JP6510256B2 - LED module manufacturing method - Google Patents

Description

  The present invention relates to an LED module incorporating an LED (Light Emitting Diode) and a method of manufacturing the same.

  In recent years, a light source device using an LED chip has attracted attention as a light source, and the light emission efficiency of this LED is much higher than that of an incandescent lamp, and has been developed even better than fluorescent lamps and HID lamps. Since the LED element itself is a semiconductor, the LED light source has a life of about 40,000 hours, several tens of times that of an incandescent bulb, and several times that of a fluorescent lamp or an HID lamp. Furthermore, the response (time from power-on to steady-state lighting) is high, and steady-state lighting in less than 100 nanoseconds can not be achieved except for the LED light source as compared to other light sources.

  However, since the light flux output from one LED element is weak, in the LED light source device, a large number of LED packages are mounted on a flexible substrate to obtain a necessary light flux (for example, see Patent Document 3) ). In recent years, with the expansion of applications of LED light source devices, development of LED modules in which LED elements capable of achieving downsizing and cost reduction can be directly die-bonded on module substrates and connected by wire bonding has become active ( See, for example, Patent Documents 1 and 2).

  Further, in many conventional LED packages, a lens is attached to improve the light extraction efficiency. Although patent document 4 is one example of a lens formation method, in this document 4, silicone resin is poured into the metal mold made by lens shape by methods, such as dispensing, and the mounting part of a LED element is carried in it. Immerse and form a lens. This method is called a compression molding method, and unlike the other molding methods such as transfer, is characterized in that no flow path such as a runner remains.

  Generally, since a COB (Chip On Board) type LED module has a light emitting area of about 25 to 50 mm in diameter or about 25 to 50 mm square, the directivity of light distribution is wide and the luminance of the light emitting surface depends on the viewing direction. The light distribution becomes proportional to cos θ, where the Lambert light distribution becomes almost constant and the angle with the front direction is θ. It is effective for a downlight light source for home use etc. because the Lambertian light distribution is suppressed as glare and it is received as a gentle light. On the other hand, in order to efficiently illuminate a large area such as a floodlight, it is necessary to effectively utilize the energy of the light source and to narrow the light distribution within the desired range. It was not suitable for said use, and it was necessary to change light distribution by auxiliary | assistant tools, such as a reflector of a lamp. However, since the COB type LED module can contribute to the miniaturization of the light source, if it is possible to obtain the desired light distribution characteristics by eliminating the auxiliary of the reflector or by attaching a small reflector, It can contribute to downsizing and weight reduction.

  For example, in Patent Document 5 below, the formation of a lens is facilitated by sealing the LED element by a dispensing method or the like using a silicone resin composition having a defined viscosity and thixotropic property as an example of the LED package. A method of manufacture is disclosed.

  Further, Patent Document 6 below discloses a manufacturing method and a manufacturing apparatus for obtaining desired shape accuracy with less variation in lens shape. In this Patent Document 6, the curing process is performed under pressure of 0.5 MPa, for example. It is described that, even if a void is generated in the lens, the void can be made sufficiently small by performing the above. In addition, by setting the viscosity (23 ° C) of the liquid resin to 10 to 200 Pa · s and the thixotropic property to 2.0 to 7.0, a method of selecting a resin characteristic suitable for the lens shape is disclosed, and further used It is described that a screw type, jet type or volumetric metering type is suitable as a dispenser to be used.

  In Patent Document 7 below, in order to improve the light extraction efficiency and to suppress the variation of the emission color, the wavelength conversion portion including the phosphor is provided flat around the LED element, and then a convex shape is formed thereon. It is described that a reflection suppressing portion having a portion (lens portion) is formed.

JP, 2011-523210, A Unexamined-Japanese-Patent No. 2013-222782 Japanese Patent Application Laid-Open No. 2002-232009 JP 2008-207450 A JP 2008-231199 A International Publication Number W2012 / 147611 JP, 2013-251321, A

  By the way, in the above-mentioned COB type LED module, the arrangement position of the LED element is different for each product, and it is necessary to prepare a mold for each product in the generally used compression molding method. difficult.

  On the other hand, in the method of forming a silicone lens using a dispenser or the like, it is possible to form a lens according to the arrangement of LED elements for each product by preparing an application program, but in the COB type LED module Alternatively, the LED element mounted by flip chip connection has a positional deviation of about 100 μm with respect to a desired mounting position in the plane of the LED module during mounting. In addition, under the influence of the dimensional accuracy of the LED module substrate itself, and the cumulative dimensional accuracy of the module substrate generated when transporting and assembling the module substrates in a collective state to improve productivity, the lens is positioned at a desired position. Since it is not mounted, such a cause causes a problem of adversely affecting the light distribution characteristic.

  Furthermore, since the COB type LED module substrate is as large as about 25 to 50 mm square, the variation in the size (height) of the lens portion in the surface of the LED module substrate can not be ignored. That is, it is necessary to keep the distance between the needle and the tip constant as an important parameter for the stabilization of the coating amount of the lens forming resin, but it is difficult to keep this distance constant and the desired accuracy It is difficult to obtain the lens shape.

  In the above Patent Document 7, as described above, after the wavelength conversion portion including the phosphor is flatly supplied around the LED element, the reflection suppressing portion having the convex lens portion is formed thereon. There is no description about the position correction for mounting the convex lens portion, and since the mounting position of the LED element can not be confirmed in the wavelength conversion portion including the phosphor, the positional deviation of the mounting of the LED element, the dimensional accuracy of the module substrate, etc. It is difficult to mount the lens in the desired position corresponding to.

  Moreover, in this patent document 7, the lens of the same shape which becomes roughly flat shape is attached, this lens is made into the arc-shaped lens shape centering on a LED element (point light source), and the light extraction efficiency is improved However, this lens can not generally change the light distribution of the COB type LED module, which is a Lambert light distribution.

  The present invention has been made in view of the above problems, and an object thereof is to position each of a plurality of LED elements even when the positional deviation of the mounted LED elements and the dimensional accuracy of the module substrate vary. An object of the present invention is to provide an LED module capable of forming a lens with high precision and obtaining a desired light distribution characteristic and a method of manufacturing the same.

In order to achieve the above object, according to the invention of claim 1, after mounting a plurality of LED elements on a substrate, manufacturing a LED module for forming a lens for the plurality of LED elements by supplying liquid resin from a dispenser In the method, the plurality of LED elements are sealed with a translucent resin to form a flat light transmitting portion whose upper surface is a flat surface, and the position of the LED element recognized by the recognition device, the height of the LED element A central portion lens group comprising a shell-shaped convex lens by supplying liquid resin onto each of the planar light transmitting portions on the LED element based on the surface height information of the planar light transmitting portion and the planar light transmitting portion And a peripheral lens group including a flat convex lens group lower than the lens height of the central lens .
In the invention of claim 2, the recognition device recognizes the position of the LED element with an image camera, and the height of the LED element and the surface height of the planar light transmission part with a laser displacement meter using a visible laser To recognize .
The invention according to claim 3 is characterized in that each of the planar light transmitting parts on the LED element is based on the position of the LED element recognized by the recognition device, the height of the LED element and the surface height information of the planar light transmitting part. A lens base forming step of forming a lens base with a translucent first liquid resin, a first curing step of temporarily curing the first liquid resin of the lens base, and after the first curing step A lens laminated portion forming step of forming a lens laminated portion by light transmitting second liquid resin by overlapping on the lens base, a first liquid resin of the lens base and a second liquid resin of the lens laminated portion And a second curing step of curing, wherein the central lens group and the peripheral lens group are formed of the first liquid resin and the second liquid resin .

  According to the above configuration, for example, the position of the LED element (all or several) is recognized by the image camera, and the height of the LED element (all or several) is recognized by the laser displacement meter. The tip of the nozzle of the dispenser moves to a predetermined position based on the information on the position and height of the LED element, and the amount of liquid resin supplied from the dispenser, the pulling width of the nozzle, and the like are controlled. Thus, a lens is formed, and as this lens, convex lenses having different heights such as shell-shaped, hemispherical, flat, etc. can be easily formed.

  According to the LED module and the method of manufacturing the same of the present invention, even if there is a positional deviation of the mounted LED elements or variations in the dimensional accuracy of the module substrate, the lenses are formed accurately at the respective positions of the plurality of LED elements. It is possible to obtain desired light distribution characteristics. As a result, in the COB type LED module, it is possible to miniaturize the auxiliary tool of the reflector and the like, and to contribute to the miniaturization and weight reduction of the whole lamp.

There are also the following advantages.
In LED modules that generally have Lambert light distribution, it is possible to convert to desired light distribution characteristics, and it is possible to reduce the area where the critical angle derived from Snell's law holds by lens formation, thus improving light extraction efficiency It can be done.
Compared to the case where one lens is formed on the light emitting surface of the LED module, the amount of expensive silicone can be reduced, high reliability and cost reduction can be achieved, and the amount of silicone is reduced, so that it is taken out from the lens It is possible to shorten the path of light emission from each of the LED elements, thereby reducing the path affected by the transmittance in the silicone resin, which in turn leads to the improvement of the light extraction efficiency.
Conventionally, it is possible to create a special light distribution characteristic with one COB type LED module, which was impossible by simply arranging packages with a single shape lens.
In lens production, it is possible to freely arrange lenses having different shapes and heights in the plane at the LED module production stage in order to use the application profile or resin characteristics.

  In addition, if a shell-shaped central lens with a high lens height and a low flat peripheral lens are provided, light refraction makes it possible to brighten the front and widen the periphery, making the energy of the light source effective in the front. It is possible to convert into a light distribution that can also illuminate the surroundings while bringing Such light distribution characteristics can not be coped with with a conventional light source such as a light projector having a narrow light distribution with a reflector or the like, and the vicinity of the light source can be brightened. It is possible to improve the problem of differences due to places.

The LED module according to the first embodiment of the present invention is as follows: (a) is a side view of a central portion cut showing the configuration of the module, and (b) is a light distribution characteristic diagram of the first embodiment. (A) is a side view of the central portion cut showing the configuration, FIG. (B) is a light distribution characteristic view, and FIG. (C) is a planar light transmission part in the first embodiment. It is explanatory drawing which shows the refracting state of the light in. It is a figure which shows the process of the first half in the manufacturing method of the LED module of 1st Example. It is a figure which shows the process of the second half in the manufacturing method of the LED module of 1st Example. It is a side view of center part cutting which shows the composition of the LED module of the 2nd example.

  1 and 2 show the configuration of the COB type LED module according to the first embodiment, and FIGS. 3 and 4 show the main manufacturing steps of this LED module. As shown in FIG. 1, in the first embodiment, a large number of LED elements 2 are disposed on the substrate 1, and all of the LED elements 2 are sealed with a light-transmitting resin to make the top surface flat. The light portion 3 is formed. Then, on the flat light transmitting portion 3, the central lens (group) 4 having a high lens height (higher than the peripheral lens) having a shell shape in potting and the lens height having a flat shape (an arc shape) The lower (lower than the central lens) peripheral lens (group) 5 is formed.

Other than the above-mentioned flat light-transmitting portion 3, a light-transmitting material, for example, a BOS phosphor which is a silicate-based complex [(Ba, Sr, Ca) ₂ SiO ₄ -based complex] is mixed with a silicone-based base resin material Yellowish (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce, α-sialon complex, Li ₂ SrSiO ₄ complex, or orangeish (Ba, Sr) ₃ SiO ₅ complex, red (Ca, Sr) ₂ Si ₅ N ₈ complexes and (Ca, Sr) AlSiN ₃ complexes, blue greenish yellowish (Ba, Sr, Ca) Si ₂ O ₂ N ₂ complexes, greenish Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce, Ca ₃ Sc ₂ O ₄ : Ce or the like is used. For example, assuming that the LED element 2 emits blue light, the combination of a yellowish phosphor and the like can generate pseudo white light.

In the case where the phosphors are kneaded into the flat light transmitting portion 3, the lenses 4 and 5 obtained by potting use the light transmitting silicone resin as it is, depending on the shapes of the lenses 4 and 5. In addition, since the optical path lengths of light in various directions emitted by the LED element 2 can be made uniform, it is possible to suppress variations in emission color.
On the other hand, in the flat peripheral lens 5, since the optical path length in the lens can be made substantially uniform, the above-mentioned silicone resin is used as it is for the flat light transmitting portion 3 in the area where the lens 5 is mounted. It is also possible to knead the phosphor with the lens 5 and use it, and a suitable specification will be selected in consideration of color temperature, color rendering property (Ra), lens shape / size, light distribution characteristic and the like.

  Further, the substrate 1 is made of ceramic, MCP (Metal Core Printed circuit board) or the like, and is selected in consideration of heat dissipation, cost and light resistance. The light resistance as used herein refers to material deterioration such as yellowing caused by a material defect or the like with respect to irradiation of light energy of high luminance in the visible light region. Also, by using a silicone resin for the planar light transmitting portion 3 and the lenses 4 and 5 as well, the strong light resistance is similarly maintained.

The light distribution characteristic of the first embodiment is shown in FIG. 1B, and the characteristic of the solid line 101 is obtained. In addition, the dotted line 100 is the light distribution characteristic of only the flat light transmitting portion 3 which is not provided with a lens. In the light distribution characteristic diagram shown in FIG. 1 (b), the contours indicate the luminous intensity (in cd units), and the angle of 0 ° indicates the front direction of the LED module.
FIG. 2 (a) shows the configuration in a state in which the above-mentioned flat light transmitting part 3 is formed. Thus, in a state in which the LED element 2 is sealed and covered only by the flat light transmitting part 3, FIG. As shown in 2 (b), the light distribution characteristic shown by the solid line 100 is obtained.

  That is, FIG. 2 (c) shows the refraction of light at part A of FIG. 2 (a), and the silicone resin of the flat light transmitting part 3 has a refractive index of about 1.4 to 1.7. (N1), the refractive index of air is 1.0 (n2), and the light extracted to the outside from the silicone resin is totally reflected in the place where the emission angle θ2 exceeds 90 ° (the limit of the light extracted to the outside Incident angle θ1: critical angle). According to Snell's law, the total reflection light is light whose incident angle θ1 exceeds about 36.0 ° to 45.6 °, and can not escape like the outgoing light Lf from the flat light transmitting portion 3 , And totally reflected light La. Thereafter, the light La totally reflected on the surface of the flat light transmitting portion 3 is irradiated to the LED element 2 and adversely affects the light extraction efficiency from the LED element 2 due to the photoelectric effect.

  On the other hand, as shown in FIG. 1 (a), the potting lenses 4 and 5 are provided, and the potting lenses 4 and 5 are made of the same silicone resin as the flat light transmitting portion 3, so that the refractive index is flat light transmission. It becomes equivalent to the part 3, and refraction of light at the boundary between the planar light transmitting part 3 and the lenses 4 and 5 hardly occurs. Therefore, the light emitted from each of the LED elements 2 is within the critical angle due to the effect of the inclination of the lenses 4 and 5, and hence the light extraction efficiency is improved.

  Moreover, while the light distribution by the shell-shaped central part lens 4 in FIG. 1A is intensified at the front side of the LED module (COB type), the light distribution of the flat peripheral lens 5 is LED It will spread around the module. The size of the LED element 2 is about 1.0 mm square, the resin thickness of the flat light transmitting part 3 is about 0.2 mm, the lens diameter of the shell-shaped central lens 4 is about 2.0 mm, and the height is flat light Assuming that the diameter of the flat peripheral lens 5 is about 2.0 mm and the height is about 1.0 mm, the light distribution characteristic is ± 20 ° in the front direction. It is possible to improve the brightness within ± 50 to around 80 °.

As described above, in the case of a light distribution characteristic in which the luminance is concentrated within ± 20 ° in the front direction, it can be used for a light projector or the like for increasing the illuminance at a desired place. As compared with the projectors and the like that have been obtained, it is possible to achieve cost reduction, size reduction, and weight reduction.
In addition, the peripheral brightness around ± 50-80 ° can also be improved, which makes it possible to blur the boundary between light and dark, which is a disadvantage of light projectors, for example, from light projectors arranged in large numbers at large stadiums etc. It is possible to contribute to reducing the overlapping area of the irradiated parts to be created, etc., and it becomes possible to reduce the variation in illuminance and the number of light projectors.

In the embodiment, the lenses 4 and 5 are formed on the flat light transmitting part 3 and the flat light transmitting part 3 is coated with a resin amount more than that of the upper surface of the chip. It may be in a state up to the last position of the upper surface or in a state not on the upper surface of the chip.
Furthermore, convex light lenses (4, 5) are directly formed in a state including one or more of the LED elements 2 without providing the plane light transmission part 3, and the heights of these lenses are different Shape, hemispherical shape, flat shape, etc.).
It is preferable to knead the phosphors by increasing the amount of kneading in the lenses 4 and 5 as the amount of the flat light transmitting portion 3 decreases, so as to produce pseudo white light having a desired color temperature.

  The shapes of the central lens 4 and the peripheral lens 5 can be made into a desired shape by the thixotropic property of the resin, and in combination with the potting profile, the lens shape of the liquid resin is In the case of a flat shape like the peripheral lens 5 and a high viscosity, it can be adjusted to a desired light distribution characteristic by approaching a shell shape like the central lens 4.

Next, the manufacturing method will be described based on FIGS. 3 and 4. In the embodiment, the position of the LED element 2 is detected and recognized by the image camera 10 and the height is detected and recognized by the laser displacement meter 12.
First, as shown in FIG. 3A, after mounting a large number of LED elements 2 on a substrate 1 by die bonding, wire bonding or flip chip, the positions of the large number of LED elements 2 are all Or it recognizes every few, and position confirmation is performed. By checking the position of the LED element 2 of the image camera 10, it is possible to grasp the mounting position deviation of the LED element 2 at the time of die bonding and the expansion / contraction deviation of the substrate 1 to be mounted. The mounting position shift and the expansion / contraction shift are about 100 μm with respect to the design value.

  After that, as shown in FIG. 3B, a desired height can be obtained by applying a silicone-based resin obtained by kneading the phosphor on the mounting surface on which the LED element 2 is mounted by the dispense needle (nozzle) 11 or the like. The flat light transmitting portion 3 is formed around the LED element 2 so that all the LED elements 2 are sealed. At this time, parameters such as coating profile and coating time are controlled, and the viscosity and thixotropic property of the silicone resin are selected. Since the silicone-based resin in which the phosphor is kneaded is generally applied to the top of the chip, it becomes difficult to confirm the arrangement position of the LED element 2 at this timing with the image camera 10, but as shown in FIG. Since the position of the LED element 2 is confirmed before applying the silicone-based resin with which the above is kneaded, the lens formation described later based on accurate chip position information can be performed without removing the substrate 1 from the application stage. Become.

  Further, when the positional information of the LED element 2 is recognized by the image camera 10, the position of the alignment mark formed on the peripheral portion etc. of the substrate 1 to which the silicone resin kneaded with the phosphor is not applied is the same image. After applying the silicone resin by checking the position information of the alignment mark and the mounting position information of the LED element 2 after confirmation by the camera 10, even if the substrate 1 is removed from the application stage, a lens described later At the time of formation, a lens can be accurately formed on the LED element 2 by confirming the position of the alignment mark.

  Thereafter, as shown in FIG. 3C, the laser displacement meter 12 recognizes the height of all or a few of the LED elements 2 and the height of the planar light transmitting portion 3. That is, in this laser displacement meter 12, the laser light emitted from the light emitting unit is reflected by the object to be measured, the reflected light is received by the light receiving unit, and triangulation is performed to obtain the angle of the reflected light that changes according to the distance. The height of each part is recognized by the applied method, and as a laser used in the laser displacement meter 12, a visible laser such as a He-Ne laser is used. As described above, it is difficult to confirm the position of the LED element 2 with the image camera 10 through the silicone resin into which the phosphor is kneaded, but it is possible to proceed to the next step without removing the substrate 1 or The height of the LED element 2 is confirmed by irradiating laser light toward the center of the mounting position of the LED element 2 by using the position of the formed alignment mark or the like.

The laser light can be transmitted at the concentration of the phosphor that emits yellow light for whitening, and when the laser light is irradiated from the top of the LED element 2, reflection from the surface of the flat light transmitting portion 3 The light is small, the laser light is almost transmitted, and the height of the surface of the flat light transmitting portion 3 can not be measured. In that case, the laser displacement meter 12 is used at an angle of about 45 °. As a result, as the optical path L ₁ in FIG. 3 (c), it is possible to increase the specularly reflected light from the surface of the planar light-transmitting portion 3, obtaining information of the height of the surface of the planar light-transmitting portion 3 be able to. In addition, information on the thickness of the coated planar light transmitting portion 3 is also obtained by adding information on the laser light refracted and refracted at the interface between the planar light transmitting portion 3 and the air layer and taken out to the air layer side. be able to. In this method, the measurement result is affected by the difference between the incident angle of the laser beam and the refractive index of the flat light transmitting part 3. Therefore, the value obtained from the laser displacement meter is calibrated in advance by the measurement system and material. There is a need.

  Next, as shown in FIG. 3D, with the positional information of XYZ coordinates obtained from the image camera 10 and the laser displacement meter 12, the dispensing needle 11 is set to a predetermined start position of the XYZ coordinates with respect to the LED element 2. Then, the start and end of the supply of the resin 14 by the needle 11 are controlled. That is, as shown in FIG. 4 (e), the liquid resin 14 is taken out by the amount adjusted in advance (the amount attached to the flat light transmitting portion 3), and thereafter, as shown in FIG. 4 (f) A necessary amount of resin is supplied by feeding out the resin 14 from its tip while pulling up 11 in the Z direction, stopping the needle 11 at the end position and stopping the resin supply. In this way, a lens of an arbitrary shape is produced, and the shell-shaped central lens 4 and the flat peripheral lens 5 (hemispherical or the like) shown in FIG. 1 can be formed. This lens shape is adjusted by the combination of the potting profile and the resin property by thixotropic property.

  When the formation of the lens for one LED element 2 is completed, as shown in FIGS. 4G and 4H, the needle 11 is moved to the start position of the next LED element 2 and the next LED element 2 is moved. Similarly, the formation of the lens is carried out. The movement of the needle 11 at this time is controlled based on the recognition data described above.

  According to such a manufacturing method, it is possible to cope with the mounting position deviation of about 100 μm of the LED element 2 and the height variation in the surface of the COB type LED module substrate, and maintain the optimal shape accuracy with less variation. A lens can be formed and disposed at a position, and stable extraction efficiency of light and light distribution characteristics can be obtained.

  After the formation of the lens, curing of the liquid resin 14 is carried out, but it is preferable to carry out under a known pressure of, for example, about 0.5 MPa. According to this, in the case where air bubbles are contained in the lens Even if there is, it is possible to sufficiently reduce the volume of the air bubbles to suppress the occurrence of variations in lens formation by the liquid resin 14.

  The structure of the LED module of 2nd Example is shown by FIG. 5, and this 2nd Example produces a lens in 2 steps (3 steps or more may be sufficient). That is, as in the case of the first embodiment, the first liquid resin such as silicone resin is placed on the flat light transmitting portion 3 in which a large number of LED elements 2 are sealed by the manufacturing method of FIGS. The lens base 6a to be the central lens and the peripheral lens 5 are coated and formed using this. Then, the first liquid resin is temporarily cured (hardened to such an extent that deformation over time does not substantially occur) in the first curing step, and thereafter, the first liquid resin is stacked on the lens base 6a and laminated with the second liquid resin. The portion 6 b is formed, and then the first liquid resin of the lens base and the second liquid resin of the lens laminated portion are subjected to main curing (second curing step). In this manner, a shell-shaped central lens 6 higher than the central lens 4 of the first embodiment can be formed.

  Such a second embodiment can be applied to, for example, a specification in which the light distribution at the front of the LED module is further narrowed and the luminance is concentrated. In addition, since the volume of the central lens 6 becomes large, the lens shape may be flattened by the weight of the liquid resin to be used, and it may be difficult to obtain a desired cannonball shape. In this case, the first liquid resin and the second liquid resin may correspond to different types of resins.

  Although the embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these. For example, the shape of the lens is not limited to the case where the central lens is raised and the peripheral lens is lowered, and the height may be changed appropriately so as to obtain desired light distribution characteristics.

1 ... board, 2 ... LED element,
3 ... flat light transmission part, 4, 6 ... central part (bullet shaped) lens,
5: Peripheral part (flat type) lens,
10 Image camera 11 Dispensing needle 12 Laser displacement meter 14 Liquid resin.

Claims (3)

In a method of manufacturing an LED module, in which a lens is formed on the plurality of LED elements by mounting a plurality of LED elements on a substrate and supplying liquid resin from a dispenser,
By sealing the plurality of LED elements with a light-transmissive resin, a flat light-transmissive portion whose upper surface is a flat surface is formed,
Position of the LED element recognized by recognition device, based on the height and the surface height information of the planar light-transmitting portion of the LED element, a liquid resin on each of the planar light-transmitting portion on the LED element By supplying, a central lens group consisting of a convex lens having a shell shape and a peripheral lens group consisting of a convex convex lens group lower than the lens height of this central lens are formed. LED module manufacturing method. The recognition device recognizes the position of the LED element with an image camera, and recognizes the height of the LED element and the surface height of the planar light transmission part with a laser displacement meter using a visible laser. The manufacturing method of the LED module of Claim 1. The light transmitting property on each of the planar light transmitting parts on the LED element is based on the position of the LED element recognized by the recognition device, the height of the LED element and the surface height information of the planar light transmitting part A lens base forming step of forming a lens base with the first liquid resin of
A first curing step of temporarily curing the first liquid resin of the lens base;
A lens laminated portion forming step of forming a lens laminated portion by light transmitting second liquid resin by laminating on the lens base after the first curing step;
And a second curing step of substantially curing the first liquid resin of the lens base and the second liquid resin of the lens stack portion,
3. The method for manufacturing an LED module according to claim 1, wherein the central lens group and the peripheral lens group are formed of the first liquid resin and the second liquid resin.

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