CN204668351U - Encapsulate firm light-emitting diode - Google Patents
Encapsulate firm light-emitting diode Download PDFInfo
- Publication number
- CN204668351U CN204668351U CN201520269205.XU CN201520269205U CN204668351U CN 204668351 U CN204668351 U CN 204668351U CN 201520269205 U CN201520269205 U CN 201520269205U CN 204668351 U CN204668351 U CN 204668351U
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- CN
- China
- Prior art keywords
- light
- emitting diode
- substrate
- backlight unit
- packaging body
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- Expired - Fee Related
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Abstract
A kind ofly encapsulate firm light-emitting diode, comprise substrate, light-emitting diode chip for backlight unit, reflector and packaging body, this substrate comprises first surface and the second surface relative with first surface, the first surface of this substrate is provided with groove, the cross section of this groove is inverted T-shaped structure, this light-emitting diode chip for backlight unit is arranged on the first surface of substrate, and this packaging body is formed at substrate first surface, and packaging body covers described light-emitting diode chip for backlight unit and is filled in the groove on described substrate; This packaging body top is formed with a spherical depression downwards, and this depression is corresponding with described light-emitting diode chip for backlight unit, and this bottom surface, reflector is bonded to concave bottom and the forward being positioned at light-emitting diode chip for backlight unit goes out on light path.Therefore, the adaptation between its packaging body and substrate obtains effective reinforcement, improves encapsulation reliability, effectively prevents packaging body from coming off, and its reflection layer structure designs, and adds the rising angle of light-emitting diode.
Description
Technical field
The utility model relates to a kind of light-emitting diode, particularly relates to a kind ofly to encapsulate firm light-emitting diode.
Background technology
Compared to traditional light emitting source, light-emitting diode (Light Emitting Diode, LED) have lightweight, volume is little, energy-conserving and environment-protective, luminous efficiency advantages of higher, it is as a kind of novel light emitting source, has been widely used in the field such as instruction, display, decoration, backlight, general lighting and urban landscape more and more.
Existing package structure for LED generally includes substrate, the electrode be arranged on substrate, be positioned on substrate and the light-emitting diode chip for backlight unit be electrically connected with electrode and being arranged on substrate and the packaging body of covering luminousing diode chip; But, also come with some shortcomings in actual applications, such as: packaging body and substrate junction is right not causes packaging body to get loose from substrate even dropping; And the Centromedian light intensity of its beam angle of general light-emitting diode is comparatively strong, light intensity is around more weak, therefore, makes the light intensity of light-emitting diode side direction not enough, thus have the phenomenons such as limitation in application process.
Utility model content
Therefore, the purpose of this utility model is that providing a kind of encapsulates firm light-emitting diode.
A kind ofly encapsulate firm light-emitting diode, it is characterized in that: comprise substrate, light-emitting diode chip for backlight unit, reflector and packaging body, this substrate comprises first surface and the second surface relative with first surface, the first surface of this substrate is provided with groove, the cross section of this groove is inverted T-shaped structure, and its degree of depth is less than the thickness between substrate first surface and second surface, this light-emitting diode chip for backlight unit is arranged on the first surface of substrate, this packaging body is formed at substrate first surface, and this packaging body covers described light-emitting diode chip for backlight unit and is filled in the groove on described substrate, and this packaging body top is formed with a spherical depression downwards, and this depression is corresponding with described light-emitting diode chip for backlight unit, this bottom surface, reflector is incorporated into concave bottom, and the forward being positioned at light-emitting diode chip for backlight unit goes out on light path.
Further, described first groove and the second groove are arranged all ringwise.
Compared with prior art, the adaptation between the packaging body of this light-emitting diode and substrate obtains effective reinforcement, improves encapsulation reliability, effectively prevents packaging body from coming off, and its reflection layer structure designs, and considerably increases the rising angle of light-emitting diode.
Accompanying drawing explanation
The cutaway view of a kind of package structure for LED that Fig. 1 provides for an execution mode of the present utility model.
Fig. 2 is the vertical view of the package structure for LED in this Fig. 1.
Fig. 3 is the light reflectogram in the package structure for LED reflector in this Fig. 1.
Embodiment
In order to make the technical solution of the utility model more clearly show, below in conjunction with accompanying drawing, the utility model is described in further detail.
As shown in Figure 1 to Figure 3, for the package structure for LED 100 of the first execution mode of the present utility model, it comprises a substrate 10, setting light-emitting diode chip for backlight unit 20, two electrode 30, two plain conductor 50 on the substrate 10, covers the packaging body 40 of this light-emitting diode chip for backlight unit 20 and be arranged on the reflector 60 at packaging body 40 top.
Described substrate 10 is for supporting light-emitting diode chip for backlight unit 20 and packaging body 40, and it includes first surface 11 and the second surface 12 corresponding with this first surface 11.Described substrate 10 is formed with groove 70 on first surface 11, this groove 70 extends towards second surface 12 direction of substrate 10, and the degree of depth of this groove 70 is less than the thickness between substrate 10 first surface 11 and second surface 12; In the present embodiment, this groove 70 cross section is an inverted T-shape structure, and it is ringwise around electrode 30 and light-emitting diode chip for backlight unit 20.
Described electrode 30 to be arranged on substrate 10 and to be electrically connected with described light-emitting diode chip for backlight unit 20; This electrode 30 comprises the first spaced electrode 31 and the second electrode 32, and this first electrode 31, second electrode 32 to be arranged on substrate first surface 11 and to extend through substrate 10 to second surface 11.
Described light-emitting diode chip for backlight unit 20 is arranged on the first surface 11 of described substrate 10, and it is electrically connected with the first electrode 31, second electrode 32 respectively by plain conductor 50.
Described packaging body 40 is arranged on substrate 10, and this packaging body 40 to be covered on light-emitting diode chip for backlight unit 20 and the groove 70 filled up on substrate 10.The top of this packaging body 40 is formed with a depression downwards, and this depression is corresponding with light-emitting diode chip for backlight unit 20; Described reflector 60 is arranged in depression, and the forward being positioned at light-emitting diode chip for backlight unit 20 goes out on light path, and this reflector 60 has a bottom surface 61, and this bottom surface 61 is bonded to this concave bottom.In the present embodiment, depression bottom surface 61 is in Surface of Sphere.When light-emitting diode chip for backlight unit 20 is luminous, it sends the reflector 60 directly over a part of light directive light-emitting diode chip for backlight unit 20, under the reflex of bottom surface, reflector 61, light-emitting diode chip for backlight unit 20 is sent towards directly over light guiding light-emitting diode chip for backlight unit side, so, what can increase light-emitting diode goes out optical range.
Adaptation between the packaging body of light-emitting diode of the present utility model and substrate obtains effective reinforcement, improves encapsulation reliability, effectively prevents packaging body from coming off, and its reflection layer structure designs, and considerably increases the rising angle of light-emitting diode.
The above embodiment only have expressed a kind of execution mode of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (2)
1. the light-emitting diode that an encapsulation is firm, it is characterized in that: comprise substrate, light-emitting diode chip for backlight unit, reflector and packaging body, this substrate comprises first surface and the second surface relative with first surface, the first surface of this substrate is provided with groove, the cross section of this groove is inverted T-shaped structure, and its degree of depth is less than the thickness between substrate first surface and second surface, this light-emitting diode chip for backlight unit is arranged on the first surface of substrate, this packaging body is formed at substrate first surface, and this packaging body covers described light-emitting diode chip for backlight unit and is filled in the groove on described substrate, described packaging body top is formed with a spherical depression downwards, and this depression is corresponding with described light-emitting diode chip for backlight unit, and this bottom surface, reflector is incorporated into concave bottom, and the forward being positioned at light-emitting diode chip for backlight unit goes out on light path.
2. the light-emitting diode that encapsulation as claimed in claim 1 is firm, is characterized in that: described groove is arranged ringwise.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520269205.XU CN204668351U (en) | 2015-04-29 | 2015-04-29 | Encapsulate firm light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520269205.XU CN204668351U (en) | 2015-04-29 | 2015-04-29 | Encapsulate firm light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204668351U true CN204668351U (en) | 2015-09-23 |
Family
ID=54138706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520269205.XU Expired - Fee Related CN204668351U (en) | 2015-04-29 | 2015-04-29 | Encapsulate firm light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204668351U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112349822A (en) * | 2019-08-09 | 2021-02-09 | 佛山市国星光电股份有限公司 | LED device and backlight module |
| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
-
2015
- 2015-04-29 CN CN201520269205.XU patent/CN204668351U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112349822A (en) * | 2019-08-09 | 2021-02-09 | 佛山市国星光电股份有限公司 | LED device and backlight module |
| CN112349822B (en) * | 2019-08-09 | 2022-03-18 | 佛山市国星光电股份有限公司 | LED device and backlight module |
| US11380827B2 (en) | 2019-08-09 | 2022-07-05 | Foshan Nationstar Optoelectronics Co., Ltd | Light emitting diode device and backlight module |
| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150923 Termination date: 20160429 |