CN219778909U

CN219778909U - Spiral flip chip COB substrate

Info

Publication number: CN219778909U
Application number: CN202320482228.3U
Authority: CN
Inventors: 周壮伟; 周林展
Original assignee: Dongguan Haiwo Electronic Technology Co ltd
Current assignee: Dongguan Haiwo Electronic Technology Co ltd
Priority date: 2023-03-14
Filing date: 2023-03-14
Publication date: 2023-09-29
Anticipated expiration: 2033-03-14

Abstract

The utility model provides a spiral flip Chip On Board (COB) substrate, which comprises a substrate and a plurality of light emitting chips, wherein the substrate is of a three-dimensional spiral structure, the light emitting chips are spirally distributed on the top surface of the substrate, and two ends of the substrate are respectively provided with an anode wiring pad and a cathode wiring pad. The three-dimensional spiral luminous shape can be formed after the positive electrode wiring bonding pad and the negative electrode wiring bonding pad are electrified, the three-dimensional spiral luminous shape has good visual effect, the use requirement of customers on non-planar luminous is met, market products are diversified, materials can be saved, production cost is reduced, and the three-dimensional spiral luminous shape is simple to process.

Description

Spiral flip chip COB substrate

Technical Field

The utility model relates to the field of COB substrates, in particular to a spiral flip-chip COB substrate.

Background

Along with the increasing market demand of COB substrates, COB substrate packaging technology is also matured slowly, the COB process comprises the steps of covering silicon chip placement points on the surface of a substrate by using heat-conducting epoxy resin, then directly placing the silicon chip on the surface of the substrate, carrying out heat treatment until the silicon chip is firmly fixed on the substrate, and then directly establishing electrical connection between the silicon chip and the substrate by using a wire bonding method.

The existing COB substrate structure mainly takes the form shown in the figure 3, a planar substrate is used, and then a light-emitting chip is packaged on the planar substrate, so that the COB substrate of the type can only emit light on one plane, has a single light-emitting form, and cannot meet the use requirement of customers on non-planar light emission.

Disclosure of Invention

The utility model aims to solve the problem of providing a spiral flip chip COB substrate, so that a light-emitting chip does not emit light on the same plane to form a solid light-emitting shape, and the diversity of market products is met.

The technical problem to be solved is to provide the spiral flip chip COB substrate according to the utility model, which comprises a substrate and a plurality of light emitting chips, wherein the substrate is of a three-dimensional spiral structure, the light emitting chips are spirally distributed on the top surface of the substrate, and both ends of the substrate are respectively provided with an anode wiring pad and a cathode wiring pad.

Preferably, the width of the substrate is 2mm.

Preferably, the thickness of the substrate is 0.6mm.

Preferably, the substrate is arranged in a conical spiral structure.

The beneficial effects of the utility model are as follows: the utility model provides a spiral flip chip COB substrate, which is characterized in that a substrate is manufactured into a solid spiral structure, a light-emitting chip is arranged on the substrate in a spiral mode, and a three-dimensional spiral light-emitting shape can be formed after the power is applied between a positive wiring pad and a negative wiring pad, so that the substrate has a good visual effect, meets the use requirement of customers on non-planar light emission, enables market products to be more diversified, saves materials, reduces production cost, and is simple to process.

Drawings

Fig. 1 illustrates a top view of the present utility model.

Fig. 2 illustrates a front view of the present utility model.

Fig. 3 illustrates a prior art schematic of the present utility model.

Reference numerals illustrate: a substrate 10, a positive electrode wiring pad 11, a negative electrode wiring pad 12, and a light emitting chip 20.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure.

All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are intended to be within the scope of the present disclosure, based on the described embodiments of the present disclosure.

Reference is made to fig. 1-3.

The utility model provides a spiral flip Chip On Board (COB) substrate, which comprises a substrate 10 and a plurality of light emitting chips 20, wherein the substrate 10 is of a three-dimensional spiral structure, the light emitting chips 20 are spirally distributed on the top surface of the substrate 10, and two ends of the substrate 10 are respectively provided with an anode wiring pad 11 and a cathode wiring pad 12.

The three-dimensional spiral type LED packaging structure is characterized in that the substrate 10 is made into a three-dimensional spiral structure, the light-emitting chip 20 is arranged on the substrate 10 in a spiral mode, a three-dimensional spiral light-emitting shape can be formed after the positive electrode wiring pad 11 and the negative electrode wiring pad 12 are electrified, good visual effects are achieved, the use requirements of customers on non-planar light-emitting are met, market products are diversified, materials can be saved, production cost is reduced, and processing is simple.

Based on the above embodiment, the width of the substrate 10 is 2mm, so that the material can be saved, the production cost can be reduced, and the miniaturization of the product can be realized.

Based on the above embodiment, the thickness of the substrate 10 is 0.6mm, so that the material can be saved, the production cost can be reduced, and the miniaturization of the product can be realized.

Based on the above embodiment, the substrate 10 is arranged in a conical spiral structure, and has good visual effect.

The above embodiments are merely illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solution of the present utility model should fall within the scope of protection defined by the claims of the present utility model without departing from the spirit of the design of the present utility model.

Claims

1. The utility model provides a spiral flip-chip COB base plate, contains base plate, a plurality of light emitting chip, its characterized in that, the base plate is three-dimensional heliciform structure, light emitting chip spiral distributes on the base plate top surface, the base plate both ends are provided with anodal wiring pad and negative pole wiring pad respectively.

2. The spiral flip-chip COB substrate of claim 1 wherein the width of the substrate is 2mm.

3. The spiral flip-chip COB substrate of claim 2 wherein the thickness of the substrate is 0.6mm.

4. The spiral flip-chip COB substrate of claim 1 wherein the substrate is arranged in a conical spiral configuration.