CN208589460U - A kind of LED encapsulation structure - Google Patents
A kind of LED encapsulation structure Download PDFInfo
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- CN208589460U CN208589460U CN201820738980.9U CN201820738980U CN208589460U CN 208589460 U CN208589460 U CN 208589460U CN 201820738980 U CN201820738980 U CN 201820738980U CN 208589460 U CN208589460 U CN 208589460U
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- led
- led wafer
- packaging body
- encapsulation structure
- wafer
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Abstract
The utility model discloses a kind of LED encapsulation structures, including LED wafer, it further include the LED support for carrying the LED wafer, and the packaging body of the encapsulation LED wafer and the part LED support, a concave surface is offered at the top of the packaging body, the light that LED wafer issues is by packaging body refraction and top concave reflection, so that light injection is arranged at packaging body surrounding and top, light emitting angle is big and is evenly distributed, other than LED wafer lower end support portions dull thread projects, other angles can emit beam.
Description
Technical field
The utility model relates to LED fields, and in particular to a kind of LED encapsulation structure.
Background technique
Electrotransformation Cheng Guang is had the characteristics that radiationless and low energy consumption by Light-emitting diode LED, can also be in the control of computer
System is lower to generate different colors, and forms different photochromic combinations, forms the various images with dynamic change effect.
However in conventional LED encapsulation structure, the light emitting angle of light source chip is limited, and the light issued is uneven, is applied to open air
Or ideal effect is not achieved in brightness when Landscape Lamp.
Utility model content
Technical problem to be solved by the utility model is: the light emitting angle for overcoming and solving LED in the prior art is limited
Problem provides a kind of LED encapsulation structure that can effectively increase LED light emitting angle.
The utility model is to solve a kind of technical solution that its technical problem provides to be:
A kind of LED encapsulation structure, including LED wafer further include carrying the LED support of the LED wafer, and encapsulate institute
The packaging body of LED wafer and the part LED support is stated, offers a concave surface at the top of the packaging body.
As an improvement of the above technical solution, the concave surface is circular conical surface, the side of the circular conical surface and the packaging body
Vertical outer surface intersection.
As an improvement of the above technical solution, the surface of the LED wafer is covered with a phosphor powder layer.
As an improvement of the above technical solution, doped with fluorescent powder in the packaging body, the fluorescent powder is uniformly distributed in
In the packaging body.
As a further improvement of the above technical scheme, the fluorescent powder is yellow fluorescent powder, and the LED wafer is blue light
LED wafer.
As an improvement of the above technical solution, the LED support includes positive pin and negative pin, the LED wafer
It is fixed on the negative pin, the LED wafer is connect by gold thread with the positive pin and negative pin.
As a further improvement of the above technical scheme, the end of the negative pin, which is equipped with, accommodates the LED wafer
Accommodating chamber.
As a further improvement of the above technical scheme, the die bond face of the accommodating chamber, which is provided with, keeps the LED wafer solid
Due to the insulation colloid on the negative pin.
The advantageous effects of the utility model are: including LED wafer, LED support, and encapsulation LED wafer and part
The packaging body of LED support offers a concave surface at the top of packaging body.The light that LED wafer issues is reflected by packaging body and top
Concave reflection, so that light injection is arranged at packaging body surrounding and top, light emitting angle is big and is evenly distributed, in addition to LED wafer
Outside lower end support portions dull thread projects, other angles can emit beam.
Detailed description of the invention
Illustrate the technical scheme in the embodiment of the utility model in order to clearer, it below will be to required in embodiment description
Attached drawing to be used briefly describes.
Fig. 1 is the cross-sectional view of the LED encapsulation structure of the utility model one embodiment.
Fig. 2 is that the light of LED encapsulation structure shown in Fig. 1 moves towards figure.
Specific embodiment
It is carried out with reference to embodiments with technical effect of the attached drawing to the design of the utility model, specific structure and generation clear
Chu is fully described by, to fully understand the purpose of this utility model, scheme and effect.It should be noted that in the feelings not conflicted
The features in the embodiments and the embodiments of the present application can be combined with each other under condition.Furthermore used in the utility model it is upper,
Under, the descriptions such as left and right be only in opposite figure for each component part mutual alignment relation of the utility model.
Fig. 1 is the cross-sectional view of the LED encapsulation structure of the utility model one embodiment, and Fig. 2 is the encapsulation knot of LED shown in Fig. 1
The light of structure moves towards figure.
For Fig. 1 to Fig. 2 shows a kind of LED encapsulation structure, specially a kind of plug-in type LED encapsulation structure is mainly used for family
In outer brightening or Landscape Lamp.Including LED wafer 100, the LED support 200 of LED wafer 100 is carried, and encapsulates LED wafer 100
With the packaging body 300 of part LED support 200, the top of packaging body 300 offers a concave surface 310.
Specifically, concave surface 310 is circular conical surface, and the specific high visibility situation of circular conical surface adjusts, the side of circular conical surface respectively with
The diameter that the vertical outer surface intersection of packaging body 300, the i.e. maximum gauge of circular conical surface are packaging body 300.LED wafer 100 issues
The encapsulated body 300 of light refraction and circular conical surface reflection, the light angle issued from packaging body 300 is bigger and distribution is equal
It is even, it can effectively solve the overall light problem of non-uniform when arrangement of several LED encapsulation structures.When for Landscape Lamp, because of light
The angle that line issues increases, and the overall brightness of LED increases, and is remarkably improved the radiation response of Landscape Lamp.
A phosphor powder layer is covered in the present embodiment, in LED wafer, in addition to this, the addition manner of fluorescent powder can be with
For the doping fluorescent powder in packaging body 310.Specifically, LED wafer 100 is blue LED wafers, and fluorescent powder is yellow fluorescent powder,
The blue light excitation yellow fluorescent powder that blue LED wafers issue issues white light.Packaging body 300 for epoxy resin colloid is cured and
At.
LED support 200 includes that positive pin 210 and negative pin 220, LED wafer 100 are fixed on negative pin 220,
It is connected between positive pin 210 and LED wafer 100 and by gold thread between LED wafer 100 and negative pin 220.Specifically
The positive electrode and negative electrode pin 220 on ground, LED wafer 100 is connected by gold thread, and the cathode of LED wafer 100 and positive pin 210 are logical
Cross gold thread connection.
The end of negative pin 220 is equipped with one for fixing the accommodating chamber 221 of LED wafer 100, and accommodating chamber 221 is in bowl
Cup-shaped, the inner wall of the bowl shape accommodating chamber have the function of reflective, and the plane of accommodating chamber is die bond face, and LED wafer 100 passes through exhausted
Edge colloid is fixed on die bond face.
The packaging method of the LED encapsulation structure are as follows: infused into the mould item with protrusion tapered surface compatible with the concave surface
Enter epoxy resin colloid, will be fixed in the LED support insertion epoxide-resin glue body of LED wafer, then by infusion epoxy resin
Colloid and the mould item baking being inserted into after bracket, obtain the LED that packaging body has concave panel to epoxy resin colloid curing and demolding
Encapsulating structure,
The light that LED wafer issues reflects through bowl and passes through the refraction of transparent epoxy resin colloid and top concave reflection, makes
Obtaining colloid surrounding and top outside bowl has light injection, and light emitting angle is big and is evenly distributed, in addition to LED wafer lower end branch
Outside frame position dull thread projects, other angles can shine.
Although specifically showing and describing the utility model in conjunction with preferred embodiment, those skilled in the art is answered
This is understood, in the spirit and scope for not departing from the utility model defined by described claims, in form and details
On the utility model can be made a variety of changes, be the protection scope of the utility model.
Claims (7)
1. a kind of LED encapsulation structure, including LED wafer, which is characterized in that it further include the LED support for carrying the LED wafer,
And the packaging body of the LED wafer and the part LED support is encapsulated, a concave surface, institute are offered at the top of the packaging body
Stating concave surface is circular conical surface, and the side of the circular conical surface is intersected with the vertical outer surface of the packaging body.
2. LED encapsulation structure according to claim 1, which is characterized in that the surface of the LED wafer is covered with a fluorescence
Bisque.
3. LED encapsulation structure according to claim 1, which is characterized in that described doped with fluorescent powder in the packaging body
Fluorescent powder is uniformly distributed in the packaging body.
4. LED encapsulation structure according to claim 2 or 3, which is characterized in that the fluorescent powder is yellow fluorescent powder, institute
Stating LED wafer is blue LED wafers.
5. LED encapsulation structure according to claim 1, which is characterized in that the LED support includes positive pin and cathode
Pin, the LED wafer are fixed on the negative pin, and the LED wafer passes through gold thread and the positive pin and cathode
Pin connection.
6. LED encapsulation structure according to claim 5, which is characterized in that the end of the negative pin, which is equipped with, accommodates institute
State the accommodating chamber of LED wafer.
7. LED encapsulation structure according to claim 6, which is characterized in that the die bond face of the accommodating chamber, which is provided with, makes institute
State the insulation colloid that LED wafer is fixed on the negative pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820738980.9U CN208589460U (en) | 2018-05-17 | 2018-05-17 | A kind of LED encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820738980.9U CN208589460U (en) | 2018-05-17 | 2018-05-17 | A kind of LED encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208589460U true CN208589460U (en) | 2019-03-08 |
Family
ID=65533986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820738980.9U Expired - Fee Related CN208589460U (en) | 2018-05-17 | 2018-05-17 | A kind of LED encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208589460U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534634A (en) * | 2019-07-25 | 2019-12-03 | 常荣杰 | A kind of guide type high power semiconductor |
-
2018
- 2018-05-17 CN CN201820738980.9U patent/CN208589460U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534634A (en) * | 2019-07-25 | 2019-12-03 | 常荣杰 | A kind of guide type high power semiconductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190308 |
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| CF01 | Termination of patent right due to non-payment of annual fee |