CN102487063A - LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens - Google Patents
LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens Download PDFInfo
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- CN102487063A CN102487063A CN2010105737247A CN201010573724A CN102487063A CN 102487063 A CN102487063 A CN 102487063A CN 2010105737247 A CN2010105737247 A CN 2010105737247A CN 201010573724 A CN201010573724 A CN 201010573724A CN 102487063 A CN102487063 A CN 102487063A
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Abstract
The invention relates to an LED (Light-Emitting Diode) array packaging structure with a microstructure silica-gel lens. The LED packaging structure comprises a substrate, a light-emitting diode chip array and a lens, wherein the lens is manufactured from fluorescent powder and filled-sealed silica gel; and the light-emitting diode chip array is fixedly arranged on the upper surface of the substrate at equal intervals by welding or bonding. The LED array packaging structure is characterized in that a cuboid packaging silica-gel lens manufactured from the fluorescent powder and the filled-sealed silica gel covers above the light-emitting diode chip array uniformly; and a geometry array with a concave or convex structure is manufactured on the upper surface of the silica-gel lens. The LED array packaging structure has the advantages that the light-taking efficiency of an LED array packaging product can be obviously improved, and the use is convenient for a user.
Description
Technical field
The present invention relates to a kind of semiconductor device, particularly a kind of led array encapsulating structure with the micro-structural silica-gel lens.
Background technology
Light-emitting diode (LED) is one type of electroluminescent device that can directly electric energy be converted into visible light and radiant energy, and its luminescence mechanism is to utilize the composite action in electronics and hole to produce photon.LED compares conventional light source and has the luminous efficiency height, and color rendering is good, and power consumption is few; Energy-conserving and environment-protective, security reliability is high, the advantage of long service life; And begun to be used widely in a lot of fields, thought the main direction in lighting source market to have huge market potential by industry.The light emitting diode matrix encapsulating products receives increasing concern in recent years, than single LEDs product, it has high power, thin volume, integrated level advantages of higher.
At present; Led array encapsulation major part is not all used the structure of encapsulation silica-gel lens surface band array; This existing encapsulating structure possibly cause existing at the LED encapsulating products that to get optical efficiency low, and the product height after the encapsulation is high, is not easy to integrated; These will cause, and the led array encapsulating products can not well be used.
Summary of the invention
The objective of the invention is to the defective that exists in the prior art; A kind of led array encapsulating structure with the micro-structural silica-gel lens is provided; The present invention includes: comprising: the lens that substrate, light-emitting diode chip for backlight unit array, phosphor gel and embedding silica gel are made; The light-emitting diode chip for backlight unit array equidistantly is fixed on upper surface of base plate through welding or stickup; It is characterized in that the said cuboid encapsulation silica-gel lens that is made into by phosphor gel and embedding silica gel evenly covers on the light-emitting diode chip for backlight unit array, the upper surface of said silica-gel lens is made into the solid array of concave or convex structure.Said concave or convex solid array is pyramid or cone or spherical crown or V-type groove array.The lens of band micro-structural silica gel have improved the optical efficiency of getting of light-emitting diode.
Advantage of the present invention is: can improve the optical efficiency of getting of LED encapsulating products by a relatively large margin, reduce the array package thickness of product, improve the reliability of device, prolong device useful life, be user-friendly to.
Description of drawings
The perspective view of Fig. 1 embodiment one;
The plan structure sketch map of Fig. 2 embodiment one;
The right TV structure sketch map of Fig. 3 embodiment one;
The perspective view of Fig. 4 embodiment two;
The plan structure sketch map of Fig. 5 embodiment two;
The right TV structure sketch map of Fig. 6 embodiment two;
The perspective view of Fig. 7 embodiment three;
The plan structure sketch map of Fig. 8 embodiment three;
The right TV structure sketch map of Fig. 9 embodiment three;
The perspective view of Figure 10 embodiment four;
The plan structure sketch map of Figure 11 embodiment four;
The right TV structure sketch map of Figure 12 embodiment four;
The perspective view of Figure 13 embodiment five;
The plan structure sketch map of Figure 14 embodiment five;
The right TV structure sketch map of Figure 15 embodiment five;
The perspective view of Figure 16 embodiment six;
The plan structure sketch map of Figure 17 embodiment six;
The right TV structure sketch map of Figure 18 embodiment six;
The perspective view of Figure 19 embodiment seven;
The plan structure sketch map of Figure 20 embodiment seven;
The right TV structure sketch map of Figure 21 embodiment seven;
The perspective view of Figure 22 embodiment eight;
The plan structure sketch map of Figure 23 embodiment eight;
The perspective view of Figure 24 embodiment eight;
Among the figure: the silica-gel lens of 1 substrate, 2 light-emitting diode chip for backlight unit arrays, 3 band micro-structurals.
Embodiment
Embodiment one
Further specify embodiments of the invention below in conjunction with accompanying drawing:
Referring to Fig. 1～Fig. 3, present embodiment is a kind of led array encapsulating structure with the micro-structural silica-gel lens.Silica-gel lens 3 upper surfaces are processed with the orthopyramid body structure of indent; Its cross section is a triangle; Light-emitting diode chip for backlight unit array 2 equidistantly is fixed on substrate 1 upper surface through silver slurry or scolder or other binding materials, and through beating gold thread or other electrode interconnection modes are accomplished the electrical interconnection between light-emitting diode chip for backlight unit 2 and the base plate for packaging 1.Light-emitting diode chip for backlight unit 2 upper surfaces with all around and surface coverage phosphor gel and casting glue are arranged, silica-gel lens 3 is processed through solidifying by phosphor gel and casting glue.Phosphor gel and casting glue solidify and form the cuboid lentoid, and the upper surface of silica-gel lens 3 is manufactured with the orthopyramid body of the quantity indent identical with light-emitting diode chip for backlight unit quantity, and said solid is of a size of 10 microns to 1000 microns.The orthopyramid body is array-like and is distributed on the light-emitting diode chip for backlight unit array, and the silica-gel lens of the orthopyramid bulk microstructure of indent has improved the optical efficiency of getting of light-emitting diode.
Embodiment two
Embodiment two is identical with embodiment one, and different is the cone that silica-gel lens 3 upper surfaces are manufactured with the quantity indent identical with light-emitting diode chip for backlight unit quantity, and cone is array-like and is distributed on the light-emitting diode chip for backlight unit array, referring to Fig. 4～Fig. 6.
Embodiment three
Embodiment three is identical with embodiment one, and different is the V-type groove that silica-gel lens 3 upper surfaces are processed with indent, and the V-type groove is array-like and is distributed on the light-emitting diode chip for backlight unit array, and the cross sectional shape of V-type groove is a triangle, referring to Fig. 7～Fig. 9.
Embodiment four
Embodiment four is identical with embodiment one, and different is that silica-gel lens 3 upper surfaces are processed with the quantity indent ball-crown body identical with light-emitting diode chip for backlight unit quantity, and ball-crown body is array-like and is distributed on the light-emitting diode chip for backlight unit array, referring to Figure 10～Figure 12.
Embodiment five
Embodiment five is identical with embodiment one; The orthopyramid body of silica-gel lens 3 upper surfaces are processed with quantity that different is and the identical evagination of light-emitting diode chip for backlight unit quantity; Its cross section is a triangle, and the orthopyramid body is array-like and is distributed on the light-emitting diode chip for backlight unit array, referring to Figure 13～Figure 15.
Embodiment six
Embodiment six is identical with embodiment one; The cone of silica-gel lens 3 upper surfaces are processed with quantity that different is and the identical evagination of light-emitting diode chip for backlight unit quantity; Cone is array-like and is distributed on the light-emitting diode chip for backlight unit array; Cone is corresponding one by one with light-emitting diode chip for backlight unit, referring to Figure 16～Figure 18.
Embodiment seven
Embodiment seven is identical with embodiment one, and different is the V-type groove that silica-gel lens 3 upper surfaces are processed with evagination, and the V-type groove is array-like and is distributed on the light-emitting diode chip for backlight unit array, and the cross sectional shape of V-type groove is a triangle, referring to Figure 19～Figure 21.
Embodiment eight
Embodiment eight is identical with embodiment one; Different is that silica-gel lens 3 upper surfaces are processed with the quantity evagination ball-crown body identical with light-emitting diode chip for backlight unit quantity; Ball-crown body is array-like and is distributed on the light-emitting diode chip for backlight unit array; Ball-crown body is corresponding one by one with light-emitting diode chip for backlight unit, referring to Figure 22～Figure 24.
Claims (5)
1. led array encapsulating structure with the micro-structural silica-gel lens; Comprise: the lens that substrate, light-emitting diode chip for backlight unit array, phosphor gel and embedding silica gel are made; The light-emitting diode chip for backlight unit array equidistantly is fixed on upper surface of base plate through welding or stickup; It is characterized in that the said cuboid encapsulation silica-gel lens that is made into by phosphor gel and embedding silica gel evenly covers on the light-emitting diode chip for backlight unit array, the upper surface of said silica-gel lens is made into the solid array of concave or convex structure.
2. the led array encapsulating structure of band micro-structural silica-gel lens according to claim 1, the solid monomer that it is characterized in that said concave or convex structure is a pyramid, the pyramid array-like is distributed on the light-emitting diode chip for backlight unit array.
3. the led array encapsulating structure of band micro-structural silica-gel lens according to claim 1, the solid monomer that it is characterized in that said concave or convex structure is a cone, the cone array-like is distributed on the light-emitting diode chip for backlight unit array.
4. the led array encapsulating structure of band micro-structural silica-gel lens according to claim 1, the solid monomer that it is characterized in that said concave or convex structure is a spherical crown, the spherical crown array-like is distributed on the light-emitting diode chip for backlight unit array.
5. the led array encapsulating structure of band micro-structural silica-gel lens according to claim 1; The solid monomer that it is characterized in that said concave or convex structure is the V-type groove; The cross sectional shape of V-type groove is a triangle, is strip and is distributed on the light-emitting diode chip for backlight unit array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2010105737247A CN102487063A (en) | 2010-12-03 | 2010-12-03 | LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens |
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| CN2010105737247A CN102487063A (en) | 2010-12-03 | 2010-12-03 | LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens |
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| CN102487063A true CN102487063A (en) | 2012-06-06 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229401A (en) * | 2016-08-24 | 2016-12-14 | 电子科技大学 | Fluorescence LED array of packages |
| CN110391216A (en) * | 2018-04-19 | 2019-10-29 | 隆达电子股份有限公司 | Light emitting module structure |
| CN112335052A (en) * | 2018-06-20 | 2021-02-05 | Lg伊诺特有限公司 | Lighting module and lighting device comprising same |
| CN114447197A (en) * | 2022-01-25 | 2022-05-06 | 金振华 | Preparation method of fly-eye array lens for LED integrated packaging |
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| CN101369615A (en) * | 2007-08-17 | 2009-02-18 | 广东昭信光电科技有限公司 | Packaging method for low-thermal resistance high-power light-emitting diode |
| US20090278151A1 (en) * | 2008-05-07 | 2009-11-12 | Samsung Electronics Co., Ltd. | Light emitting diode packages, light emitting diode systems and methods of manufacturing the same |
| CN101814572A (en) * | 2010-03-05 | 2010-08-25 | 矽畿科技股份有限公司 | Optical diode packaging structure |
| CN101887939A (en) * | 2010-05-24 | 2010-11-17 | 晶科电子（广州）有限公司 | Packaging structure and packaging method for improving LED external quantum efficiency |
| CN201887042U (en) * | 2010-12-03 | 2011-06-29 | 刘胜 | LED array packaging structure with microstructural silica gel lenses |
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2010
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| CN101369615A (en) * | 2007-08-17 | 2009-02-18 | 广东昭信光电科技有限公司 | Packaging method for low-thermal resistance high-power light-emitting diode |
| US20090278151A1 (en) * | 2008-05-07 | 2009-11-12 | Samsung Electronics Co., Ltd. | Light emitting diode packages, light emitting diode systems and methods of manufacturing the same |
| CN101814572A (en) * | 2010-03-05 | 2010-08-25 | 矽畿科技股份有限公司 | Optical diode packaging structure |
| CN101887939A (en) * | 2010-05-24 | 2010-11-17 | 晶科电子（广州）有限公司 | Packaging structure and packaging method for improving LED external quantum efficiency |
| CN201887042U (en) * | 2010-12-03 | 2011-06-29 | 刘胜 | LED array packaging structure with microstructural silica gel lenses |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106229401A (en) * | 2016-08-24 | 2016-12-14 | 电子科技大学 | Fluorescence LED array of packages |
| CN110391216A (en) * | 2018-04-19 | 2019-10-29 | 隆达电子股份有限公司 | Light emitting module structure |
| CN110391216B (en) * | 2018-04-19 | 2021-07-23 | 隆达电子股份有限公司 | Light-emitting module structure |
| US11422296B2 (en) | 2018-04-19 | 2022-08-23 | Lextar Electronics Corporation | Light-emitting module structure |
| CN112335052A (en) * | 2018-06-20 | 2021-02-05 | Lg伊诺特有限公司 | Lighting module and lighting device comprising same |
| EP3799125A4 (en) * | 2018-06-20 | 2022-03-16 | LG Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| US11306879B2 (en) | 2018-06-20 | 2022-04-19 | Lg Innotek Co., Ltd. | Lighting module and lighting device comprising same |
| CN114447197A (en) * | 2022-01-25 | 2022-05-06 | 金振华 | Preparation method of fly-eye array lens for LED integrated packaging |
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Application publication date: 20120606 |