CN204857721U - High -power LED encapsulation paster - Google Patents
High -power LED encapsulation paster Download PDFInfo
- Publication number
- CN204857721U CN204857721U CN201520537305.6U CN201520537305U CN204857721U CN 204857721 U CN204857721 U CN 204857721U CN 201520537305 U CN201520537305 U CN 201520537305U CN 204857721 U CN204857721 U CN 204857721U
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- CN
- China
- Prior art keywords
- chip
- led
- paster
- heat sink
- led encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model provides a high -power LED encapsulation paster, including heat sink, pin, chip, metal lead wire, the embedment body, epoxy plastic -sealed body, its characterized in that: the heat sink cupped metallic object of bowl that is, the chip is pasted through wafer fixing glue on heat sink, the chip pass through metal lead wire with the pin is connected, the embedment body covers chip, metal lead wire, the chip of LED encapsulation paster is three, and just be " article " font and arrange, the chip of LED encapsulation paster is white light LED chip, or is glory LED chip. The utility model discloses simple structure, reliability nature is high, and three chips are horizontal stroke " article " font and arrange for the light that the chip side sent has obtained make full use of, has improved LED encapsulation paster unit area's luminous flux, and power is big, and luminous efficacy is high, three chips are horizontal stroke " article " font arranges, and it is even to arrange in the unit area, and whole radiating effect is good to the life of encapsulation chip has been improved.
Description
Technical field
The utility model relates to integrated LED lighting technical field, is specifically related to a kind of high-power LED encapsulation paster.
Background technology
Because LED light source has, luminous efficiency is high, power consumption is few, long service life, security reliability strong, is conducive to the characteristics such as environmental protection, obtains application in recent years in urban lighting environment.Under the background particularly raised once again in the worry of global energy shortage, LED more enjoys the whole world to attract attention in the prospect of illumination market.But current single chips LED cannot realize high light output amount.And mostly adopting the light source of plurality of LEDs to become wire assembled package in a led paster both at home and abroad, this mode to some extent solves the problem of single light-source brightness deficiency.But this technique manufacturing process is loaded down with trivial details, production efficiency is low, reliability is not high; And luminous flux in unit are is on the low side, light efficiency is lower, the more important thing is, chip is linearly placed, and arranges too intensive, and integral heat sink weak effect, chip bottom heat difficulty sheds thus affects the chip life-span.
Chinese patent 201310035706.7 has opened a kind of high brightness LED chip carrier structure with strong heat sinking function, comprising: fin, electrode, for by heat sink and the as a whole packing colloid of electrode package and colloidal silica; Be formed centrally depression downwards in fin and have heat dissipation region, LED chip is fixed on the upper surface of heat dissipation region; Packing colloid is filled in fin and makes them be separated in electrode and the gap between electrode with electrode to form to insulate, the lower surface of the heat dissipation region of fin and electrode exposed outside packing colloid away from one end of fin, packing colloid is formed with a up big and down small reflection hole above LED chip; This invention adopts the lower surface of the heat dissipation region of fin to be exposed to outside packing colloid, and it has the effect of strong heat radiation, but the chip in this technical scheme is linearly arranged, and the light of chip side luminous edge can not make full use of, and the luminous flux in unit are is lower.
Chinese patent 201320744856.0 discloses a kind of high-power integrated packaging chip array structure, comprise integrated substrate and some groups of LED luminescence chip groups, LED luminescence chip group is made up of several LED luminescence chips, LED luminescence chip is mounted on integrated substrate, adjacent LED luminescence chip group interlaced arrangement.This technical scheme can increase the area of dissipation of heat generating spot bottom single LEDs luminescence chip, makes heat evenly be distributed in integrated substrate fast and effectively, thus improves integral heat sink effect; And the light of LED luminescence chip side luminous edge is fully utilized, although brightness promotes to some extent, this technology does not solve the low problem of packaged chip unit are light efficiency yet.
In sum, above-mentioned prior art does not all have the problem that effective fix-rate LED paster unit are light efficiency is low.
Summary of the invention
For overcoming the low problem of the LED paster unit are light efficiency that exists in prior art, the utility model provides a kind of high-power LED encapsulation paster.
The technical solution of the utility model is: a kind of high-power LED encapsulation paster, comprises heat sink, pin, chip, metal lead wire, embedding body, it is characterized in that: the described heat sink metallic object for bowl cup-shaped; Described chip by crystal-bonding adhesive be pasted onto described heat sink on; Described chip is connected with described pin by metal lead wire; Described embedding body covers chip, metal lead wire; The chip of described LED paster is three, and the arrangement in triangle disposition.
Further, described LED paster also comprises epoxy-plastic packaging body.
As a kind of optional execution mode of the utility model, be together in series by plain conductor between described three chips; As the another kind of optional execution mode of the utility model, described three chips are together in parallel by plain conductor.
Further, as a kind of optional execution mode of the utility model, the chip of described LED paster is all White-light LED chip;
As a kind of optional execution mode of the utility model, the chip of described LED paster is all red LED chip or is all blue-light LED chip or is all yellow light LED chip or is all green LED chip;
As a kind of optional execution mode of the utility model, three chips of described LED paster are respectively red LED chip one, yellow light LED chip one, green LED chip one.
Further, the line angle at three chips centers of described LED paster 60 degree each other, three chips both in horizontal triangle disposition arrangement, also can be arranged in perpendicular triangle disposition.
Further, described embedding body is the mixture of transparent silica gel and fluorescent material.
Further, described heat sink be copper alloy or aluminium alloy.
Further, of the present utility modelly the chip unit that N number of isosceles triangle is arranged can also to be together in series, or to be together in parallel, or adopt connected mode in parallel again of first connecting, increase technique effect of the present utility model further.
Compared with prior art, the beneficial effects of the utility model are:
1, structure of the present utility model is simple, and reliability is high, and three chips are the arrangement of horizontal triangle disposition, and the light that sides of chip is sent is fully used, and improves the luminous flux in LED paster unit are, and power is large, and luminous efficiency is high.
2, the technical solution of the utility model, three chips are the arrangement of horizontal triangle disposition, and in unit are, arrangement evenly, and not intensive again, and integral heat sink is effective, thus improves the useful life of packaged chip.
3, the utility model both can prepare White-light LED chip, also can prepare colourama LED chip, product diversification, can meet the demand of different client.
4, can go here and there can also for the connected mode of the utility model three chips, and versatile and flexible, add the reliability and stability of product, also by the series connection of the chip unit of multiple triangle disposition or can be together in parallel, the light promoting chip further leads to effect.
5, embedding body of the present utility model is the mixture of transparent silica gel and fluorescent material, and packaging technology is convenient and swift, also can prevent the aging of fluorescent material and affect luminous efficiency, improves the useful life of chip.
Accompanying drawing explanation
Fig. 1 is the structural representation of high-power LED encapsulation paster of the present utility model;
Fig. 2 is the layout viewing of chip in perpendicular " product " of high-power LED encapsulation paster of the present utility model;
Fig. 3 is the layout viewing of chip in horizontal " product " of high-power LED encapsulation paster of the present utility model;
Description of reference numerals in figure: heat sink 1, pin 2, chip 3, metal lead wire 4, embedding body 5, epoxy-plastic packaging body 6.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Embodiment 1
As shown in Figure 1, a kind of high-power LED encapsulation paster, comprises heat sink 1, pin 2, chip 3, metal lead wire 4, embedding body 5, epoxy-plastic packaging body 6, and wherein, heat sink 1 is the metallic object of bowl cup-shaped, can be copper alloy or aluminium alloy; Chip 3 is pasted onto on heat sink 1 by crystal-bonding adhesive; Chip 3 is connected with pin 2 by metal lead wire 4; Embedding body 5 covers chip, metal lead wire; The chip of LED paster is three, and the arrangement in triangle disposition; Chip 3 has three, between be together in series by plain conductor.
In the present embodiment, three chips of LED paster are all White-light LED chip.
Structure of the present utility model is simple, and reliability is high, and three chips are the arrangement of horizontal triangle disposition, and the light that sides of chip is sent is fully used, and improves the luminous flux in LED paster unit are, and power is large, and luminous efficiency is high; And three chips are the arrangement of horizontal triangle disposition, in unit are, arrangement evenly, and not intensive again, and integral heat sink is effective, thus improves the useful life of packaged chip.
Embodiment 2
With reference to figure 1, a kind of high-power LED encapsulation paster, comprises heat sink 1, pin 2, chip 3, metal lead wire 4, embedding body 5, epoxy-plastic packaging body 6, and wherein, heat sink 1 is the metallic object of bowl cup-shaped, can be copper alloy or aluminium alloy; Chip 3 is pasted onto on heat sink 1 by crystal-bonding adhesive; Chip 3 is connected with pin 2 by metal lead wire 4; Embedding body 5 covers chip, metal lead wire; The chip of LED paster is three, and in perpendicular triangle disposition arrangement (as shown in Figure 2); The line angle at three chips centers 60 degree each other, between be together in parallel by plain conductor.
In the present embodiment, three chips of LED paster are all red LED chip or are all blue-light LED chip or are all yellow light LED chip or are all green LED chip.
The utility model can prepare colourama LED chip, product diversification, can meet the demand of different client.
Embodiment 3
With reference to figure 1, a kind of high-power LED encapsulation paster, comprises heat sink 1, pin 2, chip 3, metal lead wire 4, embedding body 5, epoxy-plastic packaging body 6, and wherein, heat sink 1 is the metallic object of bowl cup-shaped, can be copper alloy or aluminium alloy; Chip 3 is pasted onto on heat sink 1 by crystal-bonding adhesive; Chip 3 is connected with pin 2 by metal lead wire 4; Embedding body 5 covers chip, metal lead wire; The chip of LED paster is three, in horizontal triangle disposition arrangement (as shown in Figure 3); The line angle at three chips centers 60 degree each other, between be together in parallel by plain conductor.
In the present embodiment, three chips of LED paster are respectively red LED chip one, yellow light LED chip one, green LED chip one.
The technical solution of the utility model, by changing the arrangement mode of chip, achieving the high-power of single packaged chip, improve the luminous flux of chip.For 2835 chips, existing 2835 Chip scale are generally 0.1w, 0.2w, 0.5w, and adopt the technical solution of the utility model, and three chips are triangle disposition arrangement, and single chips achieves 0.9w, i.e. 9V100 milliampere, 6v150 milliampere.
Embodiment 4
With reference to figure 1, a kind of high-power LED encapsulation paster, comprises heat sink 1, pin 2, chip 3, metal lead wire 4, embedding body 5, epoxy-plastic packaging body 6, and wherein, heat sink 1 is the metallic object of bowl cup-shaped, can be copper alloy or aluminium alloy; Chip 3 is pasted onto on heat sink 1 by crystal-bonding adhesive; Chip 3 is connected with pin 2 by metal lead wire 4; Embedding body 5 covers chip, metal lead wire; The chip of LED paster is three, and the arrangement in triangle disposition; Chip 3 has three, between be together in series by plain conductor.
In the present embodiment, the chip unit that N number of isosceles triangle is arranged can be together in series, or be together in parallel, or adopt connected mode in parallel again of first connecting, the light promoting chip further leads to effect.
Embodiment 5
With reference to figure 1, a kind of high-power LED encapsulation paster, comprises heat sink 1, pin 2, chip 3, metal lead wire 4, embedding body 5, epoxy-plastic packaging body 6, and wherein, heat sink 1 is the metallic object of bowl cup-shaped, can be copper alloy or aluminium alloy; Chip 3 is pasted onto on heat sink 1 by crystal-bonding adhesive; Chip 3 is connected with pin 2 by metal lead wire 4; Embedding body 5 covers chip, metal lead wire; The chip of LED paster is three, and the arrangement in triangle disposition; Chip 3 has three, between be together in series by plain conductor.
In the present embodiment, embedding body 5 is the mixture of transparent silica gel and fluorescent material.
Embedding body of the present utility model is the mixture of transparent silica gel and fluorescent material, and packaging technology is convenient and swift, also can prevent the aging of fluorescent material and affect luminous efficiency, improves the useful life of chip.
Above-mentioned explanation illustrate and describes preferred embodiment of the present utility model, as previously mentioned, be to be understood that the utility model is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in utility model contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from spirit and scope of the present utility model, then all should in the protection range of the utility model claims.
Claims (9)
1. a high-power LED encapsulation paster, comprise heat sink (1), pin (2), chip (3), metal lead wire (4), embedding body (5), it is characterized in that: the metallic object that described heat sink (1) is bowl cup-shaped; Described chip (3) is pasted onto on described heat sink (1) by crystal-bonding adhesive; Described chip (3) is connected with described pin (2) by metal lead wire (4); Described embedding body (5) covers chip, metal lead wire; The chip of described LED paster is three, and the arrangement in triangle disposition.
2. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: also comprise epoxy-plastic packaging body (6).
3. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: be together in series by plain conductor between described three chips (3).
4. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: described three chips (3) are together in parallel by plain conductor.
5. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: the chip (3) of described LED paster is all White-light LED chip.
6. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: the chip (3) of described LED paster is all red LED chip or is all blue-light LED chip or is all yellow light LED chip or is all green LED chip.
7. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: three chips (3) of described LED paster are respectively red LED chip, yellow light LED chip, green LED chip.
8. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: the line angle at three chips centers of described LED paster 60 degree each other.
9. a kind of high-power LED encapsulation paster according to claim 1, is characterized in that: described heat sink (1) is copper alloy or aluminium alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520537305.6U CN204857721U (en) | 2015-07-23 | 2015-07-23 | High -power LED encapsulation paster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520537305.6U CN204857721U (en) | 2015-07-23 | 2015-07-23 | High -power LED encapsulation paster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204857721U true CN204857721U (en) | 2015-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520537305.6U Expired - Fee Related CN204857721U (en) | 2015-07-23 | 2015-07-23 | High -power LED encapsulation paster |
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| Country | Link |
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| CN (1) | CN204857721U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582350A (en) * | 2019-09-29 | 2021-03-30 | 江苏长电科技股份有限公司 | Cavity type packaging structure and packaging method |
-
2015
- 2015-07-23 CN CN201520537305.6U patent/CN204857721U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112582350A (en) * | 2019-09-29 | 2021-03-30 | 江苏长电科技股份有限公司 | Cavity type packaging structure and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151209 Termination date: 20180723 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |