CN114447197A - Preparation method of fly-eye array lens for LED integrated packaging - Google Patents
Preparation method of fly-eye array lens for LED integrated packaging Download PDFInfo
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- CN114447197A CN114447197A CN202210085556.XA CN202210085556A CN114447197A CN 114447197 A CN114447197 A CN 114447197A CN 202210085556 A CN202210085556 A CN 202210085556A CN 114447197 A CN114447197 A CN 114447197A
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- light
- emitting
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- circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
- B29L2011/0016—Lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Abstract
The application discloses a method for preparing a fly-eye array lens of LED integrated package, which comprises the following steps: step 1: preparing an integrated light source circuit board, wherein the integrated light source circuit board comprises a plurality of light-emitting points; step 2: mounting a light-emitting wafer on each light-emitting point, and connecting positive and negative circuits of the light-emitting wafer; and step 3: and sealing and molding each light-emitting point to form a curved lens structure on each light-emitting point. The method for preparing the fly-eye array lens integrally packaged by the LED is simple in step, the curved surface lens structure is formed above the integrated light source circuit board, the light energy light-emitting rate is improved by 20% -30% compared with a plane packaging mode, on the other hand, the separated fly-eye array lens group is formed on a light-emitting point, the light shaping effect after light emitting is better than that of a single curved surface lens, the axial light is strong, and the light-emitting angle is small, so that the fly-eye array lens is suitable for remote transmission.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a method for preparing a fly-eye array lens of LED integrated packaging.
Background
The current LED integrated packaging appearance is mainly divided into two types when viewed from the light-emitting axial direction: the first is a planar package as viewed from the light emitting axis as shown in fig. 4, and the second is a curved package in which all light emitting surfaces are contained as viewed from the light emitting axis as shown in fig. 5.
Among them, the following problems exist in the light emitting mechanism of the planar package: part of large-angle light can form total reflection inside the packaging material, so that the utilization rate of light energy is reduced, the light emitted by the LED is not shaped and is in a state of divergence and large angle, the secondary optical design is difficult, and the long-distance transmission of the light is not facilitated. The following problems exist in the light emitting mechanism of the curved surface package: the light cannot form total reflection in the packaging material, the light energy utilization rate is 20% -30% higher than that of planar packaging, and the light emergent angle of the single lens is larger.
When long-distance illumination is transmitted, due to the geometrical optics principle: the image plane diameter is the magnification power and the object plane diameter is the magnification power and the light source diameter. Therefore, in the same scene and the same illumination distance, the size of the light source diameter is determined as the size of the image plane diameter. The image plane illumination is inversely proportional to the image plane area, namely the image plane illumination is inversely proportional to the square of the image plane diameter, namely the image plane illumination is inversely proportional to the square of the light source diameter, so that the LED packaged lamp with the large light source diameter and the low image plane illumination is not suitable for long-distance illumination. By combining the light emitting mechanism of the planar packaging and the curved surface packaging, the problem of poor long-distance illumination effect exists in the conventional LED integrated packaging mode.
Disclosure of Invention
The application aims to provide a method for preparing a fly-eye array lens of LED integrated package, and the problem that the existing LED integrated package mode in the background art is poor in remote illumination effect is solved.
In order to achieve the above purpose, the present application provides the following technical solutions: a preparation method of a fly-eye array lens of an LED integrated package comprises the following steps:
step 1: preparing an integrated light source circuit board, wherein the integrated light source circuit board comprises a plurality of light-emitting points;
step 2: installing a light-emitting wafer on each light-emitting point and connecting positive and negative circuits of the light-emitting wafers;
and step 3: and sealing and molding each light-emitting point to form a curved lens structure on each light-emitting point.
Preferably, the step 3 specifically comprises the following steps:
step 3-11: preparing a die-casting die, wherein the die-casting die is provided with cavities which correspond to the plurality of light-emitting points one by one, and small converging lenses are arranged in the cavities;
step 3-12: putting the integrated light source circuit board into the die-casting mould, so that each light-emitting point corresponds to the containing cavity;
step 3-13: and injecting silica gel into the die-casting mould, wherein the silica gel flows into the containing cavity and is solidified to form the light-emitting point and the micro convergent lens into a whole through die-casting.
Preferably, the micro collecting lens is any one of plastic, glass and silica gel.
Preferably, the step 3 specifically comprises the following steps:
step 3-21: preparing a monomer tiny convergent lens;
step 3-22: packaging the integrated light source circuit board and the plurality of light-emitting points on the integrated light source circuit board into a plane structure through silica gel;
step 3-23: and bonding each tiny converging lens above each luminous point in a die bonding mode.
Preferably, the micro collecting lens is any one of plastic, glass and silica gel.
Preferably, the step 3 specifically comprises the following steps:
step 3-31: packaging the integrated light source circuit board and the plurality of light-emitting points on the integrated light source circuit board into a plane structure through silica gel;
step 3-32: and planting the silica gel above each light-emitting point in a dripping mode through a precision manipulator.
Preferably, the plurality of light emitting chips are arranged in parallel.
Has the advantages that: the application discloses a preparation method of a fly-eye array lens of LED integrated package, a curved surface lens structure is formed above an integrated light source circuit board, namely the fly-eye array lens belongs to a generalized curved surface packaging form, the light energy light-emitting rate is improved by 20% -30% compared with a plane packaging form, on the other hand, a curved surface lens structure is formed on each light-emitting point, namely a separated fly-eye array lens group is formed, the light shaping effect after light emitting is better than that of a single curved surface lens, the axial light is strong, the light-emitting angle is small, the preparation method is suitable for remote transmission, and therefore the problems of plane packaging and curved surface packaging in the traditional LED integrated package are solved. Furthermore, the preparation method of the fly-eye array lens integrally packaged by the LED has multiple options, is suitable for manufacturers with different production conditions to use as an actual production process, and has high universality.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic flow chart of a method for manufacturing a fly-eye array lens of an LED integrated package in embodiment 1 of the present application;
fig. 2 is a schematic flowchart of a method for manufacturing a fly-eye array lens of an LED integrated package in embodiment 2 of the present application;
fig. 3 is a schematic flowchart of a method for manufacturing a fly-eye array lens of an LED integrated package in embodiment 3 of the present application;
FIG. 4 is a schematic diagram of an integrated LED package formed by planar packaging in the prior art;
fig. 5 is a schematic view of an LED integrated package structure formed by a curved surface package method in the prior art.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A method for preparing a fly-eye array lens of an LED integrated package as shown in fig. 1, the method comprising the following steps:
step 1: preparing an integrated light source circuit board, wherein the integrated light source circuit board comprises a plurality of light-emitting points;
step 2: installing a light-emitting wafer on each light-emitting point and connecting positive and negative circuits of the light-emitting wafer;
and step 3: sealing and molding each light-emitting point to form a curved lens structure on each light-emitting point; the method specifically comprises the following steps:
step 3-11: preparing a die-casting die, wherein the die-casting die is provided with cavities which correspond to the plurality of luminous points one by one, and small convergent lenses are arranged in the cavities and are made of any one of plastic, glass and silica gel or other transparent structures;
step 3-12: putting the integrated light source circuit board into a die-casting die, and enabling each light-emitting point to correspond to the accommodating cavity;
step 3-13: and injecting silica gel into the die-casting mould, wherein the silica gel flows into the containing cavity and enables the light-emitting point and the micro convergent lens to be die-cast and formed into a whole after being solidified.
Example 2
A method for preparing a fly-eye array lens of an LED integrated package as shown in fig. 2 comprises the following steps:
step 1: preparing an integrated light source circuit board, wherein the integrated light source circuit board comprises a plurality of light-emitting points;
step 2: mounting a light-emitting wafer on each light-emitting point, and connecting positive and negative circuits of the light-emitting wafer;
and step 3: sealing and molding each light-emitting point to form a curved lens structure on each light-emitting point; the method specifically comprises the following steps:
step 3-21: preparing a single micro converging lens, wherein the micro converging lens is prepared from any one of plastic, glass and silica gel or other transparent structures;
step 3-22: packaging the integrated light source circuit board and a plurality of light-emitting points on the integrated light source circuit board into a planar structure through silica gel;
step 3-23: and bonding each tiny collecting lens above each luminous point in a crystal fixing mode.
Example 3
A method for preparing a fly-eye array lens of an LED integrated package as shown in fig. 1, the method comprising the following steps:
step 1: preparing an integrated light source circuit board, wherein the integrated light source circuit board comprises a plurality of light-emitting points;
step 2: mounting a light-emitting wafer on each light-emitting point, and connecting positive and negative circuits of the light-emitting wafer;
and step 3: sealing and molding each light-emitting point to form a curved lens structure on each light-emitting point; the method specifically comprises the following steps:
step 3-31: packaging the integrated light source circuit board and a plurality of light-emitting points on the integrated light source circuit board into a planar structure through silica gel;
step 3-32: silica gel is planted above each luminous point in a dripping mode through a precision manipulator.
In summary, the basic principle of the method for manufacturing the fly-eye array lens of the LED integrated package of the present application is as follows: the convergent lens with the single curved surface shape on the integrated light source circuit board is removed, then a micro convergent lens is integrated above each light emitting point on the integrated light source circuit board, and a compound eye array lens group is formed by a plurality of micro convergent lenses.
In example 1, example 2, and example 3, a plurality of light-emitting chips are arranged in parallel, so that the reliability of light emission of a single light-emitting point is ensured, and the reliability of subsequent long-distance illumination is ensured.
In this document, the term "comprises/comprising" is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (7)
1. A preparation method of a fly-eye array lens of an LED integrated package is characterized by comprising the following steps:
step 1: preparing an integrated light source circuit board, wherein the integrated light source circuit board comprises a plurality of light-emitting points;
step 2: mounting a light-emitting wafer on each light-emitting point, and connecting positive and negative circuits of the light-emitting wafer;
and step 3: and sealing and molding each light-emitting point to form a curved lens structure on each light-emitting point.
2. The method for preparing a fly-eye array lens of an LED integrated package according to claim 1, wherein the step 3 specifically comprises the following steps:
step 3-11: preparing a die-casting die, wherein the die-casting die is provided with cavities which correspond to the plurality of light-emitting points one by one, and small converging lenses are arranged in the cavities;
step 3-12: putting the integrated light source circuit board into the die-casting mould, so that each light-emitting point corresponds to the containing cavity;
step 3-13: and injecting silica gel into the die-casting mould, wherein the silica gel flows into the containing cavity and is solidified to form the light-emitting point and the micro convergent lens into a whole through die-casting.
3. The method for manufacturing a fly-eye array lens integrally packaged by an LED according to claim 2, wherein the micro converging lens is any one of plastic, glass and silica gel.
4. The method for preparing a fly-eye array lens of an LED integrated package according to claim 1, wherein the step 3 specifically comprises the following steps:
step 3-21: preparing a monomer tiny convergent lens;
step 3-22: packaging the integrated light source circuit board and the plurality of light-emitting points on the integrated light source circuit board into a plane structure through silica gel;
step 3-23: and bonding each tiny converging lens above each luminous point in a die bonding mode.
5. The method for manufacturing a fly-eye array lens integrally packaged by an LED according to claim 4, wherein the micro converging lens is any one of plastic, glass and silica gel.
6. The method for preparing a fly-eye array lens of an LED integrated package according to claim 1, wherein the step 3 specifically comprises the following steps:
step 3-31: packaging the integrated light source circuit board and the plurality of light-emitting points on the integrated light source circuit board into a plane structure through silica gel;
step 3-32: and planting the silica gel above each light-emitting point in a dripping mode through a precision manipulator.
7. The method for manufacturing a fly-eye array lens of an LED integrated package according to claim 1, wherein a plurality of the light emitting chips are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210085556.XA CN114447197A (en) | 2022-01-25 | 2022-01-25 | Preparation method of fly-eye array lens for LED integrated packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210085556.XA CN114447197A (en) | 2022-01-25 | 2022-01-25 | Preparation method of fly-eye array lens for LED integrated packaging |
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| CN114447197A true CN114447197A (en) | 2022-05-06 |
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2022
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