CN112582350A - Cavity type packaging structure and packaging method - Google Patents
Cavity type packaging structure and packaging method Download PDFInfo
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- CN112582350A CN112582350A CN201910935695.5A CN201910935695A CN112582350A CN 112582350 A CN112582350 A CN 112582350A CN 201910935695 A CN201910935695 A CN 201910935695A CN 112582350 A CN112582350 A CN 112582350A
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- metal
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- heat sink
- chip
- interlayer plate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims description 34
- 239000002184 metal Substances 0.000 claims abstract description 220
- 229910052751 metal Inorganic materials 0.000 claims abstract description 220
- 238000005192 partition Methods 0.000 claims abstract description 10
- 239000011229 interlayer Substances 0.000 claims description 85
- 239000000919 ceramic Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 125000006850 spacer group Chemical group 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 description 17
- 230000010354 integration Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
Abstract
The cavity type packaging structure comprises a heat sink, a lower layer chip and metal columns are arranged on the heat sink, metal partition plates are arranged on the metal columns, and upper layer chips which are matched with the metal columns below the metal partition plates in number and correspond to the metal columns in position are arranged on the metal partition plates. Through the arrangement, the requirement that the existing cavity type packaging structure needs further high-density and integrated arrangement design can be solved.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a cavity type packaging structure and a packaging method.
Background
With the development of semiconductor technology, ceramic packaging technology is rapidly developed as a new cavity type packaging form, following metal packaging technology.
At present, ceramic cavity packaging structure generally is the design of individual layer cavity, and along with the functional continuous promotion of electronic product, electronic components's quantity constantly increases, and is higher and higher to the requirement of integration, and individual layer ceramic cavity packaging structure's packaging area and space are restricted, are unfavorable for electronic components's high integration. Therefore, the single-layer ceramic cavity packaging structure needs to be improved, so that the ceramic cavity packaging structure develops towards the direction of further integration.
Disclosure of Invention
The invention aims to provide a cavity type packaging structure to solve the requirement that the existing cavity type packaging structure needs further high-density and integrated arrangement design.
In order to achieve one of the above objects, an embodiment of the present invention provides a cavity type package structure, which includes a heat sink, a lower chip and a metal pillar are disposed on the heat sink, a metal interlayer plate is disposed on the metal pillar, and an upper chip corresponding to the metal pillar under the metal interlayer plate in number and position is disposed on the metal interlayer plate.
As a further improvement of an embodiment of the present invention, a metal interlayer plate is correspondingly provided with at least one pair of metal columns, the metal interlayer plate is further provided with a through window, and the at least one pair of metal columns are respectively located at two sides of the window; the position of the lower chip is opposite to the window.
As a further improvement of the embodiment of the present invention, the cavity type package structure further includes a bonding wire, and the bonding wire passes through the window to electrically connect the upper chip located above the metal spacer plate and the lower chip located below the window.
As a further improvement of an embodiment of the present invention, the bonding wires electrically connect at least two of the upper chips.
As a further improvement of an embodiment of the present invention, the bonding wires electrically connect at least two of the lower chips.
As a further improvement of an embodiment of the present invention, the cavity type package structure further includes a ceramic ring and a metal outer pin stacked on the heat sink, the ceramic ring is fixedly attached to an edge of the heat sink, one end of the metal outer pin is fixedly attached to the ceramic ring, and the other end of the metal outer pin extends in a direction away from the ceramic ring, and one end of the metal outer pin is electrically connected to at least one of the lower chip and the upper chip.
As a further improvement of an embodiment of the present invention, the metal pillar is integrally formed with the heat sink.
As a further improvement of an embodiment of the present invention, the metal pillar and the heat sink are both made of copper material.
An embodiment of the present invention further provides a method for packaging a cavity type package structure, including: arranging a lower chip on the heat sink; arranging a metal interlayer plate on the metal column arranged on the heat sink; and arranging an upper layer chip which is matched with the metal columns below the metal interlayer plate in number and corresponds to the metal interlayer plate in position.
As a further improvement of an embodiment of the present invention, the method further comprises: a penetrating window is formed in the metal interlayer plate; and arranging a metal interlayer plate and at least one pair of metal columns correspondingly, so that the at least one pair of metal columns are respectively positioned at two sides of the window, and the position of the lower-layer chip is opposite to the window.
As a further improvement of an embodiment of the present invention, the method further comprises: passing a bonding wire through the window; and electrically connecting the upper chip positioned above the metal interlayer plate with the lower chip positioned below the window through the bonding wires.
As a further improvement of an embodiment of the present invention, the method further comprises: and electrically connecting at least two upper chips through bonding wires.
As a further improvement of an embodiment of the present invention, the method further comprises: and electrically connecting at least two lower chips through bonding wires.
As a further improvement of an embodiment of the present invention, the method further comprises: and fixedly bonding the metal column on the heat sink.
Compared with the prior art, the invention has the beneficial effects that: the metal column and the metal partition plate are arranged on the heat sink of the cavity type packaging structure, and the upper chip is arranged on the metal column and the metal partition plate, so that the upper chip and the lower chip arranged on the heat sink are arranged in a laminated mode, and the fact that the arrangement density of the chips in the cavity type packaging structure is higher and the integration level is higher is improved.
Drawings
Fig. 1 is a schematic structural diagram of a cavity type package structure according to an embodiment of the invention;
FIG. 2 is a top view of a cavity package structure according to an embodiment of the invention;
FIG. 3 is a flow chart illustrating a method for packaging a cavity-type package structure according to an embodiment of the present invention;
fig. 4 to 8 are schematic views illustrating a packaging process of the cavity type package structure according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the technical solutions of the present application will be clearly and completely described below with reference to the detailed description of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. As in the present invention, for convenience of description, in the package structure, a side of the substrate close to the chip is a front side of the substrate, and a side far from the chip is a back side of the substrate; the direction of the plane of the substrate is the horizontal direction, and the thickness direction of the substrate is the vertical direction or the vertical direction.
As shown in fig. 1 to 2, an embodiment of the present invention provides a cavity type package structure, which includes a heat sink 8, a lower chip 2 and a metal pillar 1 are disposed on the heat sink 8, a metal interlayer plate 3 is disposed on the metal pillar 1, and an upper chip 4 corresponding to the metal pillar 1 under the metal interlayer plate 3 in number and position is disposed on the metal interlayer plate 3.
Specifically, in the cavity type packaging structure, the packaging structure comprises a heat sink 8 serving as a supporting function, and a lower chip 2 is attached to the heat sink 8; one or more metal columns 1 are also fixedly arranged on the heat sink 8, and a metal interlayer plate 3 is arranged on one or more metal columns 1; the position department that corresponds with metal column 1 on metal interlayer board 3 still is equipped with upper chip 4, and upper chip 4 is the same with the quantity of metal column 1 promptly, and metal column 1 sets up with upper chip 4 one-to-one. Therefore, the cavity type packaging structure can be provided with two or more layers of chips, the number of the chips in the cavity can be greatly expanded, and the integration level of the packaging structure is greatly improved.
Alternatively, the metal interlayer plate 3 is not limited in form, and may be an integral metal plate, or may be a plurality of independent metal plates.
Further, at least one pair of metal columns 1 is correspondingly arranged on one metal interlayer plate 3, a through window 31 is further formed in the metal interlayer plate 3, and the at least one pair of metal columns 1 are respectively located on two sides of the window 31; the position of the lower chip 2 is opposite to the window 31.
Further, the cavity type package structure further includes a bonding wire 6, and the bonding wire 6 passes through the window 31 to electrically connect the upper chip 4 located above the metal spacer plate 3 and the lower chip 2 located below the window 31.
Further, the bonding wires 6 electrically connect at least two of the upper chips 4.
Further, the bonding wires 6 electrically connect at least two of the lower chips 2.
Specifically, the metal interlayer plate 3 is an integrally formed metal plate, and at least one pair of metal columns 1 is arranged below the metal interlayer plate to stably support the metal interlayer plate 3; the metal interlayer plate 3 is also provided with a through window 31, and the window 31 is positioned between the adjacent metal columns 1; the lower chip 2 is positioned below the metal interlayer plate 3, and the number and the position of the lower chip are not limited, namely, the lower chip 2 can be positioned right below the window 31, or only positioned below the metal interlayer plate 3 and shielded by the metal interlayer plate; when the lower chip 2 needs to be electrically connected to the upper chip 4, the lower chip 2 needs to be located right below the window 31, so that the lower chip 2 can be smoothly exposed through the window 31 in the plane direction of the heat sink 8, so that the lower chip 2 and the upper chip 4 can be electrically connected in subsequent processes in the form of welding by the bonding wires 6 and the like.
When the welding type processing is carried out, the welding wire 6 can penetrate through the hollow-out window 31, one end of the welding wire 6 is welded with the upper chip 4 above the metal interlayer plate 3, the other end of the welding wire 6 is welded with the lower chip 2 adjacent to the lower part of the window 31, the number of the welding wire 6 is not limited, and the welding wire can be determined according to the actual number of pins.
In addition, the bonding wires 6 can also connect the upper chips 4 above the metal interlayer plate 3, and at least two upper chips 4 are electrically connected with each other by welding the bonding wires 6, so that various electrical connection modes inside the packaging structure are realized.
Similarly, the bonding wires 6 may connect the plurality of lower chips 2 disposed on the heat sink 8, and the at least two lower chips 2 are electrically connected to each other by welding the bonding wires 6, thereby implementing various electrical connection modes inside the package structure.
Optionally, a part of the lower chip 2 may also be located on the outer periphery of the metal interlayer plate 3, and at this time, the part of the lower chip 2 faces the periphery of the metal interlayer plate 3 and exposes the metal interlayer plate 3, and may be electrically connected to the outer pins on the periphery of the cavity type package structure, the adjacent upper chip 4 above the metal interlayer plate 3, or the adjacent lower chip 2 on the heat sink 8, and the like, in a manner of welding.
Further, cavity formula packaging structure still including pile up set up in ceramic ring 7 and metal outer pin 5 on the heat sink 8, ceramic ring 7 with the edge of heat sink 8 is pasted fixedly, metal outer pin 5 one end with ceramic ring 7 is pasted fixedly and the other end orientation deviates from ceramic ring 7's direction extends, just metal outer pin 5's one end and at least one lower floor's chip 2 or upper chip 4 electric connection.
Specifically, the heat sink 8 is further provided with an insulating ceramic ring 7, and the ceramic ring 7 is adhered to the edge of the heat sink 8, so that the internal space of the cavity of the packaging structure is large enough; the insulating ceramic ring 7 is provided with a metal outer pin 5 for electrically connecting the chip in the cavity with an external element, one end of the metal outer pin 5 is pasted on the ceramic ring 7 and is electrically connected with at least one lower chip 2 or at least one upper chip 4 in the cavity of the packaging structure, and the other end of the metal outer pin extends out of the cavity outwards to form a pin which is electrically connected with an external circuit; therefore, the internal chip of the packaging structure can be connected with an external circuit in series to realize the whole electrical performance.
Alternatively, the ceramic ring 7 may be made of other materials as long as insulation is ensured and the metal outer pipe pin 5 and the heat sink 8 are insulated from each other. And a ceramic cover 9 or an encapsulation cover made of other materials is fixedly arranged above the metal outer pins 5 and used for sealing the encapsulation structure to form an inner cavity and the overall structure of the encapsulation structure is stable in performance.
Further, the metal column 1 and the heat sink 8 are integrally formed.
Further, the metal column 1 and the heat sink 8 are both made of copper materials.
Specifically, the metal column 1 and the heat sink 8 are integrally formed, and can be formed by one-step processing of the same material, and the processing technology is not limited.
In order to realize the best heat conduction and heat transfer efficiency, a copper material with excellent heat conduction performance can be selected; the size of the metal interlayer plate 3 attached to the lower portion of the upper chip 4 is not smaller than that of the upper chip 4, so that the bottom of the upper chip 4 can be completely attached to the metal interlayer plate 3, heat of the upper chip 4 can be completely and rapidly transmitted to the metal interlayer plate 3 and then transmitted to the metal column 1 and the heat sink 8, and the rapid heat conduction and heat dissipation function of the upper chip 4 is achieved.
As shown in fig. 1 to fig. 2, the cavity type package structure in this embodiment includes a copper heat sink 8 serving as a support, and three lower chips 2 are attached to the heat sink 8; a pair of copper columns which are integrally formed are further arranged on the heat sink 8, and a metal interlayer plate 3 is arranged on each pair of copper columns; two upper chips 4 are also attached to the positions, corresponding to the pair of copper columns, of one metal interlayer plate 3; and the two upper chips 4 are matched with the two copper columns in quantity and correspond to the two copper columns in position. In addition, three lower floor's chip 2 sets up with two copper post intervals, and a lower floor's chip 2 locates between two copper posts promptly, and two other lower floor's chips 2 locate the outside of two copper posts respectively.
The integral metal interlayer plate 3 is also provided with a through window 31, and the two copper columns are positioned at two sides of the window 31; meanwhile, a lower chip 2 positioned between the two copper columns is opposite to the position of the window 31, so that the lower chip can be exposed and prevented from being laminated with the upper chip 4. The adjacent lower chip 2 and the upper chip 4 are welded through a welding wire 6, and the welding wire 6 penetrates through the hollow window 31, so that welding can be easily realized. Meanwhile, the size of the metal interlayer plate 3 after the window 31 is opened is not smaller than that of the upper chip 4, so that the heat conduction area is large enough, and the heat conduction efficiency is highest.
The packaging structure also comprises an insulating ceramic ring 7, a metal outer pin 5 and a ceramic cover 9; one end of the metal outer pipe pin 5 is adhered to the ceramic ring 7, and the other end extends out of the cavity and faces outwards; an insulating ceramic ring 7 is affixed to the edge of the heatsink 8 to insulate the metal outer pins 5 from the heatsink 8.
As shown in fig. 3 to fig. 8, an embodiment of the present invention further provides a method for packaging a cavity type package structure, where the method includes the following steps, which are specifically described below:
s01, arranging a lower chip 2 on the heat sink 8;
s03, arranging a metal interlayer plate 3 on the metal column 1 arranged on the heat sink 8;
and S05, arranging upper chips 4 on the metal interlayer plate 3, wherein the number of the upper chips is matched with that of the metal columns 1 below the metal interlayer plate 3, and the upper chips correspond to the positions of the metal columns.
As shown in fig. 4 to 6, the package structure includes a heat sink 8 as a support; firstly, mounting the chip on the heat sink 8 for one time, and attaching the lower chip 2 on the heat sink 8.
After the mounting is finished, the metal interlayer plate 3 is arranged on the metal column 1 fixedly arranged on the heat sink 8, so that the metal column 1 stably supports the metal interlayer plate 3; after the metal interlayer plate 3 is installed, silver glue is solidified, so that the metal interlayer plate 3 and the metal column 1 are firmly fixed. Optionally, the number of the metal posts 1 is not limited, and one or more metal posts can be used; in addition, the metal pillar 1 may be integrally formed with the heat sink 8, or the metal pillar 1 is mounted on the heat sink 8 in advance; the metal interlayer plate 3 is not limited in form, and can be an integral metal plate or a plurality of independent metal plates.
After the metal interlayer plate 3 is installed, secondary chip installation is carried out, an upper chip 4 is pasted on the metal interlayer plate 3, and silver glue solidification is carried out, so that the upper chip 4 is fixedly connected with the metal interlayer plate 3; the number of the upper chips 4 is the same as that of the metal posts 1, and the metal posts 1 and the upper chips 4 are arranged in a one-to-one correspondence manner.
Therefore, the cavity type packaging structure can be provided with two or more layers of chips, the number of the chips in the cavity can be greatly expanded, and the integration level of the packaging structure is greatly improved.
Further, before step S03, the method further includes:
s021, arranging a through window 31 on the metal interlayer plate 3;
after step S03, the method further includes:
s041, arranging a metal interlayer plate 3 corresponding to the at least one pair of metal posts 1, so that the at least one pair of metal posts 1 are respectively located at two sides of the window 31 and the position of the lower chip 2 is opposite to the window 31.
Specifically, the metal interlayer plate 3 is an integrally formed metal plate, and a through window 31 can be formed in advance on the metal interlayer plate 3; after the opening is finished, arranging the metal interlayer plate 3 on the at least one pair of metal columns 1 on the heat sink 8, so that the metal interlayer plate 3 is stably supported by the at least one pair of metal columns 1; meanwhile, at least one pair of metal posts 1 are positioned at two sides of the windowing 31, so that the windowing 31 is positioned between the adjacent metal posts 1; the lower chip 2 is positioned below the metal interlayer plate 3, and the number and the position of the lower chip are not limited, namely, the lower chip 2 can be positioned right below the window 31, or only positioned below the metal interlayer plate 3 and shielded by the metal interlayer plate; when the lower chip 2 needs to be electrically connected to the upper chip 4, the lower chip 2 needs to be located right below the window 31, so that the lower chip 2 can be smoothly exposed through the window 31 in the plane direction of the heat sink 8, so that the lower chip 2 and the upper chip 4 can be electrically connected in subsequent processes in the form of welding by the bonding wires 6 and the like.
Further, after step S041, the method further includes:
s071: passing a bonding wire 6 through the window 31;
s072: the upper chip 4 positioned above the metal interlayer plate 3 is electrically connected with the lower chip 2 positioned below the window 31 through the bonding wire 6.
As shown in fig. 7, when processing is performed by a welding method, the bonding wire 6 may first pass through the hollow window 31, and then one end of the bonding wire is bonded to the upper chip 4 above the metal spacer plate 3, while the other end is bonded to the lower chip 2 adjacent to the lower side of the window 31; thereby electrically connecting the adjacent upper chip 4 and the lower chip 2. The number of the bonding wires 6 is not limited and is determined according to the number of the actual pins.
Optionally, the heat sink 8 may further be provided with a plurality of other lower chips 2, and the lower chips 2 located below the metal interlayer plate 3 may not be right opposite to the window 31, i.e. may be shielded by the metal interlayer plate 3; the bonding wires 6 can also connect a plurality of lower chips 2 on the heat sink 8 with each other, and can also connect a plurality of upper chips 4 above the metal interlayer plate 3 with each other, thereby realizing various electrical connection modes inside the packaging structure.
Optionally, a part of the lower chip 2 located at the outer periphery of the metal interlayer plate 3 may also be electrically connected to the outer pins at the periphery of the cavity type package structure, the adjacent upper chip 4 above the metal interlayer plate 3, or the adjacent lower chip 2 on the heat sink 8, etc. by welding.
Further, after step S041, the method further includes:
s081: at least two of the upper chips 4 are electrically connected by bonding wires 6.
Further, after step S041, the method further includes:
s091: at least two of the lower chips 2 are electrically connected by bonding wires 6.
Specifically, the bonding wires 6 can also connect a plurality of upper chips 4 above the metal interlayer plate 3, and at least two upper chips 4 are electrically connected with each other by welding the bonding wires 6, so that various electrical connection modes inside the packaging structure are realized.
Similarly, the bonding wires 6 may connect the plurality of lower chips 2 disposed on the heat sink 8, and the at least two lower chips 2 are electrically connected to each other by welding the bonding wires 6, thereby implementing various electrical connection modes inside the package structure.
Further, before step S01, the method further includes:
and S001, fixedly bonding the metal column 1 on the heat sink 8.
Specifically, the metal column 1 is mounted on the heat sink 8 in advance, and is fixed on the surface of the heat sink 8 in advance in an adhesive manner.
Optionally, in order to achieve the best heat conduction and heat transfer efficiency, a copper material with excellent heat conduction performance can be selected as the material of the heat sink 8 or the metal column 1.
The chip packaging method is described generally below:
as shown in fig. 4 to 7, the package structure includes a heat sink 8 as a support. Firstly, mounting the chip on the heat sink 8 for one time, and attaching the lower chip 2 on the heat sink 8; then the metal interlayer plate 3 is arranged on the metal column 1 fixedly arranged on the heat sink 8, so that the metal column 1 stably supports the metal interlayer plate 3; after the installation is finished, silver adhesive solidification is carried out on the metal interlayer plate 3, so that the metal interlayer plate 3 and the metal column 1 are firmly fixed; and finally, carrying out secondary chip mounting, mounting the upper chip 4 on the metal interlayer plate 3, and carrying out silver paste curing, so that the upper chip 4 is fixedly connected with the metal interlayer plate 3.
Next, the bonding wires 6 for electrical connection are passed through the hollow windows 31 of the metal partition plate 3, and one end of each bonding wire is soldered to the upper chip 4 above the metal partition plate 3, and the other end of each bonding wire is soldered to the lower chip 2 adjacent to the lower side of the window 31, so as to electrically connect the lower chip 2 to the upper chip 4 adjacent to the lower side. Meanwhile, the bonding wires 6 on the outermost side are also welded with the metal outer pins 5 on the package structure, that is, one end of the metal outer pin 5 is electrically connected with at least one of the lower chip 2 or the upper chip 4, and the other end of the metal outer pin 5 can be electrically connected with an element outside the cavity of the package structure, so that the function of electrically connecting the inside and the outside of the package structure is realized. In addition, a plurality of other lower chips 2 can be arranged on the heat sink 8, and the lower chips 2 positioned below the metal interlayer plate 3 can be shielded by the metal interlayer plate 3 without facing the windows 31; the bonding wires 6 can also connect a plurality of lower chips 2 on the heat sink 8 with each other, and can also connect a plurality of upper chips 4 above the metal interlayer plate 3 with each other, thereby realizing various electrical connection modes inside the packaging structure.
Finally, a ceramic cover 9 or a packaging cover made of other materials is arranged above the metal outer pipe pins 5, the packaging structure is sealed, an inner cavity is formed, and the overall structure performance of the packaging structure is stable.
In summary, in the cavity type package structure provided by the present invention, the cavity type package structure includes a heat sink 8 serving as a support, a lower chip 2 is attached to the heat sink 8, a metal pillar 1 is further fixed on the heat sink 8, and a metal interlayer plate 3 is installed on the metal pillar 1; the position department that corresponds with metal column 1 on metal interlayer board 3 still is equipped with upper chip 4, and upper chip 4 is the same with the quantity of metal column 1 promptly, and metal column 1 sets up with upper chip 4 one-to-one. Therefore, the cavity type packaging structure can be provided with two or more layers of chips, the number of the chips in the cavity can be greatly expanded, and the integration level of the packaging structure is greatly improved.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are included in the scope of the present invention.
Claims (14)
1. The cavity type packaging structure comprises a heat sink and is characterized in that a lower-layer chip and metal columns are arranged on the heat sink, metal partition plates are arranged on the metal columns, and upper-layer chips which are matched with the metal columns below the metal partition plates in number and correspond to the metal columns in position are arranged on the metal partition plates.
2. The cavity type package structure of claim 1, wherein at least a pair of metal posts are disposed on a metal interlayer plate, the metal interlayer plate further has a through window, and the at least a pair of metal posts are disposed on two sides of the window respectively; the position of the lower chip is opposite to the window.
3. The cavity package structure of claim 2, further comprising a bonding wire passing through the window to electrically connect the upper die above the metal spacer plate with the lower die below the window.
4. The cavity package structure of claim 3, wherein the bonding wires electrically connect at least two of the upper chips.
5. The cavity-type package structure of claim 3, wherein the bonding wires electrically connect at least two of the lower chips.
6. The cavity type package structure of claim 1, further comprising a ceramic ring and a metal outer pin stacked on the heat sink, wherein the ceramic ring is bonded to an edge of the heat sink, one end of the metal outer pin is bonded to the ceramic ring, and the other end of the metal outer pin extends in a direction away from the ceramic ring, and one end of the metal outer pin is electrically connected to at least one of the lower chip and the upper chip.
7. The cavity-type package structure of claim 1, wherein the metal pillar is integrally formed with the heat sink.
8. The cavity package structure of claim 7, wherein the metal pillar and the heat sink are both copper materials.
9. A method for packaging a cavity type packaging structure is characterized by comprising the following steps:
arranging a lower chip on the heat sink;
arranging a metal interlayer plate on the metal column arranged on the heat sink;
and arranging an upper layer chip which is matched with the metal columns below the metal interlayer plate in number and corresponds to the metal interlayer plate in position.
10. The integrated packaging method of claim 9,
before the step of disposing a metal spacer plate on a metal pillar disposed on the heat sink, the method further comprises: a penetrating window is formed in the metal interlayer plate;
after the step of disposing a metal spacer plate on a metal pillar disposed on the heat sink, the method further comprises: and arranging a metal interlayer plate and at least one pair of metal columns correspondingly, so that the at least one pair of metal columns are respectively positioned at two sides of the window, and the position of the lower-layer chip is opposite to the window.
11. The integrated packaging method according to claim 10, wherein after the step of disposing a metal spacer plate corresponding to at least one pair of metal posts so that the at least one pair of metal posts are respectively located at two sides of the window and the lower chip is located opposite to the window, the method further comprises:
passing a bonding wire through the window;
and electrically connecting the upper chip positioned above the metal interlayer plate with the lower chip positioned below the window through the bonding wires.
12. The integrated packaging method according to claim 11, wherein after the step of disposing a metal spacer plate corresponding to at least one pair of metal posts so that the at least one pair of metal posts are respectively located at two sides of the window and the lower chip is located opposite to the window, the method further comprises:
and electrically connecting at least two upper chips through bonding wires.
13. The integrated packaging method according to claim 11, wherein after the step of disposing a metal spacer plate corresponding to at least one pair of metal posts so that the at least one pair of metal posts are respectively located at two sides of the window and the lower chip is located opposite to the window, the method further comprises:
and electrically connecting at least two lower chips through bonding wires.
14. The integrated packaging method of claim 9, wherein before the step of disposing a metal spacer plate on a metal pillar disposed on the heat sink, the method further comprises:
and fixedly bonding the metal column on the heat sink.
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