CN106229401A - Fluorescence LED array of packages - Google Patents
Fluorescence LED array of packages Download PDFInfo
- Publication number
- CN106229401A CN106229401A CN201610723666.9A CN201610723666A CN106229401A CN 106229401 A CN106229401 A CN 106229401A CN 201610723666 A CN201610723666 A CN 201610723666A CN 106229401 A CN106229401 A CN 106229401A
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- Prior art keywords
- led array
- protective layer
- fluorescence
- led
- packages
- Prior art date
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- Pending
Links
- 239000011241 protective layer Substances 0.000 claims abstract description 50
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 38
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 26
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000009792 diffusion process Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 12
- 239000000178 monomer Substances 0.000 claims description 11
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000005469 granulation Methods 0.000 claims description 5
- 230000003179 granulation Effects 0.000 claims description 5
- 239000004816 latex Substances 0.000 claims description 5
- 229920000126 latex Polymers 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920006352 transparent thermoplastic Polymers 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000001228 spectrum Methods 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 16
- 239000012780 transparent material Substances 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000265 homogenisation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000013528 metallic particle Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
nullThe present invention provides a kind of fluorescence LED array of packages，Including adhered circuit board、Base plate for packaging、LED array，Each LED element is packaged in the first protective layer，The outer surface of the first protective layer is provided with red fluorescence layer，The outer surface of fluorescence coating is packaged in the second protective layer，Second protective layer outer surface is provided with diffusing layer，Adhered circuit board is provided with external interface，LED array is connected with external power source and circuit by external interface，Fluorescent material in described phosphor powder layer is dispersed in organic transparent material，Can improve and strengthen the reflection of described phosphor material powder、Diffuse-reflectance effect，The LED array area of dissipation using distributed LED structure becomes big，Improve the radiating effect of fluorescent material and LED，The use of protective layer simultaneously can effectively realize the thickness that phosphor powder layer thick middle both sides are thin，The LED of the phosphor powder layer with this structure has preferable optical property，Thus it is effectively improved the spatial color uniformity of LED array.
Description
Technical field
The present invention relates to technical field of LED illumination, the fluorescence LED array that a kind of broad spectrum light source uses.
Background technology
The encapsulation of existing LED mostly uses the mode of directly some glue phosphor powder layer to encapsulate and forms, and point gum machine directly will injection
Phosphor gel in device is coated in LED chip over and around, it is thus achieved that the pattern spatially uniform of phosphor powder layer poor.With
Time, this technique can by chip produce heat be directly conducted to phosphor powder layer, this technique will cause fluorescent material glue-line by
In by heat ageing, directly affect the light emission rate of bisque, hamper the high-power universal of chip, and then limited to the luminous effect of LED
Rate.
If fluorescent material will be dispersed in organic transparent material in phosphor powder layer, it is possible to improve and strengthen described glimmering
The reflection of light powder material, diffuse-reflectance effect, use the LED array area of dissipation of distributed LED structure to become big, improve fluorescence
Powder and the radiating effect of LED.The use of protective layer simultaneously can effectively realize the thickness that phosphor powder layer thick middle both sides are thin, has
The LED of the phosphor powder layer of this structure has preferable optical property, thus is effectively improved the spatial color uniformity of LED array.
Summary of the invention
The present invention seeks to the shortcoming for prior art described above, it is provided that a kind of luminous efficiency height, good heat dissipation, life-span
Grow and have the fluorescence LED array of packages of ideal space uniformity.
For achieving the above object, technical solution of the present invention is as follows:
A kind of fluorescence LED array of packages, including the base plate for packaging above the adhered circuit board of bottom, adhered circuit board, envelope
The LED array of dress substrate surface attachment, described LED array includes that at least two LED element, each LED element are packaged in the
In one protective layer, the outer surface of described first protective layer is provided with red fluorescence layer, and the outer surface of described fluorescence coating is packaged in
In two protective layers, the second described protective layer outer surface is provided with diffusing layer, and adhered circuit board is provided with external interface, LED battle array
Row are connected with external power source and circuit by external interface.
LED element is placed on substrate, can produce different light intensity and the light of spectral range.
The light sent by LED, successively through the first protective layer, fluorescence coating, the second protective layer and diffusing layer, and by diffusing layer
Diffusion emergent ray.The divergence of beam diffusion that will emit in LED chip so that emergent light wide-angle outgoing so that outgoing
Ray space homogenization so that the space profiles of fluorescence and intensity distributions become to determine.
Protective layer has isolated fluorescence coating and LED element, it is to avoid fluorescent material comes off and generates heat, and plays protection and limits fluorescent material
Effect, fluorescent material can be made to be layed in equably on emitting led surface, the decay that slow down fluorescent material is aging.
It is preferred that, the thickness of the first protective layer and the second protective layer is 0.7mm to 1.5mm.Tests prove that, protect
When the thickness of sheath is 0.5mm to 2mm, spatial color uniformity, luminous efficiency and heat radiation are best.
It is preferred that, the thickness of described fluorescence coating is 0.5mm to 2mm.Tests prove that, the thickness of fluorescence coating is
During 0.5mm to 2mm, spatial color uniformity, luminous efficiency and heat radiation are best.
It is preferred that, described first protective layer and the second protective layer are hemispherical or elliposoidal.
It is preferred that, the manufacture method of described fluorescence coating is: fluorescent material, transparent thermoplastic resin, light transmission are had
Machine emulsion powder material, nano inorganic filling material are the ratio mixing granulation of 2:1:1:1 in mass ratio, then pelletize are generated
Mixture utilize mould extruding generate fluorescence coating.It is demonstrated experimentally that the spatial color of the fluorescence coating made according to the method described above is equal
Even property, luminous efficiency and heat radiation are best.
In order to improve and strengthen the reflection of described electroluminescent layer material and in order to improve radiating effect, at described protective layer
Material in possibly together with metallic particles, glass particle or ceramic particle etc..
It is preferred that, the red luminescent powder during phosphor raw material is silicate fluorescent powder in described fluorescence coating.
Fluorescence coating is dispersed in organic transparent material, sends infrared light and HONGGUANG under LED excites.
It is preferred that, the manufacture method of described protective layer is: by transparent thermoplastic resin, light transmission organic latex powder
Powder material, nano inorganic filling material are the ratio mixing granulation of 2:1:1 in mass ratio, the mixture profit then pelletize generated
Protective layer is generated with mould extruding.It is demonstrated experimentally that the spatial color uniformity of the protective layer made according to the method described above, luminous effect
Rate and heat radiation are best.
It is preferred that, described nano inorganic filling material is silica bead, nano titanium oxide one therein.
It is preferred that, described LED element includes one or more LED bare chips, and each LED has different
Peak wavelength, peak wavelength scope contains HONGGUANG and infrared range of spectrum.
It is preferred that, described diffusing layer is made up of several diffusion monomer close-packed arrays, and described diffusing layer is hemisphere
Shape, described optically focused monomer semicircular in shape.
By hemispheric diffusing layer, the light diffusion sent by LED chip is dissipated, promote diffusion effect.Due to fluorescence
The light path of the light that bisque sends more is disperseed, and the proportion shared by the light of wide-angle outgoing is higher, uses the fluorescence coating knot of the present invention
Structure reflects light by each diffusion monomer of diffusing layer so that the light dissipated dissipates through multiple diffusion monomer diffusions so that
Emergent light wide-angle outgoing so that emergent ray spatial homogenization so that the space profiles of fluorescence and intensity distributions become to determine.
LED chip in described LED array is arranged on base plate for packaging with circular or rectangular shape.
The invention have the benefit that the fluorescent material in described phosphor powder layer is dispersed in organic transparent material, Ke Yigai
It is apt to and strengthens the reflection of described phosphor material powder, diffuse-reflectance effect, using the LED array area of dissipation of distributed LED structure
Become big, improve the radiating effect of fluorescent material and LED.The use of protective layer simultaneously can effectively realize phosphor powder layer thick middle two
The thickness that side is thin, the LED of the phosphor powder layer with this structure has preferable optical property, thus is effectively improved LED array
Spatial color uniformity.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the fluorescence LED array encapsulation structure of the present invention.
Fig. 2 is the axonometric chart of the diffusing layer of the present invention.
Wherein, 1 is fluorescence LED array, and 2 is adhered circuit board, and 3 is base plate for packaging, and 4 is LED element, and 5 is external interface,
6 is diffusing layer, and 7 is the second protective layer, and 8 is fluorescence coating, and 9 is the first protective layer, and 10 is diffusion monomer.
Detailed description of the invention
Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also be by the most different concrete realities
The mode of executing is carried out or applies, the every details in this specification can also based on different viewpoints and application, without departing from
Various modification or change is carried out under the spirit of the present invention.
A kind of fluorescence LED array of packages, including the base plate for packaging 3 above the adhered circuit board 2 of bottom, adhered circuit board 2,
The surface-pasted LED array of base plate for packaging 31, described LED array includes that at least two LED element 4, each LED element 4 are sealed
Being loaded in the first protective layer 9, the outer surface of described first protective layer 9 is provided with red fluorescence layer 8, the appearance of described fluorescence coating 8
Face is packaged in the second protective layer 7, and the second described protective layer 7 outer surface is provided with diffusing layer 6, and adhered circuit board 2 is provided with
External interface 5, LED array 1 is connected with external power source and circuit by external interface 5.
LED element is placed on substrate, can produce different light intensity and the light of spectral range.
The light sent by LED, successively through the first protective layer, fluorescence coating, the second protective layer and diffusing layer, and by diffusing layer
Diffusion emergent ray.The divergence of beam diffusion that will emit in LED chip so that emergent light wide-angle outgoing so that outgoing
Ray space homogenization so that the space profiles of fluorescence and intensity distributions become to determine.
Protective layer has isolated fluorescence coating and LED element, it is to avoid fluorescent material comes off and generates heat, and plays protection and limits fluorescent material
Effect, fluorescent material can be made to be layed in equably on emitting led surface, the decay that slow down fluorescent material is aging.
The thickness of the first protective layer and the second protective layer is 0.7mm to 1.5mm.Tests prove that, the thickness of protective layer is
During 0.5mm to 2mm, spatial color uniformity, luminous efficiency and heat radiation are best.
The thickness of described fluorescence coating is 0.5mm to 2mm.Tests prove that, when the thickness of fluorescence coating is 0.5mm to 2mm, empty
Between color homogeneity, luminous efficiency and heat radiation best.
Described first protective layer and the second protective layer are hemispherical or elliposoidal.
The manufacture method of described fluorescence coating is: by fluorescent material, transparent thermoplastic resin, light transmission organic latex powder material
Material, nano inorganic filling material are the ratio mixing granulation of 2:1:1:1 in mass ratio, are then utilized by the mixture that pelletize generates
Mould extruding generates fluorescence coating.It is demonstrated experimentally that the spatial color uniformity of the fluorescence coating made according to the method described above, luminous efficiency
Best with heat radiation.
In order to improve and strengthen the reflection of described electroluminescent layer material and in order to improve radiating effect, at described protective layer
Material in possibly together with metallic particles, glass particle or ceramic particle etc..
Red luminescent powder (RG) during phosphor raw material is silicate fluorescent powder in described fluorescence coating.
Fluorescence coating is dispersed in organic transparent material, sends infrared light and HONGGUANG under LED excites.
The manufacture method of described protective layer is: by transparent thermoplastic resin, light transmission organic latex dusty material, nanometer without
Machine packing material is the ratio mixing granulation of 2:1:1 in mass ratio, and then the mixture that pelletize generates utilizes mould extruding raw
Become protective layer.It is demonstrated experimentally that spatial color uniformity, luminous efficiency and the heat radiation of the protective layer made according to the method described above are
Good.
Described nano inorganic filling material is silica bead, nano titanium oxide one therein.
Described LED element includes one or more LED bare chips, and each LED has different peak wavelengths, peak value
Wave-length coverage contains HONGGUANG and infrared range of spectrum.
Described diffusing layer 6 is made up of several diffusion monomer 10 close-packed arrays, and described diffusing layer 6 is hemispherical, described poly-
Light monomer 10 semicircular in shape.
By hemispheric diffusing layer 6, the light diffusion sent by LED chip is dissipated, promote diffusion effect.Due to glimmering
The light path of the light that light bisque sends more is disperseed, and the proportion shared by the light of wide-angle outgoing is higher, uses the fluorescence coating of the present invention
Structure reflects light by each diffusion monomer 10 of diffusing layer so that the light dissipated is sent out through the diffusion of multiple diffusion monomer 10
Dissipate so that emergent light wide-angle outgoing so that emergent ray spatial homogenization so that the space profiles of fluorescence and intensity distributions become
Must determine.
LED chip in described LED array is arranged on base plate for packaging 3 with circular or rectangular shape.
The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any ripe
Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage knowing this technology.Cause
This, have usually intellectual and completed under technological thought without departing from disclosed spirit in all art
All equivalence modify or change, must be contained by the claim of the present invention.
Claims (10)
1. a fluorescence LED array of packages, it is characterised in that: include the envelope above the adhered circuit board of bottom, adhered circuit board
Dress substrate, the surface-pasted LED array of base plate for packaging, described LED array includes at least two LED element, each LED element quilt
Being packaged in the first protective layer, the outer surface of described first protective layer is provided with red fluorescence layer, the outer surface of described fluorescence coating
Being packaged in the second protective layer, the second described protective layer outer surface is provided with diffusing layer, and adhered circuit board is provided with outside and connects
Mouthful, LED array is connected with external power source and circuit by external interface.
2. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: the first protective layer and the thickness of the second protective layer
Spend for 0.7mm to 1.5mm.
3. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: the thickness of described fluorescence coating be 0.5mm extremely
2mm。
4. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: described first protective layer and the second protective layer
For hemispherical or elliposoidal.
5. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: the manufacture method of described fluorescence coating is: by glimmering
Light powder, transparent thermoplastic resin, light transmission organic latex dusty material, nano inorganic filling material are 2:1:1:1 in mass ratio
Ratio mixing granulation, then by pelletize generate mixture utilize mould extruding generate fluorescence coating.
6. fluorescence LED array of packages as claimed in claim 5, it is characterised in that: in described fluorescence coating, phosphor raw material is silicon
Red luminescent powder in hydrochlorate fluorescent material.
7. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: the manufacture method of described protective layer is: will thoroughly
Bright thermoplastic resin, light transmission organic latex dusty material, nano inorganic filling material are the ratio mixing of 2:1:1 in mass ratio
Pelletize, then utilizes mould extruding to generate protective layer by the mixture that pelletize generates.
8. the fluorescence LED array of packages as described in claim 5 or 7, it is characterised in that: described nano inorganic filling material is silicon
Pearl, nano titanium oxide one therein.
9. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: described LED element includes one or more
LED bare chip, each LED has different peak wavelengths, and peak wavelength scope contains HONGGUANG and infrared range of spectrum.
10. fluorescence LED array of packages as claimed in claim 1, it is characterised in that: described diffusing layer is by several diffusion monomers
Close-packed arrays forms, and described diffusing layer is hemispherical, described optically focused monomer semicircular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610723666.9A CN106229401A (en) | 2016-08-24 | 2016-08-24 | Fluorescence LED array of packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610723666.9A CN106229401A (en) | 2016-08-24 | 2016-08-24 | Fluorescence LED array of packages |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106229401A true CN106229401A (en) | 2016-12-14 |
Family
ID=57554539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610723666.9A Pending CN106229401A (en) | 2016-08-24 | 2016-08-24 | Fluorescence LED array of packages |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106229401A (en) |
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