CN108011025A - LED packaging technologies - Google Patents
LED packaging technologies Download PDFInfo
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- CN108011025A CN108011025A CN201711211375.2A CN201711211375A CN108011025A CN 108011025 A CN108011025 A CN 108011025A CN 201711211375 A CN201711211375 A CN 201711211375A CN 108011025 A CN108011025 A CN 108011025A
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- 238000012536 packaging technology Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000004744 fabric Substances 0.000 claims abstract description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 87
- 239000000741 silica gel Substances 0.000 claims description 84
- 229910002027 silica gel Inorganic materials 0.000 claims description 84
- 238000000034 method Methods 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 9
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000004891 communication Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229960001866 silicon dioxide Drugs 0.000 description 75
- 239000000463 material Substances 0.000 description 29
- 238000005538 encapsulation Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of LED packaging technologies, include the following steps：(a) oblique circular groove heat-radiating substrate is prepared；(b) chip is secured on heat-radiating substrate and forms fabric；(c) lens arrangement is prepared on the fabric.Oblique circular groove among being made on heat-radiating substrate, the cost of manufacture of heat-radiating substrate is reduced in the case where intensity is constant, and middle tiltedly circular groove can increase air communication channel, using the thermal convection current speed of stack effect lifting air, add heat dissipation effect.
Description
Technical field
The invention belongs to LED technology field, and in particular to a kind of LED packaging technologies.
Background technology
High-power LED encapsulation directly influences performance and the service life of LED due to structure and complex process, always
It is research hotspot in recent years, particularly illumination level great power LED cooling encapsulation is even more the hot spot in research hotspot, with big work(
The rapid raising of rate LED core piece performance, the encapsulation technology of power-type LED continuously improves the development to adapt to the situation, from beginning
Lead frame posture is encapsulated into multiple chips array assembling, then 3D arrays encapsulation by now, its input power is continuously improved, and seals
Dress thermal resistance significantly reduces.In order to promote development of the LED in general lighting field, the heat management that a step of spouting improves LED encapsulation will be
One of key.The links such as LED chip, gold thread, potting resin, lens and heat sink, heat dissipation are asked in encapsulation process
Topic must all be paid attention to well.
Therefore, suitable structure and material, preparation process and parameter how to be developed to design and prepare low interface thermal resistance, height
Raising and development of the encapsulating structure of heat dissipation performance for the heat dissipation performance of following high-power LED encapsulation have very real meaning
Justice.
The content of the invention
In order to solve the above-mentioned problems in the prior art, the present invention provides a kind of LED packaging technologies.
An embodiment provides a kind of LED packaging technologies, including：
(a) oblique circular groove heat-radiating substrate is prepared；
(b) chip is secured on heat-radiating substrate and forms fabric；
(c) lens arrangement is prepared on the fabric.
In one embodiment of the invention, step (a) includes：
(a1) oblique circular groove is formed on the heat-radiating substrate；
(a2) heat-radiating substrate is cleaned and dried.
In one embodiment of the invention, the chip is RGB three-primary color LED wicks.
In one embodiment of the invention, step (b) uses the solder reflow process of standard.
In one embodiment of the invention, step (c) includes：
(c1) the first lens unit is repeatedly prepared on the fabric and forms central lens layer；
(c2) the second lens unit, the central lens layer and the second lens list are prepared on the central lens layer
Member forms the lens arrangement；
(c3) fabric, the lens arrangement are toasted, baking temperature is 100-150 DEG C, baking time
For 4-12 it is small when.
In one embodiment of the invention, the first lens unit of the preparation includes：
(x1) first time layer of silica gel and the first lens jacket are prepared, wherein, first lens jacket includes multiple lens balls；
(x2) layer of silica gel on first is prepared on first lens jacket, wherein, first time layer of silica gel, described first
Lens jacket, layer of silica gel forms first lens unit on described first.
In one embodiment of the invention, the lens ball is rectangular or diamond shape is evenly distributed.
In one embodiment of the invention, step (x1) includes：
(x11) first lens jacket with the first lens die is formed；
(x12) silica gel is coated on the fabric and forms first time layer of silica gel, the first lens die will be carried
First lens be placed in first time layer of silica gel and toasted, baking temperature be 90~125 DEG C, baking time
For 15~60 minutes；
(x13) first lens die is removed.
In one embodiment of the invention, the second lens unit of the preparation includes：
(y1) second time layer of silica gel and the second lens jacket are prepared on the central lens layer；
(y2) on second lens jacket prepare second on layer of silica gel, using the second lens die on described second silicon
Glue-line upper surface forms arc.
In one embodiment of the invention, after step (c), further include：It is detected and packs completes LED encapsulation
Technique.
The embodiment of the present invention has the beneficial effect that：Oblique circular groove among being made on heat-radiating substrate, in the feelings that intensity is constant
The cost of manufacture of heat-radiating substrate is reduced under condition, and middle tiltedly circular groove can increase air communication channel, be carried using stack effect
The thermal convection current speed of lift-off gas, adds heat dissipation effect.
Brief description of the drawings
Fig. 1 is a kind of flow diagram of LED packaging technologies provided in an embodiment of the present invention；
Fig. 2 synthesizes white light structure diagram for a kind of RGB three-primary color LEDs wick provided in an embodiment of the present invention；
Fig. 3 is a kind of tiltedly circular groove structure of heat dissipation substrate schematic diagram provided in an embodiment of the present invention；
Fig. 4 is that a kind of lens ball provided in an embodiment of the present invention is the evenly distributed structure diagram of diamond shape；
Fig. 5 is the structure diagram that a kind of lens ball provided in an embodiment of the present invention is rectangular uniform arrangement；
Fig. 6 (a)~Fig. 6 (d) is the process flow diagram of first lens jacket of preparation provided in an embodiment of the present invention；
Fig. 7 is the cross-section structure signal for the LED encapsulation structure that a kind of LED packaging technologies provided in an embodiment of the present invention are formed
Figure.
Embodiment
Further detailed description is done to the present invention with reference to specific embodiment, but embodiments of the present invention are not limited to
This.
Embodiment one
Fig. 1 is referred to, Fig. 1 is a kind of flow diagram of LED packaging technologies provided in an embodiment of the present invention.The technique bag
Include following steps：
(a) oblique circular groove heat-radiating substrate is prepared；
(b) chip is secured on heat-radiating substrate and forms fabric；
(c) lens arrangement is prepared on the fabric.
Wherein, step (a) includes：
(a1) oblique circular groove is formed on the heat-radiating substrate；
(a2) heat-radiating substrate is cleaned and dried.
Wherein, the chip is RGB three-primary color LED wicks.
Wherein, step (b) uses the solder reflow process of standard.
Wherein, step (c) includes：
(c1) the first lens unit is repeatedly prepared on the fabric and forms central lens layer；
(c2) the second lens unit, the central lens layer and the second lens list are prepared on the central lens layer
Member forms the lens arrangement；
(c3) fabric, the lens arrangement are toasted, baking temperature is 100-150 DEG C, baking time
For 4-12 it is small when.
Wherein, the first lens unit of the preparation includes：
(x1) first time layer of silica gel and the first lens jacket are prepared, wherein, first lens jacket includes multiple lens balls；
(x2) layer of silica gel on first is prepared on first lens jacket, wherein, first time layer of silica gel, described first
Lens jacket, layer of silica gel forms first lens unit on described first.
Wherein, the lens ball is rectangular or diamond shape is evenly distributed.
Wherein, step (x1) includes：
(x11) first lens jacket with the first lens die is formed；
(x12) silica gel is coated on the fabric and forms first time layer of silica gel, the first lens die will be carried
First lens be placed in first time layer of silica gel and toasted, baking temperature be 90~125 DEG C, baking time
For 15~60 minutes；
(x13) first lens die is removed.
Wherein, the second lens unit of the preparation includes：
(y1) second time layer of silica gel and the second lens jacket are prepared on the central lens layer；
(y2) on second lens jacket prepare second on layer of silica gel, using the second lens die on described second silicon
Glue-line upper surface forms arc.
Wherein, after step (c), further include：It is detected and packs completes LED packaging technologies.
The embodiment of the present invention has the beneficial effect that：
1st, oblique circular groove among being made on heat-radiating substrate, being fabricated to for heat-radiating substrate is reduced in the case where intensity is constant
This, and middle tiltedly circular groove can increase air communication channel, using the thermal convection current speed of stack effect lifting air, add scattered
Thermal effect；
2nd, this packaging technology compared with prior art in need the packaging technology using fluorescent powder to compare, high temperature will not be produced and drawn
Play the problem of fluorescent powder quantum efficiency declines；
3rd, lens ball can be with rectangular evenly distributed, or diamond array, it is ensured that the light of light source is equal in concentration zones
Even distribution.
Embodiment two
The present embodiment explains in detail a kind of LED packaging technologies on the basis of above-described embodiment, LED packaging technologies tool
There is two layers lens unit, comprise the following steps that：
S21：Prepare RGB three-primary color LED wicks.
Fig. 2 is referred to, Fig. 2 synthesizes white light structural representation for a kind of RGB three-primary color LEDs wick provided in an embodiment of the present invention
Figure；Wherein, RGB three-primary color LEDs wick includes：Red-light LED, green light LED, blue-ray LED.Three kinds of LED send feux rouges, green light respectively
White light is finally synthesized with blue light.
S22：Prepare stent and heat-radiating substrate.
S221：Prepare heat-radiating substrate.Fig. 3 is referred to, Fig. 3 is a kind of tiltedly circular groove heat-radiating substrate provided in an embodiment of the present invention
Structure diagram.The heat-radiating substrate drills to form oblique circular groove by material selection aluminum in the width direction on heat-radiating substrate surface,
The formation of oblique circular groove can also use casting or other manner to be formed.
Wherein, aluminum thermal capacitance is big, and good heat conduction effect, is unlikely to deform, and can be in close contact with heat-radiating substrate, heat dissipation effect
It is good.
Wherein, circular groove axis and heat-radiating substrate plane are in a certain angle, and angular range is 1~10 degree.
Wherein, the circular groove radius R of heat-radiating substratebFor 0.1~0.5mm, circular groove spacing LbFor 0.5~10mm.
Wherein, heat-radiating substrate thickness DbScope be 90-140 μm, Chip-wide WbMore than 20 μm, area is according to lamps and lanterns
Demand area is cut out.
S222：Wherein, stent and heat-radiating substrate must keep clean, it is necessary to by the spot above stent and heat-radiating substrate,
Especially oil stain cleans up, and is dried, and keeps the drying regime of stent and heat-radiating substrate.
S23：Form fabric.
After getting out stent and heat-radiating substrate according to step S22, RGB three-primary color LED wicks are welded on heat-radiating substrate
Fabric is formed, and the lead of RGB three-primary color LED wicks is welded on heat-radiating substrate, using the reflow soldering work of standard
Skill, specifically includes：Printing solder, die bond are examined, three process flows of reflow soldering.
S24：Prepare lens arrangement.Wherein, lens arrangement include first lens unit composition central lens layer and
Second lens unit, wherein, the first lens unit includes：First time layer of silica gel, the first lens jacket, layer of silica gel on first.
S241：Prepare first time layer of silica gel and the first lens jacket.Refer to Fig. 6 (a)~Fig. 6 (d), Fig. 6 (a)~Fig. 6 (d)
For first time layer of silica gel of preparation provided in an embodiment of the present invention and the process flow diagram of the first lens jacket；
S2411：Two identical lens dies 10 and lens die 11 are symmetrically placed, wherein, in two lens dies
Corresponding hemispherical groove is symmetrically placed to form a complete spherical.
S2412：The first silica gel material is injected from two lens die sides gap, until by two lens dies
Hemispherical groove and gap are filled up, and to form multiple lens balls, are connected between multiple lens balls by the second silica gel, are referred to figure
6(a)。
S2413：Remove a lens die, form the first lens jacket with lens die, refer to Fig. 6 (b).
S2414：The second silica gel material silica gel is coated on the fabric and forms first time layer of silica gel, will be carried
First lens of first lens die are placed in first time layer of silica gel, by total include the first lens jacket,
First time layer of silica gel, fabric are toasted, and baking temperature is 90~125 DEG C, and baking time is 15~60 minutes, is referred to
Fig. 6 (c).
S2415：Remove remaining lens die to form the first lens jacket, the first lens jacket has multiple silica-gel lens
Ball, refers to Fig. 6 (d).Wherein, multiple lens balls are rectangular or diamond shape is evenly distributed, refer to Fig. 4 and Fig. 5, and Fig. 4 is this
A kind of lens ball that inventive embodiments provide is the evenly distributed structure diagram of diamond shape；Fig. 5 is provided in an embodiment of the present invention
A kind of lens ball is the structure diagram of rectangular uniform arrangement.
S242：Form layer of silica gel on first.The 3rd silica gel material is coated on the first lens jacket and forms layer of silica gel on first
To form the first lens unit, that is, central lens layer.
Wherein, central lens layer includes first lens unit.
Repeat step S241 can prepare the central lens layer containing multiple first lens units, no longer detailed one by one here
State.
S243：Similarly, the 4th silica gel material is respectively adopted in repeat step S241 and the 5th silica gel material forms second respectively
Lower layer of silica gel and the second lens jacket.
S244：Form layer of silica gel on second.
The 6th silica gel material is coated on the second lens jacket and forms layer of silica gel on second, using hemispherical on second
An arc is formed in layer of silica gel to form the second lens unit.
S25：Whole LED encapsulation structure grow roasting.Fig. 7 is refer to, Fig. 7 is one kind provided in an embodiment of the present invention
The cross-sectional view for the LED encapsulation structure that LED packaging technologies are formed.
Wherein, LED encapsulation structure includes：The fabric 21 being cascading, first time layer of silica gel 22, the first lens
Layer of silica gel 24, second time layer of silica gel 25, layer of silica gel 27 on the second lens jacket 26, second on layer 23, first.
By whole encapsulating structure：Fabric, the first lens unit, the second lens unit are toasted, and baking temperature is
100-150 DEG C, when baking time is 4-12 small.
S26：Detection and packaging.Whole encapsulating structure is detected and packed to complete LED packaging technologies.
Wherein, the first silica gel material and the 5th silica gel material can be identical or different, can be polycarbonate or poly- first
Base methacrylate or glass.
Wherein, the second silica gel material can be modified epoxy, organosilicon material etc..
Wherein, the 3rd silica gel material, the 4th silica gel material are epoxy resin, modified epoxy, organosilicon material etc..
Wherein, the 6th silica gel material is epoxy resin, modified epoxy, organosilicon material, 1.41 index of refraction silicon of methyl
High folding (1.54 optical index) organic silicon rubber of rubber, phenyl.
Wherein, the first silica gel material, the second silica gel material, the 3rd silica gel material, the 4th silica gel material, the 5th silica gel material
Material, the refractive index of the 6th silica gel material can be adjusted by the adjusting to component.
Referring again to Fig. 7, it can reach higher state, phase for the light transmittance and rate of heat dissipation of balanced LED encapsulation structure
It is as follows to close process parameters design：
Wherein, the refractive index of the first lens jacket is more than the refractive index of layer of silica gel and first time layer of silica gel on first, and second is saturating
The refractive index of mirror layer is more than the refractive index of layer of silica gel and second time layer of silica gel on second, first time layer of silica gel, layer of silica gel on first,
Second time layer of silica gel, the refractive index of layer of silica gel is sequentially increased on second, so design be in order to suppress the full transmitting of emergent light, because
Emergent light can be caused to tail off for total reflection, useless heat can be absorbed into by being totally reflected to the light of inside.
Meanwhile the refractive index of layer of silica gel needs to be less than 1.5 on second, on such second the refractive index of layer of silica gel and air it
Between to form refringence smaller therefore can further suppress full transmitting effect.
Wherein, in order to make emergent light not dissipated after the lens ball outgoing of the first lens jacket to gather state, first is saturating
The distance K of mirror layer and the second lens jacket needs the focal length f for meeting the first lens less than twice1, wherein, in the first lens jacket thoroughly
The focal length f of mirror ball1For：
Wherein, R is the radius of lens ball in the first lens jacket, and n2 is the refraction of lens ball silica gel material in the first lens jacket
Rate, n1 are the refractive index of layer of silica gel silica gel material on first.
Wherein, the thickness of layer of silica gel needs to be higher by 50-500 μm of the lens top dome face of the second lens jacket on second.
Preferably, in order to which the light transmittance and balanced rate of heat dissipation, lens radius of a ball R that are optimal are more than 10 μm, the first lens
The distance L of the lens of layer to fabric is more than 2 μm, and the spacing A between lens ball is more than 5 μm, the gross thickness H models of encapsulating material
Enclose for 1000~1200 μm.
Wherein, the lens ball in the lens ball and the second lens jacket in the first lens jacket can align and can also interlock.
There is the detailed process of the LED packaging technologies of first lens unit by central lens layer above, similarly, we
Central lens layer, which can be prepared, has the LED packaging technologies of multiple first lens units, is no longer described in detail one by one here.
The embodiment of the present invention has the beneficial effect that：
1st, heat-radiating substrate is made using thick aluminum, thermal capacitance is big, good heat conductivity, and thick aluminum cooling substrates do not allow mutability
Shape, therefore can be in close contact with radiator, good heat dissipation effect；
2nd, oblique circular groove among being made on heat-radiating substrate, being fabricated to for heat-radiating substrate is reduced in the case where intensity is constant
This, and middle tiltedly circular groove can increase air communication channel, using the thermal convection current speed of stack effect lifting air, add scattered
Thermal effect；
3rd, this packaging technology compared with prior art in need the packaging technology using fluorescent powder to compare, high temperature will not be produced and drawn
Play the problem of fluorescent powder quantum efficiency declines；
4th, the silica gel contacted with chip uses high temperature resistant silica gel, therefore will not produce silica gel aging and cause what light transmittance declined
Problem；
5th, lens change the direction of propagation of light, can effectively inhibit total reflection effect, are conducive to more light emittings
Outside to LED, that is, the external quantum efficiency of LED component is increased, or improve the luminous efficiency of LED.
6th, lens ball can be with rectangular evenly distributed, or diamond array, it is ensured that the light of light source is equal in concentration zones
Even distribution；
7th, bottom silica gel refractive index is less than upper strata silica gel, and the refractive index of lens ball material is more than levels silica gel refractive index,
The refractive index of layer of silica gel is sequentially increased from top to bottom, it is ensured that chip can more shine out through encapsulating material.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
To modify to the technical solution described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic；
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical solution spirit and
Scope.
Claims (10)
1. a kind of LED packaging technologies, it is characterised in that include the following steps：
(a) oblique circular groove heat-radiating substrate is prepared；
(b) chip is secured on heat-radiating substrate and forms fabric；
(c) lens arrangement is prepared on the fabric.
2. packaging technology according to claim 1, it is characterised in that step (a) includes：
(a1) oblique circular groove is formed on the heat-radiating substrate；
(a2) heat-radiating substrate is cleaned and dried.
3. packaging technology according to claim 1, it is characterised in that the chip is RGB three-primary color LED wicks.
4. packaging technology according to claim 1, it is characterised in that step (b) uses the solder reflow process of standard.
5. packaging technology according to claim 1, it is characterised in that step (c) includes：
(c1) the first lens unit is repeatedly prepared on the fabric and forms central lens layer；
(c2) the second lens unit, the central lens layer and the second lens unit shape are prepared on the central lens layer
Into the lens arrangement；
(c3) fabric, the lens arrangement are toasted, baking temperature is 100-150 DEG C, baking time 4-
12 it is small when.
6. packaging technology according to claim 4, it is characterised in that the first lens unit of the preparation includes：
(x1) first time layer of silica gel and the first lens jacket are prepared, wherein, first lens jacket includes multiple lens balls；
(x2) layer of silica gel on first is prepared on first lens jacket, wherein, first time layer of silica gel, first lens
Layer, layer of silica gel forms first lens unit on described first.
7. packaging technology according to claim 5, it is characterised in that the lens ball is rectangular or diamond shape is uniformly arranged
Row.
8. packaging technology according to claim 5, it is characterised in that step (x1) includes：
(x11) first lens jacket with the first lens die is formed；
(x12) silica gel is coated on the fabric and forms first time layer of silica gel, by the institute with the first lens die
State the first lens to be placed in first time layer of silica gel and toasted, baking temperature is 90~125 DEG C, baking time 15
~60 minutes；
(x13) first lens die is removed.
9. packaging technology according to claim 4, it is characterised in that the second lens unit of the preparation includes：
(y1) second time layer of silica gel and the second lens jacket are prepared on the central lens layer；
(y2) on second lens jacket prepare second on layer of silica gel, using the second lens die on described second layer of silica gel
Upper surface forms arc.
10. packaging technology according to claim 1, it is characterised in that after step (c), further include：It is detected and wraps
It is filled with and completes LED packaging technologies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711211375.2A CN108011025B (en) | 2017-11-28 | 2017-11-28 | LED packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711211375.2A CN108011025B (en) | 2017-11-28 | 2017-11-28 | LED packaging process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108011025A true CN108011025A (en) | 2018-05-08 |
| CN108011025B CN108011025B (en) | 2020-02-07 |
Family
ID=62054336
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711211375.2A Active CN108011025B (en) | 2017-11-28 | 2017-11-28 | LED packaging process |
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| Country | Link |
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| CN (1) | CN108011025B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080030986A1 (en) * | 2006-08-03 | 2008-02-07 | Hitachi Maxell, Ltd. | Lighting device and display apparatus |
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| TWI431823B (en) * | 2011-09-26 | 2014-03-21 | Nat Univ Chung Hsing | Production method and finished product of light emitting diode grain element with microlens |
| JP2016146452A (en) * | 2015-02-09 | 2016-08-12 | 新日本無線株式会社 | Led module and manufacturing method therefor |
| WO2016150837A1 (en) * | 2015-03-20 | 2016-09-29 | Osram Opto Semiconductors Gmbh | Optoelectronic lighting device and method for the production of an optoelectronic lighting device |
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| US20080030986A1 (en) * | 2006-08-03 | 2008-02-07 | Hitachi Maxell, Ltd. | Lighting device and display apparatus |
| CN102422081A (en) * | 2009-05-12 | 2012-04-18 | 飞利浦拉米尔德斯照明设备有限责任公司 | Led lamp producing sparkle |
| US20120217863A1 (en) * | 2011-02-25 | 2012-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Lighting device and method for manufacturing the same |
| TWI431823B (en) * | 2011-09-26 | 2014-03-21 | Nat Univ Chung Hsing | Production method and finished product of light emitting diode grain element with microlens |
| CN202585408U (en) * | 2012-01-12 | 2012-12-05 | 盈胜科技股份有限公司 | Improved structure of a multilayer array-type light-emitting diode engine |
| JP2016146452A (en) * | 2015-02-09 | 2016-08-12 | 新日本無線株式会社 | Led module and manufacturing method therefor |
| WO2016150837A1 (en) * | 2015-03-20 | 2016-09-29 | Osram Opto Semiconductors Gmbh | Optoelectronic lighting device and method for the production of an optoelectronic lighting device |
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