described packing colloid 4 wraps up luminescence chip 2 and luminescence chip 2 is packaged in packing colloid 4; The bottom of described luminescence chip 2 leads to electrode pin 5, and described electrode pin 5 one end are electrically connected with chip, and its other end exposes packing colloid 4.Paster type light emitting type is to adopt without substrate encapsulation structure and five or five with luminescent designs above, can directly carry out SMT application, has effectively promoted product heat dispersion, thereby has improved product light efficiency and useful life.Save substrate package, can improve packaging efficiency, reduce production costs, the structure of paster type light emitting type is optimized greatly.The design of electrode pin 5, is beneficial to and improves the stability being electrically connected.
In one embodiment, rear packing colloid 4 top shape of described packing colloid 4 encapsulating light emitting chip 2 are rectangle or pentagon.Packing colloid 4 tops be shaped as the design of rectangle or pentagon, to form difform hot spot, meet the different demands of different situations to hot spot.Be noted that rectangle or pentagon are the optimal design of this programme, the design of other shape all belongs in protection range of the present utility model.
Consult Fig. 3, in a preferred embodiment, also comprise outer package colloid 6, described outer package colloid 6 wrapping and encapsulating colloids 4 are also packaged in outer package colloid 6.The thickness of outer package colloid 6 is greater than the thickness of packing colloid 4, and external sealant colloid is to protect packing colloid 4 and the luminescence chip 2 of its parcel.
In a preferred scheme, the material of described packing colloid 4 and outer package colloid 6 is fluorescent glue or transparent adhesive tape.Fluorescent glue or transparent adhesive tape are conducive to the ejaculation of light, improve light efficiency.
The utility model provides a kind of Novel patch formula light-emitting diode, mainly comprises luminescence chip and packing colloid, and direct extraction electrode pin on this luminescence chip, is electrically connected stable.Except the face at luminescence chip place, the light that luminescence chip sends can penetrate from other five faces, can improve light efficiency.The utility model utilizes the direct encapsulating light emitting chip of packing colloid, has saved the substrate of encapsulation use.This product structure has obtained further optimization, is conducive to reduce production costs, and improves radiating efficiency.Paster type light emitting type of the present utility model can directly carry out the application of SMT technology.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (4)
1. a Novel patch formula light-emitting diode, is characterized in that, comprises luminescence chip, packing colloid and electrode pin, and described packing colloid parcel luminescence chip is also packaged in luminescence chip in packing colloid; The bottom of described luminescence chip leads to electrode pin, and described electrode pin one end is electrically connected with chip, and its other end exposes packing colloid.
2. Novel patch formula light-emitting diode according to claim 1, is characterized in that, after described packing colloid encapsulating light emitting chip, packing colloid top shape is rectangle or pentagon.
3. Novel patch formula light-emitting diode according to claim 1, is characterized in that, also comprises outer package colloid, and described outer package colloid wrapping and encapsulating colloid is also packaged in outer package colloid.
4. according to the Novel patch formula light-emitting diode described in claim 1-3 any one, it is characterized in that, the material of described packing colloid and outer package colloid is fluorescent glue or transparent adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420222145.1U CN203883044U (en) | 2014-04-30 | 2014-04-30 | Novel surface mounted technology type LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420222145.1U CN203883044U (en) | 2014-04-30 | 2014-04-30 | Novel surface mounted technology type LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203883044U true CN203883044U (en) | 2014-10-15 |
Family
ID=51683516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420222145.1U Expired - Lifetime CN203883044U (en) | 2014-04-30 | 2014-04-30 | Novel surface mounted technology type LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203883044U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109309153A (en) * | 2017-07-28 | 2019-02-05 | 晶元光电股份有限公司 | Light emitting device and method for manufacturing the same |
-
2014
- 2014-04-30 CN CN201420222145.1U patent/CN203883044U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109309153A (en) * | 2017-07-28 | 2019-02-05 | 晶元光电股份有限公司 | Light emitting device and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |