CN202695442U - High-brightness light-emitting diode packaging device - Google Patents
High-brightness light-emitting diode packaging device Download PDFInfo
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- CN202695442U CN202695442U CN2012203300771U CN201220330077U CN202695442U CN 202695442 U CN202695442 U CN 202695442U CN 2012203300771 U CN2012203300771 U CN 2012203300771U CN 201220330077 U CN201220330077 U CN 201220330077U CN 202695442 U CN202695442 U CN 202695442U
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- light emitting
- high brightness
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 239000013078 crystal Substances 0.000 claims abstract description 79
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000002245 particle Substances 0.000 claims description 71
- 238000005538 encapsulation Methods 0.000 claims description 58
- 239000000463 material Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 238000007639 printing Methods 0.000 claims description 7
- 230000008033 biological extinction Effects 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 239000007787 solid Substances 0.000 abstract description 4
- 238000007598 dipping method Methods 0.000 description 5
- 230000001413 cellular effect Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- Led Device Packages (AREA)
Abstract
The utility model relates to a high-brightness light-emitting diode packaging device, which comprises a substrate and a plurality of light-emitting diode crystal grains. The substrate comprises at least one die bonding unit, and each die bonding unit is provided with at least two die bonding planes which are respectively different in distance from the bottom surface of the substrate. The light emitting diode crystal grains are respectively fixed on the crystal fixing units, each crystal fixing surface is provided with at least one light emitting diode crystal grain, and the light emitting diode crystal grains are electrically connected with the substrate and are powered by the substrate to receive electric energy to generate light. The utility model discloses utilize the solid crystal face design of different plane heights, make emitting diode crystalline grain staggers respectively and sits in different plane heights, reduces the extinction effect between the adjacent solid crystal face when emitting diode crystalline grain is luminous, borrows this luminous luminance that improves whole emitting diode packaging hardware.
Description
Technical field
The utility model relates to a kind of packaging system of light-emitting diode, particularly relates to a kind of encapsulation device of light emitting diode that improves luminosity.
Background technology
Consult Fig. 1, be packaged with in early days the package structure for LED 1 of many LED crystal particle, comprise a substrate 11, many die bonds in the conplane LED crystal particle 12 of this substrate 11, and a packaging adhesive material 13.
Described LED crystal particle 12 is to be electrically connected on this substrate 11, and is hedged off from the outer world with the solid envelope of the packaging adhesive material 13 of printing opacity again, avoids such as the impact of the external environments such as moisture infiltration and the working life of LED crystal particle 12 as described in reducing.But such package structure for LED 1 is when being made described LED crystal particle 12 luminous to 12 power supplies of described LED crystal particle by this substrate 11, described LED crystal particle 12 phenomenon of mutual extinction, interference can occur to each other, and can't reach the luminosity of expection.
Afterwards, develop improved LED encapsulating structure 2 as shown in Figure 2, it comprises a substrate 21, many LED crystal particle 22, and a packaging adhesive material 23.
This substrate 21 comprises a plurality of encapsulation grooves 213 that are spaced and extended to the bottom by these substrate 21 end faces, and bottom surface 211 of each encapsulation groove 213 all is positioned at same level.
Described LED crystal particle 22 is distributed in the described encapsulation groove 213, and is arranged at respectively on the bottom surface 211 of each encapsulation groove 213, and is electrically connected and can obtains external electric energy and produce light via this substrate 21 with this substrate 21.
This packaging adhesive material 23 fills up described encapsulation groove 213 and coats LED crystal particle 22 in its inside, described LED crystal particle 22 is hedged off from the outer world and avoids being subjected in the environment gas or influence of moisture causes ahead of time declining.
When through 21 pairs of described LED crystal particle 22 power supplies of this substrate, LED crystal particle 22 produces light, the light part that produces directly passes this packaging adhesive material 23 to the external world, part is absorbed by this substrate 21 and is transformed into used heat, and part passes this packaging adhesive material 23 to the external world after internal face 212 reflections of described encapsulation groove 213.
Although above-mentioned package structure for LED 2 relies on described LED crystal particle 22 is arranged at respectively in other encapsulation groove 213, and reduce the each other problem of extinction, but because described LED crystal particle 22 is still and is positioned at the same level height, the effect that prevents light interference phenomena is limited, still can cause the relatively poor problem that affects the homogeneous tube luminosity of the uniformity of bright dipping.
This shows, above-mentioned existing LED crystal particle obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.Therefore how to found a kind of encapsulation device of light emitting diode of high brightness of new structure, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing LED crystal particle exists, the inventor is based on being engaged in for many years abundant practical experience and professional knowledge of this type of product design manufacturing, and the utilization of cooperation scientific principle, positive research and innovation in addition, encapsulation device of light emitting diode to the high brightness of founding a kind of new structure, can improve general existing LED crystal particle, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the utility model that has practical value.
Summary of the invention
The purpose of this utility model is to overcome the defective that existing LED crystal particle exists, and provide a kind of encapsulation device of light emitting diode of high brightness of new structure, technical problem to be solved is to make it be to provide a kind of encapsulation device of light emitting diode that can improve brightness and can improve the high brightness of outgoing light homogeneity, is very suitable for practicality.
The purpose of this utility model and to solve its technical problem be to adopt following technical scheme to realize.Encapsulation device of light emitting diode according to a kind of high brightness that the utility model proposes comprises a substrate, and many are electrically connected on this substrate and convert electric energy to the LED crystal particle that luminous energy disengages when the externally fed via this substrate; It is characterized in that: this substrate comprises at least one die bond unit, and this die bond unit has at least two die bond faces that do not wait with this substrate bottom surface distance respectively, and described LED crystal particle, be arranged on this die bond unit and each die bond face of this die bond unit at least set a LED crystal particle is arranged.
The purpose of this utility model and solve its technical problem and can also be further achieved by the following technical measures.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: the die bond unit of this substrate also has at least one reflective inclined-plane that connects two adjacent die bond face sides.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: the reflective inclined-plane of this die bond unit is provided with in addition at least one and is electrically connected with this substrate and luminous LED crystal particle when electric energy is provided.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: described die bond face is to be arranged in respectively rectangle plane parallel to each other.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: wantonly two adjacent die bond faces are electrically connected in rows with the minor face that is parallel to this die bond unit and are electrically connected with this substrate after the LED crystal particle on each die bond face again.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: wantonly two adjacent die bond faces are electrically connected with this substrate after with the LED crystal particle on each die bond face of electrically connecting perpendicular to the minor face arow of this die bond unit again.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: the circular plane of described die bond face.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: set has many LED crystal particle of arranging circlewise in each die bond face.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: described die bond face is arranged in respectively concentrically ringed annular appearance.
The encapsulation device of light emitting diode of aforesaid high brightness, it is characterized in that: the encapsulation device of light emitting diode of this high brightness also comprises one and is positioned on this substrate and the packaging adhesive material of printing opacity, this packaging adhesive material be coated on described LED crystal particle and make described LED crystal particle and external environment isolated.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: the die bond unit of this substrate has two die bond faces that do not wait with this substrate bottom surface distance.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: the die bond unit of this substrate also has one from extending obliquely apart from the die bond face periphery of this substrate bottom surface close together and can catoptrical reflective inclined-plane.
The encapsulation device of light emitting diode of aforesaid high brightness is characterized in that: the reflective inclined-plane of this die bond unit is provided with in addition at least one and is electrically connected with this substrate and luminous LED crystal particle when electric energy is provided.
The encapsulation device of light emitting diode of aforesaid high brightness, it is characterized in that: the encapsulation device of light emitting diode of this high brightness also comprises one and is positioned on this substrate and the packaging adhesive material of printing opacity, this packaging adhesive material be coated on described LED crystal particle and make described LED crystal particle and external environment isolated.
By technique scheme, the encapsulation device of light emitting diode of the utility model high brightness has following advantages and beneficial effect at least: utilize the die bond face of Different Plane height to design to reduce described LED crystal particle and be electrically connected when luminous and contiguous solid interplanar extinction and interference problem, improve simultaneously outgoing light homogeneity, and improve the luminosity of homogeneous tube encapsulation device of light emitting diode.
Above-mentioned explanation only is the general introduction of technical solutions of the utility model, for can clearer understanding technological means of the present utility model, and can be implemented according to the content of specification, and for above-mentioned and other objects, features and advantages of the present utility model can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is a cross-sectional schematic, and an early stage package structure for LED is described;
Fig. 2 is a cross-sectional schematic, and an Improvement type package structure for LED is described;
Fig. 3 is a schematic top plan view, and first preferred embodiment of the encapsulation device of light emitting diode of the utility model high brightness is described;
Fig. 4 is a cross-sectional schematic, and the arrangement of the LED crystal particle that comprises in this first preferred embodiment is described;
Fig. 5 is a schematic top plan view, and second preferred embodiment of the encapsulation device of light emitting diode of the utility model high brightness is described;
Fig. 6 is a schematic top plan view, and the another kind of die bond cellular construction in this second preferred embodiment is described;
Fig. 7 is a schematic top plan view, and the another kind of die bond cellular construction in this second preferred embodiment is described;
Fig. 8 is a schematic top plan view, and the another kind of die bond cellular construction in this second preferred embodiment is described;
Fig. 9 is a cross-sectional schematic, and the another kind of die bond cellular construction in the encapsulation device of light emitting diode of this novel high brightness is described.
Tool pipe execution mode
Be to reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the utility model, below in conjunction with accompanying drawing and preferred embodiment, its tool pipe execution mode of encapsulation device of light emitting diode, structure, feature and effect thereof to according to the high brightness that the utility model proposes are described in detail as follows.
Consult Fig. 3,4, first preferred embodiment of the encapsulation device of light emitting diode of the utility model high brightness comprises a substrate 3, many LED crystal particle 4, and a packaging adhesive material 5.
These substrate 3 end faces comprise the die bond unit 31 of a plurality of adjacent arrangements, each die bond unit 31 has two die bond faces 311 that do not wait with this substrate bottom surface distance respectively, the one, the die bond face 311A nearer apart from these substrate 3 bottom surfaces, with a die bond face 311B far away apart from these substrate 3 bottom surfaces, and described die bond face 311A, 311B is arranged in each other on the parallel lines respectively and (sees Fig. 3), but and each die bond unit 31 also has one and extended obliquely near the die bond face 311A side of substrate 31 bottom surfaces by this and to connect another away from reflective inclined-plane 312 of die bond face 311B and the reflection ray of these substrate 3 bottom surfaces.
In the practical application, each die bond unit 31 can have more than two respectively die bond face 311 and the reflective inclined-plane 312 that does not wait with this substrate 3 bottom surfaces distance, or this substrate 3 include only a die bond unit 31 also can, and be not limited only to the number that this first preferred embodiment is implemented.
Described LED crystal particle 4 is bonded to respectively on the described die bond face 311, each die bond face 311 is provided with a LED crystal particle 4 at least, and each die bond face 311 illustrates a LED crystal particle 4 and is representative in the diagram of this first preferred embodiment, described LED crystal particle 4 also is electrically connected with this substrate 3, and for reducing cost and promoting usable floor area, a kind of electric connection mode also is provided in this first preferred embodiment especially: 311 in the die bond face of described orthogonal marshalling via wire 6 (for example gold thread) with perpendicular to the electrical described LED crystal particle 4 (such as Fig. 3) that is arranged at respectively on the two adjacent die bond faces 311 of series connection of the minor face arow of each die bond unit 31, see through this substrate 3 by the external circuit (not shown) again, described wire 6 provides electric energy to described LED crystal particle 4, and described LED crystal particle 4 is namely accepted electric energy and luminous.In addition, certainly be arranged at respectively LED crystal particle 4 on the two adjacent die bond faces 311 also can see through described wire 6 with the minor face that is parallel to each die bond unit 31 in rows electrically series connection form a complete electric pathway, and luminous so that each LED crystal particle 4 all can obtain electric energy that external circuit provides.
This packaging adhesive material 5 is printing opacities and is covered in these substrate 3 end faces and coats the intrawares such as described LED crystal particle 4 and wire 6, make intraware and external environment isolated, to avoid the such environmental effects such as moisture and cause ahead of time declining of intraware, the described 4 real work life-spans of LED crystal particle have been shortened.On using, but this packaging adhesive material 5 also the doping fluorescent powder make this encapsulation device of light emitting diode send mixed light more even and that wave-length coverage is wider to form the light of different wavelength range.
When external electric energy that described LED crystal particle 4 is accepted to be provided by this substrate 3, can convert electric energy to light and penetrate and left by LED crystal particle 4 surfaces, again through packaging adhesive material 5 bright dippings of this printing opacity to extraneous.
When described LED crystal particle 4 is luminous, the light of advancing towards reflective inclined-plane 312 (namely being left the light of ejaculation by described LED crystal particle 4 sides), can via bright dipping after 312 reflections of reflective inclined-plane to extraneous, not only can improve the usefulness that is transformed into used heat after emitting brightness also can avoid light to be absorbed by this substrate 3 and affects this encapsulation device of light emitting diode.
Homogeneous tube, this first preferred embodiment lays respectively at the die bond face 311 that does not wait apart from this substrate 3 bottom surfaces because having two, with respect in the described encapsulating structure of prior art all die bond more can reduce by extinction, interference effect that 4 of contiguous LED crystal particle are sent the light time in conplane LED crystal particle.
Consult Fig. 5, second preferred embodiment of the encapsulation device of light emitting diode of the utility model high brightness is similar to this first preferred embodiment, and it does not exist together and only is the spread geometry of described die bond unit 31.
In this second preferred embodiment, above-mentioned interlaced regularly arranged apart from the nearer die bond face 311A in these substrate 3 bottoms and distant die bond face 311B, but not be arranged in parallel continuously in this first preferred embodiment.Borrow the intervals of die bond face 311A, 311B that a plurality of and substrate 3 bottom surfaces distance do not wait to arrange further to reduce described die bond to each other extinction, the interference problem when LED crystal particle 4 power supply light emitting of die bond face 311 of distinguishing.
Consult Fig. 6, Fig. 7, Fig. 8, in addition, the described die bond face 311 of preferred embodiment of the present utility model can also be circular plane as shown in Figure 6, and described die bond face 311A is different with this substrate 3 distances from bottom from die bond face 311B, or as Fig. 7, shown in Figure 8 with as described in die bond unit 31 be arranged in different loop configuration, and obtain better illumination effect.
Supplementary notes is in addition, of the present utility model focus on having differ with substrate 3 distances and the plane of set LED crystal particle 4 usefulness, therefore, the shape of each die bond unit 31 and each die bond face 311, arrange be not limited to described in this first preferred embodiment and this second preferred embodiment, the arrangement architecture of the rectangle to be used for illustrating, circular configuration, array structure or concentrically ringed loop configuration etc.; Further, each die bond face 311 also can additionally arrange many LED crystal particle 4 (being arranged in such as ring-type or array structure etc.) and promotes brightness, reduces the each other problem of extinction, interference.
The encapsulation device of light emitting diode of the utility model high brightness with described LED crystal particle 4 respectively die bond on the die bond unit 31 with die bond face 311 that two relative this substrate 3 bottom surfaces distances do not wait, to improve the extinction problem of described LED crystal particle 4 311 in described die bond face when luminous; Another special feature, the reflective inclined-plane 312 that is extended obliquely by above-mentioned relatively low die bond face 311A periphery is consisted of and can be reflected from described LED crystal particle 4 with the reflective characteristic material of height to send but the light of directly not advancing towards the external world, through producing the light harvesting effect towards extraneous bright dipping after the reflection at least one times, the external world is arrived in the light bright dipping that originally can't penetrate to the external world.
Consult Fig. 9, in the encapsulation device of light emitting diode of the utility model high brightness, each connects respectively on the reflective inclined-plane 312 of above-mentioned die bond face 311 also can be provided with at least one LED crystal particle 4, improve whereby the die bond density of this substrate 3, and then strengthen again the homogeneous tube luminosity of this encapsulation device of light emitting diode.
In sum, by LED crystal particle 4 is bonded to above-mentioned die bond unit 31 designed, with these substrate 3 bottom surfaces distance a plurality of die bond faces 311 that do not wait on, not only can lower the optical problem of extinction, interference, also strengthen light enhancing effect by the utilization on reflective inclined-plane 312, therefore can significantly improve the luminosity of the utility model high brightness LED packaging system, therefore really can reach the purpose of the utility model.
The above, it only is preferred embodiment of the present utility model, be not that the utility model is done any pro forma restriction, although the utility model discloses as above with preferred embodiment, yet be not to limit the utility model, any those skilled in the art, within not breaking away from the technical solutions of the utility model scope, when the structure that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solutions of the utility model, any simple modification that foundation technical spirit of the present utility model is done above embodiment, equivalent variations and modification all still belong in the scope of technical solutions of the utility model.
Claims (14)
1. the encapsulation device of light emitting diode of a high brightness comprises a substrate, and many are electrically connected on this substrate and convert electric energy to the LED crystal particle that luminous energy disengages when the externally fed via this substrate; It is characterized in that:
This substrate comprises at least one die bond unit, and this die bond unit has at least two die bond faces that do not wait with this substrate bottom surface distance respectively, and described LED crystal particle, be arranged on this die bond unit and each die bond face of this die bond unit at least set a LED crystal particle is arranged.
2. the encapsulation device of light emitting diode of high brightness according to claim 1, it is characterized in that: the die bond unit of this substrate also has at least one reflective inclined-plane that connects two adjacent die bond face sides.
3. the encapsulation device of light emitting diode of high brightness according to claim 2 is characterized in that: the reflective inclined-plane of this die bond unit is provided with in addition at least one and is electrically connected with this substrate and luminous LED crystal particle when electric energy is provided.
4. the encapsulation device of light emitting diode of high brightness according to claim 2, it is characterized in that: described die bond face is to be arranged in respectively rectangle plane parallel to each other.
5. the encapsulation device of light emitting diode of high brightness according to claim 4 is characterized in that: wantonly two adjacent die bond faces are electrically connected in rows with the minor face that is parallel to this die bond unit and are electrically connected with this substrate after the LED crystal particle on each die bond face again.
6. the encapsulation device of light emitting diode of high brightness according to claim 4 is characterized in that: wantonly two adjacent die bond faces are electrically connected with this substrate after with the LED crystal particle on each die bond face of electrically connecting perpendicular to the minor face arow of this die bond unit again.
7. the encapsulation device of light emitting diode of high brightness according to claim 2 is characterized in that: the circular plane of described die bond face.
8. the encapsulation device of light emitting diode of high brightness according to claim 7 is characterized in that: set has many LED crystal particle of arranging circlewise in each die bond face.
9. the encapsulation device of light emitting diode of high brightness according to claim 2, it is characterized in that: described die bond face is arranged in respectively concentrically ringed annular appearance.
10. the encapsulation device of light emitting diode of high brightness according to claim 2, it is characterized in that: the encapsulation device of light emitting diode of this high brightness also comprises one and is positioned on this substrate and the packaging adhesive material of printing opacity, this packaging adhesive material be coated on described LED crystal particle and make described LED crystal particle and external environment isolated.
11. the encapsulation device of light emitting diode of high brightness according to claim 1 is characterized in that: the die bond unit of this substrate has two die bond faces that do not wait with this substrate bottom surface distance.
12. the encapsulation device of light emitting diode of high brightness according to claim 11 is characterized in that: the die bond unit of this substrate also has one from extending obliquely apart from the die bond face periphery of this substrate bottom surface close together and can catoptrical reflective inclined-plane.
13. the encapsulation device of light emitting diode of high brightness according to claim 12 is characterized in that: the reflective inclined-plane of this die bond unit is provided with in addition at least one and is electrically connected with this substrate and luminous LED crystal particle when electric energy is provided.
14. the encapsulation device of light emitting diode of high brightness according to claim 13, it is characterized in that: the encapsulation device of light emitting diode of this high brightness also comprises one and is positioned on this substrate and the packaging adhesive material of printing opacity, this packaging adhesive material be coated on described LED crystal particle and make described LED crystal particle and external environment isolated.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100214247 | 2011-08-02 | ||
| TW100214247U TWM426144U (en) | 2011-08-02 | 2011-08-02 | A high brightness light-emitting diode package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202695442U true CN202695442U (en) | 2013-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203300771U Expired - Fee Related CN202695442U (en) | 2011-08-02 | 2012-07-05 | High-brightness light-emitting diode packaging device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202695442U (en) |
| TW (1) | TWM426144U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068666A (en) * | 2017-04-21 | 2017-08-18 | 蒋雪娇 | The package structure for LED and light fixture of thermal diffusivity can be improved |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023500553A (en) | 2019-09-19 | 2023-01-10 | ラディアント オプト‐エレクトロニクス （スーチョウ） カンパニー リミテッド | Light source structure, backlight module and display device |
-
2011
- 2011-08-02 TW TW100214247U patent/TWM426144U/en not_active IP Right Cessation
-
2012
- 2012-07-05 CN CN2012203300771U patent/CN202695442U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068666A (en) * | 2017-04-21 | 2017-08-18 | 蒋雪娇 | The package structure for LED and light fixture of thermal diffusivity can be improved |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM426144U (en) | 2012-04-01 |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171114 Address after: Lee Garden Building No. 33 Hongkong Tongluowan 19 Chinese Hysan Avenue, room 1907 Patentee after: Hongkong Raj Co. Ltd. Address before: Hsinchu Science Industrial Park, Taiwan, China, No. three, 3 industrial East Road, Hsinchu, China Patentee before: Lextar Electronics Corp. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20180705 |