CN202423286U - Integrated LED point light source - Google Patents
Integrated LED point light source Download PDFInfo
- Publication number
- CN202423286U CN202423286U CN2011205750580U CN201120575058U CN202423286U CN 202423286 U CN202423286 U CN 202423286U CN 2011205750580 U CN2011205750580 U CN 2011205750580U CN 201120575058 U CN201120575058 U CN 201120575058U CN 202423286 U CN202423286 U CN 202423286U
- Authority
- CN
- China
- Prior art keywords
- led
- light source
- source
- electrical layer
- aluminium base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an integrated LED point light source. The integrated LED point light source comprises a plurality of LED light sources. Each LED light source comprises a plurality of LED chips and an aluminum substrate inside. An electrical layer is disposed on the aluminum substrate. Two electrodes are disposed on each LED chip. One electrode is connected with one end of a gold wire through a gold ball and the other electrode is encapsulated on the electrical layer directly. The other end of the gold wire is connected with the electrical layer. A fluorescence glue layer is encapsulated on each LED chip and a transparent glue layer is further encapsulated on the fluorescence glue layer. By encapsulating the LED chips on the electrical layer of the aluminum substrate directly, the integrated LED point light source has the advantages that heat dissipation is accelerated and LED luminous efficiency is enhanced, material and manufacture cost are saved, and cost per watt of an LED lamp is lowered.
Description
Technical field
The utility model relates to the led light source technical field, particularly a kind of integrated LED point-source of light.
Background technology
Led light source is claimed semiconductor light-emitting-diode again, is a kind of environment-friendly energy-saving light source, just more and more widely be applied to each lighting field, LED also can produce heat during operation, how many heats of generation depends on the luminous efficiency that led light source is whole.And whether the LED lamp work that utilizes led light source to process is stable, and the quality of quality is closely bound up with the heat dispersion of lamp body own.The heat radiation of high-brightness LED lamp in the market adopt the natural heat dissipation mode usually, but effect is unsatisfactory, in case the LED lamp can not dispel the heat well, also can be affected its useful life.
Can the LED encapsulation be divided into two big types by the unusual of LED lamp illumination mode: point-source of light and area source.Point-source of light be with led chip through solid crystalline substance-weak point bake-bonding wire-before measurement-encapsulating-length bakes etc. that operation is rack-mount, conventional led support is made up of plastics and part metals, minority is made up of pottery.After encapsulation is accomplished again through reflow soldering or manual welding on aluminium base.This be encapsulated in LED product on the support between led chip-support owing to need thermoelectric the separation, so middlely have an insulating barrier, this insulating barrier can have the effect of obstruct to the heat that produces in the led chip work, is unfavorable for the heat radiation of chip.And because equally can be owing to receive the thermal resistance of support conductive coefficient influence between support-aluminium base, both stacks will be unfavorable for the heat radiation of led chip very much.Area source is on chip, to be covered with the fluorescent glue that a layer thickness reaches 2-3mm, so, both has been unfavorable for the heat radiation of led chip, also because blocked up fluorescent glue has reduced the light efficiency of LED lamp.
The utility model content
In order to overcome the defective that above-mentioned prior art exists, the utility model provides a kind of integrated LED point-source of light of environment-friendly energy-saving.
To achieve these goals, the technical scheme of the utility model is following:
A kind of LED integrated form point-source of light comprises several led light sources, and each led light source inside comprises several led chips; Also comprise aluminium base, said aluminium base is provided with electrical layer, and led chip has two electrodes; One of them electrode is connected with an end of gold thread through gold goal, and another electrode directly is encapsulated on the electrical layer, reduces thickness of insulating layer; Reduced thermal resistance, the other end of gold thread is connected with electrical layer, the electric current of conducting led chip and electrical layer.
Be packaged with the fluorescence glue-line on the utility model led chip, going back embedding on the fluorescence glue-line has substratum transparent, with protection chip and gold thread.
The utility model aluminium base is provided with the plastic ring that led light source is surrounded, and the aluminium base edge also is provided with location hole, and the location hole side is provided with two pads, and said LED integrated form point-source of light connects power line through pad.
The beneficial effect of the utility model is that the utility model led chip has reduced the thermal resistance of LED heat radiation greatly to the insulating barrier of the height insulation low thermal resistance that has only 35um between aluminium base.Thereby improved the reliability of led chip work, reduced led chip and produced big light decay owing to temperature is too high.And saved the production cost of material cost and the Reflow Soldering processing of led support fully, reduced the unit cost of every watt on LED lamp, the LED lamp that is beneficial to environmental protection and energy saving is more popularized in an all-round way.
Description of drawings
Fig. 1 is the structure chart of each led light source of the utility model;
Fig. 2 is the utility model light source vertical view.
Among the figure, 1, gold goal, 2, gold thread, 3, aluminium base, 4, substratum transparent, 5, electrical layer, 6, the fluorescence glue-line, 7, led chip, 8, led light source, 9, location hole, 10, pad, 11, plastic ring.
Embodiment:
For the creation characteristic, the technological means that make the utility model and reach purpose and be easy to understand and understand, further set forth the utility model below in conjunction with accompanying drawing.
Referring to Fig. 1 and Fig. 2, the utility model LED integrated form point-source of light comprises several led light sources 8; Each led light source 8 inside comprises several led chips 7, also comprises aluminium base 3, and aluminium base 3 is provided with electrical layer 5; Led chip 7 has two electrodes, and one of them electrode is connected with an end of gold thread 2 through gold goal 1, and another electrode can directly be encapsulated on the electrical layer 5 through elargol; Make led chip 7 be fixed on the electrical layer 5 and the conducting electric current, the other end of gold thread 2 is connected with electrical layer 5, the electric current of conducting led chip 7 and electrical layer 5; Be packaged with fluorescence glue-line 6 on the led chip 7, going back embedding on the fluorescence glue-line 6 has substratum transparent 4, and substratum transparent 4 can be a resin.Aluminium base 3 is provided with the plastic ring 11 that LED8 is surrounded, and aluminium base 3 edges also are provided with location hole 9, and location hole 9 sides are provided with two pads 10, and said led light source connects extraneous power line through pad 10.
The manufacturing materials of gold goal 1 and gold thread 2 is a metallic gold.
More than show and described the advantage of basic principle, principal character and the utility model of the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The principle of describing in the foregoing description and the specification that the utility model just is described; The utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these variations and improvement all fall in the utility model scope that requires protection.The utility model requires protection range to be defined by appending claims and equivalent thereof.
Claims (3)
1. a LED integrated form point-source of light comprises several led light sources, and each led light source inside comprises several led chips; Also comprise aluminium base, it is characterized in that said aluminium base is provided with electrical layer; Led chip has two electrodes; One of them electrode is connected with an end of gold thread through gold goal, and another electrode directly is encapsulated on the electrical layer, and the other end of gold thread is connected with electrical layer.
2. a kind of LED integrated form point-source of light according to claim 1 is characterized in that, is packaged with the fluorescence glue-line on the said led chip, and going back embedding on the fluorescence glue-line has substratum transparent.
3. a kind of LED integrated form point-source of light according to claim 2; It is characterized in that said aluminium base is provided with the plastic ring that led light source is surrounded, the aluminium base edge also is provided with location hole; The location hole side is provided with two pads, and said LED integrated form point-source of light connects power line through pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205750580U CN202423286U (en) | 2011-12-27 | 2011-12-27 | Integrated LED point light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205750580U CN202423286U (en) | 2011-12-27 | 2011-12-27 | Integrated LED point light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202423286U true CN202423286U (en) | 2012-09-05 |
Family
ID=46748018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205750580U Expired - Fee Related CN202423286U (en) | 2011-12-27 | 2011-12-27 | Integrated LED point light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202423286U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106764561A (en) * | 2016-12-27 | 2017-05-31 | 江苏稳润光电科技有限公司 | A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package |
-
2011
- 2011-12-27 CN CN2011205750580U patent/CN202423286U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106764561A (en) * | 2016-12-27 | 2017-05-31 | 江苏稳润光电科技有限公司 | A kind of integrated lamp and preparation method based on flip LED chips Vacuum Package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201787386U (en) | Metal substrate LED module for illumination | |
| CN102738365A (en) | Novel LED (Light Emitting Diode) packaging piece based on DFN (Double Flat No-lead package) and QFN (Quad Flat No-lead Package), and manufacturing method of packaging piece | |
| CN201868429U (en) | Embedded-type encapsulating structure of luminous diode | |
| CN201116697Y (en) | Light-emitting diode capable of 360 degree illuminating | |
| CN2935474Y (en) | Functional lighting LED | |
| CN104051603B (en) | A kind of manufacturing process of the LED light bar of double-side | |
| CN201910445U (en) | Light-emitting diode (LED) packaging structure | |
| CN202423286U (en) | Integrated LED point light source | |
| CN203013791U (en) | DFN-and-QFN-based novel LED packaging member | |
| CN203377261U (en) | Light emitting diode (LED) packaging support and LED packaging structure | |
| CN202473912U (en) | LED array light source without circuit substrate | |
| CN204271135U (en) | The light source module that photoelectric conversion efficiency is high | |
| CN204011481U (en) | The separated also high reflectance circuit board of integrated LED chip of electric heating | |
| CN202695440U (en) | Led integrated light source | |
| CN102544300A (en) | LED packaging structure | |
| CN203351593U (en) | LED chip combination | |
| CN102544342B (en) | Heat radiator and electrode integrated heat radiating device and manufacturing method thereof | |
| CN202013885U (en) | LED (Light Emitting Diode) integrated packaging device arranged at upper and lower of electrode | |
| CN103022335B (en) | Integrated electronic cooling module of diaphragm panel ceramic (DPC) substrate of light-emitting diode (LED) flip chip and manufacturing method of integrated electronic cooling module | |
| CN203103348U (en) | COB base plate structure-equipped LED lamp source | |
| CN202839732U (en) | LED bracket and LED device produced therefrom | |
| CN201758139U (en) | Novel LED light source module packaging structure | |
| CN2798315Y (en) | High power LED packing structure | |
| CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
| CN204558524U (en) | For the bar-shaped LED support of flip-chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HANGZHOU LIJING OPTOELECTRONICS CO., LTD. Free format text: FORMER NAME: HANGZHOU LIJING LIGHTING CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 311199 Zhejiang province Hangzhou Yuhang District Nanyuan Street Highland Village Patentee after: Hangzhou Regent Au Optronics Co Address before: 311100 Zhejiang province Hangzhou Yuhang District Nanyuan Street Highland Village Patentee before: Hangzhou Lijing Lighting Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20171227 |