CN208674160U - A kind of SMD White-light LED package structure of high life - Google Patents

Abstract

The utility model proposes the SMD White-light LED package structures of high life a kind of, including the first pedestal and the second pedestal, LED chip and fluorescent adhesive layer and transparent filling glue-line, the LED chip is arranged on the welding substrate by crystal-bonding adhesive and is located in the package via；The transparent filling glue-line is covered in the LED chip simultaneously, and fluorescent adhesive layer is set on the transparent filling glue-line, fluorescent powder and LED chip are completely cut off by transparent filling glue-line, the heat that SMD white light LEDs are generated in application can not only effectively be improved, slow down LED chip speed of aged deterioration due to neighbouring fluorescent powder is heated, improve service life of the product within the scope of normal brightness, also make SMD white light LEDs permeate and make moist from steam in use, improves the reliability of product.

Description

A kind of SMD White-light LED package structure of high life

Technical field

The utility model relates to the fields SMD-LED, more particularly, to the SMD White-light LED package structure of high life a kind of.

Background technique

SMD white light LEDs are the surface patch diode to emit white light, compared to other kinds of LED, surface patch diode With small in size, angle of scattering is big, uniformity of luminance is good, high reliability.Existing SMD-LED white light by electrode pin, It encapsulation main body, LED chip and LED chip is encapsulated in the filling glue in encapsulation main body constitutes, and can be mixed in the filling glue Conjunction has fluorescent powder to issue white light with cooperated with LED chip；SMD-LED white light product can generate heat, long-term application in application It can make the heated aged deterioration of the fluorescent powder near internal LED chip, so that product luminescent color be made to generate variation, and brightness be made to decline Subtract reduction, influences the life requirements within the scope of normal brightness；Existing product is that glue is filled in disposable injection in manufacturing process simultaneously And fluorescent powder, it is more sensitive to the moisture in environment, it is subject to steam infiltration dampness, makes the thermal energy of product in use The moisture that gasifies generates expansive force, causes LED failure so as to cause LED gold wire is pulled apart.

Summary of the invention

A kind of in order to solve the above problems, the utility model proposes SMD White-light LED package structure of high life.

The main contents of the utility model include:

A kind of SMD White-light LED package structure of high life, including package main body, LED chip and fluorescent adhesive layer and transparent Glue-line is filled, the package main body includes the first pedestal and the second pedestal, and second pedestal is arranged in first pedestal Top, first base central offer package via, and the upper surface of second pedestal is convexly equipped with embedded plastic body, described Embedded plastic body is in U-typed；The upper surface of second pedestal is divided into first area and second area by the embedded plastic body, It is provided with welding substrate in the first area, is provided with die bond substrate in the second area, the welding substrate and described Die bond substrate is respectively arranged below with electrode pin, and the LED chip is arranged on the welding substrate and is located at by crystal-bonding adhesive In the package via, the electrode of the LED chip is connect by gold thread with the electrode pin, and the transparent filling glue-line covers It covers in LED chip, the transparent filling glue-line is formed by the transparent filling colloid being filled in the package via；It is described glimmering Optical cement layer is arranged above the transparent filling glue-line.

Preferably, the package via is in horn-like, and the diameter in the upper opening portion of the package via is greater than its under shed The diameter in portion.

Preferably, silver coating is coated on the inner wall of the package via.

Preferably, the upper surface of the fluorescent adhesive layer is lower than the upper opening portion of the package via.

Preferably, the upper surface of the transparent filling glue-line is plane, and the upper surface of the fluorescent adhesive layer is plane.

Preferably, the upper surface of the transparent filling glue-line is plane, and the upper surface of the fluorescent adhesive layer is cambered surface.

Preferably, the transparent filling colloid is the cured transparent silica gel of high-temperature baking.

Preferably, the fluorescent adhesive layer is the transparent silica gel for being uniformly mixed with fluorescent powder.

Preferably, the material of first pedestal and the second pedestal is plastics.

The utility model has the beneficial effects that: the utility model proposes a kind of encapsulating structure of SMD white light LEDs, It is convexly equipped with U-shaped embedded plastic body on the upper surface of second pedestal, the upper surface of second pedestal is divided into the firstth area The LED chip is arranged on the die bond substrate in the second area by crystal-bonding adhesive for domain and second area, while in institute It states and covers the transparent filling glue-line on LED chip, and fluorescent adhesive layer is set on the transparent filling glue-line, i.e., by saturating Bright filling glue-line isolation fluorescent powder and LED chip can not only effectively improve the heat that SMD white light LEDs are generated in application, Slow down LED chip speed of aged deterioration due to neighbouring fluorescent powder is heated, improves longevity of the product within the scope of normal brightness Life also makes SMD white light LEDs permeate and make moist from steam in use, improves the reliability of product.

Detailed description of the invention

Fig. 1 is the side cross-section schematic diagram of the utility model；

Fig. 2 is the top view of the utility model.

Specific embodiment

The technical solution protected below in conjunction with attached drawing to the utility model illustrates.

Please refer to Fig. 1 and Fig. 2.The utility model proposes the SMD White-light LED package structures of high life a kind of, including envelope Main body, LED chip 30 and fluorescent adhesive layer 50 and transparent filled layer 40 are filled, the package main body includes the first pedestal 10 and second Pedestal 20, first pedestal 10 are arranged above second pedestal 20, and the center of first pedestal 10 offers encapsulation Through-hole 11, first pedestal 10 is arranged above second pedestal 20, i.e., so that the upper surface quilt of second pedestal 20 The package via 11 is divided into two parts, and the part in the package via 11 is provided centrally with LED chip, described LED chip is fixed on second pedestal 20 by crystal-bonding adhesive 13；Transparent filling glue is covered in the LED chip Layer 40 is additionally provided with fluorescent adhesive layer 50 above the transparent filling glue-line 40, and the transparent filling glue-line 40 is described in being filled in Transparent filling colloid in package via 11 is formed, and the fluorescent adhesive layer 50 is by filling the fluorescent colloid in the package via 11 It is formed.

The transparent filling colloid is transparent silica gel in one of the embodiments, it is preferred that the fluorescent colloid is equal The even transparent silica gel for being mixed with fluorescent powder, the upper surface of the fluorescent adhesive layer 50 are lower than the upper opening portion of the package via 11, Preferably, the upper surface of the transparent filling glue-line is plane, and the upper surface of the fluorescent adhesive layer is plane；In other embodiments In, the upper surface of the substratum transparent is plane, and the upper surface of the fluorescent adhesive layer is cambered surface.

The package via 11 is in horn-like, i.e., the upper opening portion of the described package via 11 in one of the embodiments, Diameter be greater than the under shed portion of the package via 11, the inner wall of the package via 11 is inclined-plane, and is applied on its inner wall It is covered with silver coating.

First pedestal and second pedestal are plastic material, first pedestal in one of the embodiments, Shape can be cuboid, square or cylindrical body.

More specifically, embedded plastic body 21 is convexly equipped on the upper surface of second pedestal, the embedded plastic body 21 will The upper surface of second pedestal is divided into first area and second area, and welding substrate 22 is provided in the first area, Die bond substrate 23 is provided in the second area, the LED chip is arranged on the die bond substrate 23；Meanwhile in institute It states welding substrate 22 and the die bond substrate 23 is respectively arranged below with electrode pin 24, the welding substrate 22 and the die bond base Gold goal is welded on the upper surface of plate, the electrode of the LED chip is connected on gold goal by gold thread 12, i.e., realized by gold thread The LED chip and electrode pin 24 realize electrical connection.

The welding substrate 22 and the die bond substrate 23 are aluminum substrate in one of the embodiments, are conducive to product Heat dissipation.

The encapsulating structure of the SMD white light LEDs of the utility model first covers layer of transparent filling glue in the LED chip Layer, then the fluorescent adhesive layer containing fluorescent powder is covered, it is arranged between LED chip and fluorescent adhesive layer by transparent filling glue-line, with Both isolations, generate heat in SMD white light LEDs application process, and LED chip is avoided to meet fluorescent powder after long-term use and aging It is rotten, cause product luminescent color to make a variation, brightness reduces and influences life requirements of the product within the scope of normal brightness, to mention The high service life of product；In addition, filling colloid point is changed to fill twice by disposably injecting filling, reduce due to filling out Fill glue and fluorescent powder to humidity sensitive in environment, be subject to steam infiltration dampness and the thermal energy of product in use made to gasify Moisture generates expansive force and improves the reliable of product to prevent the fracture of gold thread connected between LED chip and electrode pin Property.

The above description is only the embodiments of the present invention, and therefore it does not limit the scope of the patent of the utility model, all Equivalent structure or equivalent flow shift made based on the specification and figures of the utility model, is applied directly or indirectly in Other related technical areas are also included in the patent protection scope of the utility model.

Claims (9)

1. the SMD White-light LED package structure of high life a kind of, which is characterized in that including package main body, LED chip and fluorescent glue Layer and transparent filling glue-line, the package main body include the first pedestal and the second pedestal, and first pedestal setting is described the The top of two pedestals, first base central offer package via, and the upper surface of second pedestal is convexly equipped with embedded modeling Material, the embedded plastic body are in U-typed；The embedded plastic body by the upper surface of second pedestal be divided into first area and Second area is provided with welding substrate in the first area, die bond substrate, the welding base is provided in the second area Plate and the die bond substrate are respectively arranged below with electrode pin, and the LED chip is arranged by crystal-bonding adhesive in the welding substrate Upper and be located in the package via, the electrode of the LED chip is connect by gold thread with the electrode pin, described transparent to fill out It fills glue-line to be covered in LED chip, the transparent filling glue-line is by the transparent filling colloid shape that is filled in the package via At；The fluorescent adhesive layer is arranged above the transparent filling glue-line.

2. the SMD White-light LED package structure of high life according to claim 1 a kind of, which is characterized in that the encapsulation is logical In horn-like, the diameter in the upper opening portion of the package via is greater than the diameter in its under shed portion in hole.

3. the SMD White-light LED package structure of high life according to claim 2 a kind of, which is characterized in that the encapsulation is logical Silver coating is coated on the inner wall in hole.

4. the SMD White-light LED package structure of high life according to claim 1 a kind of, which is characterized in that the fluorescent glue The upper surface of layer is lower than the upper opening portion of the package via.

5. the SMD White-light LED package structure of high life according to claim 1 a kind of, which is characterized in that described transparent to fill out The upper surface for filling glue-line is plane, and the upper surface of the fluorescent adhesive layer is plane.

6. the SMD White-light LED package structure of high life according to claim 1 a kind of, which is characterized in that described transparent to fill out The upper surface for filling glue-line is plane, and the upper surface of the fluorescent adhesive layer is cambered surface.

7. the SMD White-light LED package structure of high life according to claim 1 a kind of, which is characterized in that described transparent to fill out Filling colloid is transparent silica gel.

8. the SMD White-light LED package structure of high life according to claim 7 a kind of, which is characterized in that the fluorescent glue Layer is the transparent silica gel for being uniformly mixed with fluorescent powder.

9. the SMD White-light LED package structure of high life according to any one of claims 1 to 8 a kind of, which is characterized in that institute The material for stating the first pedestal and the second pedestal is plastics.