JP5373859B2 - Lighting device - Google Patents

Lighting device Download PDF

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JP5373859B2
JP5373859B2 JP2011149291A JP2011149291A JP5373859B2 JP 5373859 B2 JP5373859 B2 JP 5373859B2 JP 2011149291 A JP2011149291 A JP 2011149291A JP 2011149291 A JP2011149291 A JP 2011149291A JP 5373859 B2 JP5373859 B2 JP 5373859B2
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phosphor
light
light emitting
resin
substrate
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JP2013016692A (en
JP2013016692A5 (en
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靖 伊藤
祥史 上野
啓史 谷
智充 堀
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デクセリアルズ株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • F21Y2113/17Combination of light sources of different colours comprising an assembly of point-like light sources forming a single encapsulated light source
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133606Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • GPHYSICS
    • G02OPTICS
    • G02FDEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating, or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F2001/133614Illuminating devices the light is generated by photoluminescence, e.g. a phosphor is illuminated by UV or blue light
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape

Description

  The present invention relates to a lighting device used for a display device such as a liquid crystal display.

  In a liquid crystal display, a backlight light source that illuminates a liquid crystal panel from the back to the front is used. In recent years, with the increase in size, thickness, weight, and life of liquid crystal displays, multiple light emitting diodes (LEDs) are arranged on a substrate from the viewpoint of improving moving image characteristics through blinking control. A light emitting device that emits light by surface emission is attracting attention. In such a light emitting device, the following two methods are mainly used to extract white light.

  In the first method, LEDs that emit light of three colors of R, G, and B are arranged, and these are simultaneously turned on to synthesize light of three colors to obtain white light. The second method is to surround a blue LED with a phosphor-containing resin, for example, and convert blue light into white light. A structure in which the blue LED is surrounded by a phosphor-containing resin is called a “white LED”.

  However, since the first method requires LEDs of three colors R, G, and B, the cost is high. Further, in the second method, since the phosphor is potted with respect to the minute area of the LED, it is difficult to uniformly form the phosphor.

  Therefore, in recent years, as a third technique replacing the second technique, a blue LED is used by using a phosphor-containing resin in which a phosphor-containing resin is sandwiched between sheet bases or a phosphor-containing sheet obtained by processing a phosphor-containing resin into a sheet shape. The method of performing color conversion by using this method has attracted attention (see, for example, Patent Documents 1 and 2). A structure in which a phosphor-containing resin is sandwiched between two glass plates has also been proposed (see, for example, Patent Document 3).

  Such a structure in which the blue LED and the phosphor-containing resin are arranged without being in contact with each other is called a “remote phosphor structure”. Further, the “remote phosphor structure” can be used not only as a backlight for a liquid crystal display but also as a light source for illumination. In the case of an illumination light source, the phosphor-containing resin is not only a flat sheet shape as described above, but may also have a three-dimensional shape such as a cup shape.

  Generally, the biggest and permanent problem of a light source is to improve luminous efficiency. In the case of a backlight light source or illumination light source using LEDs, (1) improving the efficiency of the blue LED element itself (quantum efficiency for converting electrons and holes into light), and (2) luminous efficiency of the phosphor ( (3) To improve the efficiency of extracting the light emitted from the LED and the phosphor to the outside without losing as much as possible at any part inside the light source. Is desirable.

Now, in the case of a “white LED” in which an LED is surrounded by a phosphor-containing resin, since the LED chip and the phosphor are in contact with each other or close to each other, the heat released at the time of LED emission is easily transmitted to the phosphor. The body temperature rises. As the phosphor temperature increases, the phosphor wavelength conversion efficiency decreases. This phenomenon is called “temperature quenching”. FIG. 17 shows measurement data of phosphor temperature quenching in a Y 3 AlO 12 : Ce (YAG) phosphor.

  On the other hand, in the case of the “remote phosphor structure” using the third technique shown in Patent Documents 1 and 2, etc., since the LED and the phosphor-containing resin are arranged without contact, they are emitted at the same time when the LED emits light. Heat is not easily transmitted to the phosphor, and the temperature of the phosphor does not rise easily. For this reason, the decrease in phosphor wavelength conversion efficiency is smaller than that of “white LED”. This is one advantage of the “remote phosphor structure”. Patent Documents 1 and 2 which are prior arts can be said to be very desirable techniques because this advantage can be applied.

JP 2009-283438 A JP 2010-171342 A JP 2007-23267 A

  However, the so-called “remote phosphor structure” described in Patent Documents 1 to 3 has insufficient efficiency for extracting the light in the above (3). Further, in the “remote phosphor structure”, since the LED and the phosphor-containing structure are separated from each other, it is difficult to reduce the thickness of the device.

  This invention is made | formed in view of such a situation, and it aims at providing the illuminating device which can improve the efficiency which takes out light outside and can be reduced in thickness.

In order to solve the above-described problems, a lighting device according to the present invention includes a light emitting structure in which a blue light emitting element is included in a convex surface-shaped transparent resin, and a substrate on which the light emitting structure is two-dimensionally arranged. And a phosphor sheet containing a powdered phosphor that is disposed apart from the substrate and obtains white light from the blue light of the blue light-emitting element, and the light-emitting structure includes a base material for the blue light-emitting element. The convex light emitting structure is mounted on the lens, and the cross section of the convex light emitting structure has a lens shape, the convex surface shape is a curved surface based on the lens shape, and the curved surface has a radius of curvature r. that constitutes a part of a sphere, the ratio r / a between the radius of curvature r of the half a said convex surface shape of the width of the transparent resin in contact on said substrate, 4.0 or less It is.

  In the display device according to the present invention, the above-described illumination device is disposed on the image display panel.

  According to the present invention, the convex surface shape of the transparent resin can alleviate blue light confinement due to the total reflection of the transparent resin, and can improve the efficiency of extracting the blue light to the outside. Furthermore, the separation distance between the substrate and the phosphor sheet can be reduced by broadening the light radiation distribution due to the convex surface shape of the transparent resin and the light scattering effect by the phosphor sheet containing the powdered phosphor. In other words, the so-called “remote phosphor structure” can be thinned.

It is a schematic sectional drawing which shows the illuminating device which concerns on one embodiment of this invention. It is a schematic sectional drawing which shows the structural example of a light emitting structure. It is a figure which shows the structural example of a fluorescent substance sheet. It is a graph which shows the radiation angle distribution of a blue LED package (r / a = ∞). It is a graph which shows the radiation angle distribution of a blue LED package (r / a = 2.78). It is a graph which shows the radiation angle distribution of a blue LED package (r / a = 1.46). It is a graph which shows the radiation angle distribution of a white LED package (r / a = ∞). It is a schematic sectional drawing which shows the structure of the illuminating device of an Example. It is a schematic sectional drawing which shows the structure of the illuminating device of a reference example. It is a schematic sectional drawing which shows the structure of the illuminating device of a comparative example. It is a graph which shows LED injection current-luminance characteristics. In the illumination device of the reference example, the distance between the substrate and the diffusion plate is (A) 37 mm, (B) 34 mm, (C) 29 mm, and (D) 24 mm. In the illuminating device of the comparative example, it is an image when the distance between the substrate and the diffusion plate is (A) 37 mm, (B) 34 mm, (C) 29 mm, and (D) 24 mm. It is a graph which shows the relative luminance of the light emission surface of an illuminating device at the time of arrange | positioning the fluorescent substance sheet of the illuminating device of a reference example. It is a graph which shows the relative brightness | luminance of the light emission surface of an illuminating device when not arrange | positioning the fluorescent substance sheet of the illuminating device of a reference example. It is a graph which shows the brightness nonuniformity (%) of the LED pattern in the case where the fluorescent substance sheet of the illuminating device of a reference example is arrange | positioned, and when a fluorescent substance sheet is not arrange | positioned. Y 3 AlO 12: is a graph showing measurement data of the phosphor temperature quenching in Ce (YAG) phosphor.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.
1. 1. Configuration example of lighting device Example

<1. Configuration Example of Lighting Device>
FIG. 1 is a schematic cross-sectional view showing an illumination device according to an embodiment of the present invention. As shown in FIG. 1, the lighting device includes a light emitting structure 11 in which a blue light emitting element is covered with a convex surface-shaped transparent resin, a substrate 12 on which the light emitting structure 11 is two-dimensionally arranged, and a blue light emitting element. A diffusing plate 13 for diffusing blue light, a phosphor sheet 14 that is disposed apart from the substrate 12 and contains powdered phosphor that obtains white light from blue light of a blue light emitting element, and an optical film 15 Prepare.

  The substrate 12 and the phosphor sheet 14 are spaced apart from each other by about 10 to 50 mm, and the lighting device forms a so-called “remote phosphor structure”. The gap between the substrate 12 and the phosphor sheet 14 is held by a plurality of support pillars and reflectors, and is provided so that the support pillars and reflectors surround the four sides of the space formed by the substrate 12 and the phosphor sheet 14. .

  The light emitting structure 11 constitutes a so-called “LED package” having, for example, an InGaN blue LED (Light Emitting Diode) chip as a blue light emitting element.

  FIG. 2 is a schematic cross-sectional view illustrating a configuration example of the light emitting structure 11. The light emitting structure 11 includes a base material 111, a blue LED chip 112 that is a blue light emitting element, and a transparent resin 113. Side walls are provided at the ends of the base material 111 so that the transparent resin 113 has a convex surface shape.

  The convex cross section of the transparent resin 111 has a lens shape, and the curved surface has a half value of the width of the blue LED chip 112 mounting surface on the base material 111 (a distance from the center of the base material 111 to the inner wall) a and a curvature radius r. And the ratio r / a is preferably 4.0 or less, and more preferably 1.7 or less. When r / a is 4.0 or less, the light confinement of the blue light due to the total reflection of the transparent resin 113 can be relaxed, and the efficiency of extracting the blue light to the outside can be improved. Further, since a broad light emission distribution can be obtained, the so-called “remote phosphor structure” can be thinned.

  Further, the height b of the inner wall at the end of the substrate 111 is equal to or greater than the thickness of the blue LED chip 112, and the height d of the transparent resin 113 is greater than the height b of the inner wall. The side wall of the end portion of the base material 111 may not be formed. In that case, when using the most popular potting method as the transparent resin forming method, r / a is set to 1.7 or less. Therefore, a method such as performing transparent resin molding using a mold is required.

  The board | substrate 12 which comprises an illuminating device is comprised from the glass cloth base material using resin, such as a phenol, an epoxy, a polyimide, polyester, a bismaleimide triazine, and allylated polyphenylene oxide. On the substrate 12, the light emitting structures 11 are two-dimensionally arranged corresponding to the entire surface of the phosphor sheet 14 at equal intervals with a predetermined pitch. Moreover, you may perform a reflection process to the mounting surface of the light emission structure 11 on the board | substrate 12 as needed.

  The diffuser plate 13 diffuses the radiated light from the light emitting structure 11 over a wide range so that the shape of the light source becomes invisible. As the diffusing plate 13, one having a total light transmittance of 20% or more and 80% or less is used.

  The phosphor sheet 14 contains a powdery phosphor that obtains white light from the blue light of the blue light emitting element. The phosphor powder having an average particle size of several μm to several tens of μm is used. Thereby, the light scattering effect of the phosphor sheet 14 can be improved.

  3A and 3B are diagrams illustrating a configuration example of the phosphor sheet 14. In the phosphor sheet 14 shown in FIG. 3A, a phosphor layer 141 containing a phosphor is sandwiched between a pair of transparent base materials 142a and 142b made of, for example, PET (polyethylene terephthalate). Moreover, these are laminated | stacked by sealing film 143a, 143b from the both surfaces. Thereby, the penetration | invasion of the water | moisture content to the fluorescent substance layer 141 can be prevented more.

  The single-layer type phosphor sheet 14 shown in FIG. 3A can be manufactured by forming a phosphor layer 141 on a transparent substrate 142a and laminating another transparent substrate 142b thereon. . And the fluorescent substance sheet 14 can be manufactured by pinching | interposing the fluorescent substance sheet 14 with sealing film 143a, 143b, and thermocompression bonding the whole.

  In addition, as shown in FIG. 3B, the phosphor layers 141 a and 141 b may be provided for each phosphor via a transparent separator 144. Thereby, when using several fluorescent substance, the reaction which is not intended can be suppressed and the lifetime of a fluorescent substance sheet can be lengthened.

  The phosphor layer 141 is formed by forming a resin composition containing a powdered phosphor. As the phosphor, a sulfide-based phosphor, an oxide-based phosphor, or a mixed phosphor thereof is used.

As the sulfide-based phosphor, a sulfide-based phosphor having a red fluorescence peak with a wavelength of 620 to 660 nm by irradiation with blue excitation light, preferably CaS: Eu, SrS: Eu, or a wavelength of 530 to 30 by irradiation with blue excitation light. A sulfide-based phosphor having a green fluorescence peak of 550 nm, preferably SrGa 2 S 4 : Eu can be mentioned. In the description of the phosphor material, the parenthesis is shown before “:” and the activator is shown after.

As the oxide phosphor, an oxide phosphor that emits red fluorescence having a wavelength of 590 to 620 nm when irradiated with blue excitation light, preferably (BaSr) 3 SiO 5 : Eu, (BaSr) 2 SiO 4 : Eu, or the like. Can be mentioned.

It should be noted that phosphors other than sulfide phosphors and oxide phosphors can be used in combination with the following resin composition, for example, (YGd) 2 (AlGa) 5 O 12 : Ce, sialon A phosphor etc. can be mentioned.

In the case of using the phosphor mixture as the phosphor in the single-layer phosphor sheet 14 shown in FIG. 3 (A), in order to cause the phosphor sheet to emit white light, the wavelength 620 is irradiated by blue excitation light. Sulfide-based phosphor that emits red fluorescence of ˜660 nm or oxide-based phosphor that emits red fluorescence of wavelength 590 to 620 nm when irradiated with blue excitation light, and green fluorescence of wavelength 530 to 550 nm when irradiated with blue excitation light It is preferable to use a mixed phosphor with a sulfide-based phosphor. A particularly preferred combination is a mixed phosphor of CaS: Eu or (BaSr) 3 SiO 5 : Eu that emits red fluorescence and SrGa 2 S 4 : Eu that emits green fluorescence.

In addition, in the two-layer phosphor sheet 14 shown in FIG. 3B, when the above-described phosphor is used as the phosphor, sulfide-based fluorescence that emits red fluorescence having a wavelength of 620 to 660 nm when irradiated with blue excitation light. Or a phosphor layer containing an oxide phosphor that emits red fluorescence with a wavelength of 590 to 620 nm upon irradiation with blue excitation light, and a sulfide phosphor that emits green fluorescence with a wavelength of 530 to 550 nm upon irradiation with blue excitation light It is preferable to use a phosphor layer containing A particularly preferred combination is a phosphor layer containing CaS: Eu or (BaSr) 3 SiO 5 : Eu that emits red fluorescence and a phosphor layer containing SrGa 2 S 4 : Eu that emits green fluorescence.

  The resin composition forming the phosphor layer preferably contains a resin component selected from either a polyolefin copolymer component or a photocurable (meth) acrylic resin component.

  Examples of the polyolefin copolymer include a styrene copolymer or a hydrogenated product thereof. Preferred examples of such a styrene copolymer or a hydrogenated product thereof include a styrene-ethylene-butylene-styrene block copolymer or a hydrogenated product thereof, and a styrene-ethylene-propylene block copolymer or a hydrogenated product thereof. be able to. Among these, a hydrogenated product of styrene-ethylene-butylene-styrene block copolymer can be particularly preferably used from the viewpoints of transparency and gas barrier properties. By including such a polyolefin copolymer component, excellent light resistance and low water absorption can be obtained.

  Examples of the photocurable acrylate resin component include urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate, and the like. Among these, from the viewpoint of heat resistance after photocuring, urethane (meth) ) Acrylate can be preferably used. By including such a photocurable (meth) acrylate resin component, excellent light resistance and low water absorption can be obtained.

  Moreover, when using a polyolefin copolymer component as a resin component, it is preferable to contain a maleic anhydride component. When the maleic anhydride component is contained, the moisture that has entered the resin composition is captured by the free carboxyl group of the maleic anhydride component, and as a result, the phosphor can be prevented from being altered by moisture. Moreover, the light-diffusion effect of the fluorescent substance sheet 14 can be improved by containing a polyolefin copolymer component and a maleic anhydride component.

  The maleic anhydride component (c) may be added (external addition) as a separate independent component to the polyolefin copolymer component, or added (internal addition) so as to be graft-polymerized to the polyolefin copolymer component. Also good. When internally added, the resin composition for film formation contains a maleic anhydride-modified polyolefin copolymer. Note that the external addition is preferable to the internal addition because the yellowing of the film-forming resin composition can be further suppressed.

  Moreover, other light-transmitting resins, color pigments, solvents, and the like can be blended with the resin composition as needed, as long as the effects of the present invention are not impaired.

  The optical film 15 constituting the illumination device is composed of, for example, a reflective polarizing film, a lens film, a diffusion film, etc. for improving the visibility of the liquid crystal display device. Here, the lens film is an optical film in which minute lenses are arrayed on one surface, and is for increasing the directivity of diffused light in the front direction and increasing the luminance.

  According to the illuminating device having such a configuration, the convex surface shape of the transparent resin 113 of the light emitting structure 11 reduces the light confinement of the blue light due to the total reflection of the transparent resin 113, and the efficiency of extracting the blue light to the outside. Can be improved. Furthermore, the distance between the substrate and the phosphor sheet can be reduced by broadening the light radiation distribution by the light emitting structure 11 and the light scattering effect by the phosphor sheet 14, so-called “remote phosphor structure” device. Can be made thinner. In addition, the liquid crystal display device can be thinned by arranging the lighting device in this embodiment on, for example, a liquid crystal panel serving as a display screen of the liquid crystal display device.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various updates can be added without departing from the gist of the present invention. For example, in the above-described embodiment, an example in which the lighting device is applied to a backlight light source for a display device has been described. However, the lighting device may be applied to a lighting light source. When applied to an illumination light source, the optical film 15 is unnecessary, and the phosphor-containing resin may have not only a flat sheet shape but also a three-dimensional shape such as a cup shape.

<2. Example>
Hereinafter, the present invention will be specifically described with reference to examples. The present invention is not limited to these examples.

<Evaluation of convex surface shape of LED package>
The convex surface shape was evaluated using a blue LED package and a white LED package having the same structure as the light emitting structure shown in FIG. In both packages, the distance a from the center of the substrate 111 to the inner wall was 2.15 mm, and the height b of the inner wall was 0.85 mm. A methyl silicone resin was used as the transparent resin 113, and the white LED package contained a YAG phosphor in the methyl silicone resin. The content of the YAG phosphor was adjusted so that the chromaticity of each white LED package was approximately (x, y) = (0.338, 0.400). For evaluation of the convex surface shape of each LED package, a total radiation amount (unit W) was measured as a light emission intensity using a total luminous flux measuring device using an integrating sphere.

  Table 1 shows the measurement result of the relative light emission intensity with respect to the resin shape of the blue LED package. Table 2 shows the measurement results of the relative light emission intensity with respect to the resin shape of the white LED package. The resin shape is indicated by the ratio r / a between the half value a of the width of the transparent resin contacting the substrate and the radius of curvature r. The relative light emission intensity was shown as a relative value with respect to the intensity of the state in which the LED chip is not included in the transparent resin, that is, the LED chip is exposed.

  4 to 7 show the radiation angle distributions of the blue LED package (r / a = ∞, 2.78, 1.46) and the white LED package (r / a = ∞). 4A and 4B, the blue LED package with r / a of ∞ and the white LED package with r / a of ∞ shown in FIGS. 7A and 7B have a vertical direction (0 °) and The light intensity (cd: candela) was almost the same in the horizontal direction (90 °), and the radiation angle distribution showed almost the same spread.

  Moreover, as shown to FIG. 4 (A), (B)-FIG. 6 (A), (B), a blue LED package becomes horizontal as r / a becomes small (infinity), 2.78, 1.46. The luminous intensity in the direction (90 °) was increased, and the spread of the radiation angle distribution was increased.

  In addition, as shown in Table 1, the relative intensity of the blue LED package was improved as r / a became smaller (as the transparent resin became convex). For example, a blue LED package with an r / a of 4.0 or less has a higher relative light emission intensity than a flat blue LED package with an r / a of ∞. The blue LED package with r / a of 1.7 or less had a relative light emission intensity of 1.2 or more. On the other hand, as shown in Table 2, the relative intensity of the white LED package decreased as r / a became smaller (transparent resin became convex).

  Thus, by making the surface shape of the transparent resin convex, the effect of increasing the spread of light emitted from the LED package and improving the relative light emission intensity can be said to be a phenomenon peculiar to the blue LED package. Since the blue LED package does not reflect the phosphor in the transparent resin, the efficiency of extracting light to the outside can be improved by making the surface shape of the transparent resin convex.

<Evaluation by LED package structure>
The lighting devices of the examples, reference examples, and comparative examples shown in FIGS. 8 to 10 were produced, and the brightness of the lighting devices was evaluated. In addition, the same code | symbol is attached | subjected to the structure similar to the illuminating device shown in FIG. 1, and description is abbreviate | omitted here.

[Configuration of Illumination Device of Example]
The lighting device of the embodiment shown in FIG. 8 includes a light emitting structure 11 in which a blue light emitting element is covered with a convex surface-shaped transparent resin, and a substrate on which the light emitting structure 11 is two-dimensionally arranged, as in FIG. 12, a diffusion plate 13 that diffuses blue light of the blue light emitting element, and a phosphor in powder form that obtains white light from the blue light of the blue light emitting element, and a phosphor sheet 14 that is disposed apart from the substrate 12. With.

  As the light emitting structure 11, a blue LED package including a convex surface-shaped transparent resin having an r / a of 1.46 was used. Methyl silicone resin was used as the transparent resin. Forty blue LED packages (8 × 5) were arranged on the substrate 12 at a pitch of 30 mm × 30 mm. As the diffusing plate 13, a diffusing plate having a thickness of 1.5 mm, an A4 size, and a total light transmittance of 65% was used. The distance between the substrate 12 and the diffusion plate 13 was 12 mm, and a phosphor sheet was disposed on the diffusion plate 13.

The phosphor sheet 14 was prepared as follows. First, 100 parts by mass of toluene, 40 parts by mass of a hydrogenated styrene-ethylene-butylene-styrene block (hydrogenated SEBS) copolymer (Septon 9527, Kuraray Co., Ltd.), and 0.5 parts by mass of maleic anhydride A green phosphor sheet-forming resin composition is prepared by uniformly mixing and dispersing 2 parts by mass of SrGa 2 S 4 : Eu (sulfide phosphor) having an average particle diameter of 6 μm uniformly in the obtained mixture. did.

The same operation as described above was performed except that CaS: Eu (sulfide phosphor) having an average particle size of 9 μm was used instead of SrGa 2 S 4 : Eu (sulfide phosphor) having an average particle size of 6 μm. The resin composition for forming a red phosphor sheet was prepared.

  Next, a green phosphor sheet-forming resin composition was applied to a 25 μm polyethylene terephthalate film (T11, Toray Industries, Inc.) so that the dry thickness was 27 μm, and a drying process (100 ° C., 5 minutes) To form a green phosphor resin layer.

  Next, a transparent separator (polyethylene terephthalate film, A4300, Toyobo Co., Ltd.) having a thickness of 38 μm is laminated on the green phosphor resin layer, and the red phosphor sheet forming resin composition is dried on the transparent separator. A red phosphor resin layer was formed by applying the film so as to have a thickness of 27 μm and performing a drying process (100 ° C., 5 minutes).

  Next, a polyethylene terephthalate film (T11, Toray Industries, Inc.) having a thickness of 25 μm was laminated and thermocompression bonded (100 ° C., 0.2 MPa) to prepare a phosphor sheet corresponding to FIG.

[Configuration of Lighting Device of Reference Example]
The illumination device of the reference example shown in FIG. 9 is the illumination of the embodiment shown in FIG. 8 except that the light emitting structure 11 is a blue LED package that is contained in a transparent resin having a flat surface shape with r / a of ∞. The configuration was the same as that of the apparatus.

[Configuration of Lighting Device of Comparative Example]
The lighting device of the comparative example shown in FIG. 10 uses, as the light emitting structure 11, a white LED package included in a transparent resin having a flat surface shape with r / a of ∞, except that the phosphor sheet 14 is not disposed. The configuration of the lighting apparatus of the example shown in FIG. For the white LED package, a transparent resin containing a methyl silicone resin and a YAG phosphor was used.

[Brightness evaluation by device configuration]
FIG. 11 shows LED input current-luminance characteristics of Examples, Reference Examples, and Comparative Examples. When the input current If was 75 mA, the example was able to improve the luminance by 26% over the comparative example. In addition, when the input current If was 150 mA, the example was able to improve the luminance by 33% over the comparative example. Moreover, the Example was able to improve brightness | luminance also with respect to the reference example using the blue LED package included with the transparent resin of the flat surface shape. The reason why the luminance improvement ratio is larger when the input current If is 150 mA than when the input current If is 75 mA is that the luminous efficiency loss due to the heat generation of the white LED package accompanying the increase of the input current If of the comparative example is This is because the phosphor sheet is larger than the “remote phosphor structure” of the embodiment in which the phosphor sheet is disposed apart from the phosphor sheet.

<Evaluation of thinner lighting equipment>
Next, using the illumination device of the reference example illustrated in FIG. 9 and the illumination device of the comparative example illustrated in FIG. 10, the luminance unevenness with respect to the distance between the substrate 12 and the diffusion plate 13 was evaluated. The LEDs were arranged on the substrate 12 at a pitch of 32 mm × 32 mm.

  FIGS. 12 and 13 show the lighting devices of the reference example and the comparative example, respectively, when the distance between the substrate 12 and the diffusion plate 13 is (A) 37 mm, (B) 34 mm, (C) 29 mm, and (D) 24 mm. It is an image.

  When the distance between the substrate 12 and the diffusion plate 13 shown in FIG. 12 is (C) 29 mm, the luminance unevenness is small. However, when the distance between the substrate 12 and the diffusion plate 13 shown in FIG. Was big. That is, it was found that the illumination device using the blue LED package and the phosphor sheet can be made thinner than the illumination device using the white LED package containing the phosphor.

14 and 15 are graphs showing the relative luminance of the light emitting surface of the lighting device when the phosphor sheet 14 of the lighting device of the reference example is arranged and when the phosphor sheet 14 is not arranged, respectively. . FIG. 16 is a graph showing the luminance unevenness (%) of the LED pattern when the phosphor sheet 14 of the illumination device of the reference example is arranged and when the phosphor sheet 14 is not arranged. The relative luminance is a value when the brightest portion is 1. Further, the luminance unevenness (%) of the LED pattern was calculated from the maximum intensity (Top intensity) and the minimum intensity (Bottom intensity) as in the following equation.
Unevenness of luminance (%) = (Top intensity−Bottom intensity) / Average intensity

  14 to 16, when the luminance unevenness of the light emitting surface is set to 2% or less, in the lighting device in which the phosphor sheet 14 is not disposed, the distance (optical thickness) between the substrate 12 and the diffusion plate 13 is set to 34 mm or more. Although it must be set, in the lighting device in which the phosphor sheet 14 is arranged, the distance (optical thickness) between the substrate 12 and the diffusion plate 13 may be set to 24 mm. It was found that the light scattering effect was great.

  From the above results, it was found that the efficiency of extracting blue light to the outside can be improved by the convex surface shape of the transparent resin. Moreover, the separation distance between the substrate and the phosphor sheet can be reduced by broadening the light radiation distribution due to the convex surface shape of the transparent resin and the light scattering effect by the phosphor sheet containing the powdered phosphor. It has been found that a so-called “remote phosphor structure” device can be thinned.

  DESCRIPTION OF SYMBOLS 11 Light emitting structure, 12 Board | substrate, 13 Diffusion plate, 14 Fluorescent substance sheet, 15 Optical film, 111 Base material, 112 LED chip, 113 Transparent resin, 141 Fluorescent substance layer, 142 Transparent base material, 143 Sealing film

Claims (7)

  1. A light-emitting structure in which a blue light-emitting element is included in a convex surface-shaped transparent resin;
    A substrate on which the light emitting structure is two-dimensionally arranged;
    A phosphor sheet that is disposed apart from the substrate and contains a powdered phosphor that obtains white light from the blue light of the blue light-emitting element,
    In the light emitting structure, the blue light emitting element is mounted on a base material,
    The cross section of the convex light emitting structure is a lens shape,
    The convex surface shape is a curved surface based on the lens shape, and the curved surface constitutes a part of a spherical surface having a curvature radius r,
    The illuminating device whose ratio r / a of the half value a of the width | variety of the transparent resin which contacts on the said base material, and the curvature radius r of the said convex-shaped surface shape is 4.0 or less.
  2. In the light emitting structure, the blue light emitting element is mounted on a base material,
    2. The lighting device according to claim 1, wherein a ratio r / a between a half value a of the width of the transparent resin contacting the substrate and a curvature radius r of the convex surface shape is 1.7 or less.
  3.   The phosphor sheet includes at least one phosphor selected from the group consisting of sulfide-based phosphors, oxide-based phosphors, and mixed phosphors thereof, a polyolefin copolymer component, and a photo-curing property (meta-meta). The lighting device according to claim 1 or 2, further comprising a phosphor layer on which a resin composition containing a resin component selected from any of acrylic resin components is formed.
  4.   The lighting device according to claim 3, further comprising a phosphor layer in which a polyolefin copolymer component is selected as the resin component and a resin composition containing a maleic anhydride component is further formed.
  5.   The lighting device according to claim 3, wherein the phosphor sheet is formed by sandwiching the phosphor layer between a pair of transparent base materials and laminating with a sealing film from both sides.
  6.   The lighting device according to any one of claims 1 to 5, further comprising a diffusion plate between the substrate and the phosphor sheet.
  7.   A display device in which the illumination device according to claim 1 is disposed on an image display panel.
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CN201910584385.3A CN110265532A (en) 2011-07-05 2012-07-05 Lighting device
TW101124195A TWI570360B (en) 2011-07-05 2012-07-05 Lighting device
CN201910584203.2A CN110265533A (en) 2011-07-05 2012-07-05 Lighting device
PCT/JP2012/067177 WO2013005792A1 (en) 2011-07-05 2012-07-05 Illumination device
US14/110,796 US10415793B2 (en) 2011-07-05 2012-07-05 Illumination apparatus
KR1020147001153A KR101955188B1 (en) 2011-07-05 2012-07-05 Illumination device
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JP2013016692A (en) 2013-01-24

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