JP2016146452A - Led module and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a lens accurately at the position of each of a plurality of LED devices, even in the case of position deviation of the mounted LED devices and dispersion in the dimensional accuracy of a module substrate, to obtain a desired light distribution characteristic.SOLUTION: Each position of a multiplicity of LED devices 2 arranged on a substrate 1 is recognized by an imaging camera. The height of the LED devices 2 is recognized by a laser displacement gauge. After the LED device 2 is sealed with a planar translucent part 3, a dispensing needle is moved to a predetermined position of the planar translucent part 3, on the basis of the information of the position and the height. By the control of the start and end of supplying a liquid resin from the needle, a bullet-shaped center lens 4 having a high lens height and a low and flat peripheral lens 5 are formed on the planar translucent part 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an LED module incorporating an LED (Light Emitting Diode) and a method for manufacturing the same.

  In recent years, a light source device using an LED chip has attracted attention as a light source, and the luminous efficiency of this LED is far higher than that of an incandescent bulb, and has been developed to a performance superior to that of a fluorescent lamp or an HID lamp. Since the LED element itself is a semiconductor, the LED light source has a life of about 40,000 hours, several tens of times that of an incandescent bulb, and several times that of a fluorescent lamp or HID lamp. Furthermore, responsiveness (time from power-on to steady lighting) is high, and steady lighting in 100 nanoseconds or less cannot be achieved except for LED light sources.

  However, since the luminous flux output from one LED element is weak, a necessary luminous flux is obtained by mounting a large number of LED packages on the flexible substrate in the LED light source device (see, for example, Patent Document 3). ). In recent years, with the expansion of the application of LED light source devices, LED modules that can achieve miniaturization and cost reduction directly on a module substrate are die-bonded and connected by wire bonding. For example, see Patent Documents 1 and 2).

  In many conventional LED packages, a lens is attached to improve the light extraction efficiency. Patent document 4 is an example of a lens forming method. In this document 4, a silicone resin is poured into a mold formed in a lens shape by a method such as dispensing, and an LED element mounting portion is inserted therein. Is immersed to form a lens. This method is called a compression molding method, and is characterized in that a flow path such as a runner does not remain unlike other molding methods such as transfer.

  In general, a COB (Chip On Board) type LED module has a light emitting area with a diameter of about 25 to 50 mm, or about 25 to 50 mm square. Therefore, the directivity of light distribution is wide, and the luminance of the light emitting surface depends on the viewing direction. The Lambert light distribution is almost constant, and the luminous intensity distribution is proportional to cos θ, where θ is the angle with the front direction. For home downlight light sources, Lambert light distribution is effective because glare is suppressed and it is received as gentle light. On the other hand, in order to efficiently illuminate a vast area such as a projector, it is necessary to effectively use the energy of the light source and narrow the light distribution within a desired range. It was not suitable for the above-mentioned use, and it was necessary to change the light distribution by an auxiliary tool such as a reflector of a lamp. However, since the COB type LED module can contribute to the miniaturization of the light source, if an auxiliary tool for the reflector is not required or a desired light distribution characteristic can be obtained by attaching a small reflector, This can contribute to reduction in size and weight.

  For example, in Patent Document 5 below, as an example of an LED package, a silicone resin composition having a prescribed viscosity and thixotropic property is used, and the LED element is sealed by a dispensing method or the like, thereby facilitating lens formation. A manufacturing method is disclosed.

  Further, Patent Document 6 below discloses a manufacturing method and a manufacturing apparatus for obtaining desired shape accuracy with little variation in lens shape. In Patent Document 6, the curing process is performed under a pressure of 0.5 MPa, for example. It is described that even if voids are generated in the lens, the voids can be made sufficiently small. Further, a method for selecting resin characteristics suitable for the lens shape by setting the viscosity (23 ° C.) of the liquid resin to 10 to 200 Pa · s and the thixotropic property to 2.0 to 7.0 is disclosed and further used. As a dispenser to be used, it is described that a screw type, a jet type or a volume measuring type is appropriate.

  In Patent Document 7 below, in order to improve the light extraction efficiency and suppress the variation in emission color, a wavelength conversion unit including a phosphor is supplied in a planar shape around the LED element, and then a convex shape is formed thereon. It describes that a reflection suppressing portion having a portion (lens portion) is formed.

JP 2011-523210 A JP 2013-222782 A Japanese Patent Laid-Open No. 2002-232009 JP 2008-207450 A JP 2008-231199 A International Publication No. W2012 / 147611 JP 2013-251321 A

  By the way, in the COB type LED module, the arrangement positions of the LED elements are different for each product, and in a generally used compression molding method, it is necessary to prepare a mold for each product. difficult.

  On the other hand, in the method of forming a silicone lens using a dispenser or the like, it is possible to form a lens according to the arrangement of LED elements for each product by producing a coating program. Alternatively, the LED element mounted by flip chip connection is displaced by about 100 μm with respect to a desired mounting position in the LED module surface during mounting. In addition, the lens at the desired position is affected by the dimensional accuracy of the LED module substrate itself and the accumulated dimensional accuracy of the module substrate that is generated when the module substrate is transported and assembled in a collective state to improve productivity. Such a cause causes a problem of adversely affecting the light distribution characteristics.

  Furthermore, since the COB type LED module substrate is as large as about 25 to 50 mm square, the variation in the size (height) of the lens portion in the LED module substrate surface cannot be ignored. That is, as an important parameter for stabilizing the coating amount of the lens forming resin, it is necessary to keep the distance between the needle and the tip constant, but it is difficult to keep this distance constant, and the desired accuracy with little variation is obtained. It is difficult to obtain a lens shape.

  In Patent Document 7, as described above, after the wavelength conversion unit including the phosphor is supplied in a planar shape around the LED element, a reflection suppressing unit having a convex lens unit is formed thereon, There is no description about the position correction for mounting this convex lens part, and it is not possible to confirm the mounting position of the LED element in the wavelength conversion part including the phosphor. It is difficult to attach a lens at a desired position corresponding to the above.

  Moreover, in this patent document 7, the lens of the substantially same shape which becomes a flat shape is attached, this lens is made into the circular-arc-shaped lens shape centering on a LED element (point light source), and the improvement of the light extraction efficiency However, with this lens, the light distribution of a COB type LED module that generally has a Lambertian light distribution cannot be changed.

  The present invention has been made in view of the above problems, and the object thereof is to position each of the plurality of LED elements even when the mounted LED elements are misaligned or the dimensional accuracy of the module substrate varies. An object of the present invention is to provide an LED module that can form a lens with high accuracy and obtain desired light distribution characteristics, and a method of manufacturing the LED module.

In order to achieve the above object, the invention of claim 1 is the manufacture of an LED module in which a plurality of LED elements are mounted on a substrate and then a liquid resin is supplied from a dispenser to form a lens for the plurality of LED elements. In the method, a recognition device for recognizing the positions and heights of the plurality of LED elements is provided, the nozzle of the dispenser is moved to a desired position based on the recognition data of the recognition device, and the liquid resin is supplied from the dispenser. Is controlled to form a convex lens having a different height.
The invention of claim 2 is a lens base forming step of forming a lens base with a light-transmitting first liquid resin for the plurality of LED elements, and a first curing step of temporarily curing the liquid resin of the lens base, After this first curing step, a lens laminated portion forming step of forming a lens laminated portion with a translucent second liquid resin on the lens base, and the first liquid resin and the lens laminated portion of the lens base A second curing step of fully curing the second liquid resin.
The invention of claim 3 is an LED module in which a plurality of LED elements are mounted on a substrate, and a plurality of convex lenses formed of a liquid resin are included on the light emitting surface in a state including one or more of the LED elements. An arranged lens portion is provided, and convex lenses of the lens portion are formed at different heights.

  According to said structure, the position of the LED element (all or every several pieces) on a board | substrate is recognized, for example with an image camera, and the height of LED element (all or every several pieces) is recognized with a laser displacement meter, and this Based on the information on the position and height of the LED element, the nozzle tip of the dispenser moves to a predetermined position, and the amount of liquid resin supplied from the dispenser, the pulling width of the nozzle, and the like are controlled, so that the top of the LED element is controlled. Thus, convex lenses having different heights such as a cannonball shape, a hemispherical shape, and a flat shape can be easily formed.

  According to the LED module and the manufacturing method thereof of the present invention, a lens is accurately formed at each position of a plurality of LED elements even when the mounted LED elements are misaligned or the dimensional accuracy of the module substrate varies. Thus, it is possible to obtain desired light distribution characteristics. As a result, in the COB type LED module, it is possible to reduce the size of the reflector auxiliary tool and the like, thereby contributing to the reduction in size and weight of the entire lamp.

In addition, there are the following advantages.
In general, LED modules with Lambert light distribution can be converted to the desired light distribution characteristics, and the number of parts where the critical angle derived from Snell's law is established can be reduced by lens formation, improving the light extraction efficiency. Can be made.
Compared to the case where a single lens is formed on the light emitting surface of the LED module, the amount of expensive silicone can be reduced, and high reliability and cost can be reduced. Since the light emission path from each LED element can be shortened, the number of paths affected by the transmittance in the silicone resin is reduced, and the light extraction efficiency is similarly improved.
Conventionally, a special light distribution characteristic, which is impossible only by arranging packages with a single-shaped lens, can be created with a single COB type LED module.
Since the lens is manufactured using a coating profile or resin characteristics, it is possible to freely arrange lenses having different shapes and heights in the plane at the LED module manufacturing stage.

  In addition, if a bullet-shaped central lens with a high lens height and a low-flat peripheral lens are provided, the front can be brightened and the periphery widened by light refraction, and the energy of the light source is effective at the front. It can be converted into a light distribution that can also illuminate the surroundings. Such light distribution characteristics cannot be handled by a lamp such as a projector that narrows the light distribution with a conventional reflector or the like, and the vicinity of the light source can be brightened. It becomes possible to improve the problem of difference depending on the place.

Regarding the LED module according to the first embodiment of the present invention, FIG. (A) is a side view of a central section showing the configuration of the module, and FIG. (B) is a light distribution characteristic diagram of the first embodiment. With respect to the state in which the planar light transmitting portion is formed in the first embodiment, FIG. (A) is a side view of the central section showing the configuration, FIG. (B) is a light distribution characteristic diagram, and (c) is the planar light transmitting portion. It is explanatory drawing which shows the refractive state of light in. It is a figure which shows the process of the first half in the manufacturing method of the LED module of 1st Example. It is a figure which shows the process of the second half in the manufacturing method of the LED module of 1st Example. It is a side view of center part cutting | disconnection which shows the structure of the LED module of 2nd Example.

  1 and 2 show the configuration of the COB type LED module of the first embodiment, and FIGS. 3 and 4 show the main manufacturing steps of the LED module. FIG. As shown in FIG. 1, in the first embodiment, a large number of LED elements 2 are arranged on the substrate 1, and all of the LED elements 2 are sealed with a light-transmitting resin, so that the flat transparent surface whose upper surface is flat. The light part 3 is formed. Then, on this flat translucent portion 3, a potting lens lens having a high lens height (higher than the peripheral lens) 4 (higher than the peripheral lens) and a flat (arc-shaped) lens height by potting A peripheral lens (group) 5 having a low (lower than the central lens) is formed.

Other than the above-described planar light-transmitting portion 3, a translucent BOS phosphor that is a silicate complex [(Ba, Sr, Ca) ₂ SiO ₄ complex], for example, is translucent, for example, a silicone-based base resin material , Yellowish (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce, α-sialon complex, Li ₂ SrSiO ₄ complex, or orange (Ba, Sr) ₃ SiO ₅ complex, red (Ca, Sr) ₂ Si ₅ N ₈ complex, (Ca, Sr) AlSiN ₃ complex, blue green one yellowish (Ba, Sr, Ca) Si ₂ O ₂ N ₂ complex, greenish Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce, Ca ₃ Sc ₂ O ₄ : Ce, or the like is used. If the LED element 2 emits blue light, for example, it becomes possible to create pseudo white light by a combination of phosphors having a yellowish color.

When the phosphor is kneaded in the planar light-transmitting portion 3, in the lenses 4 and 5 obtained by potting, the silicone resin having translucency is used as it is. In addition, since the optical path lengths of the light in various directions emitted from the LED element 2 can be made uniform, it is possible to suppress variations in emission color.
On the other hand, in the flat peripheral lens 5, the optical path length in the lens can be made substantially uniform, so that the above-described silicone resin is used as it is in the planar light transmitting portion 3 in the area where the lens 5 is mounted. It is also possible to use the lens 5 with a phosphor mixed therein, and an appropriate specification is selected in consideration of color temperature, color rendering properties (Ra), lens shape / size, light distribution characteristics, and the like.

  The substrate 1 is made of ceramic, MCP (Metal Core Printed circuit board) or the like, and is selected in consideration of heat dissipation, cost, and light resistance. The term “light resistance” as used herein refers to material deterioration such as a yellowing phenomenon caused by a material defect or the like with respect to irradiation of high-brightness light energy in the visible light region. In addition, the flat light-transmitting portion 3 and the lenses 4 and 5 are similarly maintained in high light resistance by using a silicone resin.

FIG. 1B shows the light distribution characteristic of the first embodiment, and the characteristic indicated by the solid line 101 is obtained. The dotted line 100 is the light distribution characteristic of only the planar light transmitting part 3 that does not include a lens. In the light distribution characteristic diagram shown in FIG. 1B, the contour lines indicate the luminous intensity (unit: cd), and the angle of 0 ° indicates the front direction of the LED module.
FIG. 2A shows a configuration in a state in which the planar light transmitting portion 3 is formed. Thus, in a state in which the LED element 2 is sealed and covered only by the planar light transmitting portion 3, FIG. As shown in 2 (b), the light distribution characteristic indicated by the solid line 100 is obtained.

  That is, FIG. 2 (c) shows the light refraction at the portion A in FIG. 2 (a), and the silicone resin of the planar light transmitting portion 3 has a refractive index of about 1.4 to 1.7. (N1), the refractive index of air is 1.0 (n2), and the light extracted from the silicone resin to the outside is totally reflected at the place where the emission angle θ2 exceeds 90 ° (the limit of extraction to the outside). Incident angle θ1: critical angle). The total reflection light is light having an incident angle θ1 exceeding about 36.0 ° to 45.6 ° according to Snell's law, and cannot be escaped from the planar light transmitting portion 3 like the emitted light Lf. The total reflected light La is obtained. The light La totally reflected on the surface of the flat light transmitting part 3 is then irradiated to the LED element 2 and adversely affects the light extraction efficiency from the LED element 2 due to the photoelectric effect.

  On the other hand, as shown in FIG. 1 (a), a structure including potting lenses 4 and 5 is used, and the potting lenses 4 and 5 are made of the same silicone resin as that of the flat light transmitting portion 3, so that the refractive index is flat transparent. This is equivalent to the portion 3, and light refraction at the boundary between the flat light transmitting portion 3 and the lenses 4 and 5 hardly occurs. For this reason, the light emitted from each LED element 2 falls within the critical angle due to the effect of the inclination of the lenses 4 and 5, so that the light extraction efficiency is improved.

  Further, the light distribution by the bullet-shaped central lens 4 in FIG. 1 (a) increases in luminance on the front side of the LED module (COB type), whereas the light distribution by the flat peripheral lens 5 is an LED. It spreads around the module. The size of the LED element 2 is about 1.0 mm square, the resin thickness of the flat translucent portion 3 is about 0.2 mm, the lens diameter of the bullet-shaped central lens 4 is about φ2.0 mm, and the height is flat translucent. If the diameter of the flat peripheral lens 5 is about φ2.0 mm and the height is about 1.0 mm, the light distribution characteristic is ± 20 ° in the front direction. And brightness in the vicinity of ± 50 to 80 ° can be improved.

As described above, when the light distribution characteristic is such that the luminance concentrates within ± 20 ° in the front direction, it can be used for a projector that increases the illuminance at a desired location, and conventionally, the desired illuminance is achieved by a reflector. Compared with the projector etc. which have obtained, cost reduction, size reduction, and weight reduction can be achieved.
In addition, since the peripheral brightness near ± 50 to 80 ° can be improved, it is possible to blur the border between light and darkness, which was a disadvantage of projectors, etc. For example, from a large number of projectors arranged in a large stadium, etc. This contributes to reducing the overlapping area of the irradiated portions to be created, and it is possible to reduce variations in illuminance and the number of projectors.

In the embodiment, the lenses 4 and 5 are formed on the planar light transmitting portion 3 and a sufficient amount of resin is applied to the planar light transmitting portion 3 from the top surface of the chip. It may be in a state up to the last position of the upper surface or a state not on the upper surface of the chip.
Furthermore, the convex lens (4, 5) is formed directly in a state including one or more of the LED elements 2 without providing the planar light-transmitting portion 3, and the heights of these lenses are different shapes (cannonballs). Shape, hemispherical shape, flat shape, etc.).
As for the kneading of the phosphor, it is preferable that the amount of kneading is increased in the lenses 4 and 5 as the amount of the planar light-transmitting portion 3 decreases to produce pseudo white light having a desired color temperature.

  The shape of the central lens 4 and the peripheral lens 5 can be set to a desired shape depending on the thixotropic property of the resin, and in combination with the potting profile, when the viscosity is low, the lens shape of the liquid resin is In the case of a flat shape like the peripheral lens 5 and a high viscosity, it can be adjusted to a desired light distribution characteristic by being close to a bullet shape like the central lens 4.

Next, a manufacturing method is demonstrated based on FIG. 3, FIG. In the embodiment, the position of the LED element 2 is detected and recognized by the image camera 10 and the height is detected by the laser displacement meter 12.
First, as shown in FIG. 3 (a), a large number of LED elements 2 are mounted on the substrate 1 by die bonding, wire bonding, or flip chip. Alternatively, every few pieces are recognized and position confirmation is performed. By checking the position of the LED element 2 of the image camera 10, it is possible to grasp the mounting position shift of the LED element 2 during die bonding and the expansion / contraction shift of the substrate 1 to be mounted. The mounting position deviation and expansion / contraction deviation are about 100 μm with respect to the design value.

  Thereafter, as shown in FIG. 3B, a desired height is obtained by applying a silicone resin in which the phosphor is kneaded to the mounting surface on which the LED element 2 is mounted by the dispensing needle (nozzle) 11 or the like. Is formed around the LED element 2, and all the LED elements 2 are sealed. At this time, parameters such as coating profile and coating time are controlled, and the viscosity and thixotropic properties of the silicone resin are selected. Since the silicone-based resin in which the phosphor is kneaded is generally applied to the top of the chip, it is difficult to confirm the arrangement position of the LED element 2 with the image camera 10 at this timing, but as shown in FIG. Since the position of the LED element 2 is confirmed before the silicone resin kneaded with is applied, the later-described lens formation based on accurate chip position information can be performed without removing the substrate 1 from the coating stage. Become.

  Further, when the position information of the LED element 2 is recognized by the image camera 10, the positions of the alignment marks formed on the periphery of the substrate 1 where the silicone resin mixed with the phosphor is not applied are similarly imaged at the same timing. Even if the substrate 1 is removed from the coating stage after the silicone-based resin is applied by linking the position information of the alignment mark and the mounting position information of the LED element 2 by checking with the camera 10, the lens described later A lens can be accurately formed on the LED element 2 by confirming the position of the alignment mark at the time of formation.

  Thereafter, as shown in FIG. 3C, the laser displacement meter 12 recognizes the height of all or several LED elements 2 and the height of the planar light transmitting part 3. That is, the laser displacement meter 12 performs triangulation for obtaining the angle of the reflected light that changes according to the distance by reflecting the laser light emitted from the light emitting part by the object to be measured and receiving the reflected light by the light receiving part. The height of each part is recognized by the applied method, and the laser used in the laser displacement meter 12 is a visible laser such as a He-Ne laser. As described above, it is difficult to confirm the position of the LED element 2 with the image camera 10 through the silicone-based resin in which the phosphor is kneaded, but the process proceeds to the next process without removing the substrate 1 or the peripheral portion of the substrate or the like. The height of the LED element 2 is confirmed by irradiating laser light toward the center of the mounting position of the LED element 2 by using the position of the formed alignment mark.

The laser beam can be transmitted at a concentration of the phosphor that emits yellow light for whitening. When the laser beam is irradiated from the upper part of the LED element 2, the laser beam is reflected from the surface of the planar light transmitting part 3. The light is small, the laser light is almost transmitted, and the height of the surface of the flat light transmitting portion 3 cannot be measured. In that case, the laser displacement meter 12 is used with an inclination of about 45 °. As a result, as the optical path L ₁ in FIG. 3 (c), it is possible to increase the specularly reflected light from the surface of the planar light-transmitting portion 3, obtaining information of the height of the surface of the planar light-transmitting portion 3 be able to. Further, information on the thickness of the applied planar light transmitting portion 3 is also obtained by adding information of the laser light that is refracted and refracted at the interface between the planar light transmitting portion 3 and the air layer and extracted to the air layer side. be able to. In this method, since the measurement result is affected by the difference in the incident angle of the laser beam and the refractive index of the planar light transmitting portion 3, the value obtained from the laser displacement meter is calibrated in advance by the measurement system and the material. There is a need.

  Next, as shown in FIG. 3D, the dispensing needle 11 is moved to a predetermined start position of the XYZ coordinates with respect to the LED element 2 based on the position information of the XYZ coordinates obtained from the image camera 10 and the laser displacement meter 12. The start and end of the supply of the resin 14 by the needle 11 are controlled. That is, as shown in FIG. 4 (e), the liquid resin 14 is dispensed by a pre-adjusted amount (amount to be attached to the flat translucent portion 3), and thereafter, as shown in FIG. 4 (f), the needle While pulling up 11 in the Z direction, the resin 14 is fed out from the tip, and the needle 11 is stopped at the end position and the resin supply is also stopped, so that the necessary amount of resin is supplied. In this manner, a lens having an arbitrary shape is manufactured, and the bullet-shaped central lens 4 and the flat peripheral lens 5 (such as a hemispherical shape) shown in FIG. 1 can be formed. This lens shape is adjusted by a combination of a potting profile and a resin characteristic due to thixotropic properties.

  When the formation of the lens for one LED element 2 is completed, the needle 11 is moved to the start position of the next LED element 2 as shown in FIGS. Similarly, the lens is formed. The movement of the needle 11 at this time is controlled based on the recognition data described above.

  According to such a manufacturing method, it is possible to cope with a mounting position shift of about 100 μm of the LED element 2 and a height variation in the surface of the COB type LED module substrate, and to maintain an optimum shape accuracy with a small variation while maintaining a desired shape accuracy. A lens can be formed and arranged at a position, and stable light extraction efficiency and light distribution characteristics can be obtained.

  After the formation of the lens, the liquid resin 14 is cured, but it is preferably performed under a known pressure of, for example, about 0.5 MPa, and according to this, in the case where bubbles are included in the lens. Even if it exists, it can suppress that the volume of this bubble is reduced enough and variation in the lens formation by the liquid resin 14 arises.

  FIG. 5 shows the configuration of the LED module of the second embodiment. In the second embodiment, a lens is manufactured in two stages (or three or more stages). That is, as in the case of the first embodiment, the first liquid resin such as a silicone-based resin is applied on the planar light-transmitting portion 3 in which a large number of LED elements 2 are sealed by the manufacturing method of FIGS. The lens base 6a to be the central lens and the peripheral lens 5 are applied and formed. Then, the first liquid resin is temporarily cured in the first curing step (cured to such an extent that deformation with time does not substantially occur), and is then laminated on the lens base portion 6a to laminate the lens with the second liquid resin. The part 6b is formed, and then the first liquid resin in the lens base and the second liquid resin in the lens lamination part are fully cured (second curing step). In this way, a bullet-shaped central lens 6 higher than the central lens 4 of the first embodiment can be formed.

  Such a 2nd Example is applicable to the specification which concentrates a brightness | luminance by making light distribution of the front of an LED module into a narrow angle further, for example. Since the volume of the central lens 6 is increased, the lens shape may be flattened depending on the weight of the liquid resin to be used, and it may be difficult to obtain a desired shell shape. In such a case, the first liquid resin and the second liquid resin may be handled as different types of resins.

  As mentioned above, although the Example of this invention was described, it cannot be overemphasized that this invention is not limited to these. For example, the shape of the lens is not limited to the case where the central lens is made high and the peripheral lens is made low, but the height can be appropriately changed so as to obtain a desired light distribution characteristic.

1 ... substrate, 2 ... LED element,
3 ... plane translucent part, 4, 6 ... central part (cannonball) lens,
5 ... Peripheral (flat) lens,
DESCRIPTION OF SYMBOLS 10 ... Image camera, 11 ... Dispensing needle 12 ... Laser displacement meter, 14 ... Liquid resin.

Claims (3)

In a method for manufacturing an LED module in which a plurality of LED elements are mounted on a substrate and then a lens is formed for the plurality of LED elements by supplying a liquid resin from a dispenser.
A recognition device for recognizing the position and height of the plurality of LED elements is provided,
Based on the recognition data of the recognition device, the nozzle of the dispenser is moved to a desired position, the start and end of the supply of the liquid resin from the dispenser are controlled, and convex lenses having different heights are formed. The manufacturing method of the LED module. A lens base forming step of forming a lens base with a translucent first liquid resin for the plurality of LED elements;
A first curing step of temporarily curing the liquid resin of the lens base;
After this first curing step, a lens laminated portion forming step of forming a lens laminated portion with a translucent second liquid resin superimposed on the lens base,
The method for manufacturing an LED module according to claim 1, further comprising a second curing step of main curing the first liquid resin of the lens base and the second liquid resin of the lens stack. An LED module for mounting a plurality of LED elements on a substrate,
Provided with a lens portion in which a plurality of convex lenses formed of liquid resin are arranged on the light emitting surface in a state including one or more of the LED elements, the convex lenses of the lens portions are formed at different heights. The LED module characterized by the above-mentioned.

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