CN101814572A - Optical diode packaging structure - Google Patents
Optical diode packaging structure Download PDFInfo
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- CN101814572A CN101814572A CN201010130279A CN201010130279A CN101814572A CN 101814572 A CN101814572 A CN 101814572A CN 201010130279 A CN201010130279 A CN 201010130279A CN 201010130279 A CN201010130279 A CN 201010130279A CN 101814572 A CN101814572 A CN 101814572A
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- optical diode
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- package structure
- microlens array
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Abstract
The invention discloses an optical diode packaging structure applied to an optical diode crystal particle. The packaging structure comprises a base plate, a loading space and an optical material layer, wherein the base plate is provided with a first surface; an opening at the top of the loading space is positioned on the first surface of the base plate, and the bottom of the loading space is used for loading the optical diode crystal particle; and the optical material layer covers the optical diode crystal particle and has a micro-lens array structure, wherein the micro-lens array structure is positioned above the optical diode crystal particle and is used for transmitting light rays emitted by the optical diode crystal particle and defining a light type. The invention can effectively solve the problems of alignment and fixation caused by relative displacement between a lens structure and a packaging base without resulting in process complication and cost improvement.
Description
Technical field
The present invention relates to a kind of optical diode package structure, relate in particular to a kind of optical diode package structure that is applied on the optical diode grain.
Background technology
Light-emitting diode (Light Emitting Diode is hereinafter to be referred as LED) is a kind of luminescent device that can directly electric energy be converted into visible light and radiant energy, its luminous principle is that two terminals of both positive and negative polarity apply voltage in semiconductor, when electric current passes through, when electronics is combined with the hole, dump energy just discharges with the form of light, comply with the difference of the material of its use, it can just make photon energy produce the light of different wave length in rank, therefore, it is low that light-emitting diode (LED) has operating voltage usually, power consumption is little, the luminous efficiency height, emission response time is extremely short, photochromic pure, sound construction, shock resistance, vibration resistance, stable and reliable for performance, series of characteristics such as the little and cost of volume in light weight is low, the development of light-emitting diode can be said so and be advanced by leaps and bounds, and now can produce the versicolor high brightness of whole visible spectrum in a large number, premium quality product.And light-emitting diode (LED) production process in the industry cycle mainly can be divided into the upstream is light-emitting diode (LED) substrate chip and substrate production, the industry in middle reaches is light-emitting diode (LED) chip design and makes and produce, the downstream then is light-emitting diode (LED) packaging and testing, and wherein whether superior the encapsulation of light-emitting diode (LED) be to influence light-emitting diode (LED) finished product important key technology.
Package structure for LED is that single or many light-emitting diodes (LED) are fixed on support or the substrate, and allow the positive and negative electrode of light-emitting diode (LED) be connected, and use some glue or the mode of pressing mold is encapsulated light-emitting diode (LED) with epoxy resin or silica gel with electrode on support or the substrate by modes such as routing or eutectics.See also Fig. 1, it is known package structure for LED schematic diagram with lens arrangement.We can clearly be seen that from figure, this package structure for LED 1 includes an encapsulation base 10 and a lens arrangement 11, wherein this encapsulation base 10 has a bearing space 12 and is used for carrying a LED crystal particle 100, and this lens arrangement 11 binds glue 13 (for example: silicone resin (Silicone) or epoxy resin (Epoxy)) by one and engages fixing with the exiting surface 101 of this encapsulation base 10.Yet; known have the package structure for LED 1 of lens arrangement when this lens arrangement 11 engages with this encapsulation base 10; this lens arrangement 11 takes place Shi Changhui can't aim at the central point of the exiting surface 101 of this encapsulation base 10 (indicating the place as figure intermediate cam shape symbol) accurately; and cause the situation that skew is arranged between this lens arrangement 11 and this encapsulation base 10 to take place; or in the process that engages, this bonding glue 13 produces the situation of inclination because of application of force inequality causes this lens arrangement 11 and encapsulation base 10.
As Fig. 2 a-Fig. 2 c, it produces skew or inclination schematic diagram for this lens arrangement 11 engages the back with this encapsulation base 10.Shown in Fig. 2 a and Fig. 2 b, in this lens arrangement 11 and process that this encapsulation base 10 engages, shown in Fig. 2 a, when this lens arrangement 11 can't be aimed at the central point of exiting surface 101 of this encapsulating structure 10 accurately (triangle symbol indicates the place), shown in Fig. 2 b, just can produce this lens arrangement 11 produces unidirectional (directions X) or two-way (directions X and Y direction) with respect to the exiting surface 101 of this encapsulating structure 10 linear deflection.Shown in Fig. 2 c, in the process that is engaging, cause this joint glue 13 distortion because the application of force is uneven, and then cause this lens arrangement 11 to produce a deflection inclination angle with respect to the exiting surface 101 of this encapsulation base 10.This above-mentioned lens arrangement 11 produces in engaging process with encapsulation base 10 and engages condition of poor, and it is excessive with this lens arrangement 11 relative positions skew all can to produce this LED crystal particle 100, causes the change of luminous efficiency decline and light type.In addition, at this lens arrangement 11 with after this encapsulation base 10 engages, having following situation produces, vertical view shown in Fig. 2 d, we can know and find out, if this lens arrangement 11 is for being inscribed within the inscribed circle on these encapsulation base 10 4 limits, then this lens arrangement 11 can't all be contained this encapsulation base 10 (four of this encapsulation base angles are exposed to outside this encapsulation base 10 as shown in the figure), thereby has wasted the area of this encapsulation base 10; The vertical view of another situation shown in Fig. 2 e, completely this encapsulation base 10 is contained in order to make this lens arrangement 11, thereby strengthened the area of this lens arrangement 11, but this lens arrangement 11 that so has part again exceeds outside this encapsulation base 10, and has wasted the area of this lens arrangement 11.Above-mentioned two kinds of situations all can cause the raising of cost of manufacture.
And in order to improve the problem of secured in alignment that relative displacement causes between said lens structure and encapsulation base and waste cost of manufacture, thereby develop and to combine a kind of lenticule optical system (Micro lens optical system) that is shaped with many optical modules.Shown in Fig. 3 a～Fig. 3 e, make spherical lens 200 (shown in Fig. 3 a) with photoresistance heat reflow method (Reflow process) earlier; Subsequently a macromolecular material 201 is cast (Cast) at (shown in Fig. 3 b) on the spherical lens among Fig. 3 a; Obtain a macromolecular material mould 202 (Fig. 3 c) after the curing; Again in the mode of spin coating, the material of making microlens array 203 is coated among Fig. 3 c on the resulting macromolecular material mould 202 (shown in Fig. 3 d); After carrying out a demoulding program more at last, just can obtain rubber-like microlens array 203.After the explanation of above-mentioned microlens array 203 production processes, we can clearly be seen that, known microlens array 203 is after must additionally completing by a series of casting film forming technologies, indivedual single microlens structures with this microlens array 203 engage with the encapsulation base of single light-emitting diode again, form encapsulation architecture as shown in Figure 1, though this microlens array 203 can effectively improve aiming at and fixing problem that relative displacement caused between lens arrangement and encapsulation base, but so complicated technology certainly will also can cause the raising of cost of manufacture, therefore, how to improve, be topmost purpose of the present invention at above-mentioned defective.
Summary of the invention
At the defective of prior art, for the object of the present invention is to provide a kind of optical diode package structure, be applied on the optical diode grain, this encapsulating structure comprises: a substrate, it has a first surface; One bearing space, its open top are positioned at this first surface of this substrate, and its bottom is in order to carry this optical diode grain; An and optical material layer, it is formed in this bearing space and is covered on this optical diode grain and has a microlens array structure, wherein this microlens array structure is positioned at the top of this optical diode grain, the light that is sent in order to this optical diode grain of transmission, by the arrangement mode of lenticular profile and array, can effectively be lifted out optical efficiency and change light-changing type simultaneously.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this substrate is the silicon semiconductor substrate of one (100) lattice direction, one (110) lattice direction or one (111) lattice direction.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this substrate is the ceramic substrate of an aluminium oxide or an aluminium nitride material.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this substrate is with an aluminum metal or the made metal substrate of a bronze medal metal.
According to above-mentioned conception, optical diode package structure of the present invention, wherein around forming, and described a plurality of inclined-plane and this bearing space bottom angle are less than 90 degree by a plurality of inclined plane rings for this bearing space.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this bearing space is shaped as one tapered, a upright square, a square type, half ellipse or half pyramid type.
According to above-mentioned conception, optical diode package structure of the present invention also comprises a via, and its bottom opening is positioned at the second surface that this substrate has, and the top of this via is communicated in the bottom of this bearing space.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this optical material layer and this microlens array structure are to have a heat curing-type of certain light transmittance or a thermoplastics type optics colloid.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this optical material layer is to have a heat curing-type of certain light transmittance or a thermoplastics type optics colloid, and this microlens array structure is a light-sensitive material, a thermoset material or thermoplastics type's material.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this microlens array structure is pressed on this optical material layer by a die or in addition to finish on this first surface of fitting in this substrate behind the dried contour forming and this optical material layer.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this microlens array structure is made of a plurality of microlens structure, and these microlens structures can be the half elliptic three-dimensional microstructures that a hemisphere three-dimensional microstructures or two that the circular arc bending makes progress axially is uneven in length.
According to above-mentioned conception, optical diode package structure of the present invention, wherein said a plurality of microlens structures can be the half elliptic three-dimensional microstructures that the crooked downward hemisphere three-dimensional microstructures or two of circular arc axially is uneven in length.
According to above-mentioned conception, optical diode package structure of the present invention, wherein said a plurality of microlens structures can be a trihedral tapered structure or a tetrahedron tapered structure.
According to above-mentioned conception, optical diode package structure of the present invention, wherein this microlens array structure is positioned on this first surface of this substrate or is positioned at this bearing space.
According to above-mentioned conception, optical diode package structure of the present invention, its applied this optical diode grain is a light-emitting diode or a laser diode.
Beneficial effect of the present invention is, can effectively improve aiming at and fixing problem that relative displacement caused between lens arrangement and encapsulation base, and also unlikely technology is complicated to be improved with cost.
Description of drawings
Fig. 1, it is known package structure for LED schematic diagram with lens arrangement.
Fig. 2 a～Fig. 2 e, it produces skew or inclination and causes encapsulation base area waste schematic diagram for this lens arrangement engages the back with this encapsulation base.
Fig. 3 a～Fig. 3 e, it is a method for fabricating microlens array schematic flow sheet.
Fig. 4, it is for the first preferred embodiment schematic diagram of optical diode package structure of the present invention.
Fig. 5 a～Fig. 5 c, the schematic flow sheet of the microlens array construction manufacturing method that it is comprised in the optical diode packaging substrate structure described in first preferred embodiment for the present invention.
Fig. 6 a～Fig. 6 b, it is the second preferred embodiment schematic diagram of optical diode package structure of the present invention.
Fig. 7 a～Fig. 7 d, it is by being comprised the difform embodiment schematic diagram of a plurality of microlens structures in this microlens array structure.
Wherein, description of reference numerals is as follows:
Package structure for LED 1 encapsulation base 10
Exiting surface 101
Spherical lens 200 macromolecular materials 201
LED crystal particle 200
Optical diode package structure 3
Via 32,33 optical material layers 34
Microlens array structure 35 first surfaces 301
Lenticule die 3016 optical diode grain 300
Via 42,43 optical material layers 44
Microlens array structure 45 first surfaces 401
Lenticule die 4016 optical diode grain 400
Half elliptic microlens structure 50
The crooked downward semicircular microlens structure 60 of circular arc
The crooked downward half elliptic microlens structure 70 of circular arc
The microlens structure 80 of taper
Embodiment
See also Fig. 4, the first preferred embodiment schematic diagram of the optical diode package structure that its defective that produces for the existing optical diode package structure of improvement for the present invention is developed, and this encapsulating structure of the present invention is applied in the encapsulation process of optical diode grain 300 of a light-emitting diode (LED) or a laser diode (Laser Diode).We can know and find out from figure, optical diode package structure 3 of the present invention includes the substrate 30 with a first surface 301 and a second surface 302, one bearing space 31, one via 32,33, one optical material layer 34 and a microlens array structure 35, wherein this substrate 30 is one (100) lattice direction, the silicon semiconductor substrate of one (110) lattice direction or one (111) lattice direction, this type of semiconductor substrate can provide the heat radiation of high-termal conductivity, the material of this substrate 30 also can be utilized the made ceramic substrate of an aluminium oxide or an aluminium nitride material or utilize an aluminum metal in addition, the metal substrate that one bronze medal metal is made equally also can provide the heat radiation of high-termal conductivity; This bearing space 31 mainly by a plurality of inclined-planes 306 around forming, its open top is positioned at these first surface 301 1 sides of this substrate 30, the bottom of this bearing space 31 be mainly used in the carrying this optical diode grain 300; The bottom opening of this via 32 is positioned at these second surface 302 1 sides of this substrate 30, and this via 32,33 top is communicated in the bottom of this bearing space 31, and the topmost technological means of optical diode package structure of the present invention is to have this optical material layer 34 in this bearing space 31, it is covered on this optical diode grain 300, and be connected with this microlens array structure 35 on this optical material layer 34, this microlens array structure 35 is positioned at the top of this optical diode grain 300, the main light that is sent in order to this optical diode grain 300 of transmission, by the arrangement mode of single lenticular profile and array, can effectively be lifted out optical efficiency and change light-changing type simultaneously.Below be described in detail at optical diode package structure of the present invention again.
Hold above-mentioned technical descriptioon, be usually located at this first surface 301 of this substrate 30 and this bearing space 31 and this via 32 on this second surface 302, the 33rd, carry out etched mode via this first surface 301 with this second surface 302 and finish this substrate 30, according to the properties of crystal lattice of this substrate 30 respectively at the angle that forms bottom and 306 on inclined-plane on this first surface 301 and this second surface 302 these bearing spaces 31 and these vias 32 less than 90 degree, 33, and by 306 on a plurality of inclined-planes around this bearing space that forms, it is one tapered that its shape can be, one upright square, one square type, half ellipse or half pyramid type.And this optical material layer 34 is to have a heat curing-type (as: silica gel, epoxy resin) of certain light transmittance or a thermoplastics type's (as: the polyester system of high glass transition temperature ...) optics colloid, and this microlens array structure 35 is a light-sensitive material (as: photoresistance), a thermoset material or thermoplastics type's material.
See also Fig. 5 a～Fig. 5 (c), the schematic flow sheet of microlens array structure 35 manufacture methods that it is comprised in the optical diode packaging substrate structure 3 described in first preferred embodiment for the present invention.We can know and find out from figure, this microlens structure 35 mainly is to finish by a die pressing forming technology, its steps flow chart can be known from Fig. 5 a～Fig. 5 c and find out, at first shown in Fig. 5 a, we are coated with another optical material layer 350 (this optical material layer 350 we can utilize silica gel to make) on this original optical material layer 34; Shown in Fig. 5 b, a lenticule die 3016 is pressed on the optical material layer 350; Shown in Fig. 5 c, remove this lenticule die 3016, and then on optical material layer 350, form this microlens array structure 35.In addition, this microlens array structure 35 directly fits on this first surface 301 of this substrate 30 after also can be in addition being shaped with the form of dried mould.
See also Fig. 6 a and Fig. 6 b, the second preferred embodiment schematic diagram of the optical diode package structure that its defective that produces for the known optical diode package structure of improvement for the present invention is developed.We can know and find out from Fig. 6 a, optical diode package structure 4 of the present invention includes the substrate 40 with a first surface 401 and a second surface 402, one bearing space 41, one via 42,43, one optical material layer 44, described in the present embodiment optical diode package structure 4 place different with first preferred embodiment is, we only form this optical material layer 44 in this bearing space 41, need not on this optical material layer 44, form another optical material layer more in addition and make the microlens array structure, just microlens array structure 45 in the present embodiment is integrally formed with this optical material layer 44, the method of its making is shown in Fig. 6 b, one lenticule die 4016 directly is pressed on this optical material layer 44 of ot-yet-hardened, just after removing this lenticule die 4016, can on this optical material layer 44, form the microlens array structure 45 as shown in Fig. 6 a then.And this preferred embodiment has the part technological means identical with first preferred embodiment, so just will not give unnecessary details at this.
Above-mentioned we mainly make with a volume plavini, a hot melten type, a surface tension or a hot extrusion method at this lenticule die described in first preferred embodiment and second preferred embodiment 3016,4016, turn over mold technique by one again and finish this lenticule die 3016,4016.
In addition, in the making process step of above-mentioned different execution modes, we can know and find out, this optical material layer 34,44 thickness has determined this microlens array structure 35,45 formation position, for example in Fig. 4, the formation position of this microlens array structure 35 is positioned on this first surface 301 of this substrate 30, and in Fig. 6 a, the formation position of this microlens array structure 45 then is to be arranged in this bearing space 31, yet, above-mentioned execution mode only is the preferred embodiment that the present invention carried, this optical material layer 34,44 also can be along this optical diode grain 300, be coated with uniform thickness around 400 and get final product, might not need this optical material layer 34,44 fill up this bearing space 31,41.
See also Fig. 7 a～Fig. 7 d again, it is these microlens array structure 35,45 difform embodiment schematic diagrames.In the explanation of the first above-mentioned preferred embodiment and second preferred embodiment, this microlens array structure 35, comprise a plurality of microlens structures in 45, we are that example describes with a hemisphere three-dimensional structure all, yet, described a plurality of microlens structures that microlens array structure of the present invention is comprised except can this hemisphere three-dimensional microstructures, the two half elliptic three-dimensional microstructures 50 that axially are uneven in length that can also be shown in Fig. 7 a, the crooked downward hemisphere three-dimensional microstructures 60 of circular arc shown in Fig. 7 b, the crooked two downward half elliptic three-dimensional microstructures 70 that axially are uneven in length of circular arc shown in Fig. 7 c, trihedral shown in Fig. 7 d or tetrahedral tapered structure 80.
Comprehensive above different embodiment explanation, we can know and recognize that the optical diode structure by technological means of the present invention is finished has solved the defective that is produced on the known package structure really, and then realize topmost purpose of the present invention.Those skilled in the art should recognize change and the retouching of being done under the situation that does not break away from the appended scope and spirit of the present invention that claim disclosed of the present invention, all belong within the protection range of claim of the present invention.
Claims (10)
1. an optical diode package structure is applied on the optical diode grain, and this encapsulating structure comprises:
One substrate, it has a first surface;
One bearing space, its open top be positioned at this substrate this first surface, its bottom in order to carry this optical diode grain; And
One optical material layer, it is formed in this bearing space and is covered on this optical diode grain and has a microlens array structure, wherein this microlens array structure be positioned at this optical diode grain the top, in order to this optical diode grain of transmission sent light and definition light type.
2. optical diode package structure as claimed in claim 1, it is characterized in that, this substrate be one (100) lattice direction, one (110) lattice direction or one (111) lattice direction silicon semiconductor substrate or with an aluminium oxide or an aluminium nitride material ceramic substrate or with an aluminum metal or a bronze medal metal made a metal substrate.
3. optical diode package structure as claimed in claim 1, it is characterized in that, this bearing space by a plurality of inclined plane rings around forming, and described a plurality of inclined-plane and this bearing space bottom angle is less than 90 degree, and this bearing space be shaped as one tapered, a upright square, a square type, half ellipse or half pyramid type.
4. optical diode package structure as claimed in claim 1, it is characterized in that, this optical diode package structure also comprises a via, its bottom opening be positioned at that this substrate has a second surface, this via the top be communicated in this bearing space the bottom.
5. optical diode package structure as claimed in claim 1 is characterized in that, this optical material layer and this microlens array structure be have certain light transmittance a heat curing-type or a thermoplastics type the optics colloid.
6. optical diode package structure as claimed in claim 1, it is characterized in that, this optical material layer be have certain light transmittance a heat curing-type or a thermoplastics type the optics colloid, and this microlens array structure is a light-sensitive material, a thermoset material or thermoplastics type's material.
7. optical diode packaging substrate structure as claimed in claim 1, it is characterized in that, this microlens array structure be pressed on this optical material layer by a die or in addition with fit in behind the dried contour forming this substrate this first surface and this optical material layer on make.
8. optical diode packaging substrate structure as claimed in claim 1, it is characterized in that, this microlens array structure is made of a plurality of microlens structure, and described a plurality of microlens structure for the circular arc bending make progress a hemisphere three-dimensional microstructures the circular arc bending make progress two axially be uneven in length a half elliptic three-dimensional microstructures or for the crooked downward hemisphere three-dimensional microstructures of circular arc or circular arc crooked downward two axially be uneven in length a half elliptic three-dimensional microstructures or be tapered micro-structural of a trihedral or the tapered micro-structural of a tetrahedron.
9. optical diode package structure as claimed in claim 1 is characterized in that, this microlens array structure be positioned at this substrate this first surface on or be positioned at this bearing space.
10. optical diode package structure as claimed in claim 1 is characterized in that, its this applied optical diode grain is a light-emitting diode or a laser diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010130279A CN101814572A (en) | 2010-03-05 | 2010-03-05 | Optical diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010130279A CN101814572A (en) | 2010-03-05 | 2010-03-05 | Optical diode packaging structure |
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| CN101814572A true CN101814572A (en) | 2010-08-25 |
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| CN201010130279A Pending CN101814572A (en) | 2010-03-05 | 2010-03-05 | Optical diode packaging structure |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102487063A (en) * | 2010-12-03 | 2012-06-06 | 刘胜 | LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens |
| CN103474423A (en) * | 2013-03-28 | 2013-12-25 | 深圳信息职业技术学院 | High luminous efficiency LED integrated light source and LED lamp |
| CN103855270A (en) * | 2012-12-07 | 2014-06-11 | 展晶科技(深圳)有限公司 | Light-emitting device and manufacturing method thereof |
| CN104465964A (en) * | 2014-11-14 | 2015-03-25 | 司红康 | LED packaging structure |
| CN105098038A (en) * | 2014-05-22 | 2015-11-25 | 台湾半导体照明股份有限公司 | Wafer level packaging method and wafer level packaging structure |
| CN107482105A (en) * | 2016-06-07 | 2017-12-15 | 王圣然 | A kind of light emitting diode with microlens array encapsulation |
| CN111403579A (en) * | 2020-02-29 | 2020-07-10 | 华中科技大学 | High-power white light L ED with array lens light-emitting surface and preparation method thereof |
| CN111463652A (en) * | 2019-01-22 | 2020-07-28 | 隆达电子股份有限公司 | Light emitting device |
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| JP2005064111A (en) * | 2003-08-08 | 2005-03-10 | Stanley Electric Co Ltd | High luminance light emitting diode |
| US20060261357A1 (en) * | 2005-05-18 | 2006-11-23 | Ching-Fu Tsou | Array-type modularized light-emitting diode structure and a method for packaging the structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102487063A (en) * | 2010-12-03 | 2012-06-06 | 刘胜 | LED (Light-Emitting Diode) array packaging structure with microstructure silica-gel lens |
| CN103855270A (en) * | 2012-12-07 | 2014-06-11 | 展晶科技(深圳)有限公司 | Light-emitting device and manufacturing method thereof |
| CN103474423A (en) * | 2013-03-28 | 2013-12-25 | 深圳信息职业技术学院 | High luminous efficiency LED integrated light source and LED lamp |
| CN105098038A (en) * | 2014-05-22 | 2015-11-25 | 台湾半导体照明股份有限公司 | Wafer level packaging method and wafer level packaging structure |
| CN104465964A (en) * | 2014-11-14 | 2015-03-25 | 司红康 | LED packaging structure |
| CN104465964B (en) * | 2014-11-14 | 2017-01-25 | 安徽康力节能电器科技有限公司 | LED packaging structure |
| CN107482105A (en) * | 2016-06-07 | 2017-12-15 | 王圣然 | A kind of light emitting diode with microlens array encapsulation |
| CN111463652A (en) * | 2019-01-22 | 2020-07-28 | 隆达电子股份有限公司 | Light emitting device |
| CN111403579A (en) * | 2020-02-29 | 2020-07-10 | 华中科技大学 | High-power white light L ED with array lens light-emitting surface and preparation method thereof |
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Application publication date: 20100825 |